CN107942521A - A kind of diode laser array light source - Google Patents
A kind of diode laser array light source Download PDFInfo
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- CN107942521A CN107942521A CN201711389606.9A CN201711389606A CN107942521A CN 107942521 A CN107942521 A CN 107942521A CN 201711389606 A CN201711389606 A CN 201711389606A CN 107942521 A CN107942521 A CN 107942521A
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- heat sink
- diode laser
- laser
- cylindrical lens
- balancing device
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
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- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
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- 238000011840 criminal investigation Methods 0.000 description 2
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0916—Adapting the beam shape of a semiconductor light source such as a laser diode or an LED, e.g. for efficiently coupling into optical fibers
- G02B27/0922—Adapting the beam shape of a semiconductor light source such as a laser diode or an LED, e.g. for efficiently coupling into optical fibers the semiconductor light source comprising an array of light emitters
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
- G02B27/095—Refractive optical elements
- G02B27/0955—Lenses
- G02B27/0961—Lens arrays
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
- G02B27/095—Refractive optical elements
- G02B27/0955—Lenses
- G02B27/0966—Cylindrical lenses
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
Abstract
The present invention is a kind of diode laser array light source, N number of diode laser and its aspheric collimation lens are one by one in N number of mounting hole of metal heat sink, cylindrical lens is located at each hole top surface, opposite with a set of diode laser and aspheric collimation lens, forms N number of Laser emission optics monomer.It is furnished with a light balancing device being made of irregular countless lenticules in the top surface of metal heat sink.The N beams laser that N number of Laser emission optics monomer is sent forms the laser beam with the specific angle of divergence after the light balancing device, and a power >=6w is formed in 1~10 meter of far field;The high even bright hot spot of uniformity >=90%.The light balancing device of the present invention is simple, and efficiency of transmission is high;Output facula uniformity is good, no blackening;Not high to incident beam quality requirement, wave-length coverage is wide.
Description
Technical field
The present invention relates to laser optoelectronic technical field, is specially a kind of diode laser array light source.
Background technology
With the development of diode laser technology, it is applied to multiple fields, and to the requirement of laser optical power
It is higher and higher.Such as, detectd in criminal investigation skill in the material evidence search procedure in field, in order to improve biological material excitation fluorescence intensity and
Contrast using the laser of more power, it is necessary to be excited.The method of currently acquired high power laser light is common following 3 kinds:
1st, the output power of single diode laser is improved;2nd, using single diode laser array;3rd, using multiple optical fiber couplings
The diode laser of conjunction closes beam.Method 1 requires diode laser device to have new development, output power to have carrying for essence
Height, is difficult to realize in a short time, too low by cost performance from the point of view of R & D Cost.Method 2 uses single diode laser array
Require high, traditional water-cooling structure complicated cooling device, volume is necessarily large and bulky, while of high cost.More than 3 a diode of method swashs
The laser that light device is sent closes beam through fiber coupling and obtains high-power laser beam, and operation and maintenance is convenient, but the life of related facility
The requirement of production. art is high, therefore of high cost, and transmission efficiency is low, and overall volume is difficult to install and use greatly.
For this reason, present applicant has proposed the patent application of " a kind of multiple diode laser array encapsulating structures ", this side
The N number of diode laser of case and its aspheric collimation lens are embedded in N number of mounting hole of metal heat sink one by one, and cylindrical lens is located at
Each hole top surface, it is opposite with a set of diode laser and aspheric collimation lens, form a Laser emission optics monomer.The envelope
Assembling structure output power is the sum of N number of diode laser power, ensures the combination of multiple Laser emission optics monomers with small
The angle of divergence and the depth of parallelism;Cooling device is simple, and laser transmission is efficient, small.But the uniformity of light beam can not ensure.
With advances in technology, each field does not require nothing more than laser optical power height, also requires to improve the equal of laser beam spot
Even property.The biological material in field is detectd such as criminal investigation skill to be needed could suitably exciting sample fluorescence using high power and uniform laser
Intensity and contrast, to obtain accurate result.
The common methods and defect of currently acquired uniform laser hot spot are as follows:
A, using frosted glass diffusion sheet or opal diffusion sheet;Transmission efficiency is low, and hot spot lack of homogeneity, is especially adopted
Become apparent from defect during laser light source;
B, using diffraction holographic grating;Its efficiency of transmission can reach 90%, but the even light effect of the laser beam passed through
Difference;
C, combined using microlens array;System complex, it is of high cost, and uniform light spots can only be obtained on focal plane;
D, using lamp guide or liquid light guide pipe;High uniformity, but system complex, the production technology of related facility are wanted
Ask high, and transmission efficiency is low.
In short, be not yet provided with present high even light laser light beam and meanwhile cost it is low, easy to practical light supply apparatus.
The content of the invention
The object of the present invention is to provide a kind of diode laser array light source, N number of diode laser and its aspherical
Collimation lens is one by one in N number of mounting hole of metal heat sink, and cylindrical lens is located at each hole top surface, with a set of diode laser
It is opposite with aspheric collimation lens, form N number of Laser emission optics monomer.It is furnished with one by irregular in the top surface of metal heat sink
Countless lenticules form light balancing device.The laser beam that N number of Laser emission optics monomer is sent is after the light balancing device, shape
Into the laser beam with the specific angle of divergence, the laser beam of this light source output forms the even bright hot spot of a height in far field.
The light balancing device of the present invention is simple, and efficiency of transmission is high;Output facula uniformity is good, no blackening;To incident beam quality requirement not
Height, wave-length coverage are wide.
A kind of diode laser array light source that the present invention designs includes N number of diode laser, N be 3 to 20 it is whole
Number.Each diode laser is furnished with an aspheric collimation lens and a cylindrical lens, forms a Laser emission light
Learn monomer.Metal it is heat sink on have it is mutual with the matched uniformly distributed N number of mounting hole of diode laser, the center line in N number of hole
Parallel, N number of diode laser and its aspheric collimation lens are embedded in heat sink N number of mounting hole one by one, and cylindrical lens is located at
Heat sink upper surface, each cylindrical lens are opposite with a set of diode laser and aspheric collimation lens.N number of Laser emission optics
The depth of parallelism≤0.1mrad between the optical axis of monomer.A piece shape light balancing device, light uniforming device are fixed at the top of N number of cylindrical lens
The piece shape plane of part is vertical with the optical axis of each Laser emission optics monomer, and the N beams laser vertical of N number of Laser emission optics monomer is shone
Penetrate on the light balancing device, the laser beam of output forms a power >=6w in 1~10 meter of far field;The height of uniformity >=90%
Even light spot.
The light balancing device is the microlens array sheet of random arrangement, and light balancing device includes the substrate and substrate one of piece shape
The etch layer of side, the etch layer of transparent plain film substrate side differ for the multiple diameters and radius of curvature of laser ablation formation
The random arrangement of lenticule microlens array.The etch layer of substrate is towards each cylindrical lens top surface.
Diode laser emission laser beam, the angle of divergence of laser beam both direction are consistent or are inconsistent.
Laser beam is collimated by aspheric collimation lens, while compresses the beam divergence angle of both direction;Then laser beam
Collimated again by cylindrical lens, then the beam divergence angle in the one of direction of second compression.By the light twice of two lens
Beam collimates, and the laser beam divergent angle that Laser emission optics monomer is sent is less than milliradian (mrad) magnitude.Each Laser emission light
Learn the depth of parallelism≤0.1mrad between monomer.By above-mentioned light balancing device after each Laser emission optics monomer, formed with specific
One laser beam of the angle of divergence, finally exports an even bright hot spot in 1~10 meter of far field.
The heat sink silver good for heat conduction or copper or Aluminum Heat Sink of the metal.
N number of Laser emission optics monomer all same.
The top of the aspheric collimation lens is aspherical convex lens, and bottom is the identical cylindrical lens of diameter, its is straight
Footpath is more than diode laser outside diameter, its optical axis is overlapped with the laser beam center of diode laser.
The cylindrical lens top surface is convex surface, former and later two sides are parallel to each other, and the side of left and right two is parallel to each other, and
All around four sides are each perpendicular to bottom surface, and bottom surface is rectangular planes, are placed in heat sink upper surface, are pressed in heatsink mounting hole
On, rectangular length is the 6/5 to 4/3 of the aperture of heatsink mounting hole, its width is the 2/3 to 4/5 of heatsink mounting hole aperture,
The optical axis extended line of aspheric collimation lens is perpendicular through square cylindrical lens rectangular central thereon.
The diameter of the light balancing device is more than N number of external diameter of a circle of cylindrical lens top surface, and the thickness of light balancing device is less than
Or equal to 2mm.The distance of light balancing device and cylindrical lens top surface is 1mm~15mm.
The affixed vertical ring of heat sink top surface, the center line of vertical ring are overlapped with heat sink center line, are stood on ring along more saturating than cylinder
High 3mm~the 25mm of top surface of mirror, its inner ring surface are step surface, and the internal diameter in lower inner ring face is less than light balancing device outside diameter, is more than or waits
In N number of external diameter of a circle of cylindrical lens top surface, the internal diameter in upper inner ring face is more than light balancing device outside diameter.Light balancing device is placed in vertical ring
Lower inner ring face step on, and be fixed in the vertical ring at heat sink top.
Have screw thread in the upper inner ring face of vertical ring, the height of trim ring is less than the height in upper inner ring face, the outer wall of trim ring have screw thread,
It is engaged with the screw thread in upper inner ring face, the internal diameter of trim ring is greater than or equal to N number of external diameter of a circle of cylindrical lens top surface.Trim ring revolves
Enter the upper inner ring face of heat sink vertical ring, tighten the even bright device on the step for pushing down the lower inner ring face for being placed in vertical ring, the top of trim ring is low
In edge on the vertical ring at heat sink top.
Compared with prior art, a kind of of the invention diode laser array light source has the beneficial effect that:1st, its output work
Rate is the sum of N number of diode laser power, there is provided meets the high power laser light of needs;The microlens array sheet of random arrangement
Light balancing device, each lenticule is a scattering center, and multiple lenticules of the collimated light beam Jing Guo irregular random distribution, disappear
Except diffraction, the influence of incident beam change is small, produces with the specific angle of divergence, contoured (circular, square or wire etc.)
Uniform laser light beam, avoid zero level speck, 1~10m far field obtain an even light spot;2nd, hair is used with light balancing device
Glass diffusion sheet, opal diffusion sheet, diffraction holographic grating the efficiency of transmission either light source of lamp guide or liquid light guide pipe
Compare, uniformity >=90% of this light source in far-field spot;3rd, cooling device is simple, it is not necessary to complicated water-cooling cooling device;
It is small, it is portable, and packaging technology is simple, and cost is low;4th, laser transmits efficient, efficiency of transmission >=90%;To diode
Laser beam quality is of less demanding, and wave-length coverage is wide, application easy to spread.
Brief description of the drawings
The cross-sectional view of Fig. 1 this diode laser array light source embodiments;
The top view of the diode laser array of Fig. 2 this diode laser array light source embodiments;
The microlens array enlarged diagram of light balancing device in Fig. 3 Fig. 1;
The optical system schematic diagram of Fig. 4 this diode laser array light source embodiments;
The specific profile line spot schematic diagram of Fig. 5 this diode laser array light source embodiments;
The specific profile square focus spot schematic diagram of Fig. 6 this diode laser array light source embodiments;
The specific profile circular light spot schematic diagram of Fig. 7 this diode laser array light source embodiments.
Figure label is:
1st, it is heat sink, 2, diode laser, 3, aspheric collimation lens, 4, cylindrical lens, 5, light balancing device, 6, vertical ring,
7th, trim ring, 8, clamping piece, 9, trim ring ring, 10, pin.
Embodiment
As illustrated in fig. 1 and 2, copper is heat sink 1 to have 6 mounting holes to the present embodiment diode laser array light source, wherein one
A mounting hole is in center, remaining 5 mounting hole is uniformly distributed in a radius centered on the mounting hole at center and is
On the circumference of 25mm.The hole wall spacing of each mounting hole and the spacing of each mounting hole and heat sink outer wall are more than 2.5mm.In each hole
Heart line is parallel to each other.
Heat sink 1 each mounting hole is stepped hole, and lower bore dia is engaged with 2 outside diameter of diode laser, aperture 4mm, on
Hole aperture 5mm, be engaged with aspheric collimation lens 3, and upper hole hole wall has screw thread.
6 diode lasers 2 are embedded in heat sink 1 lower opening of 6 mounting holes one by one, pass through viscose glue and heat sink 1 peace
Dress hole inner wall is fixedly connected, and the pin 10 of diode laser 2 is connected through mounting hole bottom with power cord, this example diode laser
2 bottom of device is 0 with heat sink 1 bottom surface distance.
6 aspheric collimation lens 3 are embedded in the upper hole of each mounting hole, are placed on the step of lower opening one by one;This example
The top of aspheric collimation lens 3 is aspherical convex lens, and bottom is the identical cylindrical lens of diameter, and this example its diameter 5mm, is more than
2 outside diameter of diode laser, its optical axis are overlapped with the laser beam center of diode laser 2.Trim ring ring 9 is becket, ring
Height be less than upper hole depth, the internal diameter of ring is less than the outside diameter of aspheric collimation lens 3, and the outer wall of trim ring ring 9 has screw thread, with heat
The screw thread of hole inner wall is engaged on heavy 1 mounting hole, and trim ring ring 9 screws in hole on heat sink 1 mounting hole, tightens and pushes down aspherical collimation
Lens 3, the top of trim ring ring 9 are less than heat sink 1 upper surface.Aspheric collimation lens 3 fix after, 3 bottom of aspheric collimation lens with
The spacing at the top of diode laser 2 is 2mm, and the top of aspheric collimation lens 3 and the spacing on heat sink 1 surface are 3mm.
6 cylindrical lenses 4 are located on each mounting hole of heat sink 1 upper surface, each cylindrical lens 4 and a set of diode laser
Device 2 and aspheric collimation lens 3 are opposite.One diode laser, 2, aspheric collimation lens 3 and a cylinder are saturating
Mirror 4, forms a Laser emission optics monomer.6 Laser emission optics monomer all sames of this example, and 6 Laser emission optics
The depth of parallelism≤0.1mrad of monomer optical axis.
4 top surface of this example cylindrical lens is convex surface, former and later two sides are parallel to each other, and the side of left and right two is parallel to each other,
And all around four sides are each perpendicular to bottom surface, bottom surface is placed in heat sink 1 upper surface for rectangular planes, is pressed in heat sink 1 installation
Kong Shang, rectangular length are 6mm, its width is 4mm, and the optical axis extended line of aspheric collimation lens 3 is saturating perpendicular through cylinder
4 rectangular bottom surface center of mirror.
This example is in 5 cylindrical lenses 4 on the mounting hole of heat sink 1 periphery radially to dispose, i.e. the length of its rectangular bottom surface
Center line intersects at center mounting hole center;The long center line of 4 rectangular bottom surface of cylindrical lens on center mounting hole is with being in
The long center line of one 4 rectangular bottom surface of cylindrical lens of periphery is in line.
Heat sink 1 top surface, each mounting hole are and heat sink 1 material identical with a pair of clamping piece 8 being parallel to each other, clamping piece 8
Copper sheet, be fixedly connected, vertically erected in mounting hole peritreme both sides with heat sink 1, a pair of of 8 spacing of clamping piece is the length of cylindrical lens 4,
Cylindrical lens 4 is stuck between a pair of of clamping piece 8, and two less opposite sides and the clamping piece 8 of cylindrical lens 4 bond admittedly
It is fixed.
As shown in Figure 1, the affixed vertical ring 6 identical with its material of heat sink 1 top surface of this example, the center line of vertical ring 6 and heat sink 1
Center line overlaps, and edge is higher 20mm than the top surface of cylindrical lens on vertical ring 1, its inner ring surface is step surface, and the internal diameter in lower inner ring face is small
In 5 outside diameter of light balancing device, more than the 6 external diameter of a circles of cylindrical lens top surface, the internal diameter in upper inner ring face is more than outside light balancing device 5
Footpath.Light balancing device 5 is placed on the step in the lower inner ring face of vertical ring 6.
There is screw thread in the upper inner ring face of vertical ring 6, the height of trim ring 7 is less than the height in upper inner ring face, and the outer wall of trim ring 7 has spiral shell
Line, be engaged with the screw thread in upper inner ring face, and the internal diameter of trim ring 7 is more than 6 external diameter of a circles of 4 top surface of cylindrical lens.Trim ring 7 revolves
Enter the upper inner ring face of heat sink 1 vertical ring 6, tighten the even bright device 5 on the step for pushing down the lower inner ring face for being placed in vertical ring 7, trim ring 7
Top is less than edge on the vertical ring 7 at heat sink 1 top.
This example light balancing device is the microlens array sheet of random arrangement, and light balancing device 5 includes the substrate and substrate of piece shape
The etch layer of side, the multiple diameters and radius of curvature that the etch layer of transparent plain film substrate side is formed for laser ablation not phase
The microlens array of the same random arrangement of lenticule, as shown in Figure 3.The etch layer of substrate is towards each 4 top surface of cylindrical lens.
This example powers diode laser 2 by pin 10.The light path of this csr optical system is as shown in figure 4, diode
Laser 2 launches laser beam, and the angle of divergence of laser beam both direction is consistent or inconsistent.Laser beam passes through aspheric
Face collimation lens 3 is collimated, while compresses the beam divergence angle of both direction;Then laser beam passes through cylindrical lens 4 again
Collimated, then the beam divergence angle in the one of direction of second compression.By beam collimation twice, obtain the overall angle of divergence and be less than
The laser beam of milliradian magnitude.The piece shape plane of light balancing device 5 is vertical with the optical axis of each Laser emission optics monomer, and 6 are swashed
The N beam laser beam vertical irradiations of light emitting optics monomer the random arrangement of the light balancing device 5 microlens array on piece, often
A lenticule is a scattering center, and multiple lenticules of the collimated light beam Jing Guo irregular random distribution, eliminate diffraction, generation
Uniform laser light beam, avoids zero level speck, and power >=6w is obtained in the far field of 1~10m;One even light of uniformity >=90%
Spot.
Irregular microlens array using each different lenticules of Computer Simulation statistical analysis light direction and hair
Angle is dissipated, finally show that far-field spot is distributed, i.e. the hot spot with contoureds such as the specific angle of divergence, circle, square or wire.
The parameter obtained according to Computer Simulation, is exposed plain film substrate side, the laser etching process such as photoetching, forms etch layer
Upper specific multiple diameters and the different microlens array of radius of curvature, make collimated light beam pass through some irregular lenticule battle array
Row obtain the specific angle of divergence, the even light spot of contoured, and Fig. 5 to 7 is respectively that the present embodiment is installed additional obtained by different light balancing devices
Linear (0.4 ° × 100 ° of the angle of divergence), square (20 ° × 20 ° of the angle of divergence) and circular (20 ° of the angle of divergence) hot spot.
To illustrate the protrusion effect of the present embodiment, using identical diode laser array, with different light balancing devices
As a comparison case, the hot spot in efficiency of transmission and 5 meter Chu far fields is detected.
Comparative example 1
Any light balancing device is not used.
6 hot spots in 5 meter Chu far fields are consistent with the layout of cylindrical lens, and the uniformity of each hot spot is in typical Gauss light
Beam is distributed.
Comparative example 2
Frosted glass diffusion sheet or opal diffusion sheet are installed in heat sink top surface.
There is direct even light effect, 6 facula areas in 5 meter Chu far fields are all higher than cylindrical lens cross section, and hot spot is mutual
It is overlapping.
Comparative example 3
Diffraction holographic grating is installed in heat sink top surface.
Have direct even light effect, adjust diffraction holographic grating can produce with the specific angle of divergence, contoured (it is circular,
Ellipse or wire etc.) laser beam, but efficiency of transmission is relatively low, in uniformity >=70% of the hot spot in 5 meter Chu far fields,
For naked eyes still it can be seen that bright among hot spot, edge is dark.
Comparative example 4
Combined in the microlens array of heat sink top surface installation rule.
There is direct even light effect, efficiency of transmission and hot spot uniformity are close with the present embodiment, but can only be in focal plane
Obtain uniform light spots.
Comparative example 5
Lamp guide can not be installed directly at the top of each cylindrical lens or liquid light guide pipe carries out even light.Need each two
Optical fiber is coupled in pole pipe laser, then is coupled into lamp guide or liquid light guide pipe.The efficiency of transmission of gained device light is less than
70%.Hot spot uniformity is fine, reaches more than 95%.But mounting process is complicated, device volume is big.
The present embodiment and comparative example carry out even light on identical diode laser array, using different light balancing devices
Effect compares, and experimental result is as shown in table 1.
The identical diode laser array of table 1, using the even light effect comparison sheet of different light balancing devices
By the comparative example using different existing other light balancing devices as it can be seen that only the present embodiment is using random arrangement
Microlens array sheet could realize efficiency of transmission >=90%, form the specific angle of divergence, and the uniformity of contoured (does not have up to 90%
Have zero level speck, i.e., spot center is without especially bright speck) far-field spot, and to the requirement of the beam quality of incident light not
Height, that is, be not required angle of divergence collimation to reach mrad magnitudes, it is not necessary to which unpolarized light beam quality is close to diffraction limit, multimode Gauss light
Beam can also make light source.
Above-described embodiment, is only further described the purpose of the present invention, technical solution and beneficial effect specific
A example, the present invention are not limited to this.All any modifications made within the scope of disclosure of the invention, equivalent substitution, change
Into etc., it is all contained within protection scope of the present invention.
Claims (9)
1. a kind of diode laser array light source, including N number of diode laser (2), N is 3 to 20 integer;Each two pole
Pipe laser (2) is furnished with an aspheric collimation lens (3) and a cylindrical lens (4), forms a Laser emission optics
Monomer;Have on heat sink (1) of metal and the matched uniformly distributed N number of mounting hole of diode laser (2), the center line in N number of hole
It is parallel to each other, N number of diode laser (2) and its aspheric collimation lens (3) are embedded in N number of mounting hole of heat sink (1) one by one,
Cylindrical lens (4) is located at heat sink (1) upper surface, each cylindrical lens (4) and a set of diode laser (2) and aspherical collimation
Lens (3) are opposite;The depth of parallelism≤0.1mrad between the optical axis of N number of Laser emission optics monomer;It is characterized in that:
Fix a piece shape light balancing device (5) at the top of N number of cylindrical lens (4), the piece shape plane of light balancing device (5) with it is each
The optical axis of Laser emission optics monomer is vertical, and the N beam laser verticals of N number of Laser emission optics monomer are radiated at the light balancing device
(5) on, the laser beam of output forms a power >=6w in 1~10 meter of far field;The hot spot of uniformity >=90%;
The light balancing device (5) is the microlens array sheet of random arrangement, and light balancing device (5) includes the substrate and substrate of piece shape
The etch layer of side, the multiple diameters and radius of curvature that the etch layer of transparent plain film substrate side is formed for laser ablation not phase
The microlens array of the same random arrangement of lenticule;The etch layer of substrate is towards each cylindrical lens (4) top surface.
2. diode laser array light source according to claim 1, it is characterised in that:
Silver-colored heat sink or copper of heat sink (1) of the metal for heat conduction well is heat sink or Aluminum Heat Sink.
3. diode laser array light source according to claim 1, it is characterised in that:
N number of Laser emission optics monomer all same.
4. diode laser array light source according to claim 1, it is characterised in that:
The top of the aspheric collimation lens (3) is aspherical convex lens, and bottom is the identical cylindrical lens of diameter, its diameter
More than diode laser (2) outside diameter, its optical axis is overlapped with the laser beam center of diode laser (2).
5. diode laser array light source according to claim 1, it is characterised in that:
Cylindrical lens (4) top surface is convex surface, former and later two sides are parallel to each other, and the side of left and right two is parallel to each other, and
All around four sides are each perpendicular to bottom surface, and bottom surface is rectangular planes, are placed in heat sink (1) upper surface, are pressed in heat sink (1) peace
Fill on hole, rectangular length is the 6/5 to 4/3 of the aperture of heat sink (1) mounting hole, its width is heat sink (1) mounting hole aperture
2/3 to 4/5, the optical axis extended lines of aspheric collimation lens (3) is perpendicular through square cylindrical lens (4) rectangular central thereon.
6. diode laser array light source according to any one of claim 1 to 5, it is characterised in that:
The diameter of the light balancing device (5) is more than the external diameter of a circle of N number of cylindrical lens (4) top surface, the thickness of light balancing device (5)
Less than or equal to 2mm.
7. diode laser array light source according to claim 6, it is characterised in that:
The light balancing device (5) and the distance of cylindrical lens (4) top surface are 1mm~15mm.
8. diode laser array light source according to claim 7, it is characterised in that:
The affixed vertical ring (6) of heat sink (1) top surface, founding ring, (6 center line is overlapped with the center line of heat sink (1), is stood on ring (6)
Along than cylindrical lens, (4 top surface is high 3mm~25mm, its inner ring surface is step surface, and the internal diameter in lower inner ring face is less than light balancing device
(5) outside diameter, more than or equal to the external diameter of a circle of N number of cylindrical lens (4) top surface, the internal diameter in upper inner ring face be more than light balancing device
(5) outside diameter;Light balancing device (5) is placed on the step in the lower inner ring face of vertical ring (6), and is fixed in the vertical ring at the top of heat sink (1).
9. diode laser array light source according to claim 8, it is characterised in that:
There is screw thread in the upper inner ring face of the vertical ring (6), and the height of trim ring (7) is less than the height in upper inner ring face, the outer wall of trim ring (7)
There is screw thread, be engaged with the screw thread in upper inner ring face, the internal diameter of trim ring (7) is greater than or equal to N number of cylindrical lens (4) top surface circumscribed circle
Diameter;Trim ring (7) screws in the upper inner ring face of heat sink vertical ring, tightens on the step for pushing down the lower inner ring face for being placed in vertical ring (6)
Even bright device (5), the top of trim ring (7) is less than edge on the vertical ring (7) at the top of heat sink (1).
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109188823A (en) * | 2018-10-18 | 2019-01-11 | 华北水利水电大学 | A kind of laser array light source for optical scanner |
CN109412017A (en) * | 2018-10-30 | 2019-03-01 | 上海索晔国际贸易有限公司 | A kind of VCSEL laser device |
CN110836724A (en) * | 2018-08-15 | 2020-02-25 | 意法半导体(R&D)有限公司 | Optical device |
CN111880315A (en) * | 2020-08-12 | 2020-11-03 | 中国科学院长春光学精密机械与物理研究所 | Laser lighting equipment |
CN113206440A (en) * | 2021-04-23 | 2021-08-03 | 深圳市利拓光电有限公司 | Dot matrix laser packaging structure |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1688907A (en) * | 2002-09-20 | 2005-10-26 | 康宁股份有限公司 | Random microlens array for optical beam shaping and homogenization |
US20100033829A1 (en) * | 2006-10-10 | 2010-02-11 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Device for Homogenizing Radiation by Means of Irregular Microlens Arrays |
CN105024267A (en) * | 2015-08-01 | 2015-11-04 | 西南技术物理研究所 | Linear laser generation system |
CN105444047A (en) * | 2015-10-22 | 2016-03-30 | 广东三雄极光照明股份有限公司 | Micro lens and square LED down lamp provided with same |
CN107069418A (en) * | 2016-11-29 | 2017-08-18 | 中国电子科技集团公司第三十四研究所 | A kind of multiple diode laser array encapsulating structures |
CN207752250U (en) * | 2017-12-21 | 2018-08-21 | 中国电子科技集团公司第三十四研究所 | A kind of diode laser array light source |
-
2017
- 2017-12-21 CN CN201711389606.9A patent/CN107942521A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1688907A (en) * | 2002-09-20 | 2005-10-26 | 康宁股份有限公司 | Random microlens array for optical beam shaping and homogenization |
US20100033829A1 (en) * | 2006-10-10 | 2010-02-11 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Device for Homogenizing Radiation by Means of Irregular Microlens Arrays |
CN105024267A (en) * | 2015-08-01 | 2015-11-04 | 西南技术物理研究所 | Linear laser generation system |
CN105444047A (en) * | 2015-10-22 | 2016-03-30 | 广东三雄极光照明股份有限公司 | Micro lens and square LED down lamp provided with same |
CN107069418A (en) * | 2016-11-29 | 2017-08-18 | 中国电子科技集团公司第三十四研究所 | A kind of multiple diode laser array encapsulating structures |
CN207752250U (en) * | 2017-12-21 | 2018-08-21 | 中国电子科技集团公司第三十四研究所 | A kind of diode laser array light source |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110836724A (en) * | 2018-08-15 | 2020-02-25 | 意法半导体(R&D)有限公司 | Optical device |
US11573293B2 (en) | 2018-08-15 | 2023-02-07 | Stmicroelectronics (Research & Development) Limited | Apparatus providing a plurality of light beams |
US11815628B2 (en) | 2018-08-15 | 2023-11-14 | Stmicroelectronics (Research & Development) Limited | Apparatus providing a plurality of light beams |
CN109188823A (en) * | 2018-10-18 | 2019-01-11 | 华北水利水电大学 | A kind of laser array light source for optical scanner |
CN109188823B (en) * | 2018-10-18 | 2021-07-13 | 华北水利水电大学 | Laser array light source for optical scanning |
CN109412017A (en) * | 2018-10-30 | 2019-03-01 | 上海索晔国际贸易有限公司 | A kind of VCSEL laser device |
CN111880315A (en) * | 2020-08-12 | 2020-11-03 | 中国科学院长春光学精密机械与物理研究所 | Laser lighting equipment |
CN113206440A (en) * | 2021-04-23 | 2021-08-03 | 深圳市利拓光电有限公司 | Dot matrix laser packaging structure |
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