CN107975973A - A kind of liquid-type semiconductor heat-exchanger - Google Patents
A kind of liquid-type semiconductor heat-exchanger Download PDFInfo
- Publication number
- CN107975973A CN107975973A CN201711089458.9A CN201711089458A CN107975973A CN 107975973 A CN107975973 A CN 107975973A CN 201711089458 A CN201711089458 A CN 201711089458A CN 107975973 A CN107975973 A CN 107975973A
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- CN
- China
- Prior art keywords
- heat
- exchanger
- liquid
- type semiconductor
- plate liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
- F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/021—Control thereof
- F25B2321/0212—Control thereof of electric power, current or voltage
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/023—Mounting details thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2500/00—Problems to be solved
- F25B2500/12—Sound
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of liquid-type semiconductor heat-exchanger, belong to technical field of heat exchange.Liquid-type semiconductor heat-exchanger includes：Shell, set heat-exchanger rig inside the shell and the driving device being electrically connected with heat-exchanger rig, heat-exchanger rig includes semiconductor thermoelectric piece, the two-sided heat exchanger of plate liquid and plate liquid single side heat exchanger, the two-sided heat exchanger of plate liquid is located at the centre of heat-exchanger rig, and the two-sided heat exchanger both sides of plate liquid are equipped with semiconductor thermoelectric piece and plate liquid single side heat exchanger successively from inside to outside.Present invention decreases endotherm area, increases heat release area, semiconductor thermoelectric piece heating efficiency is fully used more than 1, can be as the core of air-source water heater, can also be as the core of air conditioner.
Description
Technical field
The present invention relates to technical field of heat exchange, and in particular to a kind of liquid-type semiconductor heat-exchanger.
Background technology
1821, German Seebeck (see-beck) found thermoelectric effect, the only temperature difference in measurement temperature in a metal
Applied in terms of galvanic couple.After semiconductor occurs, it is found that it can obtain the thermoelectromotive force more much bigger than metal, thermal energy and electricity
Can change has higher efficiency, therefore, is developed in terms of thermo-electric generation, thermoelectric cooling.
Semiconductor chilling plate, is also thermoelectric module, is a kind of heat pump.Its advantages of is no slide unit, is applied
Some spaces are restricted, and reliability requirement is high, the occasion of no refrigerant pollution.Using the Peltier effects of semi-conducting material,
When the galvanic couple that direct current is connected into by two kinds of different semi-conducting materials, heat can be absorbed respectively at the both ends of galvanic couple and put
Go out heat, it is possible to achieve the purpose of refrigeration.It is a kind of Refrigeration Technique for producing negative thermal resistance, its main feature is that movement-less part, can
It is also higher by property.
Heat exchange process, which is carried out, currently with semiconductor chilling plate is mainly used in water dispenser, small frozen device, thermostat
And dew-point hygrometer etc., also there is the application on a small quantity in terms of field of air conditioning, but its refrigeration effect need further
Improve.
The content of the invention
It is an object of the invention to provide a kind of liquid-type semiconductor heat-exchanger, is existed with solving existing semiconductor chilling plate
Using when refrigeration effect it is bad the problem of, especially in terms of air conditioner refrigerating.
The technical solution that the present invention solves above-mentioned technical problem is as follows：
A kind of liquid-type semiconductor heat-exchanger, including：Shell, set heat-exchanger rig inside the shell and filled with heat exchange
The driving device of electrical connection is put, heat-exchanger rig includes semiconductor thermoelectric piece, the two-sided heat exchanger of plate liquid and plate liquid single side
Heat exchanger, the two-sided heat exchanger of plate liquid are located at the centre of heat-exchanger rig, the two-sided heat exchanger both sides of plate liquid from inside to outside according to
It is secondary to be equipped with semiconductor thermoelectric piece and plate liquid single side heat exchanger.
Further, in preferred embodiments of the present invention, heat conduction has been respectively coated in the both sides of above-mentioned semiconductor thermoelectric piece
Silicone grease layer, semiconductor thermoelectric piece pass through thermal grease layer heat exchanger and plate liquid single side heat exchanger two-sided with plate liquid respectively
Connection.
Further, in preferred embodiments of the present invention, above-mentioned semiconductor thermoelectric piece is bismuth telluride.
Further, in preferred embodiments of the present invention, above-mentioned driving device includes drive circuit and with driving electricity
The pwm chip that road is electrically connected, drive circuit is H-bridge circuit.
Further, in preferred embodiments of the present invention, above-mentioned driving device is installed on shell.
Further, in preferred embodiments of the present invention, heat insulation foam layer is equipped between above-mentioned heat-exchanger rig and shell.
Further, in preferred embodiments of the present invention, aforesaid liquid formula semiconductor heat-exchanger is further included for pressing from both sides
The clamping piece of fixed heat-exchanger rig is held, clamping piece is arranged at the both sides of heat-exchanger rig, and the both ends of clamping piece are consolidated by bolt respectively
Fixed connection, wherein one end of clamping piece is secured by bolts in shell.
The invention has the advantages that：
(1) present invention using semiconductor thermoelectric piece refrigeration principle progress heat exchange, can as the core as air conditioner,
Can also air-source water heater core.The present invention can ban compressor in heating, the application of refrigerating field, reduction freon
Use, reduce the use of refrigerant, make people no longer for refrigeration system Welding Problems worry.The present invention uses semiconductor heat
Electric piece carries out heat exchange process, it is pure electronics heat exchange, and no mechanical slip, can avoid producing during mechanical heat pump compressor use
Raw noise.It is longer than compressor without mechanical loss, its service life to be additionally, since the present invention.The present invention passes through inside and outside bilayer
The two-sided heat exchanger of plate liquid and plate liquid single side heat exchanger, reduce the endotherm area of semiconductor thermoelectric piece, increase
Heat release area, makes partly to lead thermoelectric slice heating efficiency and is fully used more than 1.
(2) present invention is designed using H-bridge drive circuit, can make changes in temperature switching more freely so that whole product is more
Highly efficient durable.The present invention drives semiconductor thermoelectric piece by H-bridge circuit, can realize that temperature commutates in the several seconds to tens of seconds time,
Reach hot and cold alternation, avoid common air conditioner in cold and hot commutation to the demand of external solenoid valve.The present invention is by complete
Bridge circuit realizes commutation, simple and convenient not by any mechanical process.
(3) present invention is controlled H-bridge drive circuit by pwm chip, can accurately control whole heat exchange
The temperature difference of device, realizes speed governing more faster than frequency converting air-conditioner compressor, while more energy saving.
(4) power consumption smaller of the present invention, and it is more safe and reliable.
Brief description of the drawings
Fig. 1 is structure diagram of the liquid-type semiconductor heat-exchanger of the embodiment of the present invention under the first visual angle；
Fig. 2 is structure diagram of the liquid-type semiconductor heat-exchanger of the embodiment of the present invention under the second visual angle；
Fig. 3 is structure diagram of the liquid-type semiconductor heat-exchanger of the embodiment of the present invention under the 3rd visual angle；
Fig. 4 is the explosive view of the liquid-type semiconductor heat-exchanger part-structure of the embodiment of the present invention；
Fig. 5 is the explosive view of the liquid-type semiconductor heat-exchanger part-structure of the embodiment of the present invention.
In figure：100- liquid-type semiconductor heat-exchangers；110- shells；120- heat-exchanger rigs；121- semiconductor thermoelectric pieces；
The two-sided heat exchanger of 122- plate liquids；123- plate liquid single side heat exchangers；124- thermal grease layers；130- driving devices；
140- clamping pieces；150- bolts；151- nuts.
Embodiment
The principle and features of the present invention will be described below with reference to the accompanying drawings, and the given examples are served only to explain the present invention, and
It is non-to be used to limit the scope of the present invention.
Embodiment
Fig. 1, Fig. 2 and Fig. 3 are refer to, the liquid-type semiconductor heat-exchanger 100 of the embodiment of the present invention includes：Shell 110,
The heat-exchanger rig 120 being arranged in shell 110 and the driving device 130 being electrically connected with heat-exchanger rig 120.
Fig. 4 and Fig. 5 are refer to, heat-exchanger rig 120 includes semiconductor thermoelectric piece 121, two-sided 122 and of heat exchanger of plate liquid
Plate liquid single side heat exchanger 123.The two-sided heat exchanger 122 of plate liquid is located at the centre of heat-exchanger rig 120, and plate liquid is two-sided
122 both sides of heat exchanger are equipped with semiconductor thermoelectric piece 121 and plate liquid single side heat exchanger 123 successively from inside to outside.Semiconductor heat
Electric piece 121 is arranged between the two-sided heat exchanger 122 of plate liquid and plate liquid single side heat exchanger 123.Whole heat-exchanger rig 120
In the shape of sandwich biscuits centered on the two-sided heat exchanger 122 of plate liquid.The two-sided heat exchanger 122 of plate liquid and plate liquid
The housing of single side heat exchanger 123 is aluminium alloy burnishing shell, can increase heat conduction efficiency.
As shown in Figure 4 and Figure 5, thermal grease layer 124, semiconductor heat has been respectively coated in the both sides of semiconductor thermoelectric piece 121
By thermal grease layer 124, two-sided with plate liquid heat exchanger 122 and plate liquid single side heat exchanger 123 connect electric piece 121 respectively
Connect.Heat insulation foam layer (not shown) is equipped between heat-exchanger rig 120 and shell 110.
The semiconductor thermoelectric piece 121 that the embodiment of the present invention uses is preferably bismuth telluride or Bi-Sb-Te-Se systems
Material, such as Bi9Sb31Se60, can be skutterudite structure section bar material, such as CoSb3、CoAs3, can be Clathrates knots
Configuration material, such as Sr8Eu4Ga16Ge30Or other unrequited existing semi-conductor thermoelectric materials.
Fig. 4 and Fig. 5 are refer to, shell 110 has the U-shaped chamber for being used for accommodating heat-exchanger rig 120.Shell 110 is by three pieces
The U-shaped structure that plate is formed, can also be understood to be U-board.
Referring to Fig.1 and 2, driving device 130 is installed on shell 110, positioned at the outer wall of shell 110, with semiconductor
Thermoelectric slice 121 is electrically connected.In Fig. 1 and embodiment illustrated in fig. 2, the quantity of driving device 130 is two, two driving dresses
The semi-conductor electricity backing for putting 130 122 both sides of heat exchanger two-sided with plate liquid respectively is electrically connected, for driving electrothermal semiconductor
Piece.Driving device 130 includes drive circuit and the pwm chip being electrically connected with drive circuit, and drive circuit is H bridges electricity
Road.The drive circuit figure of the embodiment of the present invention employs full-bridge connection, semiconductor thermoelectric slice 121 can be realized and commutated, its is defeated
Go out to be connected on semiconductor thermoelectric piece 121, the PWM pulse width modulation controlleds to electric bridge are realized by pwm chip.Bridge-drive
Using two high-power driving chip BTS7960, it may be achieved temperature control.Pulse width modulation frequency can be from 50-150KHz, two-way
PWM inputs can connect the microcontroller in peripheral system.
Fig. 2 is refer to, liquid-type semiconductor heat-exchanger 100 further includes the clamping for gripping heat-exchanger rig 120
Piece 140, clamping piece 140 are arranged at the both sides of heat-exchanger rig 120, and the both ends of clamping piece 140 are fixed by bolt 150 respectively to be connected
Connect, wherein one end of clamping piece 140 is fixed in shell 110 by bolt 150.It is apparent that the present invention includes matching somebody with somebody with bolt 150
The nut 151 of set.
The operation principle of the present invention is illustrated below.
The present invention is with semiconductor thermoelectric piece 121 for heat transfer instrument.When one piece of N-type semiconductor material and one piece of p-type are partly led
The thermocouple centering that body material is coupled to have electric current by when, heat transfer will be produced between both ends, heat will be from one end
The other end is transferred to, so that producing the temperature difference forms hot and cold side.But due to semiconductor itself there are resistance when electric current is led through more than half
Heat will be produced during body, so that heat transfer can be influenced.And the heat between two pole plates can also pass through air and semiconductor
Material itself carries out reverse heat transfer.When hot and cold side reaches certain temperature difference, when the amount of both heat transfers is equal, one will be reached
A equalization point, just reverse heat transfer are cancelled out each other.The temperature of hot and cold side would not continue to change at this time.It is lower in order to reach
Temperature, the modes such as heat dissipation can be taken to reduce the temperature in hot junction to realize.Semiconductor thermoelectric piece 121 is made heat by the present invention
Pump, realizes the temperature difference at cold and hot both ends, and the semiconductor thermoelectric piece 121 for being arranged on two-sided 122 both sides of heat exchanger of plate liquid is distinguished
As the two poles of the earth of air conditioner, to replace status of the compressor in air-conditioning, by the two-sided heat exchanger 122 of plate liquid and board-like
The liquid heat transfer of liquid single side heat exchanger 123, more preferable can must provide working environment for thermoelectric slice.
The foregoing is merely presently preferred embodiments of the present invention, is not intended to limit the invention, it is all the present invention spirit and
Within principle, any modification, equivalent replacement, improvement and so on, should all be included in the protection scope of the present invention.
Claims (7)
- A kind of 1. liquid-type semiconductor heat-exchanger, it is characterised in that including：Shell, the heat exchange being arranged in shell dress The driving device put and be electrically connected with heat-exchanger rig, the heat-exchanger rig includes semiconductor thermoelectric piece, plate liquid is two-sided changes Hot device and plate liquid single side heat exchanger, the two-sided heat exchanger of plate liquid are located at the centre of the heat-exchanger rig, the plate The two-sided heat exchanger both sides of formula liquid are equipped with the semiconductor thermoelectric piece and the plate liquid single side heat exchanger successively from inside to outside.
- 2. liquid-type semiconductor heat-exchanger according to claim 1, it is characterised in that the two of the semiconductor thermoelectric piece Thermal grease layer has been respectively coated in side, and the semiconductor thermoelectric piece is double with the plate liquid respectively by the thermal grease layer Face heat exchanger is connected with the plate liquid single side heat exchanger.
- 3. liquid-type semiconductor heat-exchanger according to claim 1, it is characterised in that the semiconductor thermoelectric piece is tellurium Change bismuth.
- 4. liquid-type semiconductor heat-exchanger according to claim 1, it is characterised in that the driving device includes driving Circuit and the pwm chip being electrically connected with the drive circuit, the drive circuit are H-bridge circuit.
- 5. liquid-type semiconductor heat-exchanger according to claim 1, it is characterised in that the driving device is installed on institute State on shell.
- 6. liquid-type semiconductor heat-exchanger according to claim 1, it is characterised in that the heat-exchanger rig with it is described outer Heat insulation foam layer is equipped between shell.
- 7. liquid-type semiconductor heat-exchanger according to any one of claims 1 to 6, it is characterised in that the liquid-type Semiconductor heat-exchanger further includes the clamping piece for gripping the heat-exchanger rig, and the clamping piece is arranged at the heat exchange The both sides of device, the both ends of the clamping piece are bolted to connection respectively, and wherein one end of the clamping piece passes through bolt It is fixed in the shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711089458.9A CN107975973A (en) | 2017-11-08 | 2017-11-08 | A kind of liquid-type semiconductor heat-exchanger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711089458.9A CN107975973A (en) | 2017-11-08 | 2017-11-08 | A kind of liquid-type semiconductor heat-exchanger |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107975973A true CN107975973A (en) | 2018-05-01 |
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ID=62013073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711089458.9A Pending CN107975973A (en) | 2017-11-08 | 2017-11-08 | A kind of liquid-type semiconductor heat-exchanger |
Country Status (1)
| Country | Link |
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| CN (1) | CN107975973A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114341572A (en) * | 2019-07-15 | 2022-04-12 | 具特拉有限公司 | Adiabatic demagnetization equipment |
| CN115164445A (en) * | 2022-07-15 | 2022-10-11 | 中国电子科技集团公司第十研究所 | Semiconductor thermoelectric refrigerator structure and enhanced heat exchange method |
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| CN2519210Y (en) * | 2001-11-27 | 2002-10-30 | 李洪 | Semiconductor heat-exchanger |
| CN2630912Y (en) * | 2003-05-23 | 2004-08-04 | 华中科技大学 | High-precision temperature control circuit for thermoelectric refrigerator |
| CN101675718A (en) * | 2007-04-12 | 2010-03-17 | 利塔尔两合公司 | Thermoelectric tempering device |
| CN101922774A (en) * | 2009-06-13 | 2010-12-22 | 刘万辉 | Open external heat exchanging type semiconductor air conditioner |
| CN201909410U (en) * | 2011-01-11 | 2011-07-27 | 苏州市泰顺电器有限公司 | Semiconductor air conditioner |
| CN104838510A (en) * | 2012-12-10 | 2015-08-12 | 马勒国际公司 | Heat exchanger, particularly for motor vehicle |
| CN207379108U (en) * | 2017-11-08 | 2018-05-18 | 成都航空职业技术学院 | A kind of liquid-type semiconductor heat-exchanger |
-
2017
- 2017-11-08 CN CN201711089458.9A patent/CN107975973A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2519210Y (en) * | 2001-11-27 | 2002-10-30 | 李洪 | Semiconductor heat-exchanger |
| CN2630912Y (en) * | 2003-05-23 | 2004-08-04 | 华中科技大学 | High-precision temperature control circuit for thermoelectric refrigerator |
| CN101675718A (en) * | 2007-04-12 | 2010-03-17 | 利塔尔两合公司 | Thermoelectric tempering device |
| CN101922774A (en) * | 2009-06-13 | 2010-12-22 | 刘万辉 | Open external heat exchanging type semiconductor air conditioner |
| CN201909410U (en) * | 2011-01-11 | 2011-07-27 | 苏州市泰顺电器有限公司 | Semiconductor air conditioner |
| CN104838510A (en) * | 2012-12-10 | 2015-08-12 | 马勒国际公司 | Heat exchanger, particularly for motor vehicle |
| CN207379108U (en) * | 2017-11-08 | 2018-05-18 | 成都航空职业技术学院 | A kind of liquid-type semiconductor heat-exchanger |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114341572A (en) * | 2019-07-15 | 2022-04-12 | 具特拉有限公司 | Adiabatic demagnetization equipment |
| CN115164445A (en) * | 2022-07-15 | 2022-10-11 | 中国电子科技集团公司第十研究所 | Semiconductor thermoelectric refrigerator structure and enhanced heat exchange method |
| CN115164445B (en) * | 2022-07-15 | 2023-10-24 | 中国电子科技集团公司第十研究所 | Semiconductor thermoelectric refrigerator structure and enhanced heat exchange method |
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Application publication date: 20180501 |