CN107803602A - Laser processing device and Laser Processing chip removal device - Google Patents
Laser processing device and Laser Processing chip removal device Download PDFInfo
- Publication number
- CN107803602A CN107803602A CN201610878679.3A CN201610878679A CN107803602A CN 107803602 A CN107803602 A CN 107803602A CN 201610878679 A CN201610878679 A CN 201610878679A CN 107803602 A CN107803602 A CN 107803602A
- Authority
- CN
- China
- Prior art keywords
- laser processing
- chip removal
- laser
- removal device
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012545 processing Methods 0.000 title claims abstract description 91
- 238000005553 drilling Methods 0.000 claims abstract description 28
- 230000003287 optical effect Effects 0.000 claims abstract description 11
- 238000003754 machining Methods 0.000 claims description 13
- 239000011521 glass Substances 0.000 claims description 12
- 230000001681 protective effect Effects 0.000 claims description 12
- 239000007921 spray Substances 0.000 claims description 7
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 5
- 241000425571 Trepanes Species 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000007789 gas Substances 0.000 claims 17
- 238000010521 absorption reaction Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000013461 design Methods 0.000 abstract description 4
- 238000003698 laser cutting Methods 0.000 abstract 1
- 238000001179 sorption measurement Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000007717 exclusion Effects 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/388—Trepanning, i.e. boring by moving the beam spot about an axis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/08—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for flash removal
Abstract
The invention discloses a laser processing device and a laser processing chip removal device. The laser generating element is used for generating a laser beam and passing through the optical channel. The optical hole-surrounding element is positioned on the optical path of the laser beam and enables the laser beam to move along an annular processing path. The chip removal device for laser processing improves the flow velocity of the sprayed chip by utilizing the design of the internal flow channel of the nozzle, so that the pressure of the adsorption area is reduced. The air source is used for providing air flow, is arranged on the chip removal device for laser processing and is communicated with the internal flow channel of the nozzle. The chip removal device for laser processing generates suction aiming at a laser processing scanning area, assists a laser cutting/drilling manufacturing process, achieves large-area chip removal action, and improves the production speed and the hole quality.
Description
Technical field
The present invention relates to a kind of laser processing device and Laser Processing chip removal device, processed more particularly to a kind of large area
Laser processing device and Laser Processing chip removal device.
Background technology
With the fast development of contact panel industry, the substrate thickness of protective glass is thinning and strength enhancing is trend.Pass
System CNC machine drilling manufacture crafts face bottleneck, and the non-contact drilling technique of laser is to the substrate of high intensity because can drill,
And then gradually substitute CNC machine drillings.
The single-point drilling that laser drill is divided into small range drills with regional on a large scale.Traditional laser nozzle is to be directed to
Designed by single-point drilling, the diameter for the scope that drills is typically smaller than 2.5 millimeters.If the regional drilling (diameter of large area to be carried out
More than 10 millimeters or more), then need traditional laser nozzle coordinating biaxially (such as X-axis and Y-axis) mobile platform, can reach
Into large-scale regional drilling.However, because the translational speed of biaxially mobile platform is slow so that the production speed of laser drill is difficult to
Lifting, therefore also have traditional laser nozzle collocation scanning galvanometer to be drilled, to which there is high scan by scanning galvanometer
The characteristic of frequency accelerates drilling efficiency.
In theory, although conventional laser nozzle collocation scanning galvanometer can accelerate penetration rate, in fact, conventional laser
The penetration rate of nozzle collocation scanning galvanometer can but be limited by chip removal speed and be difficult to be lifted.Specifically, at present mostly
It is to be removed chip using gas, aperture, which increases, means that the air blowing scope of gas can also increase.However, the air blowing of chip removal gas
Scope becomes can but be greatly reduced related the air pressure of chip removal gas greatly.This situation will cause the chip removal effect of chip removal gas to drop
It is low, and it is difficult to the drilling efficiency and drilling quality of improving laser drilling.Therefore, how improving laser rig carries out large aperture
One of drilling efficiency and drilling quality during hole, then should be solved the problems, such as research staff.
The content of the invention
The invention reside in a kind of laser processing device and Laser Processing chip removal device is provided, entered with improving laser rig
The drilling efficiency of row large area and drilling quality.
In laser processing device and Laser Processing chip removal device disclosed by one embodiment of the invention, laser processing device
Comprising a laser generating element, optics around hole element, a source of the gas and a Laser Processing chip removal device.Laser generating element is producing
A raw laser beam.Optics is located in the light path of laser beam around hole element, and makes laser beam be moved along an annular machining path
It is dynamic.Laser beam passes through optical channel.Source of the gas is installed on Laser Processing chip removal device, to provide an air-flow.
According to the laser processing device of above-described embodiment and Laser Processing chip removal device, through Laser Processing chip removal device
Inner flow passage designs, and improves the flow velocity of ejection so that binding domain pressure diminishes, and suction is produced to the laser processing area of test piece
Power, and then the effect of laser machined debris exclusion, the chip of laser processing area is reached via Laser Processing chip removal device
Exclusion acts, and carries out being cut by laser/drilling manufacture craft, lifting drilling efficiency and drilling quality.In addition, it can also laser machine
Multiple air inlets are set on chip removal device, the area that multiple flow passages are in parallel, and increase laser machined debris excludes is carried out, reaches super large face
Long-pending Laser Processing chip removal device.
The explanation of explanation and implementation below above with respect to present invention is only demonstrating and explain the present invention's
Principle, and scope of the presently claimed invention is provided and further explained.
Brief description of the drawings
Figure 1A is the partial cutaway schematic view of the laser processing device according to first embodiment of the invention；
Figure 1B is the diagrammatic cross-section of the laser processing device and workpiece according to first embodiment of the invention；
Fig. 2A is the diagrammatic cross-section of the Laser Processing chip removal device of the present invention；
Fig. 2 B are Fig. 2A of the present invention partial perspective view；
Fig. 3 is the partial perspective view of the Laser Processing chip removal device in the present invention with multiple air inlets.
Symbol description
The workpiece of 10 laser processing device 20
The hole of 21 finished surface 22
The optics of 100 laser generating element 200 is around hole element
The 300 Laser Processing optical channels of chip removal device 310
The upper pedestal of 320 nozzle 321
The air inlet of 322 lower base 330
The protective glass of 340 exhaust outlet 350
The bolt of 360 fixed block 361
The source of the gas of 370 space 400
410 pipeline A central axis
L laser beam P air-flows.
Embodiment
Refer to Figure 1A and Figure 1B.Figure 1A is that the part of the laser processing device according to first embodiment of the invention is cutd open
Face schematic diagram, Figure 1B are the diagrammatic cross-section of the laser processing device and workpiece described in first embodiment of the invention.Figure 1A is not wrapped
Containing workpiece 20, Figure 1B includes workpiece 20, and wherein the workpiece 20 does not contact with Laser Processing chip removal device 300, also can be
Both are contacted with each other during processing.
The laser processing device 10 of the present embodiment makes the finished surface of workpiece 20 to be drilled to a workpiece 20
A hole 22 is formed on 21.Laser processing device 10 includes a laser generating element 100, an optics around hole element 200, a source of the gas
400 and one Laser Processing chip removal device 300.Wherein optics around hole element 200 and laser machines chip removal device 300 in the present embodiment
Integral operation is incorporated in, but the rwo in other embodiments can also lock out operation.When processing must be by optics around Kong Yuan
When part 200 is with Laser Processing 300 lock out operation of chip removal device, Laser Processing chip removal device 300 can be positioned on workpiece 20.
Laser generating element 100 is producing a laser beam L.Laser beam L is, for example, that ultraviolet laser, semiconductor are green
Light, near infrared light laser or far red light laser.
Optics is, for example, rotary drilling (trepan) optical module or scanning galvanometer module around hole element 200, and positioned at sharp
In light light beam L light path.Laser beam L is driven around hole element 200 by optics and can moved along an annular machining path.Annular adds
Work path is located on the finished surface 21 of workpiece 20, and annular machining path namely forms the edge of hole 22.In this reality
Apply in example, annular machining path is shaped as circle, and the diameter of annular machining path is more than or equal to 1 millimeter.
The side that laser machining chip removal device 300 has a space 370, a nozzle 320, corresponding nozzle 320 is set at least
One air inlet 330, the opposite side of the nozzle 320 set an at least exhaust outlet 340 and a protective glass 350, wherein 370, space
Between the lower section of protective glass 350 and air inlet 330 and exhaust outlet 340.
There is optical channel 310 a central axis A, laser beam L to pass through optical channel 310, and in optical channel 310
Pitch of the laps and moved along annular machining path.
Air inlet 330 is communicated in space 370 positioned at the side of Laser Processing chip removal device 300.
It is worth noting that, the quantity of the air inlet 330 of the present embodiment is exemplified by one, but it is not limited thereto.
In other embodiment, the quantity of air inlet 330 can also be multiple (such as more than two).
In addition, refer to Fig. 2A, Fig. 2 B and above-mentioned Figure 1B.Fig. 2A is cuing open for the Laser Processing chip removal device 300 of the present invention
Face schematic diagram.Fig. 2 B are Fig. 2A of the present invention partial perspective view.In the present embodiment, laser machine chip removal device 300 and include spray
Mouth 320, the side of corresponding nozzle 320 set the opposite side of an at least air inlet 330, the nozzle 320 to set an at least exhaust outlet
340 and protective glass 350, the fixed block 360 of protective glass 350 and one be fixed on nozzle 320, the present embodiment use bolt 361 will
The fixed block 360 of protective glass 350 and one is fixed on nozzle 320, and a space 370 is formed in nozzle 320.Nozzle 320 is by upper
Pedestal 321 and lower base 322 form, or are integrally formed, and are formed at one end after the upper pedestal 321 and the composition of lower base 322
One air inlet 330, the air inlet 330 are a tapered small aperture, form an exhaust outlet 340 in the other end, the exhaust outlet 340 is
The big aperture of one flaring or be identical aperture.When air-flow P sprays from air inlet 330, because of the aperture of air inlet 330
Reduced cross-sectional area so that air-flow P flow velocity rise, cause air-flow P to flow through in the region in space 370, cause gas pressure to reduce
Below an atmospheric pressure, the hole 22 relative to workpiece 20 is still an atmospheric pressure, therefore one is formed in the region in space 370 and is inhaled
Attached region, chip removal thing can be sucked into the region in space 370 from the hole 22 of workpiece 20, then from exhaust outlet 340 by a high speed
Gas sprays.
Fig. 3 is the part of the Laser Processing chip removal device 300 in the present invention with multiple (such as more than two) air inlets 330
Stereogram, large-area laser processing chip removal device 300 can be used as.Meanwhile also referring to above-mentioned Figure 1B.
Source of the gas 400 is connected through one or more pipelines 410 with multiple air inlets 330 of nozzle 320, there is provided a high pressure gas
Body, the gas may be, for example, continous way gas or pulsed gas.
In addition, caused high velocity air when air-flow P caused by source of the gas 400 sprays via tapered air inlet 330, will
Chip in space 370 blows to exhaust outlet 340 and flowed out.Consequently, it is possible to chip removal effects of the air-flow P to chip will can be lifted, and then
The drilling efficiency of improving laser processing unit (plant) 10.Its measured result, traditional laser processor processing diameter 1mm (millimeter) hole
Hole spends the time about 58 seconds, and in process, has dust accumulation on the finished surface of workpiece.But the present embodiment swashs
The time that the hole 22 that optical machining device 10 processes diameter 1mm is spent effectively foreshortened to 32 seconds from 58 seconds really, and processed
During, have no dust accumulation on the finished surface 21 of workpiece 20.Separately when diameter 0.5mm hole is processed, traditional
Laser processor does not have the secondary process of Laser Processing chip removal device 300 of the present invention, will be unable to process, and the laser of the present embodiment
The time that the hole 22 that processing unit (plant) 10 processes diameter 0.5mm is spent is 21 seconds.Therefore, it was found from from measured result, pass through
Air-flow P caused by the secondary process of Laser Processing chip removal device 300 of the present invention, can actually effective improving laser processing unit (plant)
10 drilling efficiency and drilling quality.
According to the laser processing device of above-described embodiment and Laser Processing chip removal device, through Laser Processing chip removal device
Inner flow passage designs, and improves the gas flow rate of ejection so that binding domain pressure diminishes, and the laser processing area of test piece is produced
Suction, reach the effect of laser machined debris excludes, and then the drilling efficiency of improving laser processing unit (plant) and drilling quality.
In addition, in addition to the inner flow passage design of above-mentioned Laser Processing chip removal device, and the Laser Processing chip removal dress of the present invention
The structure put is simple, using suction mode, thus air-flow can be avoided to be blown to the surface of workpiece and pollute, with further
The drilling efficiency of ground improving laser processing unit (plant) and drilling quality.
Although disclosing the present invention with reference to foregoing preferred embodiment, but it is not limited to the present invention, any ripe
This operator is known, without departing from the spirit and scope of the present invention, a little change and retouching, therefore the patent of the present invention can be made
What protection domain must be defined depending on this specification appended claims is defined.
Claims (20)
1. a kind of laser processing device, it is characterized in that, the laser processing device includes：
Laser generating element, to produce a laser beam；
Optics in the light path of the laser beam, and makes the laser beam be moved along an annular machining path around hole element；
Laser machine chip removal device, have space, nozzle, to should the side of nozzle an at least air inlet, the nozzle are set
Opposite side sets an at least exhaust outlet and a protective glass；And
Source of the gas, to provide an air-flow, and it is installed on the Laser Processing chip removal device.
2. laser processing device as claimed in claim 1, it is characterized in that, this is spatially located at the lower section of the protective glass and the air inlet
Between mouth and the exhaust outlet.
3. laser processing device as claimed in claim 1, it is characterized in that, the air inlet is located at the Laser Processing chip removal device
Side, and for a tapered small aperture and the space is communicated in, when the air-flow sprays from the air inlet, because of the hole of the air inlet
The reduced cross-sectional area in footpath so that the flow velocity rise of the air-flow, cause gas to flow through in the region in the space, cause gas pressure drop
Low the hole relative to workpiece is still an atmospheric pressure below an atmospheric pressure, therefore an absorption is formed in the region in the space
Region, chip removal thing can be sucked into the region in the space from the hole of the workpiece, then sprayed from the exhaust outlet by high-speed gas
Go out.
4. laser processing device as claimed in claim 1, it is characterized in that, the quantity of the air inlet is more than two.
5. laser processing device as claimed in claim 1, it is characterized in that, the protective glass and a fixed block are fixed on the nozzle
On, and the space is formed in the nozzle.
6. laser processing device as claimed in claim 1, it is characterized in that, the nozzle is made up of upper pedestal and lower base, or
It is formed in one.
7. laser processing device as claimed in claim 1, it is characterized in that, the annular machining path be shaped as circle, rectangle,
Triangle or star.
8. laser processing device as claimed in claim 1, it is characterized in that, the annular machining path is shaped as circle, and should
The diameter of annular machining path is more than or equal to 1 millimeter.
9. laser processing device as claimed in claim 1, it is characterized in that, the laser beam acts on a processing of a workpiece
Surface, and the annular machining path is located on the finished surface.
10. laser processing device as claimed in claim 1, it is characterized in that, air inlet of the source of the gas through a pipeline and the nozzle
Mouth is connected, there is provided a gases at high pressure, the gas are continous way gas or pulsed gas.
11. laser processing device as claimed in claim 1, it is characterized in that, the laser beam is ultraviolet laser, semiconductor is green
Light, near infrared light laser or far red light laser.
12. laser processing device as claimed in claim 1, it is characterized in that, the optics is rotary drilling around hole element
(trepan) optical module or scanning galvanometer module.
13. laser processing device as claimed in claim 1, it is characterized in that, the optics is around hole element and the Laser Processing chip removal
Device is detachable.
14. one kind Laser Processing chip removal device, it is characterized in that, the processing chip removal device includes：
Nozzle；
An at least air inlet, it is arranged at the side of the nozzle；
An at least exhaust outlet, it is arranged at the opposite side of the nozzle；And
Protective glass, it is fixed on a fixed block on the nozzle.
15. Laser Processing chip removal device as claimed in claim 14, it is characterized in that, in the lower section of the protective glass and the air inlet
A space is formed between the exhaust outlet.
16. Laser Processing chip removal device as claimed in claim 14, it is characterized in that, the air inlet is located at the Laser Processing chip removal
The side of device, and for a tapered small aperture and space is communicated in, when air-flow sprays from the air inlet, because of the air inlet
The reduced cross-sectional area in aperture so that the flow velocity rise of the air-flow, cause the gas to flow through in the region in the space, cause gas pressure
Power is reduced below an atmospheric pressure, is still an atmospheric pressure relative to the hole of workpiece, therefore form one in the region in the space
Binding domain, chip removal thing can be sucked into the region in the space from the hole of the workpiece, then from the exhaust outlet by high speed gas
Body sprays.
17. Laser Processing chip removal device as claimed in claim 14, it is characterized in that, the quantity of the air inlet is more than two.
18. Laser Processing chip removal device as claimed in claim 14, it is characterized in that, the nozzle is by upper pedestal and lower base group
Into, or be formed in one.
19. Laser Processing chip removal device as claimed in claim 14, it is characterized in that, the exhaust outlet be the big aperture of a flaring,
Or it is identical aperture.
20. Laser Processing chip removal device as claimed in claim 14, it is characterized in that, the Laser Processing chip removal device also includes gas
Source, and be connected through a pipeline with the air inlet of the nozzle, there is provided a gases at high pressure, the gas are continous way gas or pulse
Formula gas.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105129291 | 2016-09-09 | ||
| TW105129291A TWI613028B (en) | 2016-09-09 | 2016-09-09 | Laser treatment device and laser scrap removal device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107803602A true CN107803602A (en) | 2018-03-16 |
Family
ID=61559555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610878679.3A Pending CN107803602A (en) | 2016-09-09 | 2016-10-09 | Laser processing device and Laser Processing chip removal device |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20180071865A1 (en) |
| CN (1) | CN107803602A (en) |
| TW (1) | TWI613028B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108687440A (en) * | 2018-07-20 | 2018-10-23 | 苏州迅镭激光科技有限公司 | A kind of gentle uniform laser cutting head gas path device of blowing |
| CN110893513A (en) * | 2018-08-24 | 2020-03-20 | 发那科株式会社 | Laser processing system and laser processing method |
| CN116727899A (en) * | 2023-07-12 | 2023-09-12 | 大辽激光科技(宁波)有限公司 | Device for laser deep small hole machining and laser rotary cutting machining dust removing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102376434B1 (en) * | 2018-01-17 | 2022-03-22 | 삼성디스플레이 주식회사 | Laser apparatus |
| JP7431601B2 (en) * | 2020-02-10 | 2024-02-15 | 株式会社ディスコ | laser processing equipment |
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| Publication number | Publication date |
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| US20180071865A1 (en) | 2018-03-15 |
| TWI613028B (en) | 2018-02-01 |
| TW201811478A (en) | 2018-04-01 |
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