CN107896417B - 覆盖膜 - Google Patents

覆盖膜 Download PDF

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Publication number
CN107896417B
CN107896417B CN201710671211.1A CN201710671211A CN107896417B CN 107896417 B CN107896417 B CN 107896417B CN 201710671211 A CN201710671211 A CN 201710671211A CN 107896417 B CN107896417 B CN 107896417B
Authority
CN
China
Prior art keywords
insulating layer
film
layer
thickness
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201710671211.1A
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English (en)
Chinese (zh)
Other versions
CN107896417A (zh
Inventor
竹山早苗
野村直宏
樱木乔规
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujimori Kogyo Co Ltd
Original Assignee
Fujimori Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimori Kogyo Co Ltd filed Critical Fujimori Kogyo Co Ltd
Publication of CN107896417A publication Critical patent/CN107896417A/zh
Application granted granted Critical
Publication of CN107896417B publication Critical patent/CN107896417B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Insulating Bodies (AREA)
CN201710671211.1A 2016-10-04 2017-08-08 覆盖膜 Active CN107896417B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-196293 2016-10-04
JP2016196293A JP6883400B2 (ja) 2016-10-04 2016-10-04 カバーレイフィルム

Publications (2)

Publication Number Publication Date
CN107896417A CN107896417A (zh) 2018-04-10
CN107896417B true CN107896417B (zh) 2022-03-22

Family

ID=61802706

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710671211.1A Active CN107896417B (zh) 2016-10-04 2017-08-08 覆盖膜

Country Status (4)

Country Link
JP (1) JP6883400B2 (ko)
KR (2) KR102027140B1 (ko)
CN (1) CN107896417B (ko)
TW (1) TWI738844B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7012446B2 (ja) * 2017-03-17 2022-01-28 藤森工業株式会社 カバーレイフィルム及びその製造方法
TWI801538B (zh) 2018-03-27 2023-05-11 日商日鐵不銹鋼股份有限公司 肥粒鐵系不鏽鋼及其製造方法、肥粒鐵系不鏽鋼板及其製造方法、以及燃料電池用構件
KR102240918B1 (ko) * 2018-06-01 2021-04-16 주식회사 잉크테크 절연필름 및 절연필름의 제조방법

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005238798A (ja) * 2004-02-27 2005-09-08 Toyobo Co Ltd フレキシブルプリント配線基板
JP2009084507A (ja) * 2007-10-02 2009-04-23 Hitachi Kasei Polymer Co Ltd 多層接着フィルム及びそれを用いたカバーレイフィルム、銅箔付き多層接着フィルム
JP2010199405A (ja) * 2009-02-26 2010-09-09 Shin Etsu Polymer Co Ltd カバーレイフィルム、フレキシブルプリント配線板および光トランシーバ
CN102762083A (zh) * 2011-04-26 2012-10-31 藤森工业株式会社 Fpc用电磁波屏蔽材料
KR20150078585A (ko) * 2013-12-31 2015-07-08 도레이첨단소재 주식회사 백색 커버레이 필름
JP2015207656A (ja) * 2014-04-21 2015-11-19 三井化学株式会社 リジッドフレキ基板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09135067A (ja) 1995-09-08 1997-05-20 Shin Etsu Chem Co Ltd 遮光性カバーレイフィルム
TWI558557B (zh) * 2013-03-05 2016-11-21 印可得股份有限公司 電磁干擾屏蔽膜及其製造方法
WO2014147903A1 (ja) * 2013-03-22 2014-09-25 東亞合成株式会社 接着剤組成物並びにこれを用いたカバーレイフィルム及びフレキシブル銅張積層板
JP2014209612A (ja) * 2013-03-26 2014-11-06 東レ株式会社 電子部品用カバーレイフィルムおよびそれを用いた保護フィルム付電子部品用カバーレイフィルム
KR101516767B1 (ko) * 2014-02-18 2015-05-04 도레이첨단소재 주식회사 전자파 차폐 기능을 갖는 커버레이 필름

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005238798A (ja) * 2004-02-27 2005-09-08 Toyobo Co Ltd フレキシブルプリント配線基板
JP2009084507A (ja) * 2007-10-02 2009-04-23 Hitachi Kasei Polymer Co Ltd 多層接着フィルム及びそれを用いたカバーレイフィルム、銅箔付き多層接着フィルム
JP2010199405A (ja) * 2009-02-26 2010-09-09 Shin Etsu Polymer Co Ltd カバーレイフィルム、フレキシブルプリント配線板および光トランシーバ
CN102762083A (zh) * 2011-04-26 2012-10-31 藤森工业株式会社 Fpc用电磁波屏蔽材料
KR20150078585A (ko) * 2013-12-31 2015-07-08 도레이첨단소재 주식회사 백색 커버레이 필름
JP2015207656A (ja) * 2014-04-21 2015-11-19 三井化学株式会社 リジッドフレキ基板

Also Published As

Publication number Publication date
TWI738844B (zh) 2021-09-11
KR20190111005A (ko) 2019-10-01
KR20180037566A (ko) 2018-04-12
CN107896417A (zh) 2018-04-10
JP6883400B2 (ja) 2021-06-09
KR102132183B1 (ko) 2020-07-09
TW201826891A (zh) 2018-07-16
JP2018060883A (ja) 2018-04-12
KR102027140B1 (ko) 2019-10-01

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