CN107895708A - The transport method of conveyance pad and chip - Google Patents
The transport method of conveyance pad and chip Download PDFInfo
- Publication number
- CN107895708A CN107895708A CN201710864989.4A CN201710864989A CN107895708A CN 107895708 A CN107895708 A CN 107895708A CN 201710864989 A CN201710864989 A CN 201710864989A CN 107895708 A CN107895708 A CN 107895708A
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- air
- chip
- retaining surface
- groove
- flow
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
- H01L21/6779—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks the workpieces being stored in a carrier, involving loading and unloading
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Abstract
The transport method of conveyance pad and chip is provided, in the case where being transported using conveyance pad to chip, conveyance pad and air circulation not changed with canal path, it becomes possible to carries out contact of the conveyance pad to chip and keeps and non-contact holding.Conveyance pad (1) has：Air ejiction opening (100), it is formed at retaining surface (10b), sprays air along retaining surface (10b)；And groove (101), it makes linearly to flow towards the outer peripheral edge of retaining surface (10b) from the air that air ejiction opening (100) sprays, using the flow of the air of flowing in groove (101) to being adjusted because of the power that air is flowed in groove (101) and produces the negative pressure around groove (101), so as to be kept using retaining surface (10b) to chip.
Description
Technical field
The present invention relates to the conveyance pad of the tabular kept to chip and the transport method for the chip for having used conveyance pad.
Background technology
In topping machanism or grinding attachment being processed to semiconductor wafer etc. etc., such as before the processing of chip,
It will be placed on wafer transfer to the holding workbench of the detent mechanism of processing unit (plant), or after the processing of chip, will keep
On the wafer transfer for implementing processing to the rotary table of wafer cleaning mechanism on workbench.Also, on processing unit (plant)
The conveyance pad transported to chip is equipped with, the conveyance pad with contact wafers for example with carrying out the holding of attracting holding
Face.The retaining surface is for example made up of porous member, or formed with multiple suction holes, the stream of air is made in a manner of allowing hand over
Attraction source that road is formed with by device for vacuum generation etc. and the air being made up of compressor etc. provide source and connected (for example, referring to special
Sharp document 1).
In the state of the retaining surface of conveyance pad and contact wafers are made, attracted by attraction source and caused attraction
Retaining surface is transferred to via the stream of air, attracting holding can be carried out to chip so as to transport pad.When making chip from conveyance
When the retaining surface of pad departs from, air is switched to provide the shape that source connects with retaining surface the state that attraction source connects with retaining surface
State, provide source from air and provide air to retaining surface, a small amount of air is sprayed from retaining surface.Also, the injection pressure for passing through air
Power, the vacuum adsorption force destroyed between retaining surface and chip, so that chip departs from from retaining surface.
Patent document 1：Japanese Unexamined Patent Publication 2014-204089 publications
, will be upper in the case where being desirable with conveyance pad and chip being kept with contactless state in processing unit (plant)
State with contact carry out attracting holding conveyance pad be replaced by using Bernoulli effect produce negative pressure and in a non-contact manner
The conveyance pad of attracting holding is carried out to chip.Also, make air provide source to connect with the retaining surface of contactless conveyance pad, from
Air provides source and provides air to retaining surface, from the air of retaining surface blowout ormal weight, and makes air flow along retaining surface.It is logical
Cross the flowing (such as vortex) of the air and negative pressure is produced in retaining surface, therefore transport pad and chip is entered in a non-contact manner
Row is kept.
But with the replacing of conveyance pad, the flow of air of contact conveyance pad is supplied to (for example, being taken off in chip
From when to be supplied to conveyance pad air mass flow) and to be supplied to it is contactless conveyance pad air flow it is different, i.e. to carry
The flow for supplying the air of contactless conveyance pad is more.Therefore, following demands are produced：The pipe arrangement of air will be provided to conveyance pad
Caliber also overstriking, i.e., have in advance it is multiple match somebody with somebody canal path etc. with what conveyance pad was connected by being waited in processing unit (plant), with conveyance
The replacing of pad with canal path together to changing.But following problems be present, match somebody with somebody canal path with multiple to transport pad
Apparatus structure it is complicated, and apparatus structure can become big.
Therefore, in the case where being transported using conveyance pad to chip, following problem be present：Conveyance is not padded and matched somebody with somebody
Canal path is changed and can carry out contact of the conveyance pad to chip and keep and non-contact holding.
The content of the invention
The present invention be in view of above-mentioned problem and complete, its object is to provide conveyance pad and chip transport method,
In the case of being transported using conveyance pad to chip, conveyance pad and air circulation are not changed with canal path, with regard to energy
Contact of the conveyance pad to chip is enough carried out to keep and non-contact holding.
It is conveyance pad for solving the present invention of above-mentioned problem, it is the conveyance pad of tabular, and chip is entered using retaining surface
Row is kept, wherein, the conveyance pad has：Air ejiction opening, it is formed at the retaining surface, sprays air along the retaining surface；With
And groove, it makes linearly to flow towards the outer peripheral edge of the retaining surface from the air that the air ejiction opening sprays, using in the groove
The flow of the air of middle flowing to producing the power of the negative pressure around the groove because air flows in the cell and being adjusted,
So as to be kept using the retaining surface to chip.
In addition, the transport method for being chip for solving the present invention of above-mentioned problem, the transport method of the chip use
The conveyance pad, wherein, flow control division is connected with the conveyance pad, the flow control division will can spray from the air
The Flow-rate adjustment for the air that mouth sprays and flowed in the groove is more than first air mass flow for the first air mass flow and flow
The second air mass flow, when to be kept in a non-contact manner to chip using the retaining surface, make first air
The air of flow flows in the cell, chip is being carried out in a manner of chip is contacted with the retaining surface using the retaining surface
During holding, the air of second air mass flow is flowed in the cell, connect so as to which the conveyance pad optionally carries out the non-of chip
Touch and keep and contact to keep.
The conveyance pad of the present invention has：Air ejiction opening, it is formed at retaining surface, sprays air along retaining surface；And
Groove, it makes linearly to flow towards the outer peripheral edge of retaining surface from the air that air ejiction opening sprays, and utilizes what is flowed in groove
The flow of air can be utilized and kept to producing the power of the negative pressure around groove because air is flowed in groove and being adjusted
Kept in face of chip, therefore only by the way that the flow of air is adjusted, it becomes possible to optionally carry out the contact of chip
Keep and non-contact holding.
In the transport method of the chip of the present invention, the connection traffic adjustment portion on the conveyance pad of the present invention, the flow is adjusted
Section portion can be more for the first air mass flow and flow by the Flow-rate adjustment for the air for spraying from air ejiction opening and being flowed in groove
In the second air mass flow of the first air mass flow, chip is being kept in a non-contact manner using the retaining surface
When, the air of first air mass flow is flowed in the cell, to utilize the retaining surface so that chip contacts with the retaining surface
Mode when being kept to chip, the air of second air mass flow is flowed in the cell, so as to conveyance pad selectivity
Ground carries out the non-contact holding of chip and contact is kept.That is, in the case where being transported using conveyance pad to chip, only pass through
The flow of air is adjusted, it becomes possible to contact holding and non-contact holding of the conveyance pad to chip are optionally carried out, and
Without being changed to conveyance pad and air circulation with canal path.In addition, conveyance pad need not be made to be connected with attraction source, therefore not
With making apparatus structure be complicated structure.
Brief description of the drawings
Fig. 1 is the stereogram of one for showing to pad the conveyance of retaining surface towards the state of upside.
Fig. 2 is the stereogram of one for showing to pad the state transported to chip using conveyance.
Label declaration
1：Conveyance pad；10：Main part；10b：Retaining surface；10a：Arm joint face；100：Air ejiction opening；101：Groove；
101a：One end；101b：The other end of groove；102：Connector；109：Guide portion；20：Arm；21：Connecting member；21a：Stream；
23：Air provides road；24：Air provides source；25：Flow control division；3：Mobile unit；W：Chip；Wa：The front of chip；Wb：
The back side of chip；T：Keep workbench；T1：Adsorption section；T1a：Retaining surface；T2：Framework.
Embodiment
Conveyance pad 1 shown in the Fig. 1 kept to semiconductor wafer etc. for example with main part 10, the main part 10 by
The engineering plastics such as acrylic acid, makrolon, PBT resin or stainless steel etc. are formed, and profile is discoideus.In Fig. 1, towards upside
The retaining surface 10b of main part 10 smoothly finished as the face kept to chip, such as surface, in addition can be
Chamfering is implemented in retaining surface 10b end (crest line), to cause in the case of main part 10 and contact wafers not damage wafers.It is main
The profile in body portion 10 is not limited to circular shape, can also be formed as the triangle ten for forming a part of local excision of circle
Shape etc..
Such as have on main part 10：Air ejiction opening 100, it is formed at retaining surface 10b, is sprayed along retaining surface 10b
Go out air；And groove 101, it makes linearly to flow towards retaining surface 10b outer peripheral edge from the air that air ejiction opening 10 sprays
It is dynamic.
Groove 101 for example from retaining surface 10b center be radially oriented outside in three directions with equalization angle (such as
120 degree) extend radially, there is the degree of the pars intermedia of 10 thickness direction (Z-direction) from retaining surface 10b to main part
Depth.The width and depth of each groove 101 have the constant cross section of identical size.In addition, the formation number of groove 101 is not limited to
The number of present embodiment, circumferentially it can also form more than four so that the interval of equalization is radial on retaining surface 10b.Separately
Outside, can also be narrow by the width for the part for making groove 101, using the narrow part in the interior air passed through of groove 101
Accelerated.One end 101a of each groove 101 is in the outer peripheral edge opening of maintaining part 10, and the other end 101b of each groove 101 is with being formed at
Retaining surface 10b central each air ejiction opening 100 connects.
Each air ejiction opening 100 is respectively facing retaining surface 10b radial outside opening, by air from the another of each groove 101
End 101b flatly sprays towards one end 101a.Such as can also be that the sectional area of air ejiction opening 100 is more than cutting for groove 101
Area, when air moves from air ejiction opening 100 to groove 101, air is accelerated.In addition, each air ejiction opening 100 is from main body
The inside of the middle section in portion 10 is formed towards the arm joint face 10a in the face of the opposite side as retaining surface 10b, with
Connected in the connector 102 of arm joint face 10a upper sheds.In addition, it can also for example match somebody with somebody on the retaining surface 10b of main part 10
If the nozzle pad that can be removed, air ejiction opening 100 is formed on the nozzle pad, rather than kept as present embodiment
Air ejiction opening 100 is formed on the 10b of face.In addition, guide portion 109 for example can also be set in the outer peripheral edge of main part 10, this draws
Lead portion 109 and (that is, chip is moved up in the face side of main part 10 to chip using frictional force or from the power of outer peripheral face pressing chip
Slide laterally) limited.The guide portion 109 is formed such as by rubber or sponge, in the outer peripheral edge of main part 10 along week
Multiple (such as three are fixed to being fixed across certain interval in the way of one end 101a with groove 101 staggers with 120 degree of intervals
It is individual).
Hereinafter, to implementing removing in the case of the transport method of the chip of the present invention using the conveyance pad 1 shown in Fig. 1,2
The action of pad 1 is sent to illustrate.
In the case where the wafer W shown in 1 couple of Fig. 2 of conveyance pad transports, as shown in Fig. 2 conveyance pad 1 is in and arm
The state of 20 connections.That is, such as connecting member 21 is fixed on arm joint face 10a middle section, and conveyance pad 1 is by the link
Part 21 and in be fixed on arm 20 one end lower face side state.Mobile unit is connected with the other end of arm 20
3, mobile unit 3 can be such that arm 20 moves in parallel in the horizontal plane or in rotary moving, and can make arm 20 in the Z-axis direction
Lower movement.Mobile unit 3 is for example made by cylinder mobile under making arm 20 in the Z-axis direction using air pressure, using motor
Ball screw turns and form ball screw framework that arm 20 moves in parallel etc..
Connecting member 21, by being connected with arm 20, is formed in arm 20 and linking part such as being formed by swivel joint
The stream 21a extended on the thickness direction (Z-direction) of part 21.Stream 21a one end connects with transporting the connector 102 of pad 1,
One end that the air that the stream 21a other end is formed with by the pitch tube with flexibility or metal pipe arrangement etc. provides road 23 connects.
Alternatively, it is also possible to form throttle orifice for accelerating the air passed through in stream 21a etc. on stream 21a.
The other end on air offer road 23 is communicated with the air being made up of compressor etc. and provides source 24.In addition, in air
There is provided and be for example equipped with flow control division 25 on road 23, air can be provided source 24 and provided to conveyance pad by the flow control division 25
1 and the air for spraying and being flowed in groove 101 from air ejiction opening 100 Flow-rate adjustment for the first air mass flow F1 and flow it is more
In the first air mass flow F1 the second air mass flow F2.Flow control division 25 is, for example, choke valve, and having to hold inside valve
Air the flowmeter by flow.
Wafer W shown in Fig. 2 is, for example, the semiconductor wafer that profile is circular plate-like shape, is formed on the positive Wa of wafer W
There are multiple devices, such as be pasted with protection band (not shown) on positive Wa and positive Wa is protected.The back side Wb of wafer W
Such as the machined surface for implementing grinding etc..
First, the mobile unit 3 shown in Fig. 2 makes conveyance pad 1 move in the horizontal direction and conveyance pad 1 is positioned at into chip
W top, with to be accommodated in the back side Wb of the wafer W of wafer case (not shown) etc. with transport pad 1 retaining surface 10b it is opposed and
The back side Wb of wafer W center and the center for transporting pad 1 are substantially uniform.
Then, for example, mobile unit 3 make conveyance pad 1 towards -Z direction decline and position to conveyance pad 1 retaining surface 10b with
The height and position of the discontiguous degree of back side Wb of wafer W.In this condition, air provides source 24 and provided to air offer road 23
The air of defined pressure.Such as flow control division 25 makes in the state significantly opened inside valve, to pass through stream in advance
Measure adjustment portion 25 and reach the flow of conveyance pad 1 and the air for spraying and being flowed in groove 101 from air ejiction opening 100 as second
Air mass flow F2, it is supplied to air to provide the air on road 23 from air offer source 24 and passes through the Flow-rate adjustment for the state significantly opened
Portion 25, and then sprayed by stream 21a and connector 102 from the air ejiction opening 100 of conveyance pad 1.
It is being formed at from the air that air ejiction opening 100 sprays in retaining surface 10b each groove 101 towards radiation direction in straight
Wire is circulated with the second air mass flow F2, so as to which due to Bernoulli effect, the air around the both sides of groove 101 is inhaled into groove
Inside 101, negative pressure is produced near groove 101, so as to produce the absorption affinity to wafer W.Here, one end 101a of each groove 101 exists
The outer peripheral edge opening of maintaining part 10, therefore flowing of the air in groove 101 will not be hindered, in addition, the air of the air in groove 101
Flow turns into the second bigger air mass flow F2, therefore the absorption affinity of strength is produced on retaining surface 10b.So, utilization is worked as
When wafer W is attracted on the retaining surface 10b of conveyance pad 1 by the absorption affinity of strength, conveyance pad 1 is contacted with retaining surface 10b with wafer W
State absorption holding is carried out to wafer W.
Conveyance pad 1 will adsorb the wafer W that keeps and take out of and transport to the guarantor shown in Fig. 2 from temporary workbench of putting (not shown)
Hold on workbench T.Holding workbench T such as its profile shown in Fig. 2 is toroidal, is had：Maintaining part T1, it is by porous member
Deng composition, attracting holding is carried out to wafer W；And framework T2, it is supported to maintaining part T1.The back side Wb of wafer W is entered
The conveyance pad 1 of row attracting holding makes wafer W be contacted with keeping on workbench T in the way of the back side Wb of wafer W turns into upside.
Maintaining part T1 connects with attraction source (not shown), is attracted to be transferred to retaining surface T1a and caused attraction by attraction source,
So as to keep workbench T to carry out attracting holding to wafer W on retaining surface T1a.In addition, air is set to provide source 24 to transporting pad 1
Air provide stopping.Or reduce flow and the absorption affinity on the retaining surface 10b of conveyance pad 1 is disappeared, so that wafer W
Depart from from the retaining surface 10b of conveyance pad 1.Also, conveyance pad 1 moves back from the holding workbench T for carrying out attracting holding to wafer W
Keep away.
Wafer W for being kept workbench T attracting holdings with states of the back side Wb towards upside, such as by not shown
Grinding unit be ground from back side Wb sides and be thinned to defined thickness.The wafer W that grinding terminates is by transporting pad 1
Taken out of from workbench T is kept.
When wafer W is taken out of from holding workbench T, the mobile unit 3 shown in Fig. 2 makes conveyance pad 1 in the horizontal direction
It is mobile, conveyance pad 1 is positioned to the top of wafer W, with the back side Wb for the wafer W for keep workbench T to be kept and transported
The retaining surface 10b of pad 1 is opposed and the back side Wb of wafer W center and the center of conveyance pad 1 are substantially uniform.
Then, mobile unit 3 makes conveyance pad 1 drop to the retaining surface 10b of conveyance pad 1 and the back of the body of wafer W towards -Z direction
The height and position of the discontiguous degree of face Wb.Also, air provides the sky that source 24 provides defined pressure to air offer road 23
Gas.Such as flow control division 25 switches to the stream inside valve the state of diminution, to reach by flow control division 25
The flow of conveyance pad 1 and the air for spraying and being flowed in groove 101 from air ejiction opening 100 is less than the second air stream as flow
Measure F2 the first air mass flow F1.Therefore, it is supplied to air to provide the air on road 23 from air offer source 24 to adjust by flow
Flow throttles during section portion 25, and then is sprayed by stream 21a and connector 102 from the air ejiction opening 100 of conveyance pad 1.
It is being formed at from the air that air ejiction opening 100 sprays in retaining surface 10b each groove 101 towards radiation direction in straight
Wire is circulated with the first air mass flow F1, so as to which due to Bernoulli effect, the air around the both sides of groove 101 is inhaled into groove
Inside 101, negative pressure is produced near groove 101, so as to produce the absorption affinity to wafer W.The Flow-rate adjustment of air in groove 101 is
Flow be less than the second air mass flow F2 the first air mass flow F1, therefore between wafer W and retaining surface 10b formed with slightly
Gap state, that is, transport pad 1 absorption holding is carried out to wafer W with contactless state using retaining surface 10b.
After conveyance pad 1 has carried out absorption holding to wafer W in a non-contact manner, release and keep workbench T to crystalline substance
Piece W attracting holding.In addition, conveyance pad 1 rises to +Z direction, so as to which wafer W takes out of from holding workbench T.With non-contacting
The conveyance pad 1 that mode to the wafer W after processing adsorb holding moves horizontally, the wafer W after processing by mobile unit 3
Such as it is transported to wafer cleaner etc..
So, conveyance pad 1 of the invention has：Air ejiction opening 100, it is formed at retaining surface 10b, along retaining surface
10b sprays air；And groove 101, it makes from the air that air ejiction opening 100 sprays towards retaining surface 10b outer peripheral edge in straight
Wire flows, and conveyance pad 1 is using the flow of the air flowed in groove 101 to being produced because air is flowed in groove 101 in groove
The power of negative pressure around 101 is adjusted, and so as to be kept using retaining surface 10b to wafer W, therefore is only passed through
The flow of air is adjusted, it becomes possible to which the contact for optionally carrying out wafer W is kept and non-contact holding.
In addition, in the transport method of the chip of the present invention, the connection traffic adjustment portion 25 on conveyance pad 1, the flow is adjusted
Section portion 25 can will be the first air mass flow from the Flow-rate adjustment for the air that air ejiction opening 100 sprays and is flowed in groove 101
F1 and flow are more than the first air mass flow F1 the second air mass flow F2, are utilizing retaining surface 10b in a non-contact manner to crystalline substance
When piece W is kept, the first air mass flow F1 air flows in groove 101, wafer W is contacted with retaining surface 10b and sharp
When being kept with retaining surface 10b to wafer W, the second air mass flow F2 air flows in groove 101, so as to transport the energy of pad 1
The enough non-contact holding for optionally carrying out wafer W and contact are kept.That is, only by the way that the flow of air is adjusted, with regard to energy
It is enough to be kept using the contact for transporting pad 1 and optionally carrying out wafer W and non-contact holding, without being padded and air flow to transporting
Changed with canal path.In addition, conveyance pad 1 need not be made to be connected with attraction source, therefore without making apparatus structure be complicated
Structure.
In addition, the transport method of the chip of the present invention is not limited to above-mentioned embodiment, in addition, conveyance pad shown in the drawings
1 shape of each structure etc. is also not necessarily limited to this, can suitably be changed in the range of it can play the effect of the present invention.Such as
Can, when padding 1 pair of chip with warpage using conveyance or carrying out absorption holding in chip of the front formed with convex-concave, press
Change the air mass flow flowed in groove 101 according to following manner and kept in a non-contact manner：Flowed in groove 101 few
In the second air mass flow and the retaining surface 10b not air with the flow of the absorption affinity of the degree of contact wafers is produced, with non-contact
Mode carry out absorption holding, after being ground to the chip, the first air mass flow is flowed in groove 101, is connect with non-
Tactile mode carries out absorption holding.
Claims (2)
1. one kind conveyance pad, it is the conveyance pad of tabular, and chip is kept using retaining surface, wherein,
The conveyance pad has：
Air ejiction opening, it is formed at the retaining surface, sprays air along the retaining surface；And
Groove, it makes linearly to flow towards the outer peripheral edge of the retaining surface from the air that the air ejiction opening sprays,
Using the flow of the air flowed in the cell to producing negative pressure around the groove because air flows in the cell
Power be adjusted, so as to being kept using the retaining surface to chip.
2. a kind of transport method of chip, the conveyance pad described in claim 1 is used, wherein,
The connection traffic adjustment portion on the conveyance pad, the flow control division will can spray and described from the air ejiction opening
The Flow-rate adjustment of the air flowed in groove is the second air mass flow that the first air mass flow and flow are more than first air mass flow,
When to be kept in a non-contact manner to chip using the retaining surface, the air of first air mass flow is set to exist
Flowed in the groove, when to be kept using the retaining surface in a manner of chip is contacted with the retaining surface to chip, make this
The air of second air mass flow flows in the cell, so as to which the conveyance pad optionally carries out the non-contact holding and contact of chip
Keep.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-196281 | 2016-10-04 | ||
| JP2016196281A JP6814009B2 (en) | 2016-10-04 | 2016-10-04 | Transport method for transport pads and wafers |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107895708A true CN107895708A (en) | 2018-04-10 |
| CN107895708B CN107895708B (en) | 2023-07-25 |
Family
ID=61803497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710864989.4A Active CN107895708B (en) | 2016-10-04 | 2017-09-22 | Wafer conveying method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6814009B2 (en) |
| KR (1) | KR102315301B1 (en) |
| CN (1) | CN107895708B (en) |
| TW (1) | TWI723212B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109300832A (en) * | 2018-08-28 | 2019-02-01 | 湖州景盛新能源有限公司 | Suction means is used in a kind of production of solar battery sheet |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020032476A (en) * | 2018-08-28 | 2020-03-05 | リンク・パワー株式会社 | Non-contact holding device, non-contact holding system, non-contact conveying system and non-contact holding method |
| KR102594542B1 (en) * | 2018-10-31 | 2023-10-26 | 세메스 주식회사 | Die ejecting apparatus |
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| JP2009032744A (en) * | 2007-07-24 | 2009-02-12 | Fluoro Mechanic Kk | Bernoulli chuck |
| JP2009032981A (en) * | 2007-07-27 | 2009-02-12 | Ihi Corp | Non-contact carrier |
| US20110061999A1 (en) * | 2008-05-13 | 2011-03-17 | Ho-Young Cho | Non-contact type of vacuum pad |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20180037576A (en) | 2018-04-12 |
| TW201816919A (en) | 2018-05-01 |
| JP6814009B2 (en) | 2021-01-13 |
| CN107895708B (en) | 2023-07-25 |
| JP2018060881A (en) | 2018-04-12 |
| KR102315301B1 (en) | 2021-10-19 |
| TWI723212B (en) | 2021-04-01 |
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