CN201689154U - Testing box of multifunctional semiconductor device - Google Patents
Testing box of multifunctional semiconductor device Download PDFInfo
- Publication number
- CN201689154U CN201689154U CN 201020198610 CN201020198610U CN201689154U CN 201689154 U CN201689154 U CN 201689154U CN 201020198610 CN201020198610 CN 201020198610 CN 201020198610 U CN201020198610 U CN 201020198610U CN 201689154 U CN201689154 U CN 201689154U
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- probe
- semiconductor device
- multifunctional semiconductor
- device detection
- detection box
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Abstract
The utility model relates to a testing box of a multifunctional semiconductor device, comprising a box body, a box cover and a probe, wherein the probe is arranged in the box body and has elastic deformation; a device to be tested is arranged between the probe and the box cover; and the probe contacts with an electrode of the device to be tested and an electrode of a power supply. The testing box solves the technical problem that the electrodes are easy to be damaged by being clamped when an iron clamp is adopted to keep good contact in the prior art.
Description
Technical field
The utility model belongs to the semiconducter device testing field, is specifically related to a kind of multifunctional semiconductor device detection box.
Background technology
In prior art, for the electrical performance testing of semiconductor devices, we need obtain device voltage, flow through the electric current of device, also need the luminous intensity information of acquisition device for luminescent device.During test, generally the both positive and negative polarity of voltage source or current source and the respective electrode of semiconductor devices are coupled together, thereby provide voltage or electric current, make device in running order to semiconductor devices by agrafe.Usually in order to guarantee in the test process that contact is good between voltage source or current source and the device, agrafe need be designed very sharp very firmly, it is just probably bad with electrode holder to be clipped in the device two ends like this; If semiconductor devices to be measured is a luminescent device, also need an extra spectrometer by the light intensity of probe to defocused measurement luminescent device, need build a whole set of optics electrical testing system like this, complex operation and cost costliness.
The utility model content
The purpose of this utility model is to overcome above-mentioned weak point, multifunctional semiconductor device detection box is provided, keep well contact by probe between device under test and voltage source or the current source, mainly solved problem easily that electrode holder is bad when the available technology adopting agrafe keeps well contacting.
The utility model is realized above-mentioned purpose by the following technical solutions: multifunctional semiconductor device detection box, comprise box body, lid, and also comprise the elastically-deformable probe that has that is arranged in the box body; Device under test places between probe and the lid, and the one side that device under test comprises electrode contacts with probe.
Offer the through hole of placing photodetector or transparent glass on the described lid.
Described photodetector is photoelectric cell or brightness photometer; Described transparent glass is a transparency silica glass.
Be provided with the draw-in groove that at least one is used to place device under test in the described box body.
The inside surface of described box body and lid is provided with magnet.
Be provided with the Peltier sheet of heating of energising back or refrigeration in the described box body.
Described probe is welded on the pcb board, and the both positive and negative polarity of voltage source or current source links to each other with probe by pcb board.
The utility model has following advantage and effect with respect to prior art:
1, in the box body elastic probe is set, makes device under test keep excellent contact, thereby avoided the electrode of device under test, the electrode of power supply to be damaged by probe and power supply (voltage source or current source).
2, on the lid through hole is set, this through hole can be placed photoelectric cell or transparency silica glass, and to satisfy the needs of the different semiconductor devices of test, photoelectric cell is used for gathering the brightness of luminescent device; Transparency silica glass is equivalent to an optical window, allows external light source to go into to shine, as the exciting light source of semiconductor devices such as solar cell or optical sensor.
3, in the box body a plurality of draw-in grooves can be set, so the utility model can test a plurality of similar devices simultaneously, or even a plurality of different types of device.
4, can heat or freeze after the energising of Peltier sheet, provide high temperature or low-temperature test environment to device under test, thereby make range of application of the present utility model more extensive.
Description of drawings
Fig. 1 is the one-piece construction synoptic diagram of the utility model embodiment;
Fig. 2 is the synoptic diagram of opening of Fig. 1;
Fig. 3 is integrated in synoptic diagram on the pcb board with the semiconducter device testing box.
Embodiment
Below in conjunction with embodiment and accompanying drawing the utility model is described in further detail, but embodiment of the present utility model is not limited thereto.
As shown in Figure 1, the utility model comprises box body 1 and lid 2, and box body 1 is connected by rotating shaft 3 with lid 2.Peltier sheet 5, probe 6 and draw-in groove 4 are set in the box body.Draw-in groove 4 is used to place device under test, and the utility model is provided with 2 draw-in grooves, can test two semiconductor devices simultaneously.Device under test is placed in the draw-in groove 4, and device under test promptly places on the probe 6, and the one side that device under test comprises electrode contacts with probe 6.Box body 1 is provided with magnet 7 with the inside surface of lid 2, and circular magnet; Again because probe has elasticity, and and all keep good Ohmic contact between the positive and negative electrode of the electrode of device under test, power supply (voltage source or current source), when lid 2 when rotating shaft 3 is closed up downwards, because the interaction of magnet makes well to fit together between lid 2 and the box body 1.Because device under test places between probe and the lid, by means of the suction of magnet, lid is oppressed probe by device under test, and probe is extruded the generation elastic deformation, and device under test just well contacts with probe like this.Probe can be tack or round end, the number of probe can be two, three or add arbitrarily as required.
In the present embodiment, probe is welded on the pcb board, the both positive and negative polarity of voltage source or current source links to each other with probe by pcb board, and specific driving circuit is arranged on the pcb board, is bridge with the probe, provides voltage or electric current to device under test.This way of contact based on probe, integrate pcb board after, make this testing cassete not only can be used for surveying light emitting diode, semiconductor devices such as also can be used for shoot the sun can battery, optical sensor, transistor.
Can heat or freeze after described Peltier sheet 5 energisings, the Peltier chip size is 18mm (length) * 18mm (wide) * 3mm (height) herein, provides high temperature or low-temperature test environment to device under test.Offer a through hole 8 on the lid 1 with a certain size, if device under test is a light emitting diode, in described through hole photodetector (photodetector preferred light battery or brightness photometer) is installed, can be conveniently surveyed the luminous intensity of light emitting diode; Lead-in wire with photodetector inserts on the pcb board then, and electric signal is exaggerated circuit and amplifies, and is finished the measurement of luminous intensity at last by voltage table.If device under test is solar cell or optical sensor, in described through hole a transparency silica glass is installed, external light source promptly can go into to shine by quartz glass.If device under test is a transistor, then do not need out this through hole, we increase the quantity to three of probe.We can the design flexible box body shape to adapt to different demands, it is the optics electrical measurement device of a cover perfect in shape and function that the semiconducter device testing box is developed to.
As described in Figure 3, the semiconducter device testing box is installed on the pcb board 9 by screw, and what adopt in this example is double-deck pcb board.Driving circuit comprises that the both positive and negative polarity of voltage source just or current source links to each other with probe by the pcb board cabling on the pcb board; Photronic electric current output is drawn by the pcb board line, amplifies the back through signal and finishes measurement by voltage table.
The foregoing description is the utility model preferred implementation; but embodiment of the present utility model is not restricted to the described embodiments; other any do not deviate from change, the modification done under spirit of the present utility model and the principle, substitutes, combination, simplify; all should be the substitute mode of equivalence, be included within the protection domain of the present utility model.
Claims (9)
1. multifunctional semiconductor device detection box comprises box body, lid, it is characterized in that: also comprise the elastically-deformable probe that has that is arranged in the box body; Device under test places between probe and the lid, and probe contacts with the electrode of device under test, the electrode of power supply.
2. multifunctional semiconductor device detection box according to claim 1 is characterized in that: offer the through hole of placing photodetector or transparent glass on the described lid.
3. multifunctional semiconductor device detection box according to claim 2 is characterized in that: described photodetector is photoelectric cell or brightness photometer; Described transparent glass is a transparency silica glass.
4. multifunctional semiconductor device detection box according to claim 1 and 2 is characterized in that: be provided with the draw-in groove that at least one is used to place device under test in the described box body.
5. multifunctional semiconductor device detection box according to claim 1 and 2, it is characterized in that: the inside surface of described box body and lid is provided with magnet.
6. multifunctional semiconductor device detection box according to claim 5 is characterized in that: described magnet is circular magnet.
7. multifunctional semiconductor device detection box according to claim 1 and 2 is characterized in that: the Peltier sheet that is provided with heating of energising back or refrigeration in the described box body.
8. multifunctional semiconductor device detection box according to claim 1 and 2 is characterized in that: described probe is the tack probe, or the round end probe.
9. multifunctional semiconductor device detection box according to claim 1 and 2, it is characterized in that: described probe is welded on the pcb board, and the both positive and negative polarity of voltage source or current source links to each other with probe by pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020198610 CN201689154U (en) | 2010-05-14 | 2010-05-14 | Testing box of multifunctional semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020198610 CN201689154U (en) | 2010-05-14 | 2010-05-14 | Testing box of multifunctional semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201689154U true CN201689154U (en) | 2010-12-29 |
Family
ID=43377434
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201020198610 Expired - Lifetime CN201689154U (en) | 2010-05-14 | 2010-05-14 | Testing box of multifunctional semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201689154U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104820116A (en) * | 2015-05-08 | 2015-08-05 | 河南大学 | Connecting device suitable for low-temperature electrical test and using method thereof |
| CN105973548A (en) * | 2016-05-07 | 2016-09-28 | 上海大学 | Water vapor transmittance testing clamp based on active metal electrical method |
| CN107367679A (en) * | 2017-06-19 | 2017-11-21 | 武汉嘉仪通科技有限公司 | Hall effect test system |
| CN113253095A (en) * | 2021-05-12 | 2021-08-13 | 中国科学院地质与地球物理研究所 | MEMS acceleration sensor chip batch test method and system |
-
2010
- 2010-05-14 CN CN 201020198610 patent/CN201689154U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104820116A (en) * | 2015-05-08 | 2015-08-05 | 河南大学 | Connecting device suitable for low-temperature electrical test and using method thereof |
| CN105973548A (en) * | 2016-05-07 | 2016-09-28 | 上海大学 | Water vapor transmittance testing clamp based on active metal electrical method |
| CN105973548B (en) * | 2016-05-07 | 2019-04-16 | 上海大学 | Testing vapor transmission fixture based on active metal electric method |
| CN107367679A (en) * | 2017-06-19 | 2017-11-21 | 武汉嘉仪通科技有限公司 | Hall effect test system |
| CN113253095A (en) * | 2021-05-12 | 2021-08-13 | 中国科学院地质与地球物理研究所 | MEMS acceleration sensor chip batch test method and system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20101229 |
|
| CX01 | Expiry of patent term |