CN107903653A - A kind of high performance lED heat sink material - Google Patents
A kind of high performance lED heat sink material Download PDFInfo
- Publication number
- CN107903653A CN107903653A CN201711411429.XA CN201711411429A CN107903653A CN 107903653 A CN107903653 A CN 107903653A CN 201711411429 A CN201711411429 A CN 201711411429A CN 107903653 A CN107903653 A CN 107903653A
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- Prior art keywords
- parts
- heat sink
- sink material
- high performance
- led heat
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
- C08K2003/3009—Sulfides
- C08K2003/3036—Sulfides of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a kind of high performance lED heat sink material, the heat sink material is counted in parts by weight, including is made of 18 30 parts of water-soluble resin, 36 parts of polyacrylamide, 7 10 parts of silicon nitride, 3 3.5 parts of boron nitride, 1.5 3 parts of triphenyl phosphate of isopropyl alcoholization, 35 parts of ammonium persulfate, 1.0 4 parts of nano-zinc sulfide, 1 1.5 parts of N hydroxymethyl acrylamide, 0.2 0.3 parts of light stabilizer, 24 parts of polyurethane associative thickener, 37 43 parts of filler.
Description
Technical field
The present invention relates to the technical field of heat sink material, refers in particular to a kind of high performance lED heat sink material.
Background technology
At present, LED light heat dissipation problem always in the industry more headache the problem of, have using metal type heat conduction and heat radiation, it is also organic
Tool formula blowing device radiates, not only complicated, but also heat dissipation performance is also more general.
The content of the invention
It is an object of the invention to overcome the deficiencies of the prior art and provide a kind of high performance lED heat sink material.
In order to realize above-mentioned purpose, a kind of high performance lED heat sink material provided by the present invention, the heat sink material is by weight
Measure number meter, including by 18-30 parts of water-soluble resin, 3-6 parts of polyacrylamide, 7-10 parts of silicon nitride, 3-3.5 parts of boron nitride,
1.5-3 parts of triphenyl phosphate of isopropyl alcoholization, 3-5 parts of ammonium persulfate, 1.0-4 parts of nano-zinc sulfide, N hydroxymethyl acrylamide 1-
1.5 parts, 0.2-0.3 parts of light stabilizer, 2-4 parts of polyurethane associative thickener, 37-43 parts of filler composition.
Further, which counts in parts by weight, including by 23 parts of water-soluble resin, 4.5 parts of polyacrylamide, nitrogen
8 parts of SiClx, 3.5 parts of boron nitride, 2.2 parts of triphenyl phosphate of isopropyl alcoholization, 4 parts of ammonium persulfate, 1.8 parts of nano-zinc sulfide, N- hydroxyls
40 parts of 1.2 parts of Methacrylamide, 0.2 part of light stabilizer, 3 parts of polyurethane associative thickener, filler compositions.
Further, filler is graphite powder, ultra tiny ferrophosphorus powder, acetylene carbon black, the one or more of polybenzoate powder.
A kind of preparation method of high performance lED heat sink material, including have the following steps：
S1. by weight, weigh above-mentioned composition to be uniformly mixed, stirred 30 minutes at 35-40 DEG C；
S2. when the material input ball mill grinding 3 after stirring evenly is small,
S3. inserted after the completion of to be ground in grinding tool, 100 DEG C place 1 it is small when after mould unloading.
The present invention uses above-mentioned scheme, and its advantage is：Heat sink material made by the present invention have cost it is low,
Light-weight, the characteristics of heat conduction rate is high, high performance heat dissipation effect, service life length.
Embodiment
With reference to specific embodiment, the present invention is further illustrated.
Embodiment one：
In the present embodiment, a kind of high performance lED heat sink material, the heat sink material are counted in parts by weight, including are set by water solubility
18 parts of fat, 3 parts of polyacrylamide, 7 parts of silicon nitride, 3 parts of boron nitride, isopropyl alcoholization 1.5 parts of triphenyl phosphate, 3 parts of ammonium persulfate,
1 part of nano-zinc sulfide, 1 part of N hydroxymethyl acrylamide, 0.2 part of light stabilizer, 2 parts of polyurethane associative thickener, 37 parts of filler
Composition.
Further, filler is graphite powder graphite powder.
Embodiment two：
In the present embodiment, a kind of high performance lED heat sink material, the heat sink material are counted in parts by weight, including are set by water solubility
30 parts of fat, 6 parts of polyacrylamide, 10 parts of silicon nitride, 3.5 parts of boron nitride, 3 parts of triphenyl phosphate of isopropyl alcoholization, ammonium persulfate 5
Part, 4 parts of nano-zinc sulfide, 1.5 parts of N hydroxymethyl acrylamide, 0.3 part of light stabilizer, 4 parts of polyurethane associative thickener, filler
43 parts of compositions.
Further, filler is graphite powder graphite powder, ultra tiny ferrophosphorus powder, the mixture of acetylene carbon black.
Embodiment three：
In the present embodiment, a kind of high performance lED heat sink material, the heat sink material are counted in parts by weight, including are set by water solubility
23 parts of fat, 4.5 parts of polyacrylamide, 8 parts of silicon nitride, 3.5 parts of boron nitride, 2.2 parts of triphenyl phosphate of isopropyl alcoholization, ammonium persulfate
4 parts, 1.8 parts of nano-zinc sulfide, 1.2 parts of N hydroxymethyl acrylamide, 0.2 part of light stabilizer, 3 parts of polyurethane associative thickener,
40 parts of compositions of filler.
Further, filler is graphite powder graphite powder, ultra tiny ferrophosphorus powder, acetylene carbon black, the mixture of polybenzoate powder.
The preparation method of the heat sink material of the present invention is described further in conjunction with specific embodiment.
A kind of preparation method of high performance lED heat sink material, including have the following steps：
S1. by weight, above-mentioned 23 parts of water-soluble resin, 4.5 parts of polyacrylamide, 8 parts of silicon nitride, boron nitride 3.5 are weighed
Part, isopropyl alcoholization 2.2 parts of triphenyl phosphate, 4 parts of ammonium persulfate, 1.8 parts of nano-zinc sulfide, 1.2 parts of N hydroxymethyl acrylamide,
0.2 part of light stabilizer, 3 parts of polyurethane associative thickener, the raw material composition of 40 parts of filler are uniformly mixed, and are stirred at 35-40 DEG C
30 minutes；
S2. when the material input ball mill grinding 3 after stirring evenly is small；
S3. inserted after the completion of to be ground in grinding tool, 100 DEG C place 1 it is small when after mould unloading, so as to complete LED heat sink materials
Prepare.
The embodiment of the above is only presently preferred embodiments of the present invention, and limit in any form is not done to the present invention
System.Any those skilled in the art, without departing from the scope of the technical proposal of the invention, utilize the skill of the disclosure above
Art content makes technical solution of the present invention more possible variations and retouching, or modification is the equivalent embodiment of the present invention.
Therefore all contents without departing from technical solution of the present invention, the equivalent equivalence changes that the thinking according to the present invention is made, should all be covered by
In protection scope of the present invention.
Claims (4)
- A kind of 1. high performance lED heat sink material, it is characterised in that：The heat sink material is counted in parts by weight, including is set by water solubility 18-30 parts of fat, 3-6 parts of polyacrylamide, 7-10 parts of silicon nitride, 3-3.5 parts of boron nitride, isopropyl alcoholization triphenyl phosphate 1.5-3 Part, 3-5 parts of ammonium persulfate, 1.0-4 parts of nano-zinc sulfide, 1-1.5 parts of N hydroxymethyl acrylamide, 0.2-0.3 parts of light stabilizer, 37-43 parts of 2-4 parts of polyurethane associative thickener, filler compositions.
- A kind of 2. high performance lED heat sink material according to claim 1, it is characterised in that：The heat sink material is by weight Number meter, including phosphoric acid is refined by 23 parts of water-soluble resin, 4.5 parts of polyacrylamide, 8 parts of silicon nitride, 3.5 parts of boron nitride, isopropyl 2.2 parts of triphen fat, 4 parts of ammonium persulfate, 1.8 parts of nano-zinc sulfide, 1.2 parts of N hydroxymethyl acrylamide, 0.2 part of light stabilizer, 40 parts of 3 parts of polyurethane associative thickener, filler compositions.
- A kind of 3. high performance lED heat sink material according to claim 1 or 2, it is characterised in that：Filler is graphite powder, surpasses Fine ferrophosphorus powder, acetylene carbon black, the one or more of polybenzoate powder.
- 4. a kind of a kind of preparation method of high performance lED heat sink material as described in claim 1-3 any one, its feature exist In：Including having the following steps：S1. by weight, weigh above-mentioned composition to be uniformly mixed, stirred 30 minutes at 35-40 DEG C；S2. when the material input ball mill grinding 3 after stirring evenly is small,S3. inserted after the completion of to be ground in grinding tool, 100 DEG C place 1 it is small when after mould unloading.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711411429.XA CN107903653A (en) | 2017-12-23 | 2017-12-23 | A kind of high performance lED heat sink material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711411429.XA CN107903653A (en) | 2017-12-23 | 2017-12-23 | A kind of high performance lED heat sink material |
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| Publication Number | Publication Date |
|---|---|
| CN107903653A true CN107903653A (en) | 2018-04-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711411429.XA Pending CN107903653A (en) | 2017-12-23 | 2017-12-23 | A kind of high performance lED heat sink material |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104359091A (en) * | 2014-10-17 | 2015-02-18 | 安徽永旭照明科技有限公司 | Heat dissipation sheet for LED lamp and heat dissipation coating for coating heat dissipation sheet |
| CN105111851A (en) * | 2015-08-27 | 2015-12-02 | 安徽明威照明器材有限公司 | Gel LED (light-emitting diode) heat-dissipation paint and preparation method thereof |
-
2017
- 2017-12-23 CN CN201711411429.XA patent/CN107903653A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104359091A (en) * | 2014-10-17 | 2015-02-18 | 安徽永旭照明科技有限公司 | Heat dissipation sheet for LED lamp and heat dissipation coating for coating heat dissipation sheet |
| CN105111851A (en) * | 2015-08-27 | 2015-12-02 | 安徽明威照明器材有限公司 | Gel LED (light-emitting diode) heat-dissipation paint and preparation method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180413 |