CN114216100A - Transmission type laser lighting module, light homogenizing method and application - Google Patents
Transmission type laser lighting module, light homogenizing method and application Download PDFInfo
- Publication number
- CN114216100A CN114216100A CN202111408295.2A CN202111408295A CN114216100A CN 114216100 A CN114216100 A CN 114216100A CN 202111408295 A CN202111408295 A CN 202111408295A CN 114216100 A CN114216100 A CN 114216100A
- Authority
- CN
- China
- Prior art keywords
- light
- laser
- wavelength conversion
- conversion unit
- micro
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 23
- 230000005540 biological transmission Effects 0.000 title claims abstract description 19
- 238000006243 chemical reaction Methods 0.000 claims abstract description 45
- 241001270131 Agaricus moelleri Species 0.000 claims abstract description 31
- 238000007493 shaping process Methods 0.000 claims abstract description 31
- 239000002131 composite material Substances 0.000 claims abstract description 29
- 230000003287 optical effect Effects 0.000 claims abstract description 28
- 238000005286 illumination Methods 0.000 claims abstract description 22
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 51
- 239000011248 coating agent Substances 0.000 claims description 30
- 238000000576 coating method Methods 0.000 claims description 30
- 229910052681 coesite Inorganic materials 0.000 claims description 24
- 229910052906 cristobalite Inorganic materials 0.000 claims description 24
- 239000000377 silicon dioxide Substances 0.000 claims description 24
- 229910052682 stishovite Inorganic materials 0.000 claims description 24
- 229910052905 tridymite Inorganic materials 0.000 claims description 24
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(IV) oxide Inorganic materials O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 claims description 18
- 239000010410 layer Substances 0.000 claims description 18
- 239000000919 ceramic Substances 0.000 claims description 16
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 claims description 13
- 238000007747 plating Methods 0.000 claims description 12
- 239000000843 powder Substances 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 6
- 239000002344 surface layer Substances 0.000 claims description 6
- 238000010304 firing Methods 0.000 claims description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical group O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- 229910052593 corundum Inorganic materials 0.000 claims description 4
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 238000003801 milling Methods 0.000 claims description 3
- 239000003921 oil Substances 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 230000001154 acute effect Effects 0.000 claims description 2
- 238000000605 extraction Methods 0.000 abstract description 4
- 239000010408 film Substances 0.000 description 79
- 238000002834 transmittance Methods 0.000 description 16
- 239000000463 material Substances 0.000 description 15
- 238000005516 engineering process Methods 0.000 description 9
- 229910052594 sapphire Inorganic materials 0.000 description 8
- 239000010980 sapphire Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 230000004907 flux Effects 0.000 description 6
- 238000009826 distribution Methods 0.000 description 5
- 230000001795 light effect Effects 0.000 description 5
- 238000011160 research Methods 0.000 description 5
- 239000013078 crystal Substances 0.000 description 4
- 238000002310 reflectometry Methods 0.000 description 4
- 230000002277 temperature effect Effects 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000003667 anti-reflective effect Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 108010043121 Green Fluorescent Proteins Proteins 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/04—Refractors for light sources of lens shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/002—Refractors for light sources using microoptical elements for redirecting or diffusing light
- F21V5/004—Refractors for light sources using microoptical elements for redirecting or diffusing light using microlenses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/04—Refractors for light sources of lens shape
- F21V5/043—Refractors for light sources of lens shape the lens having cylindrical faces, e.g. rod lenses, toric lenses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/08—Refractors for light sources producing an asymmetric light distribution
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/04—Optical design
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
- F21V7/24—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by the material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
- F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/30—Semiconductor lasers
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention belongs to the field of laser illumination, and particularly discloses a transmission type laser illumination module, a light homogenizing method and application. The transmission-type laser lighting module comprises: the device comprises a laser unit, a flat-top shaping lens, a reflection unit, a micro-nano lens array, a wavelength conversion unit, a light homogenizing rod and a free-form surface reflector. According to the invention, through flat top shaping of the negative cylindrical lens, uniform light and beam expansion of the micro-nano lens array, uniform light of the wavelength unit scattering medium and uniform light of the uniform light rod, the uniformity of emergent light is obviously improved. The laser light incidence surface of the wavelength conversion unit is plated with the AR-BP composite film, the light emergent surface is plated with the anti-reflection film, the light extraction efficiency is improved, and the light efficiency of the module is improved. In addition, the optical function of the light homogenizing rod is safely integrated with the laser, so that the light homogenizing rod can homogenize light and protect the light and becomes an inherent safety structure. If the wavelength conversion unit is damaged, the light homogenizing rod can shield the laser, and potential risks of damaging human eyes or causing fire and the like due to laser leakage are avoided.
Description
Technical Field
The invention belongs to the field of laser illumination, and particularly relates to a transmission type laser illumination module, a light homogenizing method and application.
Background
In the laser illumination application, the illumination quality is greatly influenced by the laser speckle phenomenon generated by Gaussian distribution of laser and laser interference, and the transmission-type excitation luminescence is particularly prominent. The concrete expression is as follows: for white light illumination, the central light intensity is high, the edge light intensity is low, the middle color temperature is high, the edge color temperature is low, the middle color is blue, the edge color is yellow, and the light color difference is large. Shaping laser emergent light beams and inhibiting laser speckles are problems to be solved urgently for improving laser illumination effects.
The laser transmission type excites fluorescent crystals (fluorescent ceramics, fluorescent single crystals, fluorescent thin films and the like) to emit light, and the emitted light is emitted in a forward direction and also emitted in a backward direction. Most of which is forward-emerging light. The emission of the forward emergent light is utilized, the emission of the backward emergent light cannot be utilized effectively, and the light extraction efficiency is low. Although the quantum efficiency of the laser excited fluorescent crystal is high, the problem of waste of back-emergent light must be solved to improve the light efficiency of the system.
At present, a few schemes for applying illumination by transmitting laser to excite light have been proposed, such as chinese patent grant publication No. CN 210376903U, grant publication No. CN 211574811U, grant publication No. CN 212060767U, chinese patent application publication No. CN 110195827 a, application publication No. CN 109798457 a, application publication No. CN 105866969 a, application publication No. CN 111022942 a, application publication No. CN 112540464A, etc. In the aspect of laser flat-top shaping, the above research mainly uses aspheric and binary optical elements for shaping, and can realize laser flat-top output at a certain focal plane position or within a certain distance under a fixed spot size. Both methods have precise requirements on the processing of optical elements and the index of incident light beams. In the speckle suppression, researchers have proposed various methods such as a vibrating fiber method, a rotating integrating rod method, a vibrating screen method, a wavelength diversity method, and a phase element method. However, they have their own disadvantages, such as complicated structure, high cost, general speckle suppression effect, etc. Another part of the research is to apply the wavelength conversion component (material) technology to prepare the diffuse reflection layer for dodging. However, the prepared diffuse emission layer is irregular, poor in consistency, large in light loss, low in transmittance, capable of achieving uniform light in a small range, and poor in performance effect in a long distance (more than 25 meters).
In the aspect of improving the light efficiency by laser, researchers have a coating technical scheme of increasing the transmission of blue light and reflecting yellow light, and the coating technical scheme focuses on optical theory and concept. The conventional performances such as wavelength and film layer arrangement mode are researched more. The research on the matching of the film layer and the laser is less, particularly the research on the transmissivity, the reflectivity, the temperature resistance of the film layer and the like is less, and the research on the material, the purity, the structure and the like of the film is less.
The problems of manufacturing a transmissive laser lighting module according to the prior art are improved, but the requirements for high quality lighting are not yet well met. If the problem of light uniformity and light efficiency cannot be well solved only by adopting a single optical technology or a single wavelength conversion device (material) technology, the problem can be effectively solved only by combining the optical technology and the material technology. Therefore, the practical laser lighting module with good light uniformity, high light efficiency and low cost is provided, and the defects in the prior art are overcome, so that the practical laser lighting module has important significance.
In addition, the safety of laser illumination is not studied much in the prior art, and an electromechanical control means is adopted in some designs, but the safety and the optical function are not combined. The optical function of the light homogenizing rod is safely integrated with the laser, so that the light homogenizing rod can homogenize light and protect the light and is of a self-owned safety structure. If the wavelength conversion unit is damaged, the light homogenizing rod can shield the laser, and potential risks of damaging human eyes or causing fire and the like due to laser leakage are avoided.
Disclosure of Invention
As is known in the art, a laser transmission excited fluorescent ceramic wafer (PIC) or a fluorescent single crystal or a fluorescent glass film (PIG) emits light, and has a simple structure, is convenient to use, but has poor light uniformity and low light efficiency. In order to overcome the defects and shortcomings in the prior art, the invention mainly aims to provide a transmission type laser lighting module. Overcomes the defects in the prior art, namelyGood spot uniformity, 25m cross section 1250 × 800mm2The difference of the illumination (light power) of each point in the light spot is less than 30%, the difference of the color temperature is less than 300K, and the illumination quality is obviously improved; the light extraction rate is high, and the system light efficiency is improved by more than 17 lm/W.
The invention also aims to provide a light homogenizing method for transmission type laser illumination.
The invention also aims to provide a laser lighting device prepared by utilizing the transmission type laser lighting module.
The invention also aims to provide the application of the laser lighting module in high-brightness, far-projection, high-stability and long-life searchlighting, searching, shooting, projection lighting and other scenes of aerospace, aviation, navigation, ocean, war industry, automobiles, mines, oil fields, display and the like.
The purpose of the invention is realized by the following scheme:
a transmission type laser illumination dodging method comprises at least two steps of negative cylindrical lens flat top shaping, micro-nano lens array dodging and beam expanding, wavelength unit scattering medium dodging and dodging of a dodging rod.
In one preferred scheme, the transmission type laser illumination dodging method specifically comprises primary negative cylindrical mirror flat top shaping, primary micro-nano lens array dodging and beam expanding, primary wavelength unit scattering medium dodging and primary dodging rod dodging.
A transmission type laser lighting module for realizing the dodging method comprises the following steps: the device comprises a laser unit, a flat-top shaping lens, a reflection unit, a micro-nano lens array, a wavelength conversion unit, a light homogenizing rod and a free-form surface reflector;
the laser unit comprises a Laser (LD) for emitting a light source; the flat-top shaping lens is positioned right in front of the light emitted by the laser, is coaxial with the laser and is used for flat-top shaping of the laser beam; the reflecting unit comprises a reflecting mirror, the laser, the flat-top shaping lens and the reflecting mirror are sequentially connected through a light path along the emergent light direction of the laser, and the reflecting mirror vertically (Z-axis direction) reflects a horizontal laser beam incident from an X axis to the micro-nano lens array; the micro-nano lens array is arranged above the reflector (in the Z-axis direction), and is used for homogenizing and expanding the laser beam reflected by the reflector once to form a circular light spot; the wavelength conversion unit is positioned above the micro-nano lens array and is opposite to emergent light of the micro-nano lens array, circular light spots emergent from the micro-nano lens array are incident to the wavelength conversion unit, and the wavelength conversion unit is excited to emit light; the light emitted by the wavelength conversion unit is scattered by the scattering medium inside for light uniformization again, and the light uniformized by the secondary light uniformization is emitted into the light uniformizing rod; the light homogenizing rod is arranged on an emergent light path of the wavelength conversion unit and is used for performing three-time light homogenizing on incident light in a diffuse reflection mode; and finally, transmitting the light by a free-form surface reflector to form the light shape of the required light spot.
In one preferred embodiment, the transmissive laser lighting module further includes a base, the laser unit is located at the front end (in the direction of the light exit of the reflector) of the base, the reflection unit is located at the tail end (right end) of the base, and the flat-top shaping lens is interposed between the laser unit and the reflection unit; the free-form surface reflector is located on the upper surface of the base.
The micro-nano lens array and the wavelength conversion unit are arranged in the Z-axis direction at the rear part of the base and are positioned in adjacent positioning step holes on the same axis, the wavelength conversion unit is positioned on the upper surface of the base, and the micro-nano lens array is positioned below the wavelength conversion unit; furthermore, the distance between the two is less than 1.0mm, and the middle is provided with a light through hole; the Z axis is orthogonal to the X axis;
the light homogenizing rod is arranged on the upper surface of the base, is positioned on an XOZ plane passing through the central line of the length direction of the base, extends into the reflector from the left end of the base, forms an acute angle with the horizontal plane, and is intersected with the axis of the positioning step hole of the wavelength conversion unit at the focus of the reflector, and the focus of the reflector is positioned in the XOZ plane.
In one preferred scheme, the laser unit further comprises a bracket, the bracket is mounted on the base, and the laser is mounted in an inner hole of a central line (in the X-axis direction) of the bracket; the flat-top shaping lens is arranged in an inner hole (in the X-axis direction) of the center line of the length direction of the base; the reflecting unit further comprises a reflector support, the reflector is arranged in a central positioning groove of the reflector support, and the center of the reflector, the laser and the flat-top shaping lens are arranged on a light path of the same axis. Furthermore, the distance between the flat-top shaping lens and the laser is less than 4 mm.
The units, devices, components, reflectors and the like are fixed and connected through threads and a bracket and are installed on the base; the inner structure is provided with a light through hole or a groove which is matched with the laser beam; the bottom surface and the side surface of the base are also provided with heat dissipation fins (grooves).
In one preferred scheme, the emission wavelength of the laser is 440-480nm, and the optical power is 3.0-5.0W.
In one preferred scheme, the flat-top shaping lens is a negative cylindrical lens, the central thickness is less than or equal to 3.0mm, the focal length is more than or equal to-15 mm, and the clear aperture is more than or equal to 85%. The laser beam is shaped by the flat top of the lens, and the long light spot can be shaped into a rectangular or quasi-circular light spot.
In one preferable scheme, the reflector is an optical quartz coated all-dielectric film, and the reflectivity is higher than 99.0%.
In one preferred scheme, the micro-nano lens array is a randomly arranged micro-lens array, the thickness is 0.30-2.00mm, and the preferred thickness is 1-2 mm; the unit size is 3-2 mm, preferably 10-100 μm; the divergence angle is 10-40 degrees, and preferably 10-30 degrees. Further, a blue light antireflection film is plated on the surface of the micro-nano lens array incident light S1, and the light transmittance is higher than 95%. The diameter and the divergence angle of the laser can be adjusted to obtain different spot uniformity and beam angles. The micro-nano lens array is prepared by a quartz glass etching or quartz glass hot-embossing film method, preferably by quartz glass etching.
In one preferred scheme, the wavelength conversion unit is a fluorescent ceramic chip (PIC), and a scattering medium is added during firing; the scattering medium is TiO2、Al2O3BN, more preferably Al2O3(ii) a The scattering medium is submicron and/or micron-sized, preferably D50: 0.4-30.0 μm, more preferably D50:0.4-20.0 μm; the scattering medium accounts for 3-30% of the mass of the fluorescent powder, and is preferably 4-15%.
In one preferable scheme, the laser light incident surface of the fluorescent ceramic chip of the wavelength conversion unit is plated with an AR-BP composite film for reflecting yellow light (containing more than or equal to 500nm) by using anti-reflection blue light, and the light emergent surface of the fluorescent ceramic chip is plated with an anti-reflection film, so that all visible light passes through the anti-reflection film. The final effect is that blue light is transmitted, yellow light (containing more than or equal to 500nm) and visible light are all emitted forwards, namely emitted along the same direction of laser incidence.
Further, the optical properties of the AR-BP composite film are as follows: in the 400-plus 485nm wave band, the incident angle is 0 +/-5 degrees, Rave is less than or equal to 0.5% @ 400-plus 485nm, Tave is less than or equal to 98.6% @ 400-plus 485nm, and Tave is less than or equal to 0.8% @ 500-plus 800 nm; the purity of the material is more than or equal to 99.99 percent. The AR-BP composite film adopts Ta2O5、HfO2With SiO2And (5) alternately coating. Preferably SiO is used2、Ta2O5Alternately coating as a bottom layer, SiO2、HfO2The alternate coating film is used as a surface layer, the film thickness of the bottom layer is 2000-4500nm, and the film thickness of the surface layer is 200-500 nm;
the optical properties of the antireflection film are as follows: 400-800nm section with an incident angle of 0 +/-5 DEG, R is less than or equal to 0.8%, Tave is more than or equal to 95% @400-800nm section with a film thickness of 200-500nm section, and SiO is adopted2、HfO2And (5) alternately coating, wherein the purity of the material is 99.99%.
The coating layer can resist the temperature of 700 ℃, is matched with high-density blue laser, and improves the luminous efficiency of the system by more than 17 lm/W.
In addition, the wavelength conversion unit can generate white light, green light, red light, and the like, and can be freely changed according to needs.
In one preferable scheme, the light homogenizing rod is a multi-radian hook-shaped diffuse reflection rod body, the length is 10-30mm, the width is 1.0-2.5mm, and the thickness is 1.0-2.5 mm; the coating of the diffuse reflection layer of the light homogenizing rod is high-temperature-resistant silicon resin mixed nano and/or micron powder, and the uniform rod diffuse reflection layer is prepared by coating the coating by a conventional spraying method and baking and curing. Preferably, the baking temperature is 350-450 ℃, and the baking time is 20-35 min.
Particularly preferably, the coating comprises the following components in percentage by mass:
the light-homogenizing rod is designed into the own safety structure of the laser module, and the influence of the light-homogenizing rod on the light efficiency is less than 5 lm/W. The light homogenizing rod can shield strong light beams emitted by the wavelength conversion unit in the Z-axis direction and strong light beams reflected by an XOZ plane passing through the center line of the reflector when the module light (light source) is observed from the front side of the light outlet of the reflector. If the wavelength conversion unit is damaged, the light homogenizing rod can shield the laser, and potential risks of damaging human eyes or causing fire and the like due to laser leakage are avoided.
In one preferred scheme, the light-emitting direction of the free-form surface reflector is opposite to the light-emitting direction of the LD, and the included angle is 135 minus 180 degrees. The reflector is formed by finely adjusting a plurality of small curved surfaces on the paraboloid rotating body, so that emergent light spots meet a certain shape.
The transmission type laser lighting module adopts a parent structure except for the light homogenizing rod and the reflector, and is divided into units by linear cutting after the integral positioning, punching, cutting and milling of a workpiece. The coaxiality, the verticality and the planeness of each unit are high, the positioning is accurate, the scattering is less, and the light loss is small.
A laser lighting device is made of 1-n transmission laser lighting modules, wherein n is a natural number. Further, the transmission type laser lighting device also comprises components such as an optical lens, a controller, a shell or a glass panel.
The transmission type laser lighting module can be used for high-brightness, long-distance projection, high-stability and long-life searchlighting, searching, shooting, projection lighting and other scenes of aerospace, aviation, navigation, ocean, war industry, automobiles, mines, oil fields, display and the like.
Compared with the conventional technology in the field, the invention is characterized in that:
the method obviously improves the light uniformity through primary negative cylindrical mirror flat top shaping, primary micro-nano lens array dodging and beam expanding, primary wavelength unit scattering medium dodging and primary dodging rod dodging. The invention has the further characteristics that the light incident surface of the PIC laser of the wavelength conversion unit is plated with an anti-reflection AR-BP composite film, and the light emergent surface is plated with an anti-reflection film, so that the light extraction rate is improved, and the light efficiency of the system is improved. The third characteristic of the invention is that the optical function of the light-homogenizing rod and the laser are safely fused, and the light-homogenizing rod can homogenize light and protect the light and becomes a self-owned safety structure. The fourth characteristic of the invention is that the structure is exquisite, except the light homogenizing rod and the reflector, the module adopts a parent structure, and the module is divided into units by linear cutting after the whole positioning, punching, cutting and milling of a workpiece, and the coaxiality, verticality and planeness of each unit are high, and the positioning is accurate. Light scattering is small and light loss is small. Small size, light weight and low cost.
Drawings
FIG. 1 is a perspective view of a laser lighting module according to an embodiment of the present invention;
the device comprises a laser unit-10, a laser-110, a support-120, a base-20, a flat-top shaping lens-220, a micro-nano lens array-230, a wavelength conversion unit-240, a reflection unit-30, a reflector-310, a reflector support-320, a light homogenizing rod-40 and a reflector-50.
FIG. 2 is a perspective cross-sectional view of a laser lighting module in an embodiment of the present invention;
FIG. 3 is a cross-sectional view of the laser lighting module of FIG. 1;
FIG. 4 is a schematic view showing a laser light source of a fluorescent ceramic sheet coated with SiO on the laser light entrance surface of the laser lighting module of example 22/Ta2O5And SiO2/HfO2The light-emitting surface of the AR-BP composite film is coated with SiO2/HfO2Reflectance curve of antireflective film;
FIG. 5 is an optical sapphire SiO-plated film2、Ta2O5And SiO2、HfO2The transmittance curve of the composite film before and after baking at 700 ℃.
FIG. 6 is optical sapphire SiO-plated2/Nd2O5Film and uncoated SiO2/Nd2O5The transmittance curve of the AR-BP composite film;
FIG. 7 is an optical sapphire SiO-plated film2/Nd2O5Before and after baking the membrane system AR-BP composite membrane at 700 DEG CA transmittance curve;
FIG. 8 is a 25m cross-section 1250X 800mm2The distribution curve of the illumination of each point in the light spot;
FIG. 9 is a 25m cross-section 1250X 800mm2And color temperature distribution curves of all points in the light spots.
Detailed Description
The present invention will be described in further detail with reference to examples and drawings, but the embodiments of the present invention are not limited thereto. The raw materials related to the invention can be directly purchased from the market. For process parameters not specifically noted, reference may be made to conventional techniques.
Please refer to fig. 1-3 for a laser lighting module of the present invention. Fig. 1 is a perspective structural view of a laser lighting module in an embodiment of the present invention, fig. 2 is a perspective sectional view of the laser lighting module in the embodiment of the present invention, and fig. 3 is a sectional view of the laser lighting module in the embodiment of the present invention:
the laser unit 10 is disposed at the front end (left end) of the base 20, and the laser 110 is installed in the inner hole of the center line (X-axis direction) of the holder 120 thereof. The flat-top shaping lens 220 is arranged in an inner hole (in the X-axis direction) of the central line of the length direction of the base 20, is positioned right in front of the laser 110, has a distance of less than 4mm, is coaxial with the laser 110, and is used for flat-top shaping of a laser beam; the flat top shaping lens 220 shapes the "long bar" type laser spot into a rectangular or quasi-circular spot. The reflecting unit 30 is disposed at the rear end (right end) of the base 20, opposite to the laser unit 10, the reflecting mirror 310 is installed in a central positioning groove of the reflecting mirror support 320, and the center of the reflecting mirror 310 is located on the light path of the same axis as the laser 110 and the flat top shaping lens 220. The reflector 310 vertically reflects the horizontal laser beam incident from the X axis (Z axis direction) to the micro-nano lens array 230, the micro-nano lens array 230 homogenizes and expands the laser beam, and the rectangular or quasi-circular light spot is shaped into a circular light spot with uniform light intensity distribution, so that the optical density is reduced; circular light spots emitted by the micro-nano lens array 230 enter a wavelength conversion unit 240, the wavelength conversion unit 240 is located above the micro-nano lens array 230, the distance is smaller than 1.0mm, and the wavelength conversion unit 240 is excited to emit light; the light emitted from the wavelength conversion unit 240 is scattered by the scattering medium added in the wavelength conversion unit 240 for the second dodging and then enters the dodging rod 40, the dodging rod 40 diffusely reflects the incident light for the third dodging, the diffusely reflected light enters the free-form surface reflector 50 and then is projected, the light-emitting direction of the free-form surface reflector 50 is opposite to the light-emitting direction of the LD, and the included angle is 135-.
Example 1
The PIC of the module wavelength conversion unit of the embodiment is a YAG fluorescent ceramic sheet (white light), and is not plated with an AR-BP composite film and an antireflection film.
Referring to fig. 1-3, the arrangement (counting) and functions of the units, devices, components, reflectors and bases are the same as those described above and will not be described again. LD is emission wavelength 450nm, light power 5.0W; the flat-top shaping lens is a negative cylindrical lens, the center thickness is 2.0mm, the focal length is-15 mm, the clear aperture is 85%, and the distance between the flat-top shaping lens and the LD is 1.0 mm; the thickness of the micro-nano lens array is 1.2mm, the unit size is 20 mu m, the divergence full angle is 10 degrees, the randomly arranged micro-lens array is manufactured by quartz etching, the surface of incident light S1 of the lens is plated with a blue light antireflection film, and the light transmittance is 95 percent; the wavelength conversion unit is PIC (brand XUFU, model XF-PIC-6000K-0303), and scattering medium TiO is added during the PIC firing2And D50: 0.6 μm, adding 7% of fluorescent powder, not plating AR-BP composite film on the surface of PIC laser, and not plating antireflection film on the surface of emergent light.
The light homogenizing rod is a multi-radian hook-shaped diffuse reflection rod body, the length is 25mm, the width is 2.0mm, and the thickness is 2.0 mm; the diffuse reflection layer of the light homogenizing rod is prepared by preparing a coating by mixing high-temperature-resistant silicon resin with micron powder and the like, and is coated by a conventional spraying method. The coating comprises the following components in percentage by mass:
baking and curing the coating at the temperature of 350-450 ℃ for 20-35min to obtain a diffuse reflection layer of the fluorescent rod; the multi-curved surface reflector is formed by finely adjusting a plurality of small curved surfaces on the paraboloid rotating body, so that emergent light spots meet the shape of a 'shoe-shaped gold ingot'.
The light flux, color temperature and light effect data measured in example 1 are shown in table 1.
Example 2
Please continue to refer to fig. 1-3As shown. This embodiment is substantially the same as embodiment 1. The only difference is that in this embodiment, the module wavelength converting unit PIC is coated with the AR-BP composite film and the antireflection film. The AR-BP composite film with the anti-reflection blue light reflection yellow light (containing more than or equal to 500nm) is plated on a PIC laser light incident surface, and the optical properties are as follows: in the 400-plus 485nm wave band, the incident angle is 0 +/-5 degrees, Rave is less than or equal to 0.5% @ 400-plus 485nm, Tave is less than or equal to 98.6% @ 400-plus 485nm, and Tave is less than or equal to 0.8% @ 500-plus 800 nm; by means of SiO2、Ta2O5Alternately coating as bottom layer and SiO2、HfO2The alternate coating is used as a surface layer, the thickness of the bottom layer is 3000nm, the thickness of the surface layer is 300nm, and the material purity is more than or equal to 99.99%. Plating an antireflection film on the light emergent surface of the PIC, wherein the optical properties are as follows: 400-800nm section (incident angle 0 +/-5 ℃), R is less than or equal to 0.8%, Tave is greater than or equal to 95% @400-800nm, the film thickness is 300nm, SiO is adopted2、HfO2Alternately coating films, wherein the purity of the material is more than or equal to 99.99 percent.
The film layer can resist the temperature of 700 ℃, is matched with high-density blue laser, and improves the light efficiency of a system by more than 17.2 lm/W.
FIG. 4 is a graph of the reflectivity of the PIC AR-BP coated composite film and the antireflective film measured in example 2. The data of light flux, color temperature and light effect are shown in table 1.
Example 3
Please continue to refer to fig. 1-3. This embodiment is substantially the same as embodiment 2. The difference is that in the present embodiment, the module wavelength conversion unit PIC is a LuAG green fluorescent ceramic plate (brand XUFU, model XF-PIC-525nm-0303), and a scattering medium Al is added during the PIC firing2O3And D50: 0.6 μm, 7% of the mass of the added fluorescent powder), no light homogenizing rod is arranged in the module, the LD is the emission wavelength of 450nm, the optical power is 5.0W, and the actual input electric power is 7.8W.
The light flux, color temperature and light effect data measured in example 3 are shown in table 2; it can be seen that the light efficiency of the module of the embodiment 3 is high, but the light uniformity is poor and the dispersion is large.
Example 4
Please continue to refer to fig. 1-3. This embodiment is substantially the same as embodiment 3. The only difference is that in this embodiment the module is provided with a dodging rod.
The light flux, color temperature and light effect data measured in example 4 are shown in table 2; it can be seen that the light efficiency of the module of the embodiment 4 is high, the light uniformity is good, the dispersion is small, and the electro-optical efficiency is only reduced by 4.9 lm/W. The invention has the advantages that after the light homogenizing rod is arranged, the uniformity of emergent light is improved, meanwhile, the influence on the light effect is small, and the self-owned characteristic of the safety of laser is realized.
Example 5
Please continue to refer to fig. 1-3. This embodiment is substantially the same as the embodiment of example 2, and is a further modification of example 2. The difference is that in the present embodiment, the module wavelength conversion unit PIC fluorescent ceramic plate is XF-PIC-6700K-0303, and scattering medium Al is added during the PIC firing2O3And D50: 0.6 mu m, 7 percent of the mass of the fluorescent powder, 1.2mm of the thickness of the micro-nano lens array, 10um of unit size and 30 degrees of divergence angle.
Al2O3The introduction of scattering medium can not only scatter light, but also increase the heat conduction of ceramics, compared with the addition of TiO in fluorescent ceramics2The scattering medium performance is improved. The temperature saturation effect of the light generated by the ceramic is weaker, and the high-power-density white light illumination can be realized.
The divergence angle of the large-angle micro-nano lens array is increased, the uniformity of light is further enhanced, and the requirement of high-uniformity illumination can be better met.
FIG. 8 shows a cross-section 1250 × 800mm of 25m in example 52And testing the illumination of each point in the light spot.
FIG. 9 shows a cross-section 1250 × 800mm of 25m in example 52And testing the color temperature distribution of each point in the light spot.
Table 1 luminous flux, color temperature and luminous efficacy data measured in examples 1 and 2
Table 2 luminous flux, color temperature and luminous efficacy data measured in examples 3 and 4
Comparative example 1
The coating technology is one of modern optical precision machining technologies, the methods are numerous, the family spectrum is rich, and many top-end subdivision technologies are still under development and are not on the ground. As known in the industry, the blue light LD for laser illumination has a wavelength of 440-480nm, a narrow wavelength, high optical density and high spot temperature (generally more than 300 ℃), and has high matching requirements on the transmissivity of the blue light, the reflectivity of yellow light and visible light of a coating material and good temperature resistance. Under-bonded sapphire SiO-plated2/Ta2O5And SiO2/HfO2Composite film and SiO-plated film2/Nd2O5Comparative examples of film systems illustrating the differences in performance after coating of different film systems:
1. an AR-BP composite film for reflecting yellow light (containing more than or equal to 500nm) by anti-reflection blue light is plated on a laser light incident surface of an A optical sapphire wafer (with the thickness of 0.30mm), and the film thickness is 3000 nm. By means of SiO2、Ta2O5And SiO2、HfO2The film system and the film coating method are the same as the example 2, and the material purity is more than or equal to 99.99 percent; plating a reflection reducing film on the light emergent surface of the sapphire, wherein the optical properties of the reflection reducing film are as follows: 400-800nm section (incident angle 0 +/-5 ℃), R is less than or equal to 0.8%, Tave is greater than or equal to 95% @400-800nm, the film thickness is 300nm, SiO is adopted2、HfO2Alternately coating films, wherein the purity of the material is more than or equal to 99.99 percent. The transmittance of the a-coated wafer was tested before and after baking at 700 ℃ for 30 minutes (see fig. 5).
2. In 3#Transmittance of optical sapphire wafer (thickness 0.30mm) was measured before plating, and 3#Plating an antireflection film (AR) on one side: 400-500nm wave band (incident angle 0 +/-5 ℃), R is less than or equal to 0.8 percent, and the film thickness is 300 nm. By means of SiO2、Nd2O5Alternately coating, the material purity is more than or equal to 99.99% (see figure 6);
3. in 1#、2#Coating an antireflection film (AR) on a laser light incident surface of an optical sapphire wafer (thickness of 0.30 mm): 400-500nm wave band (incident angle 0 +/-5 ℃), R is less than or equal to 0.8 percent, and the film thickness is 300 nm. By means of SiO2/Nd2O5Alternately coating films, wherein the material purity is more than or equal to 99.99 percent; plating anti-reflection blue light reflection yellow light (includingNot less than 500nm) and the film thickness is 3000 nm. By means of SiO2/Nd2O5Alternately coating films, wherein the purity of the material is more than or equal to 99.99 percent, and testing the transmissivity of the material (see figure 6);
4. 1 in the '4' is added#The coated wafer was baked at 700 ℃ for 30 minutes to test its transmittance (see FIG. 7).
As can be seen from fig. 5: for SiO2、Ta2O5And SiO2、HfO2The transmittance of the composite film system is sharply reduced after 490nm, which indicates that blue laser passes through the composite film system, and the transmittance is almost not reduced after the composite film system is baked for 30 minutes at 700 ℃, so that the composite film system is matched with the laser optics.
As can be seen from FIG. 6, for SiO2/Nd2O5Film system, the transmissivity is obviously increased after the AR film is plated; the transmittance of the AR-BP plated composite film is sharply reduced after 475nm, which indicates that part of blue laser can not pass through; as can be seen from FIG. 7, SiO plating2/Nd2O5The transmittance of the sample of AR-BP film after baking at 700 ℃ for 30 minutes decreased by 4%. The film system is not well matched with the blue laser, and cannot be matched with the SiO film of the invention2、Ta2O5And SiO2、HfO2The composite film system has the same effect. The same theory shows that PIC is plated with SiO2/Nd2O5The film-based AR-BP film cannot be used for SiO coating in the invention2、Ta2O5And SiO2、HfO2The composite film system has the same effect.
FIG. 5 is a SiO plating2、Ta2O5And SiO2、HfO2The transmittance curve of the AR-BP composite film of the film system before and after high-temperature baking;
FIG. 6 is a SiO plating2/Nd2O5Film and uncoated SiO2/Nd2O5The transmittance curve of the AR-BP composite film;
FIG. 7 is a SiO plating2/Nd2O5The transmittance curve before and after baking the AR-BP film of the film system at high temperature.
The above embodiments are preferred embodiments of the present invention, but the present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be construed as equivalents thereof, and all such changes, modifications, substitutions, combinations, and simplifications are intended to be included in the scope of the present invention.
Claims (10)
1. A transmission type laser illumination dodging method is characterized in that: the method comprises at least two steps of flat top shaping of a negative cylindrical lens, light homogenizing and beam expanding of a micro-nano lens array, light homogenizing of a wavelength unit scattering medium and light homogenizing of a light homogenizing rod.
2. A transmissive laser illumination module for implementing the method of claim 1, comprising: the device comprises a laser unit, a flat-top shaping lens, a reflection unit, a micro-nano lens array, a wavelength conversion unit, a light homogenizing rod and a free-form surface reflector;
the laser unit comprises a laser for emitting a light source; the flat-top shaping lens is positioned right in front of the light emitted by the laser, is coaxial with the laser and is used for flat-top shaping of the laser beam; the reflecting unit comprises a reflecting mirror, the laser, the flat-top shaping lens and the reflecting mirror are sequentially connected through a light path along the laser emitting direction, and the reflecting mirror vertically reflects a horizontal laser beam incident from an X axis to the micro-nano lens array; the micro-nano lens array is arranged above the reflector, and primary light homogenizing and beam expanding are carried out on the laser beams reflected by the reflector to form circular light spots; the wavelength conversion unit is positioned above the micro-nano lens array and is opposite to emergent light of the micro-nano lens array, circular light spots emergent from the micro-nano lens array are incident to the wavelength conversion unit, and the wavelength conversion unit is excited to emit light; the light emitted by the wavelength conversion unit is scattered by a scattering medium in the wavelength conversion unit for secondary light uniformization, and the secondary light uniformization is emitted into the light uniformization rod; the light homogenizing rod is arranged on an emergent light path of the wavelength conversion unit and is used for performing three-time light homogenizing on incident light in a diffuse reflection mode; and finally, transmitting the light by the free-form surface reflector to form the required light shape.
3. The transmissive laser lighting module of claim 2, wherein:
the transmission type laser lighting module comprises a base, wherein the laser unit is positioned at the front end of the base, the reflection unit is positioned at the tail end of the base, and the flat-top shaping lens is arranged between the laser unit and the reflection unit; the free-form surface reflector is positioned on the upper surface of the base;
the micro-nano lens array and the wavelength conversion unit are arranged in the Z-axis direction at the rear part of the base and are positioned in adjacent positioning step holes on the same axis, the wavelength conversion unit is positioned on the upper surface of the base, and the micro-nano lens array is positioned below the wavelength conversion unit;
the light homogenizing rod is arranged on the upper surface of the base, is positioned on an XOZ plane passing through the central line of the length direction of the base, extends into the reflector from the left end of the base, forms an acute angle with the horizontal plane, and is intersected with the axis of the positioning step hole of the wavelength conversion unit at the focus of the reflector, and the focus of the reflector is positioned in the XOZ plane.
4. The transmissive laser lighting module of claim 2, wherein: the flat-top shaping lens is a negative cylindrical lens, the center thickness is less than or equal to 3.0mm, the focal length is more than or equal to-15 mm, and the clear aperture is more than or equal to 85%;
the micro-nano lens array is a randomly arranged micro-lens array, the thickness is 0.30-2.00mm, the unit size is 3 mu m-2mm, and the divergence angle is 10-40 degrees.
5. The transmissive laser lighting module of claim 2, wherein: the wavelength conversion unit is a fluorescent ceramic piece, a scattering medium is added in the fluorescent ceramic piece during firing, and the scattering medium is TiO2、Al2O3And BN.
6. The transmissive laser lighting module of claim 2, wherein: the laser light incident surface of the fluorescent ceramic chip of the wavelength conversion unit is plated with an AR-BP composite film for reflecting yellow light by anti-reflection blue light, and the light emergent surface of the fluorescent ceramic chip is plated with an anti-reflection film;
the above-mentionedOptical properties of the AR-BP composite film: in the 400-plus 485nm wave band, the incident angle is 0 +/-5 degrees, Rave is less than or equal to 0.5% @ 400-plus 485nm, Tave is less than or equal to 98.6% @ 400-plus 485nm, and Tave is less than or equal to 0.8% @ 500-plus 800 nm; the film thickness of the AR-BP composite film is 2000-5000 nm; the AR-BP composite film adopts Ta2O5And HfO2With SiO2Alternately plating a film; preferably SiO is used2、Ta2O5Alternately coating as bottom layer and SiO2、HfO2The alternate coating film is used as a surface layer, the film thickness of the bottom layer is 2000-4500nm, and the film thickness of the surface layer is 200-500 nm;
the optical properties of the antireflection film are as follows: 400-800nm section with an incident angle of 0 +/-5 DEG, R is less than or equal to 0.8%, Tave is more than or equal to 95% @400-800nm section with a film thickness of 200-500nm section, and SiO is adopted2、HfO2And (5) alternately coating.
7. The transmissive laser lighting module of claim 2, wherein:
the light homogenizing rod is a multi-radian hook-shaped diffuse reflection rod body; the coating of the diffuse reflection layer of the light homogenizing rod is high-temperature-resistant silicon resin mixed nano and/or micron powder, is coated by a conventional spraying method, and is baked and cured to prepare the uniform rod diffuse reflection layer;
preferably, the coating comprises the following components in percentage by mass:
the light-emitting direction of the free-form surface reflector is opposite to the light-emitting direction of the LD, and the included angle is 135-180 degrees.
8. The transmissive laser lighting module of claim 2, wherein: except the light homogenizing rod and the reflector, the module adopts a parent structure, and is divided into units by linear cutting after integral positioning, punching, cutting and milling of a workpiece.
9. A laser lighting device made of 1 to n transmissive laser lighting modules according to any one of claims 2 to 8, wherein n is a natural number.
10. Use of the transmissive laser lighting module of any of claims 2 to 8 in aerospace, aviation, marine, military, automotive, mine and oil field, projection display or camera scenes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111408295.2A CN114216100A (en) | 2021-11-19 | 2021-11-19 | Transmission type laser lighting module, light homogenizing method and application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111408295.2A CN114216100A (en) | 2021-11-19 | 2021-11-19 | Transmission type laser lighting module, light homogenizing method and application |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114216100A true CN114216100A (en) | 2022-03-22 |
Family
ID=80698234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111408295.2A Pending CN114216100A (en) | 2021-11-19 | 2021-11-19 | Transmission type laser lighting module, light homogenizing method and application |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114216100A (en) |
Citations (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102853330A (en) * | 2011-06-28 | 2013-01-02 | 夏普株式会社 | Illumination device and vehicle headlight |
| CN204740418U (en) * | 2015-07-14 | 2015-11-04 | 中国科学院重庆绿色智能技术研究院 | Blue light fluorescence excitation powder formula laser car light based on DMD |
| CN105866969A (en) * | 2016-03-03 | 2016-08-17 | 北京应用物理与计算数学研究所 | Method of increasing laser far-field light spot uniformity based on light ladder |
| US20180081182A1 (en) * | 2015-04-15 | 2018-03-22 | Sharp Kabushiki Kaisha | Illumination device and observation system |
| CN107940268A (en) * | 2017-12-21 | 2018-04-20 | 超视界激光科技（苏州）有限公司 | Laser module and laser lighting lamp |
| CN107942521A (en) * | 2017-12-21 | 2018-04-20 | 中国电子科技集团公司第三十四研究所 | A kind of diode laser array light source |
| CN109578823A (en) * | 2018-12-17 | 2019-04-05 | 华中科技大学 | A kind of laser white light source of laser diode and fluorescent powder membrane cooling simultaneously |
| CN109798457A (en) * | 2019-01-23 | 2019-05-24 | 厦门大学 | A kind of transmission-type blue laser light fixture |
| CN110195827A (en) * | 2018-02-26 | 2019-09-03 | 上海午井光电科技有限公司 | The transmission-type laser illumination system of component is reformed equipped with optical path and light wave |
| CN110388578A (en) * | 2019-08-09 | 2019-10-29 | 广州光联电子科技有限公司 | A kind of laser lighting light source |
| CN111022942A (en) * | 2018-10-09 | 2020-04-17 | 深圳市绎立锐光科技开发有限公司 | Laser lighting device |
| CN210376903U (en) * | 2019-09-06 | 2020-04-21 | 成都绝影智能科技有限公司 | Speckle-dissipating laser light source device for machine vision |
| WO2020078185A1 (en) * | 2018-10-15 | 2020-04-23 | 深圳市绎立锐光科技开发有限公司 | Illumination device and illumination system |
| CN211574811U (en) * | 2020-04-22 | 2020-09-25 | 史晓庆 | Laser illumination structure with uniform light color |
| CN211600261U (en) * | 2020-01-03 | 2020-09-29 | 上海航空电器有限公司 | High-power semiconductor laser lighting device |
| CN212060767U (en) * | 2020-05-27 | 2020-12-01 | 史晓庆 | Laser lighting structure with even facula |
| WO2021037224A1 (en) * | 2019-08-29 | 2021-03-04 | 深圳市中光工业技术研究院 | Laser light source and laser light source system |
| CN112540464A (en) * | 2019-09-20 | 2021-03-23 | 中国空气动力研究与发展中心超高速空气动力研究所 | Laser homogenization illumination light path and device |
| WO2021121073A1 (en) * | 2019-12-18 | 2021-06-24 | 深圳市中光工业技术研究院 | Beam lamp light source system |
| CN213750520U (en) * | 2020-12-01 | 2021-07-20 | 深圳市中光工业技术研究院 | Laser light source device |
| CN213840548U (en) * | 2021-01-13 | 2021-07-30 | 湖州中科光电技术有限公司 | Double-laser light source module |
-
2021
- 2021-11-19 CN CN202111408295.2A patent/CN114216100A/en active Pending
Patent Citations (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102853330A (en) * | 2011-06-28 | 2013-01-02 | 夏普株式会社 | Illumination device and vehicle headlight |
| US20180081182A1 (en) * | 2015-04-15 | 2018-03-22 | Sharp Kabushiki Kaisha | Illumination device and observation system |
| CN204740418U (en) * | 2015-07-14 | 2015-11-04 | 中国科学院重庆绿色智能技术研究院 | Blue light fluorescence excitation powder formula laser car light based on DMD |
| CN105866969A (en) * | 2016-03-03 | 2016-08-17 | 北京应用物理与计算数学研究所 | Method of increasing laser far-field light spot uniformity based on light ladder |
| CN107940268A (en) * | 2017-12-21 | 2018-04-20 | 超视界激光科技（苏州）有限公司 | Laser module and laser lighting lamp |
| CN107942521A (en) * | 2017-12-21 | 2018-04-20 | 中国电子科技集团公司第三十四研究所 | A kind of diode laser array light source |
| CN110195827A (en) * | 2018-02-26 | 2019-09-03 | 上海午井光电科技有限公司 | The transmission-type laser illumination system of component is reformed equipped with optical path and light wave |
| CN111022942A (en) * | 2018-10-09 | 2020-04-17 | 深圳市绎立锐光科技开发有限公司 | Laser lighting device |
| WO2020078185A1 (en) * | 2018-10-15 | 2020-04-23 | 深圳市绎立锐光科技开发有限公司 | Illumination device and illumination system |
| CN109578823A (en) * | 2018-12-17 | 2019-04-05 | 华中科技大学 | A kind of laser white light source of laser diode and fluorescent powder membrane cooling simultaneously |
| CN109798457A (en) * | 2019-01-23 | 2019-05-24 | 厦门大学 | A kind of transmission-type blue laser light fixture |
| CN110388578A (en) * | 2019-08-09 | 2019-10-29 | 广州光联电子科技有限公司 | A kind of laser lighting light source |
| WO2021037224A1 (en) * | 2019-08-29 | 2021-03-04 | 深圳市中光工业技术研究院 | Laser light source and laser light source system |
| CN210376903U (en) * | 2019-09-06 | 2020-04-21 | 成都绝影智能科技有限公司 | Speckle-dissipating laser light source device for machine vision |
| CN112540464A (en) * | 2019-09-20 | 2021-03-23 | 中国空气动力研究与发展中心超高速空气动力研究所 | Laser homogenization illumination light path and device |
| WO2021121073A1 (en) * | 2019-12-18 | 2021-06-24 | 深圳市中光工业技术研究院 | Beam lamp light source system |
| CN113074328A (en) * | 2019-12-18 | 2021-07-06 | 深圳市中光工业技术研究院 | Light beam lamp light source system |
| CN211600261U (en) * | 2020-01-03 | 2020-09-29 | 上海航空电器有限公司 | High-power semiconductor laser lighting device |
| CN211574811U (en) * | 2020-04-22 | 2020-09-25 | 史晓庆 | Laser illumination structure with uniform light color |
| CN212060767U (en) * | 2020-05-27 | 2020-12-01 | 史晓庆 | Laser lighting structure with even facula |
| CN213750520U (en) * | 2020-12-01 | 2021-07-20 | 深圳市中光工业技术研究院 | Laser light source device |
| CN213840548U (en) * | 2021-01-13 | 2021-07-30 | 湖州中科光电技术有限公司 | Double-laser light source module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10465873B2 (en) | Light emitting device, vehicle headlamp, illumination device, and laser element | |
| US20180356069A1 (en) | Light-emitting device, illumination device, and vehicle headlamp | |
| US9500343B2 (en) | Light source device, lighting device, vehicular headlight, and vehicle | |
| EP2752701B1 (en) | Light source and projection device with the light source | |
| EP2796771B1 (en) | Light emitting device, vehicle light fitting and vehicle | |
| US20130088471A1 (en) | Light source device and image display device | |
| JP2011154995A (en) | Illumination device | |
| JP6482993B2 (en) | Lighting device | |
| US20140016300A1 (en) | Light emitting device, illuminating apparatus, and light emitting method | |
| CN110160001B (en) | Lighting device and vehicle lamp | |
| JP2019528482A (en) | Laser LED hybrid light source for projection display | |
| EP2781823B1 (en) | Light-emitting body and manufacturing method thereof, and light-emitting device including the same | |
| JP2019045778A (en) | Wavelength conversion element, light source device, and projector | |
| CN112034651A (en) | Multi-primary color laser array side-entering type uniform light area light source of liquid crystal display | |
| CN111552144A (en) | Laser light source and lighting apparatus | |
| CN108351076B (en) | Lighting device with pump radiation source | |
| WO2020248559A1 (en) | Ld laser light source module | |
| CN106950785B (en) | Light source device and lighting device | |
| CN101907235A (en) | Multiple-lights-combining illumination device and the projection display device that has used this device | |
| TWI680307B (en) | White light illumination system | |
| CN114216100A (en) | Transmission type laser lighting module, light homogenizing method and application | |
| CN113671781B (en) | Light emitting unit, light source system, and laser projection apparatus | |
| US20230417395A1 (en) | Light source | |
| WO2020151628A1 (en) | Light source system and lighting apparatus comprising light source system | |
| WO2020248625A1 (en) | Ld laser light source module for blocking blue light |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |