CN201909410U - Semiconductor air conditioner - Google Patents
Semiconductor air conditioner Download PDFInfo
- Publication number
- CN201909410U CN201909410U CN2011200061172U CN201120006117U CN201909410U CN 201909410 U CN201909410 U CN 201909410U CN 2011200061172 U CN2011200061172 U CN 2011200061172U CN 201120006117 U CN201120006117 U CN 201120006117U CN 201909410 U CN201909410 U CN 201909410U
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- semiconductor
- water tank
- heat exchange
- semiconductor air
- air
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Abstract
The utility model discloses a semiconductor air conditioner, comprising an energy transferring water tank, radiating fins positioned on the energy transferring water tank, a fan, a waste temperature water discharging tank and semiconductor refrigerating pieces, wherein the fan blows towards the radiating fins. The semiconductor air conditioner is characterized in that refrigerating surfaces and heating surfaces of the semiconductor refrigerating pieces are respectively attached with heat exchange water tanks; and the heat exchange water tanks are respectively connected with the energy transferring water tank and the waste temperature water discharging tank by a micropump. In the semiconductor air conditioner, the refrigerating mode is simple, the noise is low, the heat exchange efficiency is high, and the efficiency ratio reaches 2.4, the refrigerating mode of the semiconductor air conditioner is close to a direct refrigerating mode. In addition, the water is used as a cooling agent, and no pollution is caused to the environment.
Description
Technical field
The utility model relates to a kind of refrigeration plant, especially a kind of semiconductor air-conditioner.
Background technology
The air-conditioner of prior art is the liquid refrigerant R22 in the outdoor inlet chamber, in the inlet chamber in the exchanging air (evaporimeter) with the room in air carry out heat exchange.Liquid R22 cold-producing medium is because the heat that absorbs in the space air becomes gas by liquid, and its temperature, pressure does not all change, and the air in the room is pulled away owing to heat, and temperature descends, and cold air blows out from air outlet.Liquid R22 cold-producing medium is behind indoor the gasification, in the compressor of the inlet chamber outside, become the gas of high temperature, high pressure by compressor compresses, enter then in the outdoor heat exchange gas (condenser), the gas refrigerant of HTHP carries out heat exchange in outdoor air in condenser pipe, the liquid of warm high pressure in being cooled into.After outdoor air absorbed heat, temperature raise and is discharged in the external environment.The middle temperature highly pressurised liquid that is come out by condenser pipe must make its temperature, pressure all drop to original low-temp low-pressure state through throttling arrangement decompression cooling.General packaged air-conditioner adopts capillary-compensated.In process of refrigerastion, the temperature of evaporator surface is usually less than the room air dew-point temperature that is cooled, and condensate water constantly flows out from evaporator surface.Like this cold-producing medium in compression, condensation, throttling, evaporate in these four processes and go round and begin again, produce refrigeration effect continuously.Realize the air-conditioner complex structure of said process, production cost is higher, and refrigerating efficiency is lower, and energy waste is big.And, can destroy atmosphere, contaminated environment because cold-producing medium uses freon.
Summary of the invention
The utility model purpose is: provide a kind of simple in structure, easy to use, the semiconductor air-conditioner of energy-conserving and environment-protective.
The technical solution of the utility model is: a kind of semiconductor air-conditioner, comprise that energy transmits water tank, is positioned at fin, blower fan, useless warm water discharge case and semiconductor chilling plate on the described energy transmission water tank, described blower fan blows facing to described fin, it is characterized in that, the chill surface of described semiconductor chilling plate and the face that heats are close to the heat exchange water tank respectively, and described heat exchange water tank transmits water tank by micropump with described energy respectively and useless warm water discharge case links to each other.
Preferably, except the place that contacts with semiconductor chilling plate, thermal insulation layer is arranged all on the described heat exchange water tank.
Preferably, described thermal insulation layer is an insulating layer of asbestos.
Preferably, the volume of described useless warm water discharge case be heat exchange water tank volume 7-10 doubly.
Preferably, in the described useless warm water discharge case deflector is arranged.
Preferably, described useless warm water discharge case also is provided with fin outward.
Preferably, also comprise the semiconductor air-conditioner control circuit, described semiconductor air-conditioner control circuit links to each other with semiconductor chilling plate.
The utility model has the advantages that:
Adopt high efficiency semiconductor refrigeration chip as heat exchanger, refrigeration modes is simple, and noise is little, the heat exchanger effectiveness height, and the efficient ratio reaches 2.4, approaches direct refrigeration modes.Make water as cooling agent in addition, environment is not polluted.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further described:
Fig. 1 is a semiconductor air-conditioner structure chart of the present utility model.
Fig. 2 is a semiconductor air-conditioner partial enlarged drawing of the present utility model.
Fig. 3 is the useless warm water discharge box structure figure of semiconductor air-conditioner of the present utility model.
Fig. 4 is the control circuit figure of semiconductor air-conditioner of the present utility model.
Wherein: 1 semiconductor chilling plate; 2 heat exchange water tanks; 3 heat exchange water tanks; 4 energy transmit water tank; 5 working cycles water tanks; 6 useless warm water discharge casees; 7 heat insulation foams; 8 deflectors.
The specific embodiment
Embodiment: as Fig. 1, the semiconductor air-conditioner shown in 2 comprises two-layer semiconductor chilling plate 1, and this two-layer semiconductor chilling plate modes of emplacement is for relative in twos, and promptly the chill surface of two-layer semiconductor chilling plate is that rightabout places.Heat exchange water tank 2 is arranged between the two-layer semiconductor chilling plate, heat exchange water tank 2 is close to the chill surface of semiconductor chilling plate 1, the other one side of semiconductor chilling plate 1 also is close to heat exchange water tank 3, heat exchange water tank 2 transmits water tank 4 by working cycles water tank 5 and energy and links to each other, and the cold-producing medium in above-mentioned each water tank is a water.In the working cycles water tank 5 micropump is arranged, can be so that water transmits circulation between the water tank 4 at heat exchange water tank 2 and energy.Heat exchange water tank 3 links to each other with useless warm water discharge case 6.Except the place that contacts with semiconductor chilling plate insulating layer of asbestos is arranged all on the heat exchange water tank 2 and 3, also all there is thermal insulation layer other water tanks and pipeline outside.Semiconductor chilling plate cold junction refrigeration hot junction heats under the effect of electric current, the semiconductor chilling plate cold junction makes the water temperature in the heat exchange water tank 2 reduce, the water of low temperature flows to energy and transmits water tank 4 under the effect of working cycles water tank 5, energy transmits on the water tank 4 fin, fan blows facing to the fin that energy transmits water tank 4, make the ambient air temperature reduce, and energy transmit the water that heats up in the water tank and continues to flow to and go cooling in the heat exchange water tank.In order to improve refrigerating efficiency, reduce hot-side temperature as early as possible to increase the two ends temperature difference, improve refrigeration, water in the heat exchange water tank 3 in hot junction absorbs the temperature in hot junction, and flow to heat radiation in the useless warm water discharge case 6, in order to improve radiating efficiency, the volume of useless warm water discharge case is 7-10 a times of heat exchange water tank volume.Be provided with deflector 8 in the useless warm water discharge case 6 as shown in Figure 3, it is mobile that deflector 8 makes that water is s shape in the heat exchange water tank, improves radiating efficiency.In order further to improve the radiating efficiency of useless warm water discharge case, can also load onto fin on the useless warm water discharge case.In order to make semiconductor air-conditioner of the present utility model can realize heating and refrigerating function, this semiconductor air-conditioner has also comprised the semiconductor air-conditioner control circuit, this control circuit is a prior art, and this control circuit can be realized the conversion in semiconductor chilling plate cold junction and hot junction as shown in Figure 3.
Above embodiment only is the utility model a kind of embodiment wherein, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model claim.Should be pointed out that for the person of ordinary skill of the art under the prerequisite that does not break away from the utility model design, can also make some distortion and improvement, these all belong to protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be as the criterion with claims.
Claims (7)
1. semiconductor air-conditioner, comprise that energy transmits water tank, is positioned at fin, blower fan, useless warm water discharge case and semiconductor chilling plate on the described energy transmission water tank, described blower fan blows facing to described fin, it is characterized in that, the chill surface of described semiconductor chilling plate and the face that heats are close to the heat exchange water tank respectively, and described heat exchange water tank transmits water tank by micropump with described energy respectively and useless warm water discharge case links to each other.
2. semiconductor air-conditioner according to claim 1 is characterized in that, except the place that contacts with semiconductor chilling plate thermal insulation layer is arranged all on the described heat exchange water tank.
3. semiconductor air-conditioner according to claim 2 is characterized in that, described thermal insulation layer is an insulating layer of asbestos.
4. semiconductor air-conditioner according to claim 1 is characterized in that, the volume of described useless warm water discharge case is 7-10 a times of heat exchange water tank volume.
5. semiconductor air-conditioner according to claim 1 is characterized in that, in the described useless warm water discharge case deflector is arranged.
6. semiconductor air-conditioner according to claim 1 is characterized in that, described useless warm water discharge case also is provided with fin outward.
7. semiconductor air-conditioner according to claim 1 is characterized in that, also comprises the semiconductor air-conditioner control circuit, and described semiconductor air-conditioner control circuit links to each other with semiconductor chilling plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200061172U CN201909410U (en) | 2011-01-11 | 2011-01-11 | Semiconductor air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200061172U CN201909410U (en) | 2011-01-11 | 2011-01-11 | Semiconductor air conditioner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201909410U true CN201909410U (en) | 2011-07-27 |
Family
ID=44301611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200061172U Expired - Fee Related CN201909410U (en) | 2011-01-11 | 2011-01-11 | Semiconductor air conditioner |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201909410U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102022795A (en) * | 2011-01-11 | 2011-04-20 | 苏州市泰顺电器有限公司 | Semiconductor air-conditioner |
| CN106379139A (en) * | 2016-10-18 | 2017-02-08 | 河海大学 | Solar vehicle-mounted auxiliary air conditioner system |
| CN107975973A (en) * | 2017-11-08 | 2018-05-01 | 成都航空职业技术学院 | A kind of liquid-type semiconductor heat-exchanger |
| CN111237933A (en) * | 2020-02-24 | 2020-06-05 | 上海绿筑住宅系统科技有限公司 | Hybrid cooling system between unmanned on duty equipment of no external electricity |
-
2011
- 2011-01-11 CN CN2011200061172U patent/CN201909410U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102022795A (en) * | 2011-01-11 | 2011-04-20 | 苏州市泰顺电器有限公司 | Semiconductor air-conditioner |
| CN106379139A (en) * | 2016-10-18 | 2017-02-08 | 河海大学 | Solar vehicle-mounted auxiliary air conditioner system |
| CN107975973A (en) * | 2017-11-08 | 2018-05-01 | 成都航空职业技术学院 | A kind of liquid-type semiconductor heat-exchanger |
| CN111237933A (en) * | 2020-02-24 | 2020-06-05 | 上海绿筑住宅系统科技有限公司 | Hybrid cooling system between unmanned on duty equipment of no external electricity |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110727 Termination date: 20120111 |