CN107805393A - The surfacing of Electrostatic Absorption film production mould - Google Patents

The surfacing of Electrostatic Absorption film production mould Download PDF

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Publication number
CN107805393A
CN107805393A CN201711083405.6A CN201711083405A CN107805393A CN 107805393 A CN107805393 A CN 107805393A CN 201711083405 A CN201711083405 A CN 201711083405A CN 107805393 A CN107805393 A CN 107805393A
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CN
China
Prior art keywords
parts
absorption film
electrostatic absorption
surfacing
film production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201711083405.6A
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Chinese (zh)
Inventor
张永宏
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Individual
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Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201711083405.6A priority Critical patent/CN107805393A/en
Publication of CN107805393A publication Critical patent/CN107805393A/en
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L91/00Compositions of oils, fats or waxes; Compositions of derivatives thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2227Oxides; Hydroxides of metals of aluminium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24Acids; Salts thereof
    • C08K3/26Carbonates; Bicarbonates
    • C08K2003/262Alkali metal carbonates

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  • Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

The present invention provides a kind of surfacing of Electrostatic Absorption film production mould, includes the active princlple of following parts by weight:10 parts of butadiene-styrene rubber, 15 parts of naphthenic oil, 6 parts of boric acid, 2 parts of sodium carbonate, 22 parts of butanediol, 32 parts of aluminium hydroxide, 3 parts of aromatic polyvalent amine curing agent.The remarkable result of the present invention is to be easier to be stripped in the production of Electrostatic Absorption film.

Description

The surfacing of Electrostatic Absorption film production mould
Technical field
The present invention relates to Electrostatic Absorption film field, specifically, is related to a kind of surface of Electrostatic Absorption film production mould Material.
Background technology
PE diaphragms make adhesive using Special polyethylene (PE) plastic sheeting as base material, with cross-linking type acrylic acid resin, then It is process by several special auxiliary agents.Its property is soft, and adhesive performance is good, easily pastes, is easily peeled off, peels off no cull, Application field is extensive, stainless steel plate, aluminium sheet, aluminium alloy extrusions, plastic-steel section bar and door and window, aluminium-plastic panel, fluorine carbon plate, mirror board, folder Heart color steel, fire-proof plate, decoration panel, poly (methyl methacrylate) plate, PS, PE, PVC board sunlight board (polycarbonate plate), antitheft door, label, Coated glass, top-grade furniture, high-grade handicraft, Electric Appliance Cabinet, computer casing, automobile lamp, floor, household appliances shell, instrument Instrument, various fields are waited to need product surface to be protected all to can be used.
The film of static electrification easily adsorbs dust, makes film surface dirty;The normal operating of electrostatic influence film production, seriously When can wound operator;The big film of electrostatic influences the normal production of machine, and it is normal that Fei Bao phenomena impairs tobacco factory is produced when serious Production.It can thus be appreciated that eliminating electrostatic for PE films, meaning is very great.
The content of the invention
It is an object of the invention to provide a kind of surfacing of Electrostatic Absorption film production mould, to solve above-mentioned technology Problem.
The present invention using following technical scheme in order to solve the above technical problems, realized:
A kind of surfacing of Electrostatic Absorption film production mould, it is characterised in that effective group including following parts by weight Part:Butadiene-styrene rubber 5-20 parts, naphthenic oil 5-20 parts, boric acid 2-8 parts, sodium carbonate 2-4 parts, butanediol 2-4 parts, aluminium hydroxide 3-6 Part, curing agent 2-6 parts.
Include the active princlple of following parts by weight:10 parts of butadiene-styrene rubber, 15 parts of naphthenic oil, 6 parts of boric acid, 2 parts of sodium carbonate, fourth 22 parts of glycol, 32 parts of aluminium hydroxide, 2 parts of curing agent.
The curing agent is amine curing agent.
The curing agent is aromatic polyvalent amine curing agent.
The beneficial effects of the invention are as follows:
The remarkable result of the present invention is to be easier to be stripped in the production of Electrostatic Absorption film.
Embodiment
In order that the technical means, the inventive features, the objects and the advantages of the present invention are easy to understand, tie below Specific embodiment is closed, the present invention is expanded on further, but following embodiments are only the preferred embodiments of the present invention, and it is not all. Based on the embodiment in embodiment, those skilled in the art obtain other realities on the premise of creative work is not made Example is applied, belongs to protection scope of the present invention.Experimental method in following embodiments, it is conventional method unless otherwise specified, Material used, reagent etc., unless otherwise specified, are commercially obtained in following embodiments.
Embodiment 1
A kind of surfacing of Electrostatic Absorption film production mould, include the active princlple of following parts by weight:Butadiene-styrene rubber 10 parts, 15 parts of naphthenic oil, 6 parts of boric acid, 2 parts of sodium carbonate, 22 parts of butanediol, 32 parts of aluminium hydroxide, aromatic polyvalent amine solidification 3 parts of agent.
Above-mentioned raw materials are well mixed that compound, the production of Electrostatic Absorption film are warming up to 120 degrees Celsius with the surface of mould, Then it is 120-350 μm in the surface of mould, thickness by compound uniform adhesion by organic silica gel, then hot pressing is uniform, heat It is 355 degrees Celsius to press temperature.
Embodiment 2
The present embodiment is same as Example 1 in addition to following characteristics:
A kind of surfacing of Electrostatic Absorption film production mould, include the active princlple of following parts by weight:Butadiene-styrene rubber 16 parts, 18 parts of naphthenic oil, 4 parts of boric acid, 2 parts of sodium carbonate, 3 parts of butanediol, 3 parts of aluminium hydroxide, aromatic polyvalent amine curing agent 4 Part.
Above-mentioned raw materials are well mixed that compound, the production of Electrostatic Absorption film are warming up to 120 degrees Celsius with the surface of mould, Then it is 120-350 μm in the surface of mould, thickness by compound uniform adhesion by organic silica gel, then hot pressing is uniform, heat It is 355 degrees Celsius to press temperature.
General principle, principal character and the advantages of the present invention of the present invention has been shown and described above.The technology of the industry For personnel it should be appreciated that the present invention is not limited to the above embodiments, that described in above-described embodiment and specification is only the present invention Preference, be not intended to limit the present invention, without departing from the spirit and scope of the present invention, the present invention also have it is various Changes and improvements, these changes and improvements all fall within the protetion scope of the claimed invention.The claimed scope of the invention is by institute Attached claims and its equivalent thereof.

Claims (4)

1. a kind of surfacing of Electrostatic Absorption film production mould, it is characterised in that include the active princlple of following parts by weight: Butadiene-styrene rubber 5-20 parts, naphthenic oil 5-20 parts, boric acid 2-8 parts, sodium carbonate 2-4 parts, butanediol 2-4 parts, aluminium hydroxide 3-6 parts, Curing agent 2-6 parts.
2. the surfacing of Electrostatic Absorption film production mould according to claim 1, it is characterised in that including following heavy Measure the active princlple of part:10 parts of butadiene-styrene rubber, 15 parts of naphthenic oil, 6 parts of boric acid, 2 parts of sodium carbonate, 22 parts of butanediol, aluminium hydroxide 32 parts, 2 parts of curing agent.
3. the surfacing of Electrostatic Absorption film production mould according to claim 1 or 2, it is characterised in that described solid Agent is amine curing agent.
4. the surfacing of Electrostatic Absorption film production mould according to claim 3, it is characterised in that the curing agent For aromatic polyvalent amine curing agent.
CN201711083405.6A 2017-11-06 2017-11-06 The surfacing of Electrostatic Absorption film production mould Pending CN107805393A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711083405.6A CN107805393A (en) 2017-11-06 2017-11-06 The surfacing of Electrostatic Absorption film production mould

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711083405.6A CN107805393A (en) 2017-11-06 2017-11-06 The surfacing of Electrostatic Absorption film production mould

Publications (1)

Publication Number Publication Date
CN107805393A true CN107805393A (en) 2018-03-16

Family

ID=61583630

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201711083405.6A Pending CN107805393A (en) 2017-11-06 2017-11-06 The surfacing of Electrostatic Absorption film production mould

Country Status (1)

Country Link
CN (1) CN107805393A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1587310A (en) * 2004-07-02 2005-03-02 杨太龙 Water-proof liquid rubber
CN102766284A (en) * 2012-08-07 2012-11-07 天津德高化成电子材料有限公司 Tasteless mold cleaning material for semiconductor packaging mold
CN102786725A (en) * 2012-08-07 2012-11-21 天津德高化成电子材料有限公司 Tasteless double-functional material for cleaning and lubricating semiconductor packaging mold
CN103305154A (en) * 2013-07-15 2013-09-18 张家港康得新光电材料有限公司 High-temperature-resisting pressure-sensitive adhesive for adhesive tape, adhesive tape and preparation process

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1587310A (en) * 2004-07-02 2005-03-02 杨太龙 Water-proof liquid rubber
CN102766284A (en) * 2012-08-07 2012-11-07 天津德高化成电子材料有限公司 Tasteless mold cleaning material for semiconductor packaging mold
CN102786725A (en) * 2012-08-07 2012-11-21 天津德高化成电子材料有限公司 Tasteless double-functional material for cleaning and lubricating semiconductor packaging mold
CN103305154A (en) * 2013-07-15 2013-09-18 张家港康得新光电材料有限公司 High-temperature-resisting pressure-sensitive adhesive for adhesive tape, adhesive tape and preparation process

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Application publication date: 20180316