CN107978567A - 一种三维陶瓷基板及其制备方法 - Google Patents
一种三维陶瓷基板及其制备方法 Download PDFInfo
- Publication number
- CN107978567A CN107978567A CN201711227522.5A CN201711227522A CN107978567A CN 107978567 A CN107978567 A CN 107978567A CN 201711227522 A CN201711227522 A CN 201711227522A CN 107978567 A CN107978567 A CN 107978567A
- Authority
- CN
- China
- Prior art keywords
- ceramic
- ceramic substrate
- dimensional
- cavity
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 212
- 239000000758 substrate Substances 0.000 title claims abstract description 133
- 238000002360 preparation method Methods 0.000 title claims abstract description 19
- 239000002002 slurry Substances 0.000 claims abstract description 30
- 239000000463 material Substances 0.000 claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 239000002585 base Substances 0.000 claims description 16
- 239000012188 paraffin wax Substances 0.000 claims description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 8
- 229910052910 alkali metal silicate Inorganic materials 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 229910001868 water Inorganic materials 0.000 claims description 6
- 108010010803 Gelatin Proteins 0.000 claims description 5
- 239000008273 gelatin Substances 0.000 claims description 5
- 229920000159 gelatin Polymers 0.000 claims description 5
- 235000019322 gelatine Nutrition 0.000 claims description 5
- 235000011852 gelatine desserts Nutrition 0.000 claims description 5
- 239000004111 Potassium silicate Substances 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- NNHHDJVEYQHLHG-UHFFFAOYSA-N potassium silicate Chemical compound [K+].[K+].[O-][Si]([O-])=O NNHHDJVEYQHLHG-UHFFFAOYSA-N 0.000 claims description 4
- 229910052913 potassium silicate Inorganic materials 0.000 claims description 4
- 235000019353 potassium silicate Nutrition 0.000 claims description 4
- PAZHGORSDKKUPI-UHFFFAOYSA-N lithium metasilicate Chemical compound [Li+].[Li+].[O-][Si]([O-])=O PAZHGORSDKKUPI-UHFFFAOYSA-N 0.000 claims description 3
- 229910052912 lithium silicate Inorganic materials 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- ORVGYTXFUWTWDM-UHFFFAOYSA-N silicic acid;sodium Chemical group [Na].O[Si](O)(O)O ORVGYTXFUWTWDM-UHFFFAOYSA-N 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 12
- 238000010586 diagram Methods 0.000 description 11
- 208000002925 dental caries Diseases 0.000 description 7
- 238000005538 encapsulation Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 5
- 235000010210 aluminium Nutrition 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 229910052573 porcelain Inorganic materials 0.000 description 4
- 239000004115 Sodium Silicate Substances 0.000 description 3
- 238000000861 blow drying Methods 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 235000019795 sodium metasilicate Nutrition 0.000 description 3
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical group [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 3
- 229910052911 sodium silicate Inorganic materials 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 229920000297 Rayon Polymers 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000000499 gel Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- SWPMTVXRLXPNDP-UHFFFAOYSA-N 4-hydroxy-2,6,6-trimethylcyclohexene-1-carbaldehyde Chemical compound CC1=C(C=O)C(C)(C)CC(O)C1 SWPMTVXRLXPNDP-UHFFFAOYSA-N 0.000 description 1
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000010344 co-firing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000007363 ring formation reaction Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/4807—Ceramic parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711227522.5A CN107978567B (zh) | 2017-11-29 | 2017-11-29 | 一种三维陶瓷基板及其制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711227522.5A CN107978567B (zh) | 2017-11-29 | 2017-11-29 | 一种三维陶瓷基板及其制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107978567A true CN107978567A (zh) | 2018-05-01 |
CN107978567B CN107978567B (zh) | 2020-11-06 |
Family
ID=62008591
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201711227522.5A Active CN107978567B (zh) | 2017-11-29 | 2017-11-29 | 一种三维陶瓷基板及其制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN107978567B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108811307A (zh) * | 2018-06-29 | 2018-11-13 | 华中科技大学 | 一种三维陶瓷电路板及其制备方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000073241A1 (en) * | 1999-06-02 | 2000-12-07 | Sandia Corporation | Fabrication of ceramic microstructures from polymer compositions containing ceramic nanoparticles |
CN101786868A (zh) * | 2010-01-20 | 2010-07-28 | 湖南科技大学 | 一种免烧耐酸陶瓷的制备方法 |
JP2012234947A (ja) * | 2011-04-28 | 2012-11-29 | Mitsubishi Chemicals Corp | 半導体発光装置用樹脂パッケージ及び該樹脂パッケージを有してなる半導体発光装置並びにそれらの製造方法 |
JP2013040343A (ja) * | 2012-10-23 | 2013-02-28 | Hitachi Chemical Co Ltd | リフレクターの製造方法及びled装置 |
JP2013043329A (ja) * | 2011-08-23 | 2013-03-04 | Towa Corp | 反射体付基板の製造方法及び製造装置 |
KR20130027709A (ko) * | 2011-09-08 | 2013-03-18 | 삼성테크윈 주식회사 | 엘이디용 리플렉터 제조 방법 |
CN106981458A (zh) * | 2017-03-24 | 2017-07-25 | 武汉利之达科技股份有限公司 | 一种含腔体结构的三维陶瓷基板及其制备方法 |
-
2017
- 2017-11-29 CN CN201711227522.5A patent/CN107978567B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000073241A1 (en) * | 1999-06-02 | 2000-12-07 | Sandia Corporation | Fabrication of ceramic microstructures from polymer compositions containing ceramic nanoparticles |
CN101786868A (zh) * | 2010-01-20 | 2010-07-28 | 湖南科技大学 | 一种免烧耐酸陶瓷的制备方法 |
JP2012234947A (ja) * | 2011-04-28 | 2012-11-29 | Mitsubishi Chemicals Corp | 半導体発光装置用樹脂パッケージ及び該樹脂パッケージを有してなる半導体発光装置並びにそれらの製造方法 |
JP2013043329A (ja) * | 2011-08-23 | 2013-03-04 | Towa Corp | 反射体付基板の製造方法及び製造装置 |
KR20130027709A (ko) * | 2011-09-08 | 2013-03-18 | 삼성테크윈 주식회사 | 엘이디용 리플렉터 제조 방법 |
JP2013040343A (ja) * | 2012-10-23 | 2013-02-28 | Hitachi Chemical Co Ltd | リフレクターの製造方法及びled装置 |
CN106981458A (zh) * | 2017-03-24 | 2017-07-25 | 武汉利之达科技股份有限公司 | 一种含腔体结构的三维陶瓷基板及其制备方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108811307A (zh) * | 2018-06-29 | 2018-11-13 | 华中科技大学 | 一种三维陶瓷电路板及其制备方法 |
Also Published As
Publication number | Publication date |
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CN107978567B (zh) | 2020-11-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20190109 Address after: 430200 Wuhan four East Lake Road Development Zone, Hubei 40 Gezhouba Dam 40 Sun City 23 building 103 room. Applicant after: WUHAN LIZHIDA TECHNOLOGY CO.,LTD. Address before: 430074 Hubei Province, Wuhan city Hongshan District Luoyu Road No. 1037 Applicant before: Huazhong University of Science and Technology |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: The invention relates to a three-dimensional ceramic substrate and a preparation method thereof Effective date of registration: 20220317 Granted publication date: 20201106 Pledgee: Bank of China Limited Wuhan provincial branch Pledgor: WUHAN LIZHIDA TECHNOLOGY CO.,LTD. Registration number: Y2022420000066 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20201106 Pledgee: Bank of China Limited Wuhan provincial branch Pledgor: WUHAN LIZHIDA TECHNOLOGY CO.,LTD. Registration number: Y2022420000066 |