CN107958854A - A kind of LED light strip chip mounter of integrated electro detecting system - Google Patents
A kind of LED light strip chip mounter of integrated electro detecting system Download PDFInfo
- Publication number
- CN107958854A CN107958854A CN201711160912.5A CN201711160912A CN107958854A CN 107958854 A CN107958854 A CN 107958854A CN 201711160912 A CN201711160912 A CN 201711160912A CN 107958854 A CN107958854 A CN 107958854A
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- China
- Prior art keywords
- led
- probe
- suction nozzle
- chip mounter
- light strip
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- 239000000523 sample Substances 0.000 claims abstract description 35
- 238000001514 detection method Methods 0.000 claims abstract description 26
- 230000003287 optical effect Effects 0.000 claims abstract description 16
- 239000013536 elastomeric material Substances 0.000 claims description 4
- 230000004907 flux Effects 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 230000008569 process Effects 0.000 abstract description 6
- 230000000694 effects Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Devices (AREA)
Abstract
The present invention provides a kind of LED light strip chip mounter of integrated electro detecting system, including：Suction nozzle, the suction nozzle includes hollow insulating body, is positioned at hollow insulating body inner wall and opposite the first probe and the second probe, first probe and the second probe configuration, is contacted respectively with the P electrode and N electrode of LED when drawing LED using suction nozzle；Optical detection apparatus, the optical detection apparatus is located at the inside of hollow insulating body, for detecting the optical parameter of LED；And electrical detection device, the electrical detection device is electrical connected with the first probe and the second probe, for detecting the electrical parameter of LED.Compared with existing chip mounter, the present invention passes through the integrated electro detecting system on the suction nozzle of chip mounter, it may be implemented in and its every photoelectric properties is detected when suction nozzle draws LED, the LED detection processes after the completion of LED attachments are reduced, the production cost of LED light strip is significantly reduced and improves the production efficiency of LED light strip.
Description
Technical field
The present invention relates to LED light strip manufacture field, more particularly, to a kind of LED light strip patch of integrated electro detecting system
Machine.
Background technology
LED (Light Emitting Diode, light emitting diode) industry is one of industry to attract most attention in recent years, hair
Exhibition so far, LED product have energy saving, power saving, high efficiency, the reaction time soon, the life cycle time it is long and not mercurous, with
The advantages that environmental benefit, have been used in illumination and decorative use.LED light bar, generally will using chip mounter on processing procedure
LED is mounted on strip substrate surface to form the LED light bar with multiple LED.Traditional chip mounter uses a vacuum slot
To draw LED element, then LED element is placed on the substrate of lamp bar, to complete the patch process of LED element, is then examined again
Whether the every photoelectric parameter for testing the LED being mounted on substrate is normal.But add one of inspection man again after the completion of patch process
Sequence, meeting labor intensive and time, the Productive statistics of increase assembling manufacturer.
The content of the invention
The present invention provides a kind of LED light strip chip mounter of integrated electro detecting system, it is detected when drawing LED to realize
Whether every photoelectric properties parameter is normal, subsequent detection process is reduced, so as to reduce production cost.
The technical scheme is that a kind of LED light strip chip mounter of integrated electro detecting system, including：
Suction nozzle, the suction nozzle include hollow insulating body, positioned at hollow insulating body inner wall and the first opposite probe
With the second probe, first probe and the second probe configuration be, when drawing LED using suction nozzle respectively with the P electrode of LED and
N electrode contacts；
Optical detection apparatus, the optical detection apparatus is located at the inside of hollow insulating body, for detecting the optics of LED
Parameter；And
Electrical detection device, the electrical detection device is electrical connected with the first probe and the second probe, for detecting LED
Electrical parameter.
Preferably, the suction nozzle is connected with a vacuum pump, to realize that the suction of hollow insulating body inner air is put.
Preferably, the suction nozzle is made of elastomeric material.
Preferably, the shape of the hollow insulating body of the suction nozzle is cylinder or rectangle.
Preferably, the optical parameter includes at least one of following：Luminous flux, luminous efficiency, luminous intensity, light intensity
Distribution, peak luminous wavelength and colour temperature.
Preferably, the electrical parameter includes at least one of following：IV characteristic curves, forward voltage, backward voltage
And reverse current.
Beneficial effects of the present invention are：
Compared with existing chip mounter, the present invention by the integrated electro detecting system on the suction nozzle of chip mounter, it can be achieved that
Its every photoelectric properties is detected when suction nozzle draws LED, reduces the LED detection processes after the completion of LED attachments, effectively
Reduce the production cost of LED light strip and improve the production efficiency of LED light strip.
Brief description of the drawings
The present invention is described below below in conjunction with the accompanying drawings, feature of the invention and advantage will become obvious, this
A little attached drawings are not intended to limit the scope of the invention, but in order to show its some attribute, wherein：
Fig. 1 show the module map of the LED light strip chip mounter of integrated electro detecting system according to the present invention；
The nozzle structure vertical view that Fig. 2 show the LED light strip chip mounter of integrated electro detecting system according to the present invention is shown
It is intended to；
The nozzle structure side view that Fig. 3 show the LED light strip chip mounter of integrated electro detecting system according to the present invention is shown
It is intended to.
Embodiment
Carried out clearly below with reference to the technique effect of the design of embodiment and attached drawing to the present invention, concrete structure and generation
Chu, complete description, to be completely understood by the purpose of the present invention, scheme and effect.It should be noted that in situation about not conflicting
Under, the feature in embodiment and embodiment in the application can be mutually combined.
It should be noted that unless otherwise specified, when a certain feature is referred to as " fixing ", " connection " in another feature,
It can directly fix, be connected in another feature, can also indirectly fix, be connected in another feature.In addition, this
The descriptions such as the upper and lower, left and right used in invention are only to be closed relative to the mutual alignment of each part of the present invention in attached drawing
For system.In " one kind " of singulative of the invention and used in the attached claims, " described " and "the" also purport
Including most forms, unless context clearly shows that other implications.
In addition, unless otherwise defined, the technology of all of technologies and scientific terms used here by the article and the art
The normally understood implication of personnel is identical.Term used in the description is intended merely to description specific embodiment herein, without
It is to limit the present invention.Term as used herein "and/or" includes the arbitrary of one or more relevant Listed Items
Combination.
It will be appreciated that though various elements, but this may be described using term first, second, third, etc. in the disclosure
A little elements should not necessarily be limited by these terms.These terms are only used for same type of element being distinguished from each other out.For example, do not departing from
In the case of disclosure scope, the first element can also be referred to as the second element, and similarly, the second element can also be referred to as
One element.Depending on linguistic context, word as used in this " if " can be construed to " ... when " or " when ...
When ".
The present invention provides a kind of LED light strip chip mounter of integrated electro detecting system, including：
Suction nozzle, the suction nozzle include hollow insulating body, positioned at hollow insulating body inner wall and the first opposite probe
With the second probe, first probe and the second probe configuration be, when drawing LED using suction nozzle respectively with the P electrode of LED and
N electrode contacts；
Optical detection apparatus, the optical detection apparatus is located at the inside of hollow insulating body, for detecting the optics of LED
Parameter；And
Electrical detection device, the electrical detection device is electrical connected with the first probe and the second probe, for detecting LED
Electrical parameter.
According to a preferred embodiment of the invention, the suction nozzle is connected with a vacuum pump, to realize inside hollow insulating body
The suction of air is put.
According to a preferred embodiment of the invention, the suction nozzle is made of elastomeric material.
According to a preferred embodiment of the invention, the shape of the hollow insulating body of the suction nozzle is cylinder or rectangle.
According to a preferred embodiment of the invention, the optical parameter includes at least one of following：Luminous flux, shine effect
Rate, luminous intensity, light distribution, peak luminous wavelength and colour temperature.
An embodiment according to the present invention, the electrical parameter include at least one of following：IV characteristic curves, forward direction
Voltage, backward voltage and reverse current.
With reference to Fig. 1, it shows the module map of the LED light strip chip mounter of integrated electro detecting system according to the present invention, bag
Suction nozzle, optical detection apparatus, electrical detection device and power supply are included, which is used to give by the probe inside suction nozzle
LED provides electric current, and different detection electric currents can be provided according to the LED of different capacity.
With reference to Fig. 2, it shows that the nozzle structure of the LED light strip chip mounter of integrated electro detecting system according to the present invention is bowed
View, suction nozzle 1 according to the present invention be embodied as cylindrical shape in the present embodiment, including hollow insulating body 2, is located at
Empty 2 inner wall of insulating body and opposite the first probe 3 and the second probe 4, which can be true by using one
Sky pumps (being not shown for clarity) to make its internal generation vacuum state, so as to utilize suction to draw LED.First probe 3
Contacted respectively with the P electrode and N electrode of LED with the second probe 4, for providing detection electric current to LED and being additionally operable to detect it
Electrical parameter.Further, since the hollow insulating body 2 of suction nozzle 1 is insulation, thus the first probe 3 and the second probe 4 it is mutual it
Between realize electric isolution, it is preferable that suction nozzle 1 is made of elastomeric material.Although it is understood that suction nozzle in the present embodiment
It is embodied as cylindrical shape, but the present invention is not limited thereto, it is cuboid etc. that suction nozzle according to the present invention, which can also be,
Shape, in the case of for cuboid, the first probe and the second probe are located on two opposite sides of cuboid respectively.
With reference to Fig. 3, it shows the nozzle structure side of the LED light strip chip mounter of integrated electro detecting system according to the present invention
Depending on schematic diagram, wherein optical detection apparatus 5 is located in the space of hollow 2 inner upper of insulating body, shines for detecting LED 6
Every optical parameter, include but not limited to, luminous flux, luminous efficiency, luminous intensity, light distribution, peak luminous wavelength with
And colour temperature.In addition, the first probe 3 and the second probe 4 are also connected with electrical detection device (being not shown for clarity) respectively,
For detecting every electrical parameter of LED 6, include but not limited to IV characteristic curves, forward voltage, backward voltage and reversely
Electric current.
Compared with existing chip mounter, the present invention by the integrated electro detecting system on the suction nozzle of chip mounter, it can be achieved that
Its every photoelectric properties is detected when suction nozzle draws LED, reduces the LED detection processes after the completion of LED attachments, effectively
Reduce the production cost of LED light strip and improve the production efficiency of LED light strip.
The above, is presently preferred embodiments of the present invention, the invention is not limited in the above embodiment, as long as
It reaches the technique effect of the present invention with identical means, all within the spirit and principle of the disclosure, any modification for being made,
Equivalent substitution, improvement etc., should be included within the scope of disclosure protection.Protection scope of the present invention should all be belonged to.At this
Its technical solution and/or embodiment can have a variety of modifications and variations in the protection domain of invention.
Claims (6)
- A kind of 1. LED light strip chip mounter of integrated electro detecting system, it is characterised in that including：Suction nozzle, the suction nozzle include hollow insulating body, positioned at hollow insulating body inner wall and the first opposite probe and the Two probes, first probe and the second probe configuration are that the P electrode and N when drawing LED using suction nozzle respectively with LED are electric Pole contacts；Optical detection apparatus, the optical detection apparatus is located at the inside of hollow insulating body, for detecting the Optical Parametric of LED Number；AndElectrical detection device, the electrical detection device is electrical connected with the first probe and the second probe, for detecting the electricity of LED Learn parameter.
- 2. the LED light strip chip mounter of a kind of integrated electro detecting system according to claim 1, it is characterised in that described Suction nozzle is connected with a vacuum pump, to realize that the suction of hollow insulating body inner air is put.
- 3. the LED light strip chip mounter of a kind of integrated electro detecting system according to claim 1, it is characterised in that described Suction nozzle is made of elastomeric material.
- A kind of 4. LED light strip chip mounter of integrated electro detecting system according to claim 1, it is characterised in that：It is described The shape of the hollow insulating body of suction nozzle is cylinder or rectangle.
- 5. the LED light strip chip mounter of a kind of integrated electro detecting system according to claim 1, it is characterised in that described Optical parameter includes at least one of following：Luminous flux, luminous efficiency, luminous intensity, light distribution, peak luminous wavelength with And colour temperature.
- 6. the LED light strip chip mounter of a kind of integrated electro detecting system according to claim 1, it is characterised in that described Electrical parameter includes at least one of following：IV characteristic curves, forward voltage, backward voltage and reverse current.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711160912.5A CN107958854A (en) | 2017-11-20 | 2017-11-20 | A kind of LED light strip chip mounter of integrated electro detecting system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711160912.5A CN107958854A (en) | 2017-11-20 | 2017-11-20 | A kind of LED light strip chip mounter of integrated electro detecting system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107958854A true CN107958854A (en) | 2018-04-24 |
Family
ID=61963943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711160912.5A Pending CN107958854A (en) | 2017-11-20 | 2017-11-20 | A kind of LED light strip chip mounter of integrated electro detecting system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107958854A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110534469A (en) * | 2019-09-05 | 2019-12-03 | 苏州苏驼通信科技股份有限公司 | It is a kind of for the displacement alignment device of the photodiode in optical module, method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103296147A (en) * | 2012-02-23 | 2013-09-11 | 鸿富锦精密工业（深圳）有限公司 | Mounter with LED optical detection function and mounting method thereof |
-
2017
- 2017-11-20 CN CN201711160912.5A patent/CN107958854A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103296147A (en) * | 2012-02-23 | 2013-09-11 | 鸿富锦精密工业（深圳）有限公司 | Mounter with LED optical detection function and mounting method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110534469A (en) * | 2019-09-05 | 2019-12-03 | 苏州苏驼通信科技股份有限公司 | It is a kind of for the displacement alignment device of the photodiode in optical module, method |
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Application publication date: 20180424 |