CN107904649A - 一种vcp镀铜生产效率提升方法 - Google Patents
一种vcp镀铜生产效率提升方法 Download PDFInfo
- Publication number
- CN107904649A CN107904649A CN201711225591.2A CN201711225591A CN107904649A CN 107904649 A CN107904649 A CN 107904649A CN 201711225591 A CN201711225591 A CN 201711225591A CN 107904649 A CN107904649 A CN 107904649A
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- China
- Prior art keywords
- circuit board
- rebound
- voltage
- electric current
- electroplating bath
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201711225591.2A CN107904649B (zh) | 2017-11-29 | 2017-11-29 | 一种vcp镀铜生产效率提升方法 |
Applications Claiming Priority (1)
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CN201711225591.2A CN107904649B (zh) | 2017-11-29 | 2017-11-29 | 一种vcp镀铜生产效率提升方法 |
Publications (2)
Publication Number | Publication Date |
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CN107904649A true CN107904649A (zh) | 2018-04-13 |
CN107904649B CN107904649B (zh) | 2019-07-19 |
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CN201711225591.2A Active CN107904649B (zh) | 2017-11-29 | 2017-11-29 | 一种vcp镀铜生产效率提升方法 |
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CN (1) | CN107904649B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111254483A (zh) * | 2020-03-11 | 2020-06-09 | 大连崇达电路有限公司 | 一种提高vcp电镀线切换料号效率的方法 |
CN112899759A (zh) * | 2021-01-20 | 2021-06-04 | 珠海松柏科技有限公司 | 电镀生产线及多种板型的切换工艺 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN202543364U (zh) * | 2012-04-24 | 2012-11-21 | 博敏电子股份有限公司 | 一种分段打电流的电镀槽 |
CN104862768A (zh) * | 2015-05-27 | 2015-08-26 | 广州杰赛科技股份有限公司 | 一种电路板的电镀方法及装置 |
CN104988573A (zh) * | 2015-05-27 | 2015-10-21 | 广州杰赛科技股份有限公司 | 一种电路板的电镀方法及装置 |
-
2017
- 2017-11-29 CN CN201711225591.2A patent/CN107904649B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN202543364U (zh) * | 2012-04-24 | 2012-11-21 | 博敏电子股份有限公司 | 一种分段打电流的电镀槽 |
CN104862768A (zh) * | 2015-05-27 | 2015-08-26 | 广州杰赛科技股份有限公司 | 一种电路板的电镀方法及装置 |
CN104988573A (zh) * | 2015-05-27 | 2015-10-21 | 广州杰赛科技股份有限公司 | 一种电路板的电镀方法及装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111254483A (zh) * | 2020-03-11 | 2020-06-09 | 大连崇达电路有限公司 | 一种提高vcp电镀线切换料号效率的方法 |
CN112899759A (zh) * | 2021-01-20 | 2021-06-04 | 珠海松柏科技有限公司 | 电镀生产线及多种板型的切换工艺 |
Also Published As
Publication number | Publication date |
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CN107904649B (zh) | 2019-07-19 |
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CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 516300 Jinpaishan Mountain, Taiyang Depression, Baihua Town, Huidong County, Huizhou City, Guangdong Province Patentee after: Huizhou techuang Electronic Technology Co.,Ltd. Address before: 516300 Jinpaishan Mountain, Taiyang Depression, Baihua Town, Huidong County, Huizhou City, Guangdong Province Patentee before: HUIZHOU GLORYSKY ELECTRONICS TECHNOLOGY Co.,Ltd. |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A method to improve the production efficiency of VCP copper plating Effective date of registration: 20221213 Granted publication date: 20190719 Pledgee: China Co. truction Bank Corp Huidong branch Pledgor: Huizhou techuang Electronic Technology Co.,Ltd. Registration number: Y2022980026914 |