CN108084975A - A kind of LED magnalium base composite heat dissipation materials - Google Patents
A kind of LED magnalium base composite heat dissipation materials Download PDFInfo
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- CN108084975A CN108084975A CN201711411451.4A CN201711411451A CN108084975A CN 108084975 A CN108084975 A CN 108084975A CN 201711411451 A CN201711411451 A CN 201711411451A CN 108084975 A CN108084975 A CN 108084975A
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- China
- Prior art keywords
- parts
- heat dissipation
- base composite
- composite heat
- led
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
Abstract
The invention discloses a kind of high performance lED magnalium base composite heat dissipation materials, the heat sink material is counted in parts by weight, including being made of 43 51 parts of aluminium, 79 parts of magnesium, 18 30 parts of water-soluble resin, 36 parts of polyacrylamide, 7 10 parts of silicon nitride, 3 3.5 parts of boron nitride, 1.5 3 parts of triphenyl phosphate of isopropyl alcoholization, 35 parts of ammonium persulfate, 1.0 4 parts of nano-zinc sulfide, 1 1.5 parts of N hydroxymethyl acrylamide, 0.2 0.3 parts of light stabilizer, 24 parts of polyurethane associative thickener, 14 18 parts of kaolin, 45 parts of antioxidant, 20 30 parts of filler.
Description
Technical field
The present invention relates to the technical fields of heat sink material, refer in particular to a kind of LED magnalium base composite heat dissipation materials.
Background technology
At present, LED light heat dissipation problem always in the industry more headache the problem of, have using metal type heat conduction and heat radiation, it is also organic
Tool formula blowing device radiates, not only complicated, but also heat dissipation performance is also more general.Existing LED heat sink materials master
If being made of metal materials such as aluminium, copper, in actual use there are cost limitation, insulation performance is bad the deficiencies of, therefore have
Necessity improves the formula of material, and material is made to reach more good heat dissipation effect, improves the performance of lamps and lanterns, extends its use
Service life.
The content of the invention
It is dissipated it is an object of the invention to overcome the deficiencies of the prior art and provide a kind of high performance LED with magnalium base is compound
Hot material.
In order to realize above-mentioned purpose, a kind of LED provided by the present invention magnalium base composite heat dissipation materials, the heat dissipation material
Material is counted in parts by weight, including by 43-51 parts of aluminium, 7-9 parts of magnesium, 18-30 parts of water-soluble resin, 3-6 parts of polyacrylamide, nitridation
7-10 parts of silicon, 3-3.5 parts of boron nitride, 1.5-3 parts of triphenyl phosphate of isopropyl alcoholization, 3-5 parts of ammonium persulfate, nano-zinc sulfide 1.0-
4 parts, 1-1.5 parts of N hydroxymethyl acrylamide, 0.2-0.3 parts of light stabilizer, 2-4 parts of polyurethane associative thickener, kaolin 14-
18 parts, 4-5 parts of antioxidant, 20-30 parts of filler composition.
Further, which counts in parts by weight, including by 46 parts of aluminium, 8 parts of magnesium, 20 parts of water-soluble resin, poly- third
4 parts of acrylamide, 9 parts of silicon nitride, 3.2 parts of boron nitride, 2.3 parts of triphenyl phosphate of isopropyl alcoholization, 4.5 parts of ammonium persulfate, nano-sulfur
Change 2.2 parts of zinc, 1.2 parts of N hydroxymethyl acrylamide, 0.2- parts of light stabilizer, 2.3 parts of polyurethane associative thickener, kaolin 17
25 parts of part, 4.5 parts of antioxidant, filler compositions.
Further, filler is graphite powder, ultra tiny ferrophosphorus powder, acetylene carbon black, the one or more of polybenzoate powder.
The present invention uses above-mentioned scheme, and its advantage is：Heat sink material made by the present invention is by being provided with
Magnalium base, heat dissipation effect are more preferable；Have the characteristics that at low cost, light-weight, heat conduction rate is high, high performance heat dissipation effect makes
Use long lifespan.
Specific embodiment
With reference to specific embodiment, the present invention is further illustrated.
Embodiment one：
In the present embodiment, a kind of LED magnalium base composite heat dissipation materials, which counts in parts by weight, including by aluminium
43 parts, 7 parts of magnesium, 18 parts of water-soluble resin, 3 parts of polyacrylamide, 7 parts of silicon nitride, 3 parts of boron nitride, isopropyl alcoholization tricresyl phosphate benzene
1.5 parts of fat, 3 parts of ammonium persulfate, 1 part of nano-zinc sulfide, 1 part of N hydroxymethyl acrylamide, 0.2 part of light stabilizer, polyurethane are formed
Close 20 parts of 2 parts of thickener, 14 parts of kaolin, 4 parts of antioxidant, filler compositions.
Further, filler is graphite powder.
Embodiment two：
In the present embodiment, a kind of LED magnalium base composite heat dissipation materials, which counts in parts by weight, including by aluminium
51 parts, 9 parts of magnesium, 30 parts of water-soluble resin, 6 parts of polyacrylamide, 10 parts of silicon nitride, 3.5 parts of boron nitride, isopropyl alcoholization tricresyl phosphate
3 parts of benzene fat, 5 parts of ammonium persulfate, 4 parts of nano-zinc sulfide, 1.5 parts of N hydroxymethyl acrylamide, 0.3 part of light stabilizer, polyurethane
30 parts of 4 parts of associative thickener, 18 parts of kaolin, 5 parts of antioxidant, filler compositions.
Further, filler is graphite powder, ultra tiny ferrophosphorus powder, the mixture of acetylene carbon black.
Embodiment three：
In the present embodiment, a kind of LED magnalium base composite heat dissipation materials, which counts in parts by weight, including by aluminium
46 parts, 8 parts of magnesium, 20 parts of water-soluble resin, 4 parts of polyacrylamide, 9 parts of silicon nitride, 3.2 parts of boron nitride, isopropyl alcoholization tricresyl phosphate
2.3 parts of benzene fat, 4.5 parts of ammonium persulfate, 2.2 parts of nano-zinc sulfide, 1.2 parts of N hydroxymethyl acrylamide, 0.2- parts of light stabilizer,
25 parts of 2.3 parts of polyurethane associative thickener, 17 parts of kaolin, 4.5 parts of antioxidant, filler compositions.
Further, filler is graphite powder graphite powder, ultra tiny ferrophosphorus powder, acetylene carbon black, the mixture of polybenzoate powder.
The preparation method of the heat sink material of the present invention is described further in conjunction with specific embodiment.
The preparation method of a kind of LED magnalium base composite heat dissipation materials, including having the following steps：
S1. by weight, 46 parts of aluminium, 8 parts of magnesium, 20 parts of water-soluble resin, 4 parts of polyacrylamide, 9 parts of silicon nitride, nitrogen are weighed
Change 3.2 parts of boron, 2.3 parts of triphenyl phosphate of isopropyl alcoholization, 4.5 parts of ammonium persulfate, 2.2 parts of nano-zinc sulfide, N- methylol propylene
1.2 parts of amide, 0.2- parts of light stabilizer, 2.3 parts of polyurethane associative thickener, 17 parts of kaolin, 4.5 parts of antioxidant, filler
25 parts of material is uniformly mixed, and is stirred 30 minutes at 35-40 DEG C；
S2. after stirring evenly material input ball mill grinding 3 it is small when so that grinding after material square hole plug surplus for≤
0.1%
S3. inserted after the completion of to be ground in grinding tool, 100 DEG C place 1 it is small when after after mould unloading, cooled down at room temperature
The embodiment of the above is only presently preferred embodiments of the present invention, and limitation in any form is not done to the present invention.Appoint
What those skilled in the art, without departing from the scope of the technical proposal of the invention, using in the technology of the disclosure above
Appearance makes technical solution of the present invention more possible variations and retouching or modification is the equivalent embodiment of the present invention.It is therefore all
Without departing from the equivalent equivalence changes that the content of technical solution of the present invention, the thinking according to the present invention are made, this hair should all be covered by
In bright protection domain.
Claims (3)
1. a kind of LED magnalium base composite heat dissipation materials, it is characterised in that：The heat sink material is counted in parts by weight, including by aluminium
43-51 parts, 7-9 parts of magnesium, 18-30 parts of water-soluble resin, 3-6 parts of polyacrylamide, 7-10 parts of silicon nitride, 3-3.5 parts of boron nitride,
1.5-3 parts of triphenyl phosphate of isopropyl alcoholization, 3-5 parts of ammonium persulfate, 1.0-4 parts of nano-zinc sulfide, N hydroxymethyl acrylamide 1-
1.5 parts, 0.2-0.3 parts of light stabilizer, 2-4 parts of polyurethane associative thickener, 14-18 parts of kaolin, 4-5 parts of antioxidant, fill out
20-30 parts of compositions of material.
2. a kind of LED according to claim 1 magnalium base composite heat dissipation materials, it is characterised in that：The heat sink material is pressed
Parts by weight meter, including by 46 parts of aluminium, 8 parts of magnesium, 20 parts of water-soluble resin, 4 parts of polyacrylamide, 9 parts of silicon nitride, boron nitride
3.2 parts, isopropyl alcoholization 2.3 parts of triphenyl phosphate, 4.5 parts of ammonium persulfate, 2.2 parts of nano-zinc sulfide, N hydroxymethyl acrylamide
1.2 parts, 0.2- parts of light stabilizer, 2.3 parts of polyurethane associative thickener, 17 parts of kaolin, 4.5 parts of antioxidant, 25 parts of filler
Composition.
3. a kind of LED according to claim 1 or 2 magnalium base composite heat dissipation materials, it is characterised in that：Filler is graphite
Powder, ultra tiny ferrophosphorus powder, acetylene carbon black, the one or more of polybenzoate powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711411451.4A CN108084975A (en) | 2017-12-23 | 2017-12-23 | A kind of LED magnalium base composite heat dissipation materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711411451.4A CN108084975A (en) | 2017-12-23 | 2017-12-23 | A kind of LED magnalium base composite heat dissipation materials |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108084975A true CN108084975A (en) | 2018-05-29 |
Family
ID=62178806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711411451.4A Pending CN108084975A (en) | 2017-12-23 | 2017-12-23 | A kind of LED magnalium base composite heat dissipation materials |
Country Status (1)
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103205075A (en) * | 2012-01-17 | 2013-07-17 | 帛宏兴业股份有限公司 | Heat radiation material, heat radiation structure, and preparation method and application thereof |
| CN103881439A (en) * | 2014-02-14 | 2014-06-25 | 程实 | LED (light-emitting diode) heat dissipation paint with alloy powder and preparation method thereof |
| CN104359091A (en) * | 2014-10-17 | 2015-02-18 | 安徽永旭照明科技有限公司 | Heat dissipation sheet for LED lamp and heat dissipation coating for coating heat dissipation sheet |
| CN105001633A (en) * | 2015-07-23 | 2015-10-28 | 合肥凯士新材料贸易有限公司 | High-strength PA10T composite heat dissipation material for LED lamp and preparing method thereof |
-
2017
- 2017-12-23 CN CN201711411451.4A patent/CN108084975A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103205075A (en) * | 2012-01-17 | 2013-07-17 | 帛宏兴业股份有限公司 | Heat radiation material, heat radiation structure, and preparation method and application thereof |
| CN103881439A (en) * | 2014-02-14 | 2014-06-25 | 程实 | LED (light-emitting diode) heat dissipation paint with alloy powder and preparation method thereof |
| CN104359091A (en) * | 2014-10-17 | 2015-02-18 | 安徽永旭照明科技有限公司 | Heat dissipation sheet for LED lamp and heat dissipation coating for coating heat dissipation sheet |
| CN105001633A (en) * | 2015-07-23 | 2015-10-28 | 合肥凯士新材料贸易有限公司 | High-strength PA10T composite heat dissipation material for LED lamp and preparing method thereof |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180529 |
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| RJ01 | Rejection of invention patent application after publication |