CN107953044A - The automatic substrate pushing meanss of improved bonding equipment - Google Patents
The automatic substrate pushing meanss of improved bonding equipment Download PDFInfo
- Publication number
- CN107953044A CN107953044A CN201610895491.XA CN201610895491A CN107953044A CN 107953044 A CN107953044 A CN 107953044A CN 201610895491 A CN201610895491 A CN 201610895491A CN 107953044 A CN107953044 A CN 107953044A
- Authority
- CN
- China
- Prior art keywords
- pushing meanss
- bonding equipment
- automatic substrate
- substrate pushing
- improved bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
Abstract
The present invention relates to the device for promoting substrate in a kind of semiconductor fabrication sequence automatically, more particularly to it is a kind of can separate catch bar or axis as needed, can by gear combination adjust catch bar driving velocity so as to improve semiconductor fabrication sequence operating efficiency improved bonding equipment automatic substrate pushing meanss.One kind is based in semiconductor fabrication sequence, for the automatic substrate pushing meanss for being passed on substrate using bonding equipment, it is characterised in that including：Board member；Work department, is configured at the top of the board member so as to the movement of control base board；Axle portion, it is vertical with the board member to be combined；Main part, is incorporated into the top of the axle portion；Catch bar, the top of the main part is installed on by rack, is promoted substrate to bonding equipment by linear motion；Master gear, is related to the engine portion in the main part and is connected with engine portion；And gear combination, with the master gear and rack linkage so as to control the driving velocity of the catch bar.
Description
Technical field
The present invention relates to the device for promoting substrate in a kind of semiconductor fabrication sequence automatically, more particularly to one kind is as needed
Catch bar or axis can be separated, and the driving velocity of catch bar can be adjusted by gear combination so as to improve semiconductor manufacturing
Automatic substrate pushing meanss (the IMPROVED AUTOMATIC PCB PUSH of the improved bonding equipment of procedures efficiency
APPARATUS OF WIRE BONDING MACHINE)。
Background technology
In general, in the manufacturing process of semiconductor subassembly, the lead frame formed using sheet metal will be partly
Conductor chip face attached thereto, and the wire bonding process that the semiconductor chip is connected with lead with metal wire, this
In wire bonding process, perform and the equipment of the pad of semiconductor chip and bonding wire connection line operation is called bonding equipment.
In the past, in semiconductor fabrication sequence as described above, substrate (tellite) or semiconductor chip are supplied
When being given on the bonding equipment of the metal wire bonding by semiconductor chip and lead electrical connection, having used will be single by gas cylinders
Substrate is pushed into the mode of supply one by one.
But mode as described above is to say that the displacement distance of pushing block is longer, the length of catch bar can increase so as to account for
According to much room, since the accuracy being moved to substrate on desired position can be reduced with accurate dynamics using gas cylinders,
When that substrate cannot be moved to accurate location, substrate is stuck on feed cassette, and if with this state catch bar implementation dynamics
It is excessive, then there is the problem of mistake operating or substrate damage.
Also, adhered to operate the engine of catch bar with horizontal direction, in the semiconductor system using multiple bonding equipments
Make in process stages, it is more difficult due to reducing its size, so limitation may be mounted at the materials such as the equipment quantity of unit space, substrate
When material is stuck on device, by the narrow space of catch bar lower part, due to needing to remove the materials such as the substrate, so making operation
Difficulty rise and there is the problem of needing time or overlong time.
It is as described above in order to solve the problems, such as, develop and reduce size and catch bar can be lifted to top automatic
Substrate pushing meanss, are not only simply to do the operation for removing material, being must be to work by the substrate in magazine (Magazine)
When industry space is moved, can not be by its simple process there are this automatic substrate pushing meanss the problem of.
Magazine is a kind of box for using the assembling of the electronic components such as semiconductor chip in the process of substrate, and substrate is folded
Layer or storage or the transfer being mainly used between each operation.Technology is more flourishing, and the size of substrate becomes larger same gradually in this magazine
Shi Chongliang becomes weight because in the thinning trend of thickness, it is above-mentioned the problem of become apparent.
In addition, conventional automatic substrate pushing meanss cause engine when the sensor error of installation or generation mistake operating
When not stopping, since the jitter phenomenon of engine causes substrate to rock so that undesirable possibility increase occurs.Also, due to
Used Rubber Conveyor Belt Scrap in automatic substrate pushing meanss, by Reusability cause Rubber Conveyor Belt Scrap be worn phenomenon produce it is micro-
, there is the problem of thus causing fraction defective increase in dirt.
From result, actually solve the problem above-mentioned so as to improve operating efficiency and reduce the improvement of fraction defective
Automatic substrate pushing meanss are necessary.
The content of the invention
(solving the problems, such as)
The present invention in order to solve the problems, such as that above-mentioned conventional art is proposed, its object is to, there is provided one kind can improve
The automatic substrate pushing meanss of the improved bonding equipment of semiconductor fabrication sequence efficiency.
More specifically, since the present invention applies separable axis in the automatic substrate pushing meanss of bonding equipment
Portion, so wanting to provide a kind of than to the automatic substrate pushing meanss for transferring the easier bonding equipment of substrate inside and outside magazine.
Also, the gear of its size can be changed since the present invention applies in the automatic substrate pushing meanss of bonding equipment
Combination, so desired offer is a kind of under the power supply of limitation, can also adjust the bonding equipment of catch bar substrate driving velocity
Automatic substrate pushing meanss.
The present invention thinks that technical problems to be solved are limited from above-mentioned technical problem, does not refer to or other
Technical problem can be expressly understood that from the record of the present invention for belonging to people of this area with common knowledge.
(means solved the problems, such as)
According in order to solve the problems, such as the present invention of the conventional art, there is provided a kind of automatic substrate of improved bonding equipment pushes away
Dynamic device, is the automatic substrate pushing meanss for passing on substrate to bonding equipment in semiconductor fabrication sequence, it is characterised in that bag
Include：Board member；Work department, is configured at the top of the board member so as to the movement of control base board；Axle portion, hangs down with the board member
It is straight to combine；Main part, is incorporated into the top of the axle portion；Catch bar (Push Bar), the main part is installed on by rack
Top, by linear motion by substrate to bonding equipment promote；Master gear, be related to the main part transmitter part and with
Engine portion connects；And gear combination (Gear Assembly), with the master gear and rack linkage so as to control the promotion
The driving velocity of bar.
In the present invention, the work department forms mainboard on the top of the board member and is combined with plate covering part to protect
Mainboard is stated, formed with the on/off button being connected with the mainboard in the plate covering part, is formed to receive on the mainboard and moved
Dynamic signal is so as to drive the engine portion to promote the control unit of substrate.
The gear combination of the present invention, including：Block portion；Bevel gear, is configured at described piece of side, and with the master
Gear-linked；And horizontal gear, described piece of opposite side is configured at, is connected by the block portion axis for penetrating through the block portion with the bevel gear
Connect, and link and form with the rack.
Preferably, in the present invention, the big I of the bevel gear and horizontal gear changes to control the promotion speed of catch bar
Degree.
In the present invention, the bevel gear, horizontal gear, master gear and rack are by ceramic (Ceramics) or zirconium oxide
(Zirconia) material is formed.
Preferably, in the present invention, the axle portion is made of the upper axle portion and lower shaft portion being separated from each other.
In the present invention, the facies posterior hepatis of metal material is formed in the one side of the lower shaft portion.
In the present invention, attachment magnets portion is formed in the one side of upper axle portion, when the upper axle portion and the lower axle part
From when, can be attached in facies posterior hepatis or plate covering part.
Preferably, the catch bar can from the main part from.
Present invention additionally comprises sensor portion, so as to perceive the mistake of the catch bar on the another side of the main part
Promote by mistake.
Preferably, in the present invention, the sensor portion is by the linear motion section Liang Ge ends of the catch bar
Respective 1 stop sensor and 1 limiting sensor are formed.
In the present invention, formed in the board member 1 to 2 it is described on axle portion can be inserted into the opening portion of size.
Present invention additionally comprises covering part, is incorporated into the upper end of the main part so as to cover the upper of automatic substrate pushing meanss
Portion face.
Present invention additionally comprises the covering part magnet part in the main part one side, when covering part covers automatic substrate
During pushing meanss, the fixed covering part.
Preferably, present invention additionally comprises position-regulation portion, the lower end of the board member is incorporated into so that automatic substrate pushes away
Dynamic device can be with transverse shifting.
(The effect of invention)
Since the axle portion of the automatic substrate pushing meanss present invention would apply to bonding equipment separates manufacture, thus with than
Be inserted into substrate or the effect for substrate removal operation being easily performed in magazine into magazine.
Also, since the present invention applies the preferable material of abrasiveness in the automatic substrate pushing meanss of bonding equipment and can change
Become the gear combination of size, so with catch bar driving velocity can also be adjusted under the voltage of restricted power supply supply source
Effect.
Also, due to the present invention on the travel direction both sides of catch bar each two sensors of self installation, so when promote
When bar mistake operates, having makes power supply supply interrupt so as to reduce the effect that bad possibility occurs in process.
Brief description of the drawings
Fig. 1 is the front elevation of the automatic substrate pushing meanss of the improved bonding equipment of one embodiment according to the present invention.
Fig. 2 is the end perspective view of the automatic substrate pushing meanss of the improved bonding equipment of one embodiment according to the present invention.
Fig. 3 is that the automatic substrate of one embodiment catch bar or the separated improved bonding equipment of axis promotes dress according to the present invention
The stereogram put.
Fig. 4 is the stereogram of one embodiment gear combination according to the present invention.
Fig. 5 is that the automatic substrate of the improved bonding equipment that one embodiment covering part covers state according to the present invention promotes dress
The stereogram put.
Fig. 6 is the automatic substrate for the improved bonding equipment applied according to the present invention in one embodiment semiconductor fabrication sequence
The demonstration graph of pushing meanss.
(description of reference numerals)
10：Automatic substrate pushing meanss 20：Magazine
30：Bonding equipment 100：Board member
110：Opening portion 200：Work department
210：Plate covering part 220：On/off button
300：Axle portion 310：Upper axle portion
311：Attachment magnets portion 320：Lower shaft portion
321：Facies posterior hepatis 400：Main part
500：Catch bar 510：Rack
600：Master gear 610：Engine portion
700：Gear combination 710：Block portion
720：Bevel gear 730：Horizontal gear
740：Block portion axis 800：Covering part
810：Covering part magnet part 900：Position-regulation portion
1000：Sensor portion
Embodiment
Hereinafter, preferred embodiments of the present invention will be described in detail referring to the drawings.Before this, this specification and power
The term or vocabulary that are used in sharp claimed range cannot be limited to usually or the meaning on dictionary is explained, inventor in order to incite somebody to action from
Oneself invention illustrates that the principle from reasonable definition term concept is started with optimal mode, can only with the technology of the present invention thought
The meaning and concept that meet is explained.Therefore, the structure illustrated in the embodiment described in this specification and attached drawing is only this
Invention most preferred embodiment, is not the explanation to the technological thought whole of the present invention, the actual conditions based on the application should
This, which is interpreted as there may be, replaces these various equivalent and variation.
The term used in the present specification is used in order to illustrate specific embodiment, is not limited to the present invention
's.As used in this description shown, if odd number form is not to explicitly point out other contextual situations, can include multiple
Number form state.
As needed catch bar or axis can separate and by gear combination can adjust the driving velocity of catch bar from
And improve the present invention of semiconductor fabrication sequence operating efficiency, there is provided one kind is based in semiconductor fabrication sequence, in order to utilize
The automatic substrate pushing meanss 10 that bonding equipment (Wire Bonding Machine) 30 passes on substrate, it is characterised in that including：
Board member 100；Work department 200, is configured at the top of the board member so as to the movement of control base board；Axle portion 300, with the plate
Component vertically combines；Main part 400, is incorporated into the top of the axle portion；Catch bar (Push Bar) 500, is pacified by rack 510
Mounted in the top of the main part, substrate is promoted to bonding equipment by linear motion；Master gear 600, is related in the main body
The engine portion in portion and it is connected with engine portion；And gear combination (Gear Assembly) 700, with the master gear and tooth
Bar linkage is so as to control the driving velocity of the catch bar.
In order to further be explained, Fig. 1 illustrates one embodiment according to the present invention improved bonding equipment from
The front elevation of dynamic substrate pushing meanss, the automatic substrate that Fig. 2 illustrates the improved bonding equipment of one embodiment according to the present invention push away
The end perspective view of dynamic device, Fig. 3 illustrate one embodiment catch bar according to the present invention or the separated improved bonding equipment of axis
Automatic substrate pushing meanss stereogram.
Firstly, since the board member 100 of the present invention contacts bottom surface, so playing supporting automatic substrate pushing meanss 10
Effect, and by the morphosis of straight tetragonal, positive quadrangle or circle etc., its material is that metal or plastic cement etc. are as needed
It can be formed by a variety of.
Work department 200, the work department are formed in the board member 100, it is characterised in that including：In the plate portion
Mainboard is formed at the top of part, protects the plate covering part 210 of the mainboard, is connected with mainboard, and in the plate covering part side
Formed open (on)/close (off) button 220 and be formed on the mainboard and receive the engine portion 610 of movable signal with
And the control unit of control base board driving velocity.
In order to adjust the displacement distance of catch bar 500 so as to which the control unit formed can use AVR (Automatic
Voltage Regulator) software is also as needed to work as to be presented using the relay circuit of at least more than one sensor
Right.
Also, with vertical direction combination axle portion 300 on the side of the board member 100, the axle portion mainly plays tune
Save the effect of 10 height of automatic substrate regulating device.To say again, the axle portion penetrates through the board member and is formed, so that axle portion
A part to the lower section of board member it is prominents while can reduce highly, axle portion can also be made not dash forward completely to the lower section of board member
Go out so as to set maximum height.
This axle portion 300 is made of the upper axle portion 310 and lower shaft portion 320 that can be separated from each other, general process into
Operation is carried out with the state of combination in row, when the substrate removed in magazine 20 or when substrate is inserted into magazine, in order to prevent by
It is difficult so as to be separated into the upper axle portion and lower shaft portion in operation caused by automatic substrate pushing meanss 10.
If the upper axle portion 310 and lower shaft portion 320 separate, the distance caused by the physical electrical connection of various accessories
It is difficult placement to be separated from each other long, so forming the facies posterior hepatis 321 of metal material, the upper axis in the one side of the lower shaft portion
Attachment magnets portion 311 is formed in the one side in portion so as to which upper axle portion is attached to the facies posterior hepatis or plate using the attachment magnets portion
In covering part 210.
In addition to the previous methods, inserted on 1 to 2 opening portion 110 that can also be formed in the board member 100
Enter the upper axle portion 310 so as to dispose, use selection of any method according to user.
Main part 400 is connected on the top of the axle portion 300, is longitudinally erect with the main part on the attached drawing of the present invention
Smooth straight tetragonal state show that its form various can be formed according to the needs in process or manufacture.
Formed on the top of the main part 400 and installed by rack 510, and formed by move along a straight line by substrate to
The catch bar 500 that bonding equipment promotes, also, form engine portion 610 in the side of the main part and be connected to described start
Master gear 600 in machine portion.
Also, with the master gear 600 and the linkage of rack 510 so as to control the gear of 500 driving velocity of catch bar
Combination 700 is also mounted on the main part 400.
Fig. 4 illustrates the stereogram of one embodiment gear combination according to the present invention, as shown in the figure, the gear combination
700, it is characterised in that by block portion 710, bevel gear 720 is configured at described piece of side, and with the master gear 600
It is dynamic；And horizontal gear 730, described piece of opposite side is configured at, is connected by the block portion axis 740 for penetrating through the block portion with the bevel gear
Connect, and link with the rack.
The power supply supply source of product absorption starting point is defined to 12V by the automatic substrate pushing meanss of conventional bonding equipment, due to
It is difficult that the speed for being classified engine is become into desired speed with this 12V power supplys, so the present invention is in order to solve described problem
Gear combination 700 is applied in automatic substrate pushing meanss 10.
If simply checking 10 driving of the automatic substrate pushing meanss order using the gear combination 700, pass through work
The control unit driving engine portion 610 in portion 200, the master gear 600 that the engine portion is drivingly connected, the master gear driving cone
Gear 720, the bevel gear drive horizontal gear 730 by block portion axis 740, and the horizontal gear drive rack 510 pushes away so as to follow
Lever 500 performs the stage of linear motion.
The linear motion of this catch bar 500 can also control its speed under limited power as described above, by
In the size that it controls the bevel gear 720 and horizontal gear 730, it is possible to improve or reduce speed.
In addition, in the past by the automatic substrate pushing meanss that pulley and conveyer belt are formed since the generation that frequently rubs is trickle
The foreign substances such as rubber powder, although eventually becoming the reason for causing substrate bad, the present invention is by the bevel gear 720, flat tooth
Wheel 730, master gear 600 and rack 510 are formed by ceramics or zirconium oxide material minimizes friction phenomenon.
Present invention additionally comprises a sensor portion 1000, so as to perceive institute on the another side of the main part 400
The mistake promotion of catch bar 500 is stated, as shown in the figure, the sensor portion is by two, the linear motion section of catch bar end
Respective 1 stop sensor and 1 limiting sensor are formed on end.
Therefore, the stop sensor for being normally at the linear motion of catch bar 500 section Liang Ge ends limits the catch bar
Linear motion boundary, if the stop sensor cannot play its normal effect so as to which mistake operating or mistake occur, be
Prevent the lasting rotation of engine portion 610, limiting sensor can recognize such case so as to attempt to close power supply by switch.
If the engine portion 610 persistently rotates, occur vibration be ultimately present due to trickle substrate position movement from
And undesirable danger occurs, so the present invention interrupts it so that fraction defective minimizes in advance.
Also, present invention additionally comprises covering part 800, is incorporated into the upper end of the main part 400 so as to cover automatic substrate
The upper side of pushing meanss 10, installs covering part magnet part 810 in the main part one side, when covering part covers automatic substrate
During pushing meanss, the covering part is set not rock so as to fixed.
On this content, Fig. 5 illustrates the improved bonding equipment that one embodiment covering part according to the present invention covers state
Automatic substrate pushing meanss stereogram.
Finally, present invention additionally comprises position-regulation portion 900, the lower end of the board member 100 is incorporated into so that automatic base
Plate pushing meanss 10 can be with transverse shifting, it is therefore an objective to moves automatic substrate pushing meanss in the lateral direction, so that determine will be compared with
The optimum position that big or smaller substrate promotes.
This position-regulation portion 900 typically is provided with manual movement so as to fixed structure, as needed including various
Gear to engine can also be made of the structure semi-automatically, or automatically adjusted.
The state that the automatic substrate pushing meanss of the improved bonding equipment of the present invention are applied in semiconductor fabrication sequence is in Fig. 6
In illustrated.
If referring to the drawings, disposed in the travel direction of 10 catch bar 500 of automatic substrate pushing meanss according to the present invention
There is magazine 20, if missing the magazine, can confirm that and be also arranged bonding equipment 30 and other magazine.
If remove by substrate in first magazine 20 or need to be inserted into substrate with this magazine, by the automatic base of the present invention
The axle portion 300 of plate pushing meanss 10 is separated into axle portion 310 and lower shaft portion 320 so as to simply perform operation.
For result, since the axle portion of the automatic substrate pushing meanss present invention would apply to bonding equipment is separable into
Axle portion and lower shaft portion are formed, so easily performed with the operation that substrate is removed than the insertion substrate into magazine or in magazine
Advantage.
Also, the present invention is that the preferable material of abrasivity is applied in the automatic substrate pushing meanss of bonding equipment and can be changed
The gear combination of size under the voltage of limited power supply supply source so that adjust the driving velocity of catch bar, due to pushing away
Each two sensors of self installation on the execution direction both sides of lever, so with when catch bar mistake operates, it is electric to interrupt supply
Source is so as to reduce the advantages of bad possibility occurs in process.
Above to being illustrated on the specific implementation form of the present invention, this is only a demonstration, and the present invention is not
System limited thereto.In the technical field belonging to the present invention, the people with common knowledge does not depart from the scope of the present invention and can
With to the embodiment make a change of explanation or deformation, in the technological thought of the present invention and the right of following record
In equivalents, it is possible to implement a variety of modifications and deformation.
Claims (14)
1. a kind of automatic substrate pushing meanss of improved bonding equipment, are to pass substrate to bonding equipment in semiconductor fabrication sequence
The automatic substrate pushing meanss reached, it is characterised in that including：
Board member；
Work department, be configured at the board member top and the movement of control base board；
Axle portion, it is vertical with the board member to be combined；
Main part, is incorporated into the top of the axle portion；
Catch bar, the top of the main part is installed on by rack, is promoted substrate to bonding equipment by linear motion；
Transmitter part on the main part and the master gear being connected with the engine portion；And gear combination, with institute
Master gear and rack linkage are stated so as to control the driving velocity of the catch bar；
The gear combination, including：
Block portion；
Bevel gear, is configured at the side of the block portion, and links with the master gear；And
Horizontal gear, is configured at the opposite side of the block portion, is connected by the block portion axis for penetrating through the block portion with the bevel gear, and
And link with the rack.
2. the automatic substrate pushing meanss of improved bonding equipment according to claim 1, it is characterised in that
The work department forms mainboard simultaneously on the top of the board member
Plate covering part is combined with to protect the mainboard,
Formed with the on/off button being connected with the mainboard in the plate covering part,
Formed on the mainboard and receive movable signal so as to drive the engine portion to promote the control unit of substrate.
3. the automatic substrate pushing meanss of improved bonding equipment according to claim 1, it is characterised in that
The big I of the bevel gear and horizontal gear changes to control the driving velocity of catch bar.
4. the automatic substrate pushing meanss of improved bonding equipment according to claim 1, it is characterised in that
The bevel gear, horizontal gear, master gear and rack are formed by ceramics or zirconium oxide material.
5. the automatic substrate pushing meanss of improved bonding equipment according to claim 1, it is characterised in that
The axle portion is made of the upper axle portion and lower shaft portion that can be separated from each other.
6. the automatic substrate pushing meanss of improved bonding equipment according to claim 5, it is characterised in that
The facies posterior hepatis of metal material is formed in the one side of the lower shaft portion.
7. the automatic substrate pushing meanss of improved bonding equipment according to claim 6, it is characterised in that
Attachment magnets portion is formed in the one side of upper axle portion, when the upper axle portion is separated with the lower shaft portion, can be attached to
On facies posterior hepatis or plate covering part.
8. the automatic substrate pushing meanss of improved bonding equipment according to claim 1, it is characterised in that
The catch bar can from the main part from.
9. the automatic substrate pushing meanss of improved bonding equipment according to claim 1, it is characterised in that further include：
Sensor portion, promotes on the another side of the main part so as to perceive the mistake of the catch bar.
10. the automatic substrate pushing meanss of improved bonding equipment according to claim 9, it is characterised in that
The sensor portion is by 1 stop sensor each being set on the linear motion section Liang Ge ends of the catch bar
Formed with 1 limiting sensor.
11. the automatic substrate pushing meanss of improved bonding equipment according to claim 5, it is characterised in that
Formed in the board member 1 to 2 be formed as described on axle portion can be inserted into the opening portion of size.
12. the automatic substrate pushing meanss of improved bonding equipment according to claim 1, it is characterised in that further include：
Covering part, is incorporated into the upper end of the main part so as to cover the upper side of automatic substrate pushing meanss.
13. the automatic substrate pushing meanss of improved bonding equipment according to claim 12, it is characterised in that
The covering part magnet part in the main part one side is further included, when covering part covers automatic substrate pushing meanss
When, the fixed covering part.
14. the automatic substrate pushing meanss of improved bonding equipment according to claim 1, it is characterised in that further include：Position
Adjustment portion is put, the lower end of the board member is incorporated into and makes automatic substrate pushing meanss transverse shifting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610895491.XA CN107953044A (en) | 2016-10-14 | 2016-10-14 | The automatic substrate pushing meanss of improved bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610895491.XA CN107953044A (en) | 2016-10-14 | 2016-10-14 | The automatic substrate pushing meanss of improved bonding equipment |
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| Publication Number | Publication Date |
|---|---|
| CN107953044A true CN107953044A (en) | 2018-04-24 |
Family
ID=61953740
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610895491.XA Pending CN107953044A (en) | 2016-10-14 | 2016-10-14 | The automatic substrate pushing meanss of improved bonding equipment |
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| CN204896757U (en) * | 2015-07-19 | 2015-12-23 | 南安贤达机械有限公司 | Material feeding unit on PCB paster production line |
| CN105293040A (en) * | 2015-10-28 | 2016-02-03 | 芜湖市恒浩机械制造有限公司 | Deflecting transloading equipment |
| CN205362453U (en) * | 2016-01-26 | 2016-07-06 | 西安井田亚迪铁心制造有限公司 | Automatic feeding device |
| CN105834845A (en) * | 2016-05-07 | 2016-08-10 | 郭磊 | Automatic feeding and discharging equipment for centerless grinding machine for grinding bearing rollers |
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2016
- 2016-10-14 CN CN201610895491.XA patent/CN107953044A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101094541B1 (en) * | 2010-10-01 | 2011-12-19 | 서영완 | Wire bonding equipment for automatic pcb push apparatus |
| CN104418080A (en) * | 2013-08-19 | 2015-03-18 | 朴兴濬 | Automatic substrate pushing device |
| CN104649042A (en) * | 2013-11-22 | 2015-05-27 | 西安嘉乐世纪机电科技有限公司 | On-line full-automatic PCB feeding machine structure |
| CN104528367A (en) * | 2014-12-24 | 2015-04-22 | 重庆新派工业设计有限公司 | Large stroke pushing device |
| CN104890202A (en) * | 2015-06-03 | 2015-09-09 | 宁波巴斯顿机械科技有限公司 | Automatic material taking device |
| CN204896757U (en) * | 2015-07-19 | 2015-12-23 | 南安贤达机械有限公司 | Material feeding unit on PCB paster production line |
| CN105293040A (en) * | 2015-10-28 | 2016-02-03 | 芜湖市恒浩机械制造有限公司 | Deflecting transloading equipment |
| CN205362453U (en) * | 2016-01-26 | 2016-07-06 | 西安井田亚迪铁心制造有限公司 | Automatic feeding device |
| CN105834845A (en) * | 2016-05-07 | 2016-08-10 | 郭磊 | Automatic feeding and discharging equipment for centerless grinding machine for grinding bearing rollers |
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Application publication date: 20180424 |