CN103900791A - Led detecting device - Google Patents
Led detecting device Download PDFInfo
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- CN103900791A CN103900791A CN201210567594.5A CN201210567594A CN103900791A CN 103900791 A CN103900791 A CN 103900791A CN 201210567594 A CN201210567594 A CN 201210567594A CN 103900791 A CN103900791 A CN 103900791A
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Abstract
An LED detecting device at least comprises a light collecting device having an opening, a supporting member and a point measuring device, wherein the light collecting device has an opening. The supporting member is used for carrying at least one light emitting diode chip. The point measuring device includes a power supply device and at least two flexible power transmission components. The two ends of each flexible power transmission component are electrically connected with the light emitting diode chip and the power supply device respectively to enable the light emitting diode chip to emit light. In addition, the LED detecting device of the invention further comprises an ejector pin used for pushing the light emitting diode chip into the light collecting device through the opening so as to enable the light collecting device to collect the light emitted by the light emitting diode chip.
Description
[technical field]
The invention relates to a kind of pick-up unit, relate to especially a kind of LED pick-up unit.
[background technology]
Along with the lifting of scientific-technical progress and quality of the life, modern more becomes to paying attention to for illumination.Utilize substance combustion to carry out torch, animals and plants oil lamp, candle, the kerosene lamp of luminous lighting from ancient times, utilize the luminous incandescent lamp of electric power, fluorescent light, or be light emitting diode (the light-emitting diode commonly using now, LED), all epochmaking role is played the part of in display lighting in mankind's daily life.
Light emitting diode is to utilize the hole combination of electronics electricity to send monochromatic light, to reach the effect of illumination or warning.Light emitting diode is compared to conventional light source, has that luminescence efficiency is high, a long service life, the advantage such as cracky, reaction velocity be not fast.Due under the acceleration of promotion energetically of government in recent years and each city LED street lamp scale expands, use LED to be seen everywhere as lighting use.
General conventional detection machine is to detect the luminescence efficiency of LED wafer.Existing detection machine is to utilize probe to provide LED wafer luminous voltage source, the light that LED wafer sends is collected after light via the receipts electro-optical device of the machine of detection, convert electric signal to by photoelectric conversion device, and then judge the luminescence efficiency of LED wafer.But, the light that LED wafer sends but may be because receive the restriction of electro-optical device shape, cause LED wafer cannot press close to receive electro-optical device, produce light leak, and cannot collect the light that LED wafer sends completely, and then impact detects the accuracy of LED wafer luminescence efficiency.
[summary of the invention]
Because the problem of above-mentioned prior art, a wherein object of the present invention is to provide a kind of LED pick-up unit exactly, to solve the problem of receiving electro-optical device and cannot collecting the light that LED wafer sends completely.
Another object of the present invention, is to propose a kind of LED pick-up unit, accurately to detect the luminescence efficiency of LED wafer.
For reaching aforementioned object, the present invention proposes a kind of LED pick-up unit, at least comprises receipts electro-optical device, support member and the spot measurement device with opening.Support member is in order to carry at least one LED wafer, and LED wafer setting position to be detected corresponds to the opening of receiving electro-optical device.Spot measurement device comprises power supply unit and at least two flexual transmission of electricity elements, and the two ends of transmission of electricity element are electrically connected respectively LED wafer and power supply unit, to make LED wafer emit beam, because transmission of electricity element has pliability, can make LED wafer and the opening of receiving electro-optical device more fit, the light that LED wafer sends can more intactly enter receipts electro-optical device, to solve light from receiving the problem of the gap leakage between electro-optical device and LED wafer.More particularly, transmission of electricity element comprises transparent membrane and transparency conducting layer, and transparency conducting layer is arranged on transparent membrane, the material of transparency conducting layer is tin indium oxide (indium tin oxide, or indium zinc oxide (indium zinc oxide ITO), IZO), and the transmittance of transparent membrane is greater than 80%, the material of transparent membrane is such as but not limited to polyethylene terephthalate (polyethylene terephthalate, PET), tygon (polyethylene, PE), Polyethylene Naphthalate (Polyethylene naphthalate, PEN), polyethersulfone (Polyether sulfone, PES), polybutylene terephthalate (PBT), polycarbonate (polycarbonate, PC), Polyvinylchloride (PolyVinyl Chloride, PVC), polypropylene (Polypropylene, or polystyrene (Polystyrene PP), PS), wherein, the material preferably of transparent membrane is polyethylene terephthalate (polyethylene terephthalate, PET), tygon (polyethylene, or Polyvinylchloride (PolyVinyl Chloride PE), PVC), in addition, transparent membrane has pliability, transparency conducting layer is arranged on flexual transparent membrane, obtain flexual transmission of electricity element with this.Can be integrating sphere, solar panels or photodetector array (photodetector array) and receive electro-optical device, above-mentioned solar panels or photodetector array preferably can be and are arranged in one hood-shaped (cap-shape) device, be beneficial to collect the light that LED wafer sends, wherein photodetector array is photodiode, charge-coupled image sensor (charge coupled device, CCD), the array of quantum device optical detecting device, photoelectricity lock, light resistance, photoelectric crystal or optical conductor, the preferred embodiment of receiving electro-optical device is integrating sphere.
In addition, LED pick-up unit of the present invention more comprises thimble, in order to LED wafer is pushed and to be received in electro-optical device by opening, collects to make receiving electro-optical device the light that LED wafer sends.
According to the first preferred embodiment of LED pick-up unit of the present invention, thimble is positioned at support member and the below of receiving electro-optical device, and LED wafer is between transmission of electricity element and support member, and transmission of electricity element is arranged at the bright dipping side of LED wafer.In the time that thimble promotes support member, be positioned at the light penetration transmission of electricity element that the LED wafer on support member sends, more intactly collect to make receiving electro-optical device the light that LED wafer sends.
According to the second preferred embodiment of LED pick-up unit of the present invention, the LED pick-up unit of the present embodiment is similar to the LED pick-up unit of the first preferred embodiment, and its difference is: the transmission of electricity element of the LED pick-up unit of the present embodiment is arranged at respectively the both sides of LED wafer.In the time that thimble promotes support member, be positioned at the light penetration transmission of electricity element that the LED wafer on support member sends, more intactly collect to make receiving electro-optical device the light that LED wafer sends.
According to the 3rd preferred embodiment of LED pick-up unit of the present invention, the LED pick-up unit of the present embodiment is similar to the LED pick-up unit of the first preferred embodiment, and its difference is: the transmission of electricity element of the LED pick-up unit of the present embodiment is arranged between thimble and support member.When thimble promotes when support member, be positioned at the light that the LED wafer on support member sends and directly inject receipts electro-optical device, more intactly collect to make receiving electro-optical device the light that LED wafer sends.
According to the 4th preferred embodiment of LED pick-up unit of the present invention, the LED pick-up unit of the present embodiment is similar to the LED pick-up unit of the first preferred embodiment, its difference is: thimble is positioned at support member and the top of receiving electro-optical device, transmission of electricity element is arranged between support member and LED wafer, the support member of the present embodiment is to be greater than 80% transparent material by transmittance to be formed, and support member is for having elasticity.In the time that thimble promotes LED wafer, light penetration transmission of electricity element and support member that LED wafer sends, collect to make receiving electro-optical device the light that LED wafer sends completely.
According to the 5th preferred embodiment of LED pick-up unit of the present invention, the LED pick-up unit of the present embodiment is similar to the LED pick-up unit of the 4th preferred embodiment, and its difference is: the transmission of electricity element of the LED pick-up unit of the present embodiment is arranged at respectively the both sides of LED wafer.In the time that thimble promotes LED wafer, light penetration transmission of electricity element and support member that LED wafer sends, collect to make receiving electro-optical device the light that LED wafer sends completely.
According to the 6th preferred embodiment of LED pick-up unit of the present invention, the LED pick-up unit of the present embodiment is similar to the LED pick-up unit of the 4th preferred embodiment, and its difference is: the transmission of electricity element of the LED pick-up unit of the present embodiment is arranged between thimble and LED wafer.In the time that thimble promotes LED wafer, the light penetration support member that LED wafer sends, collects to make receiving electro-optical device the light that LED wafer sends completely.
From the above, LED pick-up unit of the present invention, it can have one or more following advantage:
(1) LED pick-up unit of the present invention, utilize flexual transmission of electricity element, can make to receive electro-optical device and LED wafer is more approaching, make the light that LED wafer sends can more intactly enter receipts electro-optical device, to solve light from receiving the problem of the gap leakage between electro-optical device and LED wafer.
(2) LED pick-up unit of the present invention, utilizes thimble that LED wafer is pushed and received in electro-optical device, to solve the problem of receiving electro-optical device and cannot collecting the light that LED wafer sends completely.
(3) LED pick-up unit of the present invention, utilize thimble that LED wafer is pushed and received in electro-optical device, can solve the problem of receiving electro-optical device and cannot collecting the light that LED wafer sends completely, accurately to detect the luminescence efficiency of LED wafer.
[accompanying drawing explanation]
Fig. 1 is the diagrammatic cross-section of LED pick-up unit of the present invention.
Fig. 2 is the diagrammatic cross-section of the first preferred embodiment of LED pick-up unit of the present invention.
Fig. 3 is that in the first preferred embodiment of LED pick-up unit of the present invention, LED wafer is pushed the diagrammatic cross-section in integrating sphere by thimble.
Fig. 4 is the diagrammatic cross-section of the second preferred embodiment of LED pick-up unit of the present invention.
Fig. 5 is the diagrammatic cross-section of the 3rd preferred embodiment of LED pick-up unit of the present invention.
Fig. 6 is the diagrammatic cross-section of the 4th preferred embodiment of LED pick-up unit of the present invention.
Fig. 7 is the diagrammatic cross-section of the 5th preferred embodiment of LED pick-up unit of the present invention.
Fig. 8 is the diagrammatic cross-section of the 6th preferred embodiment of LED pick-up unit of the present invention.
10: LED wafer
30: integrating sphere
301: opening
20: support member
100: spot measurement device
11: transparency conducting layer
12: transmission of electricity element
13: power supply unit
40: thimble
15: photoelectric conversion device
L1: light
50: transparent membrane
201: conduction region
D1, D2, D3, D4: direction
[embodiment]
LED pick-up unit of the present invention is to utilize bendable transmission of electricity element to replace conventional probe, makes to receive electro-optical device and is able to more intactly collect the light that LED wafer sends, and reaches the object of accurate measurement LED wafer luminescence efficiency.Receive electro-optical device and can be integrating sphere, solar panels or photodetector array (photodetector array), wherein photodetector array is the array of photodiode, charge-coupled image sensor (charge coupled device, CCD), quantum device optical detecting device, photoelectricity lock, light resistance, photoelectric crystal or optical conductor.Wherein, the preferred embodiment of receipts electro-optical device is integrating sphere.Following by several embodiment that list LED pick-up unit of the present invention to further illustrate LED pick-up unit of the present invention, but these embodiment are not in order to limit the present invention.
Refer to Fig. 1, it is the diagrammatic cross-section of LED pick-up unit of the present invention.LED pick-up unit of the present invention comprises integrating sphere 30, support member 20 and the spot measurement device 100 (position of opening 301 refers to Fig. 2) with opening 301.Support member 20 is in order to carry at least one LED wafer 10, and the putting position of LED wafer 10 to be measured corresponds to the opening 301 of integrating sphere 30.Spot measurement device 100 comprises power supply unit 13 and at least two flexual transmission of electricity elements 12, and the two ends of transmission of electricity element 12 are electrically connected respectively LED wafer 10 and power supply unit 13, to make LED wafer 10 L1 that emits beam.Due to the flexible characteristic of transmission of electricity element, LED wafer and integrating sphere opening are more fitted, the light that LED wafer sends can more intactly enter receipts electro-optical device, to solve light from receiving the problem of the gap leakage between electro-optical device and LED wafer.
Refer to Fig. 2 and Fig. 4 to Fig. 8, it is respectively the diagrammatic cross-section of the first preferred embodiment to the six preferred embodiments of LED pick-up unit of the present invention.But, the embodiment of modifying under any spirit that does not depart from the claims in the present invention and category, the scope that all belongs to the present invention and apply for protection.
See also Fig. 2 and Fig. 3, wherein Fig. 3 is that in the first preferred embodiment of LED pick-up unit of the present invention, LED wafer is pushed the diagrammatic cross-section in integrating sphere by thimble.As shown in Figures 2 and 3, the first preferred embodiment of LED pick-up unit of the present invention comprises integrating sphere 30, support member 20, thimble 40 and the spot measurement device 100 with opening 301.Support member 20 is in order to carry at least one LED wafer 10, and thimble 40 is positioned at the below of support member 20 and integrating sphere 30, and the putting position of LED wafer 10 to be measured corresponds to the opening 301 of integrating sphere 30.Spot measurement device 100 comprises power supply unit 13 and at least two flexual transmission of electricity elements 12, and the two ends of transmission of electricity element 12 are electrically connected respectively LED wafer 10 and power supply unit 13, to make LED wafer 10 L1 that emits beam.Thimble 40 is in order to LED wafer 10 is pushed in integrating sphere 30 along direction D1 by opening 301, to make integrating sphere 30 collect light L1, and changes light L1 via photoelectric conversion device 15 and becomes an electric signal.Wherein, transmission of electricity element 12 comprises transparency conducting layer 11 and transparent membrane 50, the material of transparency conducting layer 11 can be for example the material of the tool light-permeable characteristics such as tin indium oxide or indium zinc oxide, and the material of transparent membrane 50 is polyethylene terephthalate, tygon, Polyvinylchloride, and its transmittance is greater than 80%, and transparent membrane 50 has flexibility.Wherein, most preferred embodiment is Polyvinylchloride.
In the first preferred embodiment of the present invention, LED wafer 10 is between transmission of electricity element 12 and support member 20, and two transmission of electricity elements are all arranged at the bright dipping side of LED wafer.In addition, each transmission of electricity element 12 is electrically insulated with adjacent transmission of electricity element 12, makes the LED wafer 10 of two transmission of electricity elements 12 in electrical contact be received different voltage and emit beam.
Refer to Fig. 3, in the time that thimble 40 makes to be positioned at the LED wafer 10 transmission of electricity element 12 in electrical contact on support member 20 along direction D1 promotion support member 20, because transmission of electricity element 12 possesses flexual characteristic, therefore thimble 40 can push LED wafer 10 in integrating sphere 30 along direction D1 by opening 301 (as illustrated in Fig. 2) together with transmission of electricity element 12, now two adjacent transmission of electricity elements 12 provide a voltage difference to make LED wafer 10 L1 that emits beam, the penetrable transmission of electricity element 12 that possesses light-permeable characteristic of light sending due to LED wafer 10, integrating sphere 30 can more intactly be collected the light L1 that LED wafer 10 sends, and then reach the object of the luminescence efficiency of accurate detection LED wafer 10.
As shown in Figures 2 and 3, the first preferred embodiment of LED pick-up unit of the present invention is applicable to detect the luminescence efficiency of LED wafer 10, and its testing process is as described below: carry LED wafer 10 with support member 20; Thimble 40 is moved to promote support member 20 along direction D1, make to be positioned at the LED wafer 10 transmission of electricity element 12 in electrical contact on support member 20; Then, continue LED wafer 10 to push in integrating sphere 30 along direction D1 together with transmission of electricity element 12, apply that voltage sends LED wafer 10 to be penetrated the light L1 of transmission of electricity element 12 and towards integrating sphere 30, and then make integrating sphere 30 be able to more intactly collect light L1; Then, recycle photoelectric conversion device 15 receiving optical signals and convert electric signal to present the luminescence efficiency of LED wafer 10; Finally, thimble 40 can move along direction D2 again, makes the measurement region of LED wafer 10 away from integrating sphere 30, to finish to measure the luminescence efficiency of LED wafer 10.
In addition, in the testing process of the first preferred embodiment of the present invention, thimble 40 provides the function that LED wafer 10 is pushed or released the measurement region of integrating sphere 30, " release " herein refers to because the transparent membrane 50 in transmission of electricity element 12 has pliability, therefore when thimble 40 is no longer exerted pressure to support member 20, LED wafer 10 and support member 20 can exit integrating sphere 30 along direction D2 because of the bounce of transparent membrane 50.In other words, user can first push LED wafer 10 in integrating sphere 30 with thimble 40, and recycling spot measurement device 100 provides the voltage source of LED wafer 10, to reach the object of collecting the light L1 that LED wafer 10 sends.
In LED pick-up unit of the present invention; the setting position of transmission of electricity element 12 is not limited to various embodiment of the present invention; anyly can provide LED wafer voltage; make the setting position of the transmission of electricity element that LED wafer emitted beam, the scope that all belongs to the present invention and apply for protection.
Please continue and consult Fig. 4, it is the diagrammatic cross-section of the second preferred embodiment of LED pick-up unit of the present invention.In the second preferred embodiment of LED pick-up unit of the present invention, transmission of electricity element 12 is arranged at respectively the two ends of LED wafer 10, wherein a transmission of electricity element 12 is positioned at the exiting surface of LED wafer 10, another transmission of electricity element 12 is arranged between thimble 40 and support member 20, for the voltage source that should be carried on the LED wafer 10 on support member 20.Therefore, in the second preferred embodiment of the present invention, the material of support member 20 must for possess can conductive characteristic material, to reach the effect that LED wafer 10 voltages are provided.Wherein, transmission of electricity element 12 comprises transparency conducting layer 11 and transparent membrane 50, the material of transparency conducting layer 11 can be for example the material of the tool light-permeable characteristics such as tin indium oxide or indium zinc oxide, and the material of transparent membrane 50 is polyethylene terephthalate, tygon, Polyvinylchloride, and its transmittance is greater than 80%, and transparent membrane 50 has flexibility.Wherein, most preferred embodiment is Polyvinylchloride.
As shown in Figure 4 and Figure 2, the present invention's the second preferred embodiment and the first preferred embodiment difference part are, the transmission of electricity element 12 of the second preferred embodiment is arranged at respectively the both sides of LED wafer 10, wherein a transmission of electricity element 12 is positioned at the exiting surface of LED wafer 10, and another transmission of electricity element 12 is between thimble 40 and support member 20.The testing process of the present invention's the second preferred embodiment is as described below: carry LED wafer 10 with support member 20; Utilize mobile thimble 40 to promote support member 20, then, continue LED wafer 10 to push in integrating sphere 30 along direction D1 together with transmission of electricity element 12, apply voltage and make to be positioned at that LED wafer 10 on support member 20 is in electrical contact is arranged at respectively transmission of electricity element 12 on its exiting surface and thimble 40 and the L1 that emits beam; The light L1 sending is penetrated transmission of electricity element 12 towards integrating sphere 30, and then make integrating sphere 30 be able to more intactly to collect light L1 and the light L1 that utilizes photoelectric conversion device 15 conversion light emitting diode wafers 10 to send becomes an electric signal, to present the luminescence efficiency of LED wafer 10.
In addition,, in LED pick-up unit of the present invention, the more visual actual demand of user is directly arranged at transmission of electricity element 12 on thimble 40.As shown in Figure 5, it is the diagrammatic cross-section of the 3rd preferred embodiment of LED pick-up unit of the present invention.In the 3rd preferred embodiment of LED pick-up unit of the present invention, it is upper that transmission of electricity element 12 is arranged at thimble 40 surfaces, to supply the voltage source of the LED wafer 10 being positioned on support member 20.In addition, because the LED wafer 10 being positioned on support member 20 is to utilize to be arranged at the lip-deep transmission of electricity element 12 of thimble 40 with the luminous voltage source of supply LED wafer 10, therefore, in the 3rd most preferred embodiment of the present invention, the support member 20 that corresponds respectively to two transmission of electricity element 12 positions must arrange conduction region 201, while making thimble 40 contact support member 20, can utilize conduction region 201 with LED wafer 10 in electrical contact, and LED wafer 10 is pushed in integrating sphere 30 together with transmission of electricity element 12, and then make LED wafer 10 L1 that emits beam.Wherein, transmission of electricity element 12 comprises transparency conducting layer 11 and transparent membrane 50, and the material of transparency conducting layer 11 can be for example tin indium oxide or indium zinc oxide, but is not limited to this.
As shown in Fig. 5 and Fig. 2, the present invention's the 3rd preferred embodiment and the first preferred embodiment difference part be, the transmission of electricity element 12 of the 3rd preferred embodiment is arranged between thimble 40 and support member 20.The testing process of the present invention's the 3rd preferred embodiment is as described below: carry LED wafer 10 with support member 20; Utilize mobile thimble 40 to promote support member 20 until push in integrating sphere 30, make LED wafer 10 utilize that conduction region 201 is in electrical contact is arranged at transmission of electricity element 12 on thimble 40 and the L1 that emits beam; Utilize integrating sphere 30 to collect light L1 and utilize photoelectric conversion device 15 to be converted into electric signal to present the luminescence efficiency of LED wafer 10.
LED pick-up unit of the present invention has bendable transmission of electricity element and thimble, utilize thimble that LED wafer is pushed in integrating sphere, make integrating sphere be able to more intactly collect the light that LED wafer sends, reach the object of the luminescence efficiency of accurate measurement LED wafer.But, in LED pick-up unit of the present invention, the above-mentioned first to the 3rd preferred embodiment graphic not in order to limit LED pick-up unit of the present invention.LED pick-up unit of the present invention more can be described in following the 4th to the 6th preferred embodiment.
Fig. 6 to Fig. 8 is respectively the diagrammatic cross-section of the 4th preferred embodiment to the six preferred embodiments of LED pick-up unit of the present invention.In the 4th to the 6th preferred embodiment of the present invention, thimble 40 is positioned at the top of support member 20 and this integrating sphere 30, support member 20 by transmittance be greater than 80% and the material of tool pliability characteristic formed.In the time that thimble 40 promotes LED wafer 10, can be pushed in the lump in integrating sphere 30 together with support member 20, the support member 20 of the penetrable tool transparent characteristic of light L1 that LED wafer 10 sends, to make integrating sphere 30 more intactly collect the light L1 that LED wafer 10 sends.
Refer to Fig. 6, in the 4th preferred embodiment of the present invention, transmission of electricity element 12 is arranged between LED wafer 10 and support member 20, and each transmission of electricity element 12 is electrically insulated with adjacent transmission of electricity element 12, make the LED wafer 10 of two transmission of electricity elements 12 in electrical contact be received different voltage and emit beam.Wherein, transmission of electricity element 12 comprises transparency conducting layer 11 and transparent membrane 50, and the material of transparency conducting layer 11 can be for example the material of the tool light-permeable characteristics such as tin indium oxide or indium zinc oxide.
As shown in Fig. 6 and Fig. 2, the present invention's the 4th preferred embodiment and the first preferred embodiment difference part are, the thimble 40 of the 4th preferred embodiment is positioned at the top of support member 20 and integrating sphere 30, and transmission of electricity element 12 is arranged between LED wafer 10 and support member 20.Thimble 40 directly contacts LED wafer 10 and it is pushed in integrating sphere 30 along direction D4 via opening 301.The testing process of the present invention's the 4th preferred embodiment is as described below: on the support member 20 that is provided with two transmission of electricity elements 12, carry LED wafer 10; Thimble 40 is moved to promote LED wafer 10 along direction D4, LED wafer 10 is pushed in integrating sphere 30 by thimble 40 together with support member 20; Utilize spot measurement device 100 to detect, wherein the power supply unit 13 of spot measurement device 100 provides the voltage source of LED wafer 10 via transmission of electricity element 12, to make LED wafer 10 L1 that emits beam; Integrating sphere 30 can more intactly receive the light L1 that LED wafer 10 sends and utilize photoelectric conversion device 15 to convert thereof into an electric signal to present the luminescence efficiency of LED wafer 10; Finally, thimble 40 can move along direction D3 again, makes the measurement region of LED wafer 10 away from integrating sphere 30, to finish to measure the luminescence efficiency of LED wafer 10.
Compared to the 4th preferred embodiment, in LED pick-up unit of the present invention, transmission of electricity element 12 is except being arranged at (described in Fig. 6 and the 4th preferred embodiment) between LED wafer 10 and support member 20, and the more visual actual demand of user is arranged at transmission of electricity element 12 on other elements in pick-up unit of the present invention.And; the setting position of transmission of electricity element 12 is not limited to various embodiment of the present invention; anyly can provide LED wafer voltage, make the setting position of the transmission of electricity element that LED wafer emitted beam, the scope that all belongs to the present invention and apply for protection.
Please continue and consult Fig. 7, it is the diagrammatic cross-section of the 5th preferred embodiment of LED pick-up unit of the present invention.In the 5th preferred embodiment of LED pick-up unit of the present invention, support member 20 be by transmittance be greater than 80% and the material of tool pliability characteristic formed, and transmission of electricity element 12 is arranged at respectively LED wafer both sides, to supply the voltage source of the LED wafer 10 being positioned on support member 20.In the time that thimble 40 promotes LED wafer 10, support member 20 can be pushed in integrating sphere 30 in the lump, the support member 20 of the penetrable tool transparent characteristic of light L1 that LED wafer 10 sends, to make integrating sphere 30 more intactly collect the light L1 that LED wafer 10 sends.Wherein, the transmission of electricity element 12 being arranged on support member 20 comprises transparency conducting layer 11 and transparent membrane 50, and the material of transparency conducting layer 11 can be for example the material of the tool light-permeable characteristics such as tin indium oxide or indium zinc oxide.
As shown in Fig. 7 and Fig. 6, the present invention's the 5th preferred embodiment and the 4th preferred embodiment difference part be, the transmission of electricity element 12 of the 5th preferred embodiment is arranged at respectively LED wafer 10 both sides.The testing process of the present invention's the 5th preferred embodiment is as described below: LED wafer 10 is arranged on the support member 20 of a transmission of electricity element 12; Mobile thimble 40, makes the LED wafer 10 transmission of electricity element 12 being arranged at respectively on thimble 40 and support member 20 in electrical contact; Then, continue LED wafer 10 to push in integrating sphere 30 together with support member 20, make LED wafer 10 L1 that emits beam, and penetrated the transmission of electricity element 12 that is positioned on support member 20 and support member 20 and towards integrating sphere 30, and then make integrating sphere 30 be able to more intactly collect light L1, and utilize the light L1 that photoelectric conversion device 15 sends LED wafer 10 to convert an electric signal to present the luminescence efficiency of LED wafer 10.
In addition,, in LED pick-up unit of the present invention, the more visual actual demand of user is arranged at transmission of electricity element 12 between thimble 40 and LED wafer 10.As shown in Figure 8, it is the diagrammatic cross-section of the 6th preferred embodiment of LED pick-up unit of the present invention.In the 6th preferred embodiment of LED pick-up unit of the present invention, support member 20 be by transmittance be greater than 80% and the material of tool pliability characteristic formed, and transmission of electricity element 12 is arranged between thimble 40 and LED wafer 10, to supply the voltage source of the LED wafer 10 being positioned on support member 20.
As shown in Fig. 8 and Fig. 6, the present invention's the 6th preferred embodiment and the 4th preferred embodiment difference part be, the transmission of electricity element 12 of the 6th preferred embodiment is arranged between thimble 40 and LED wafer 10.The testing process of the present invention's the 6th preferred embodiment is as described below: carry LED wafer 10 with support member 20; Utilize mobile thimble 40 with by LED wafer 10 in electrical contact the transmission of electricity element 12 between thimble 40 and LED wafer 10; Continue to promote thimble 40 and make LED wafer 10 be pushed in the lump in integrating sphere 30 and the L1 that emits beam together with support member 20, make integrating sphere 30 be able to more intactly collect light L1 and utilize photoelectric conversion device 15 to convert light L1 to an electric signal to present the luminescence efficiency of LED wafer 10.
In sum, LED pick-up unit of the present invention utilizes thimble that LED wafer is pushed in integrating sphere, makes integrating sphere be collected the light that LED wafer sends completely, reaches the object of the luminescence efficiency of accurate measurement LED wafer.
The foregoing is only illustrative, but not be restricted person.Anyly do not depart from spirit of the present invention and category, and equivalent modifications or change that it is carried out all should be contained in claim of the present invention.
Claims (13)
1. a LED pick-up unit, at least comprises:
There is the receipts electro-optical device of opening;
Support member, in order to carry at least one LED wafer; And
Spot measurement device, described spot measurement device comprises power supply unit and at least two flexual transmission of electricity elements, and the two ends of these transmission of electricity elements are electrically connected respectively described LED wafer and described power supply unit, to make described LED wafer emit beam.
2. LED pick-up unit as claimed in claim 1, is characterized in that, described transmission of electricity element comprises transparent membrane and transparency conducting layer, and described transparency conducting layer is arranged on described transparent membrane.
3. LED pick-up unit as claimed in claim 2, is characterized in that, the material of described transparency conducting layer is tin indium oxide or indium zinc oxide.
4. LED pick-up unit as claimed in claim 2, is characterized in that, the material of described transparent membrane is polyethylene terephthalate, Polyvinylchloride or tygon.
5. LED pick-up unit as claimed in claim 1, is characterized in that, described receipts electro-optical device is integrating sphere, solar panels or photodetector array.
6. LED pick-up unit as claimed in claim 1, it is characterized in that, also comprise thimble, described thimble is positioned at the below of described support member and described receipts electro-optical device, in order to described LED wafer is pushed in described receipts electro-optical device by described opening, to make described receipts electro-optical device collect the light that described LED wafer sends.
7. LED pick-up unit as claimed in claim 6, is characterized in that, described LED wafer is between described transmission of electricity element and described support member.
8. LED pick-up unit as claimed in claim 6, is characterized in that, these transmission of electricity elements are arranged at respectively the both sides of described LED wafer.
9. LED pick-up unit as claimed in claim 6, is characterized in that, these transmission of electricity elements are arranged between described thimble and described support member.
10. LED pick-up unit as claimed in claim 1, it is characterized in that, also comprise thimble, described thimble is positioned at the top of described support member and described receipts electro-optical device, in order to described LED wafer is pushed in described receipts electro-optical device by described opening, to make described receipts electro-optical device collect the light that described LED wafer sends, and described support member is to be greater than 80% transparent material by transmittance to be formed.
11. LED pick-up units as claimed in claim 10, is characterized in that, these transmission of electricity elements are arranged between described support member and described LED wafer.
12. LED pick-up units as claimed in claim 10, is characterized in that, these transmission of electricity elements are arranged at respectively the both sides of described LED wafer.
13. LED pick-up units as claimed in claim 10, is characterized in that, these transmission of electricity elements are arranged between described thimble and described LED wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210567594.5A CN103900791A (en) | 2012-12-24 | 2012-12-24 | Led detecting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210567594.5A CN103900791A (en) | 2012-12-24 | 2012-12-24 | Led detecting device |
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| Publication Number | Publication Date |
|---|---|
| CN103900791A true CN103900791A (en) | 2014-07-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210567594.5A Pending CN103900791A (en) | 2012-12-24 | 2012-12-24 | Led detecting device |
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| CN (1) | CN103900791A (en) |
Cited By (2)
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| CN104502069A (en) * | 2014-12-31 | 2015-04-08 | 华中科技大学 | Flip LED (light emitting diode) chip on-line detection light receiving testing method |
| CN105157955A (en) * | 2015-09-29 | 2015-12-16 | 佛山市国星光电股份有限公司 | Testing device and testing method for LED light source |
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| JP2009295796A (en) * | 2008-06-05 | 2009-12-17 | Harison Toshiba Lighting Corp | Method and device for inspecting light-emitting device |
| CN102072811A (en) * | 2009-11-20 | 2011-05-25 | 广镓光电股份有限公司 | Optical detection device and detection method by applying same |
| CN102147327A (en) * | 2010-02-09 | 2011-08-10 | 均豪精密工业股份有限公司 | Method and system for detecting light-emitting diode (LED) |
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| JP2009295796A (en) * | 2008-06-05 | 2009-12-17 | Harison Toshiba Lighting Corp | Method and device for inspecting light-emitting device |
| CN102072811A (en) * | 2009-11-20 | 2011-05-25 | 广镓光电股份有限公司 | Optical detection device and detection method by applying same |
| CN102147327A (en) * | 2010-02-09 | 2011-08-10 | 均豪精密工业股份有限公司 | Method and system for detecting light-emitting diode (LED) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104502069A (en) * | 2014-12-31 | 2015-04-08 | 华中科技大学 | Flip LED (light emitting diode) chip on-line detection light receiving testing method |
| CN105157955A (en) * | 2015-09-29 | 2015-12-16 | 佛山市国星光电股份有限公司 | Testing device and testing method for LED light source |
| CN105157955B (en) * | 2015-09-29 | 2018-11-13 | 佛山市国星光电股份有限公司 | A kind of test device and test method of LED light source |
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Application publication date: 20140702 |