CN113436781A - Wear-resistant conductive paste and preparation method thereof - Google Patents
Wear-resistant conductive paste and preparation method thereof Download PDFInfo
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- CN113436781A CN113436781A CN202110853748.6A CN202110853748A CN113436781A CN 113436781 A CN113436781 A CN 113436781A CN 202110853748 A CN202110853748 A CN 202110853748A CN 113436781 A CN113436781 A CN 113436781A
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- 238000002360 preparation method Methods 0.000 title abstract description 7
- 239000002002 slurry Substances 0.000 claims abstract description 34
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 33
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229920005989 resin Polymers 0.000 claims abstract description 23
- 239000011347 resin Substances 0.000 claims abstract description 23
- 238000009835 boiling Methods 0.000 claims abstract description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000002318 adhesion promoter Substances 0.000 claims abstract description 12
- 239000002518 antifoaming agent Substances 0.000 claims abstract description 12
- 239000002270 dispersing agent Substances 0.000 claims abstract description 12
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 11
- 239000000945 filler Substances 0.000 claims abstract description 11
- 239000003960 organic solvent Substances 0.000 claims abstract description 5
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims abstract description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229920005749 polyurethane resin Polymers 0.000 claims abstract description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- 238000002156 mixing Methods 0.000 claims description 14
- 238000005303 weighing Methods 0.000 claims description 14
- 239000002904 solvent Substances 0.000 claims description 10
- 238000005299 abrasion Methods 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 238000001914 filtration Methods 0.000 claims description 7
- 238000000227 grinding Methods 0.000 claims description 7
- 239000012535 impurity Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 239000002994 raw material Substances 0.000 claims description 7
- 238000010008 shearing Methods 0.000 claims description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 6
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical compound CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 claims description 4
- 239000007822 coupling agent Substances 0.000 claims description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 4
- 229910003460 diamond Inorganic materials 0.000 claims description 4
- 239000010432 diamond Substances 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 claims description 4
- 150000002576 ketones Chemical class 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 claims description 2
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 claims description 2
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 claims description 2
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 claims description 2
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 claims description 2
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 2
- UDSFAEKRVUSQDD-UHFFFAOYSA-N Dimethyl adipate Chemical compound COC(=O)CCCCC(=O)OC UDSFAEKRVUSQDD-UHFFFAOYSA-N 0.000 claims description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 2
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 2
- 150000004645 aluminates Chemical class 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 239000006229 carbon black Substances 0.000 claims description 2
- 239000002041 carbon nanotube Substances 0.000 claims description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 2
- 150000007942 carboxylates Chemical class 0.000 claims description 2
- XTDYIOOONNVFMA-UHFFFAOYSA-N dimethyl pentanedioate Chemical compound COC(=O)CCCC(=O)OC XTDYIOOONNVFMA-UHFFFAOYSA-N 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 claims description 2
- 229910021485 fumed silica Inorganic materials 0.000 claims description 2
- 229910021389 graphene Inorganic materials 0.000 claims description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 2
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 claims description 2
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 claims description 2
- 239000012948 isocyanate Substances 0.000 claims description 2
- 150000002513 isocyanates Chemical class 0.000 claims description 2
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 claims description 2
- 229940011051 isopropyl acetate Drugs 0.000 claims description 2
- GWYFCOCPABKNJV-UHFFFAOYSA-N isovaleric acid Chemical compound CC(C)CC(O)=O GWYFCOCPABKNJV-UHFFFAOYSA-N 0.000 claims description 2
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 claims description 2
- OJURWUUOVGOHJZ-UHFFFAOYSA-N methyl 2-[(2-acetyloxyphenyl)methyl-[2-[(2-acetyloxyphenyl)methyl-(2-methoxy-2-oxoethyl)amino]ethyl]amino]acetate Chemical compound C=1C=CC=C(OC(C)=O)C=1CN(CC(=O)OC)CCN(CC(=O)OC)CC1=CC=CC=C1OC(C)=O OJURWUUOVGOHJZ-UHFFFAOYSA-N 0.000 claims description 2
- YKYONYBAUNKHLG-UHFFFAOYSA-N n-Propyl acetate Natural products CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 claims description 2
- 229920000728 polyester Polymers 0.000 claims description 2
- 239000002952 polymeric resin Substances 0.000 claims description 2
- 238000012805 post-processing Methods 0.000 claims description 2
- 229940090181 propyl acetate Drugs 0.000 claims description 2
- 229920006395 saturated elastomer Polymers 0.000 claims description 2
- 229920003002 synthetic resin Polymers 0.000 claims description 2
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 claims description 2
- 238000009472 formulation Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 238000001723 curing Methods 0.000 abstract description 24
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 238000005452 bending Methods 0.000 abstract description 5
- 238000013329 compounding Methods 0.000 abstract description 2
- 238000013035 low temperature curing Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- 238000003860 storage Methods 0.000 abstract description 2
- 239000000047 product Substances 0.000 description 4
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
Landscapes
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Conductive Materials (AREA)
Abstract
The application discloses wear-resistant conductive paste and a preparation method thereof. The conductive paste comprises the following components in parts by weight: 0.1-1 part of water boiling adhesion promoter, 0.5-1 part of anti-overflow ink auxiliary agent, 0.2-1 part of defoaming agent, 0.2-0.5 part of dispersing agent, 0.1-0.2 part of curing agent promoter, 5-40 parts of organic solvent, 10-50 parts of wear-resistant filler, 20-40 parts of flake silver powder, 5-30 parts of resin and 0.5-0.8 part of curing agent. According to the preparation method, acrylic acid modified polyurethane resin is used as a bonding phase, so that the boiling performance and the bending resistance of the conductive paste are greatly improved, and the storage stability is good. Different types of low-temperature curing agents are used for compounding, so that the adhesive force of the slurry in a constant-temperature and constant-humidity environment is improved on the basis of ensuring other performances, and the use requirement of the base material on the low-temperature environment is met. Meanwhile, the conductive silver powder and the wear-resistant filler are added, so that the conductive silver powder has high wear resistance and low conductivity.
Description
Technical Field
The application relates to the field of conductive paste, in particular to wear-resistant conductive paste and a preparation method thereof.
Background
Antenna feed point generally sets up on cell-phone casing and links through metal shrapnel and circuit board, and when customer used the cell-phone, the shrapnel can produce frictional force with the feed point, and antenna feed point is worn and torn or wears, causes the phenomenon of circuit short circuit or bad connection, and present electronic product does more and more thinly moreover, and the performance and the thickness direct relation of antenna feed point are to the quality of product. However, the wear resistance of the wear-resistant conductive paste cannot well meet the requirements of end products, and the wear-resistant conductive paste is not good in boiling resistance and bending resistance and poor in adhesive force in a constant-temperature and constant-humidity environment.
Aiming at the problems that the wear resistance in the related technology can not well meet the requirements of terminal products, the boiling resistance and the bending resistance are poor, and the adhesive force under the constant temperature and humidity environment is poor, an effective solution is not provided at present.
Disclosure of Invention
The application mainly aims to provide the wear-resistant conductive paste and the preparation method thereof, so as to solve the problems that the wear resistance cannot well meet the requirements of terminal products, the water boiling resistance and the bending resistance are poor, and the adhesive force under the constant-temperature and constant-humidity environment is poor.
In order to achieve the above object, according to one aspect of the present application, there is provided a wear-resistant conductive paste.
The conductive paste for abrasion resistance according to the present application includes: 0.1-1 part of water boiling adhesion promoter, 0.5-1 part of anti-overflow ink auxiliary agent, 0.2-1 part of defoaming agent, 0.2-0.5 part of dispersing agent, 0.1-0.2 part of curing agent promoter, 5-40 parts of organic solvent, 10-50 parts of wear-resistant filler, 20-40 parts of flake silver powder, 5-30 parts of resin and 0.5-0.8 part of curing agent.
Further, the resin is a combination resin of low molecular resin and high molecular resin; wherein the low molecular resin comprises acrylate modified short chain epoxy resin, one or more of abrasion resistant resins BY-5550, BY-9320, JN-352 and TJ-PTE500, and the TG temperature of the low molecular resin is above 60 ℃; the high molecular resin comprises high molecular weight epoxy resin: PKHH, jER8800, PKHB, TT386, GT6099, GZ7071X75, saturated polyester: one or more of ES100, BX7000A, ES110, ES120 and ES250, wherein the TG temperature of the used polymer resin is above 65 ℃.
Further, the organic solvent is a ketone and ester combined solvent; the ketone solvent comprises one or more of cyclohexanone, isophorone, N-methyl pyrrolidone and methyl ethyl ketone; the ester solvent comprises one or more of propylene glycol methyl ether acetate, ethyl acetate, n-butyl acetate, ethylene glycol ethyl ether acetate, dimethyl ester, dimethyl glutarate, propylene glycol methyl ether acetate, dimethyl adipate, butyl acetate, diethylene glycol butyl ether acetate, propyl acetate, isopropyl acetate and isobutyl acetate.
Further, the water boiling adhesion promoter is one or more of titanate coupling agent, aluminate coupling agent, silane coupling agent WD-26, WD-31, WD-50, WD-56, WD-42, A150, KMB5220, KBM602, KH550, Nanda-42, Nanda-73 and Z-6032.
Further, the dispersant is one or more of SP-762, EBS, 7043, K-702, 9300, SDJ8006, SRE-47000 and AD 3013; the defoaming agent is BYK A550, CBK-208, EDL-2100 or EDL 2800.
Further, the ink overflow prevention auxiliary agent is selected from wax powder, carbon black, graphene, carbon nano tubes or fumed silica.
Further, the curing agent is selected from one or more of isocyanate, benzimidazole, acetamide, PN-23J, UN15, 010 and methyl nadic anhydride.
Further, the wear-resistant filler is one or more of spherical nickel powder 2-10um, zirconium powder, diamond powder, aluminum powder, silver-coated nickel powder and nickel-coated carbon powder; the flake silver powder is selected from one or more of D50 1um, 2um, 5um and 8 um.
Further, the curing agent accelerator is selected from 2101CN, DMP-30, metal carboxylate, E6623.
In order to achieve the above object, according to another aspect of the present application, there is provided a method of preparing a conductive paste for wear resistance.
The preparation method of the wear-resistant conductive paste comprises the following steps based on any one of the conductive paste formulas: s1, preparing a premix, weighing a water boiling adhesion promoter, an anti-overflow ink auxiliary agent, a defoaming agent, a dispersing agent, a curing agent promoter, a solvent, an abrasion-resistant filler, silver powder and 5-30 wt% of acrylic acid modified polyurethane resin according to the formula ratio, mixing the raw materials in a mixer for 1h, and then shearing, grinding and dispersing at a high speed in a grinder to obtain the premix; s2, preparing conductive slurry, namely weighing a curing agent according to a formula, controlling the temperature to be within the range of-100-50 ℃, and mixing the curing agent and the premix prepared in the step S1 in a mixer for 30min to obtain the conductive slurry; s3, post-processing the conductive paste, namely filtering the conductive paste obtained in the step S2 through a 200-mesh and 800-mesh screen to remove impurities or large non-uniformly dispersed particles in the paste, then placing the filtered conductive paste in a vacuum defoaming machine, vacuumizing to obtain the conductive paste, and detecting the viscosity value of the conductive paste, wherein the required value is 4000-mesh and 15000 cps.
According to the invention, the acrylic acid modified polyurethane resin is used as the binding phase, so that the boiling performance and the bending resistance of the conductive paste are greatly improved, and the conductive paste has good storage stability. Different types of low-temperature curing agents are used for compounding, so that the adhesive force of the slurry in a constant-temperature and constant-humidity environment is improved on the basis of ensuring other performances, and the use requirement of the base material on the low-temperature environment is met. The wear-resistant framework is made of different types of metal wear-resistant fillers and nonmetal wear-resistant fillers, and the small-particle-size flaky silver powder is filled in gaps of the wear-resistant fillers to enhance the stability of the wear-resistant framework, improve the wear resistance of the slurry and reduce the conductivity of the slurry to a certain extent. Meanwhile, a certain amount of flake silver powder with large particle size is added to cover the surface of the wear-resistant framework to form a conductive path, so that the conductive performance of the wear-resistant slurry is greatly reduced. The prepared silver paste breaks through the limit of 2000 times of the requirement on the wear resistance of the traditional wear-resistant silver paste for more than 5000 times under the condition of ensuring the ultra-excellent performances of the resistance less than 0.8mm x m omega and the film layer less than 20 um.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, serve to provide a further understanding of the application and to enable other features, objects, and advantages of the application to be more apparent. The drawings and their description illustrate the embodiments of the invention and do not limit it. In the drawings:
fig. 1 is a schematic flow chart of a method for preparing a wear-resistant conductive paste according to an embodiment of the present application.
Detailed Description
In order to make the technical solutions in the embodiments of the present application better understood, the technical solutions in the embodiments of the present application are clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are only partial embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application described herein may be used. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
Example 1:
weighing 0.2% of water boiling adhesion promoter, 0.5% of anti-overflow ink auxiliary agent, 0.15% of defoaming agent, 0.5% of dispersing agent, 0.15% of curing agent promoter, 8.5% of solvent, 45% of nickel powder, 5% of zirconium oxide, 30% of silver powder and 15 wt% of resin according to the mass percentage, mixing the raw materials in a mixer for 1h, and then carrying out high-speed shearing, grinding and dispersing in a grinder to obtain a premix; weighing a curing agent according to a formula, controlling the temperature to be in a range of-100-50 ℃, and mixing the curing agent and the premix in a mixer for 30min to obtain conductive slurry; filtering the obtained conductive slurry through a 200-plus-800-mesh screen to remove impurities or large non-uniform dispersed particles in the slurry, then placing the filtered conductive silver slurry in a vacuum defoaming machine, vacuumizing to obtain the conductive slurry, and detecting the viscosity value of the conductive slurry, wherein the required value is 4000-plus-15000 cps.
Example 2:
weighing 0.2% of water boiling adhesion promoter, 0.5% of anti-overflow ink auxiliary agent, 0.15% of defoaming agent, 0.5% of dispersing agent, 0.15% of curing agent promoter, 8.5% of solvent, 40% of nickel powder, 5% of diamond, 30% of silver powder and 15 wt% of resin according to the mass percentage, mixing the raw materials in a mixer for 1h, and then carrying out high-speed shearing, grinding and dispersing in a grinder to obtain the premix. Weighing a curing agent according to a formula, controlling the temperature to be in a range of-100-50 ℃, and mixing the curing agent and the premix in a mixer for 30min to obtain conductive slurry; filtering the obtained conductive slurry through a 200-plus-800-mesh screen to remove impurities or large non-uniform dispersed particles in the slurry, then placing the filtered conductive silver slurry in a vacuum defoaming machine, vacuumizing to obtain the conductive slurry, and detecting the viscosity value of the conductive slurry, wherein the required value is 4000-plus-15000 cps.
Example 3:
weighing 0.2% of water boiling adhesion promoter, 0.5% of anti-overflow ink auxiliary agent, 0.15% of defoaming agent, 0.5% of dispersing agent, 0.15% of curing agent promoter, 8.5% of solvent, 45% of nickel-coated carbon, 30% of silver powder and 15 wt% of resin according to the mass percentage, mixing the raw materials in a mixer for 1h, and then carrying out high-speed shearing, grinding and dispersing in a grinder to obtain the premix. Weighing a curing agent according to a formula, controlling the temperature to be in a range of-100-50 ℃, and mixing the curing agent and the premix in a mixer for 30min to obtain conductive slurry; filtering the obtained conductive slurry through a 200-plus-800-mesh screen to remove impurities or large non-uniform dispersed particles in the slurry, then placing the filtered conductive silver slurry in a vacuum defoaming machine, vacuumizing to obtain the conductive slurry, and detecting the viscosity value of the conductive slurry, wherein the required value is 4000-plus-15000 cps.
Example 4:
weighing 0.2% of water boiling adhesion promoter, 0.5% of anti-overflow ink auxiliary agent, 0.15% of defoaming agent, 0.5% of dispersing agent, 0.15% of curing agent promoter, 8.5% of solvent, 40% of silver-coated nickel powder, 5% of diamond, 30% of silver powder and 15 wt% of resin according to the mass percentage, mixing the raw materials in a mixer for 1h, and then carrying out high-speed shearing, grinding and dispersing in a grinder to obtain the premix. Weighing a curing agent according to a formula, controlling the temperature to be in a range of-100-50 ℃, and mixing the curing agent and the premix in a mixer for 30min to obtain conductive slurry; filtering the obtained conductive slurry through a 200-plus-800-mesh screen to remove impurities or large non-uniform dispersed particles in the slurry, then placing the filtered conductive silver slurry in a vacuum defoaming machine, vacuumizing to obtain the conductive slurry, and detecting the viscosity value of the conductive slurry, wherein the required value is 4000-plus-15000 cps.
Example 5:
weighing 0.2% of water boiling adhesion promoter, 0.5% of anti-overflow ink auxiliary agent, 0.15% of defoaming agent, 0.5% of dispersing agent, 0.15% of curing agent promoter, 8.5% of solvent, 40% of silver-coated nickel powder, 5% of alumina, 30% of silver powder and 15 wt% of resin according to the mass percentage, mixing the raw materials in a mixer for 1h, and then carrying out high-speed shearing, grinding and dispersing in a grinder to obtain the premix. Weighing a curing agent according to a formula, controlling the temperature to be in a range of-100-50 ℃, and mixing the curing agent and the premix in a mixer for 30min to obtain conductive slurry; the obtained conductive slurry passes through a 200-mesh and 800-mesh screen
Filtering to remove impurities in the slurry or disperse uneven larger particles, then placing the filtered conductive silver slurry in a vacuum defoaming machine, vacuumizing to obtain the conductive slurry, and detecting the viscosity value of the conductive slurry, wherein the required value is 4000-15000 cps.
The conductive paste prepared in the above embodiment is transfer-printed on a PC + glass fiber substrate for 3 times, the thickness of the formed film is 15-20 microns, the transfer-printed substrate is cured in an oven at 80 ℃ for 2 hours, and performance detection is performed after the formed film.
The results are shown in the following table:
the above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (10)
1. The wear-resistant conductive paste is characterized by comprising the following components in parts by weight: 0.1-1 part of water boiling adhesion promoter, 0.5-1 part of anti-overflow ink auxiliary agent, 0.2-1 part of defoaming agent, 0.2-0.5 part of dispersing agent, 0.1-0.2 part of curing agent promoter, 5-40 parts of organic solvent, 10-50 parts of wear-resistant filler, 20-40 parts of flake silver powder, 5-30 parts of resin and 0.5-0.8 part of curing agent.
2. The conductive paste of claim 1, wherein the resin is a combination of a low molecular resin and a high molecular resin; wherein the low molecular resin comprises acrylate modified short chain epoxy resin, one or more of abrasion resistant resins BY-5550, BY-9320, JN-352 and TJ-PTE500, and the TG temperature of the low molecular resin is above 60 ℃; the high molecular resin comprises high molecular weight epoxy resin: PKHH, jER8800, PKHB, TT386, GT6099, GZ7071X75, saturated polyester: one or more of ES100, BX7000A, ES110, ES120 and ES250, wherein the TG temperature of the used polymer resin is above 65 ℃.
3. The conductive paste of claim 1, wherein the organic solvent is a combination of ketones and esters; the ketone solvent comprises one or more of cyclohexanone, isophorone, N-methyl pyrrolidone and methyl ethyl ketone; the ester solvent comprises one or more of propylene glycol methyl ether acetate, ethyl acetate, n-butyl acetate, ethylene glycol ethyl ether acetate, dimethyl ester, dimethyl glutarate, propylene glycol methyl ether acetate, dimethyl adipate, butyl acetate, diethylene glycol butyl ether acetate, propyl acetate, isopropyl acetate and isobutyl acetate.
4. The abrasion-resistant conductive paste according to claim 1, wherein the water boiling adhesion promoter is one or more of titanate coupling agent, aluminate coupling agent, silane coupling agent WD-26, WD-31, WD-50, WD-56, WD-42, A150, KMB5220, KBM602, KH550, Nanda-42, Nanda-73, and Z-6032.
5. The wear-resistant conductive paste according to claim 1, wherein the dispersant is one or more of SP-762, EBS, 7043, K-702, 9300, SDJ8006, SRE-47000, AD 3013; the defoaming agent is BYK A550, CBK-208, EDL-2100 or EDL 2800.
6. The abrasion-resistant conductive paste according to claim 1, wherein the anti-bleeding aid is selected from wax powder, carbon black, graphene, carbon nanotubes, or fumed silica.
7. The abrasion-resistant conductive paste according to claim 1, wherein the curing agent is one or more selected from isocyanate, benzimidazole, acetamide, PN-23J, UN15, 010, and methyl nadic anhydride.
8. The wear-resistant conductive paste according to claim 1, wherein the wear-resistant filler is one or more of spherical nickel powder 2-10um, zirconium powder, diamond powder, aluminum powder, silver-coated nickel powder and nickel-coated carbon powder; the flake silver powder is selected from one or more of D50 1um, 2um, 5um and 8 um.
9. The abrasion resistant conductive paste of claim 1, wherein said curing agent accelerator is selected from 2101CN, DMP-30, metal carboxylates, E6623.
10. A method for preparing a wear-resistant conductive paste, based on the conductive paste formulation of any one of claims 1 to 9, comprising the steps of:
s1, preparing a premix, weighing a water boiling adhesion promoter, an anti-overflow ink auxiliary agent, a defoaming agent, a dispersing agent, a curing agent promoter, a solvent, an abrasion-resistant filler, silver powder and 5-30 wt% of acrylic acid modified polyurethane resin according to the formula ratio, mixing the raw materials in a mixer for 1h, and then shearing, grinding and dispersing at a high speed in a grinder to obtain the premix;
s2, preparing conductive slurry, namely weighing a curing agent according to a formula, controlling the temperature to be within the range of-100-50 ℃, and mixing the curing agent and the premix prepared in the step S1 in a mixer for 30min to obtain the conductive slurry;
s3, post-processing the conductive paste, namely filtering the conductive paste obtained in the step S2 through a 200-mesh and 800-mesh screen to remove impurities or large non-uniformly dispersed particles in the paste, then placing the filtered conductive paste in a vacuum defoaming machine, vacuumizing to obtain the conductive paste, and detecting the viscosity value of the conductive paste, wherein the required value is 4000-mesh and 15000 cps.
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