CN107914450A - The preparation method of high heat-conducting ceramic aluminum-based copper-clad plate - Google Patents
The preparation method of high heat-conducting ceramic aluminum-based copper-clad plate Download PDFInfo
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- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
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- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/08—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the cooling method
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
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- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B37/1009—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using vacuum and fluid pressure
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
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- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
- C03C8/20—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing titanium compounds; containing zirconium compounds
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- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
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- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B2307/00—Properties of the layers or laminate
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Abstract
The invention discloses the preparation method of high heat-conducting ceramic aluminum-based copper-clad plate, it comprises the following steps：（1）, aluminium sheet pretreatment；（2）, aluminium sheet ceramic treatment；（3）, coating tack coat；（4）, overlapping hot pressing.Ceramic treatment is carried out the beneficial effects of the invention are as follows first being pre-processed to aluminium sheet, then to aluminium sheet, has overturned conventional preparation techniques, the composite coating taken has excellent heat conductivility and insulation performance, the thickness of insulating layer is reduced, production cost is reduced, increases economic efficiency.
Description
Technical field
The present invention relates to the preparation method of the preparation method of aluminum-based copper-clad plate, more particularly to ceramic-aluminum-bascopper copper clad plate.
Background technology
With the development of Power Electronic Technique, the encapsulation direction of novel power transistor uses modularization, and wherein leads
The ceramic copper-clad plate of heat is critical material.It is and ceramic（AlN or Al2O3）The production of copper-clad plate is frequently with directly covering copper method DBC works
Skill, the technique are to produce Cu-Cu between 1064 DEG C -1083 DEG C using copper and cuprous oxide2O eutectic liquid phases are as copper coin and pottery
Binding agent between porcelain plate, which covers the two, to be connected together.The peel strength for covering the ceramic copper-clad plate after connecing reaches more than 60N/cm, and
There is good thermal conductivity, cold-resistant thermal impact, higher temperature in use, the chip suitable for various power modules
Substrate.
The production of ceramic copper-clad plate mainly has the processes such as raw material cleaning, copper sheet pre-oxidation, superposition sintering, its production process
Complicated and complex process, excessive to equipment requirement, current ceramic copper-clad plate suqare is subject to equipment to restrict, and can only produce mostly
Below 180*180mm plates.And ceramic substrate is since brittleness is big, relatively difficult in follow-up PCB processing.
Aluminum-based copper-clad plate is that he eliminates ceramic substrate process complexity and does not allow after a heat conduction product of ceramic substrate extension
The restriction of easy to control, brittleness knead dough product not easy to be processed greatly, but the structure of aluminum substrate is one layer thin by being leaned between aluminium sheet and copper foil
Thin insulating layer bonds, to improve the heat conductivility of aluminum substrate, the more Bao Yuehao for only doing insulating layer, and insulating layer
Thickness determines the pressure-resistant effect of aluminum-based copper-clad plate insulation at the same time.Insulating layer does thin, and pressure-resistant performance will reduce, and usual aluminium base is covered
It is 2KV/mm that copper coin is pressure-resistant.
Chinese invention patent application number CN201210238309.5 discloses a kind of preparation method of ceramic-aluminum-bascopper copper clad plate,
This method comprises the following steps：Ceramic treatment is carried out in surface of aluminum plate；Surface-treated layer is formed in ceramic aluminium sheet ceramic plane；Will
The ceramic plane coating high heat conduction tack coat of surface treated ceramics aluminium sheet；The ceramic aluminium sheet and copper foil of high thermal conductivity layer will be coated
Superposition, forms overlapping body；Overlapping body is subjected to hot pressing in vacuum hotpressing machine, then is cold-pressed, ceramic-aluminum-bascopper copper clad plate is made.
The present invention has excellent heat conduction by the coating high heat conduction tack coat on ceramic aluminium sheet, then composite copper foil, copper foil and ceramic layer
Effect, tack coat and ceramic layer have excellent insulation effect, and voltage endurance capability also gets a promotion, and the pressure-resistant of common aluminum substrate is
2KV/mm, and the resistance to pressure energy of Al-base ceramic copper-clad plate prepared by the method provided by the present invention reaches 10-40KV/mm.Although this method carries
Heat-conducting effect and voltage endurance capability have been risen, but premised on increasing the thickness of ceramic-aluminum-bascopper copper clad plate, improve production cost,
Concrete application, which is got up, still has certain limitation.
The content of the invention
Preparation method the technical problem to be solved in the present invention is existing Al-base ceramic copper-clad plate can increase thickness.Improve
Production cost, provides a kind of preparation method of high heat-conducting ceramic aluminum-based copper-clad plate for this.
The technical scheme is that：The preparation method of high heat-conducting ceramic aluminum-based copper-clad plate, it comprises the following steps：（1）、
Aluminium sheet pre-processes：Uniformly coating a layer thickness is the composite coating of 2-4mm and is dried at 220-240 DEG C on aluminium sheet, described
Composite coating is included by weight：10-20 parts of neutral silicone adhesives, 4-6 parts of castor oil polyoxyethylene ethers and 4-8 parts of mahogany acids
Sodium；（2）, aluminium sheet ceramic treatment：Ceramic enamel is uniformly sprayed on aluminium sheet with spray gun, then with 350-370 DEG C of reinforcing 20-
30 min, form ceramic aluminium sheet, and the ceramics enamel is included by weight：2-4 parts of aluminium oxide, 28-33 parts of silica,
7-10 parts of titanium dioxide, 6-8 parts of boron oxides and 3-5 parts of microcrystalline celluloses, the enamel coating thickness are 2-8 μm；（3）, coating
Tack coat：Surface of aluminum plate coating tack coat after ceramic, the tack coat include 10-20 by weight parts of poly- amino first
The calcium oxide that the zirconium oxide and 6-10 parts of particle diameters that acid esters, 10-20 part particle diameter are 10-20nm are 15-30nm；（4）, overlapping hot pressing：
The ceramic aluminium sheet for coating tack coat is superimposed with copper foil, overlapping body is formed by body is overlapped and hot pressing is carried out in vacuum hotpressing machine, then
It is cold-pressed and both obtains finished product, at 100-120 DEG C, hot pressing time is controlled in 10- for the vacuum hotpressing machine hot pressing temperature control
15min。
Ceramic treatment is carried out the beneficial effects of the invention are as follows first being pre-processed to aluminium sheet, then to aluminium sheet, has overturned biography
Unite preparation process, and the composite coating taken has excellent heat conductivility and insulation performance, reduces the thickness of insulating layer, reduces life
Cost is produced, is increased economic efficiency.
Embodiment
The preparation method of high heat-conducting ceramic aluminum-based copper-clad plate, it comprises the following steps：（1）, aluminium sheet pretreatment：On aluminium sheet
Uniformly coating a layer thickness is the composite coating of 2-4mm and is dried at 220-240 DEG C that the composite coating is included by weight
Meter：10-20 parts of neutral silicone adhesives, 4-6 parts of castor oil polyoxyethylene ethers and 4-8 parts of petroleum sodium sulfonates；（2）, at aluminium sheet ceramic
Reason：Ceramic enamel is uniformly sprayed on aluminium sheet with spray gun, then with 350-370 DEG C of reinforcing 20-30 min, forms ceramic aluminium
Plate, the ceramics enamel are included by weight：2-4 parts of aluminium oxide, 28-33 parts of silica, 7-10 parts of titanium dioxide, 6-8
Part boron oxide and 3-5 parts of microcrystalline celluloses, the enamel coating thickness are 2-8 μm；（3）, coating tack coat：After ceramic
Surface of aluminum plate coats tack coat, and the tack coat includes 10-20 by weight parts of polyurethanes, 10-20 parts of particle diameters are
Zirconium oxide and 6-10 part particle diameter of 10-20nm is the calcium oxide of 15-30nm；（4）, overlapping hot pressing：The ceramics of tack coat will be coated
Aluminium sheet is superimposed with copper foil, forms overlapping body by body is overlapped and hot pressing is carried out in vacuum hotpressing machine, then be cold-pressed and both obtain finished product, institute
The control of vacuum hotpressing machine hot pressing temperature is stated at 100-120 DEG C, hot pressing time is controlled in 10-15min.
With reference to embodiment, the present invention will be further described.
Embodiment 1：The preparation method of high heat-conducting ceramic aluminum-based copper-clad plate, it comprises the following steps：（1）, aluminium sheet pretreatment：
Uniformly coating a layer thickness is the composite coating of 2mm and is dried at 220 DEG C that the composite coating is included by weight on aluminium sheet
Part meter：10 parts of neutral silicone adhesives, 4 parts of castor oil polyoxyethylene ethers and 4 parts of petroleum sodium sulfonates；（2）, aluminium sheet ceramic treatment：With
Spray gun uniformly sprays ceramic enamel on aluminium sheet, then with 350 DEG C of 20 min of reinforcing, forms ceramic aluminium sheet, the ceramics
Enamel is included by weight：2 parts of aluminium oxide, 28 parts of silica, 7 parts of titanium dioxide, 6 parts of boron oxides and 3 parts of microcrystalline celluloses
Element, the enamel coating thickness are 2 μm；（3）, coating tack coat：Surface of aluminum plate coating tack coat after ceramic, it is described viscous
Tie the oxygen that layer includes 10 parts of polyurethanes by weight, the zirconium oxide that 10 parts of particle diameters are 10nm and 6 parts of particle diameters are 15nm
Change calcium；（4）, overlapping hot pressing：The ceramic aluminium sheet for coating tack coat is superimposed with copper foil, body will be overlapped in Vacuum Heat by forming overlapping body
Hot pressing is carried out in press, then be cold-pressed both finished product, vacuum hotpressing machine hot pressing temperature control is at 100 DEG C, hot pressing time
Control is in 10min.
Embodiment 2：The preparation method of high heat-conducting ceramic aluminum-based copper-clad plate, it comprises the following steps：（1）, aluminium sheet pretreatment：
Uniformly coating a layer thickness is the composite coating of 3mm and is dried at 230 DEG C that the composite coating is included by weight on aluminium sheet
Part meter：15 parts of neutral silicone adhesives, 5 parts of castor oil polyoxyethylene ethers and 6 parts of petroleum sodium sulfonates；（2）, aluminium sheet ceramic treatment：With
Spray gun uniformly sprays ceramic enamel on aluminium sheet, then with 360 DEG C of 25 min of reinforcing, forms ceramic aluminium sheet, the ceramics
Enamel is included by weight：3 parts of aluminium oxide, 30 parts of silica, 8 parts of titanium dioxide, 7 parts of boron oxides and 4 parts of microcrystalline celluloses
Element, the enamel coating thickness are 5 μm；（3）, coating tack coat：Surface of aluminum plate coating tack coat after ceramic, it is described viscous
Tie the oxygen that layer includes 15 parts of polyurethanes by weight, the zirconium oxide that 15 parts of particle diameters are 15nm and 8 parts of particle diameters are 23nm
Change calcium；（4）, overlapping hot pressing：The ceramic aluminium sheet for coating tack coat is superimposed with copper foil, body will be overlapped in Vacuum Heat by forming overlapping body
Hot pressing is carried out in press, then be cold-pressed both finished product, vacuum hotpressing machine hot pressing temperature control is at 110 DEG C, hot pressing time
Control is in 12min.
Embodiment 3：The preparation method of high heat-conducting ceramic aluminum-based copper-clad plate, it comprises the following steps：（1）, aluminium sheet pretreatment：
Uniformly coating a layer thickness is the composite coating of 4mm and is dried at 240 DEG C that the composite coating is included by weight on aluminium sheet
Part meter：20 parts of neutral silicone adhesives, 6 parts of castor oil polyoxyethylene ethers and 8 parts of petroleum sodium sulfonates；（2）, aluminium sheet ceramic treatment：With
Spray gun uniformly sprays ceramic enamel on aluminium sheet, then with 370 DEG C of 30 min of reinforcing, forms ceramic aluminium sheet, the ceramics
Enamel is included by weight：4 parts of aluminium oxide, 33 parts of silica, 10 parts of titanium dioxide, 8 parts of boron oxides and 5 parts of crystallite fibres
Dimension element, the enamel coating thickness are 8 μm；（3）, coating tack coat：Surface of aluminum plate coating tack coat after ceramic, it is described
It is 30nm's that tack coat, which includes 20 parts of polyurethanes by weight, the zirconium oxide that 20 parts of particle diameters are 20nm and 10 parts of particle diameters,
Calcium oxide；（4）, overlapping hot pressing：The ceramic aluminium sheet for coating tack coat is superimposed with copper foil, body will be overlapped in vacuum by forming overlapping body
Hot pressing is carried out in hot press, then is cold-pressed and both obtains finished product, the vacuum hotpressing machine hot pressing temperature control is at 120 DEG C, hot pressing
Between control in 15min.
Compared with prior art, the present invention first being pre-processed to aluminium sheet, the thermal conductivity and insulation performance of aluminium sheet are improved, is created
The property made adds neutral silicone adhesive in composite coating, increases heat transfer space, while reduces the requirement to composite coating thickness,
Identical heat conductivility and insulation performance are realized under relatively low thickness；Microcrystalline cellulose is added in ceramic enamel to form solid
Formula radiates, reinforced insulation performance, improves aluminium sheet overall stability, and the hot pressing temperature and time for reducing follow-up overlapping hot pressing will
Ask, reduce energy consumption, it is cost-effective, increase economic efficiency.
Claims (1)
1. the preparation method of high heat-conducting ceramic aluminum-based copper-clad plate, it is characterized in that it comprises the following steps：（1）, aluminium sheet pretreatment：
Uniformly coating a layer thickness is the composite coating of 2-4mm and is dried at 220-240 DEG C on aluminium sheet, and the composite coating includes pressing
Parts by weight meter：10-20 parts of neutral silicone adhesives, 4-6 parts of castor oil polyoxyethylene ethers and 4-8 parts of petroleum sodium sulfonates；（2）, aluminium sheet pottery
Porcelainization processing：Ceramic enamel is uniformly sprayed on aluminium sheet with spray gun, then with 350-370 DEG C of reinforcing 20-30 min, forms pottery
Porcelain aluminium sheet, the ceramics enamel are included by weight：2-4 parts of aluminium oxide, 28-33 parts of silica, 7-10 parts of titanium dioxides
Titanium, 6-8 part boron oxide and 3-5 parts of microcrystalline celluloses, the enamel coating thickness are 2-8 μm；（3）, coating tack coat：In ceramics
After change surface of aluminum plate coating tack coat, the tack coat include 10-20 by weight parts of polyurethanes, 10-20 parts
The calcium oxide that zirconium oxide and 6-10 part particle diameter that particle diameter is 10-20nm are 15-30nm；（4）, overlapping hot pressing：Tack coat will be coated
Ceramic aluminium sheet be superimposed with copper foil, form overlapping body by body is overlapped and carry out hot pressing in vacuum hotpressing machine, then be cold-pressed both
Finished product, at 100-120 DEG C, hot pressing time is controlled in 10-15min for the vacuum hotpressing machine hot pressing temperature control.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110053331A (en) * | 2019-05-09 | 2019-07-26 | 河源广工大协同创新研究院 | A kind of preparation method of ceramic substrate high-frequency copper-clad plate |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102795875A (en) * | 2012-07-11 | 2012-11-28 | 铜陵颐和泰新材料股份有限公司 | Preparation method of ceramic-aluminum-base copper clad plate |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102795875A (en) * | 2012-07-11 | 2012-11-28 | 铜陵颐和泰新材料股份有限公司 | Preparation method of ceramic-aluminum-base copper clad plate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110053331A (en) * | 2019-05-09 | 2019-07-26 | 河源广工大协同创新研究院 | A kind of preparation method of ceramic substrate high-frequency copper-clad plate |
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