TW201318747A - Carbon-pollution-free laser processing device and method thereof - Google Patents
Carbon-pollution-free laser processing device and method thereof Download PDFInfo
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本發明是關於一種雷射加工方法及裝置,尤指一種可令加工物經雷射加工後無焦黑現象之無碳污染雷射加工裝置及方法。The invention relates to a laser processing method and device, in particular to a carbon-free pollution laser processing device and method which can make a processed object without laser black after laser processing.
早期以雷射發射器對軟性電路板、硬式電路板、陶瓷基板、鋁板、銅板等加工物進行切割、劃線與鑽孔加工時,其主要令雷射發射器直接聚焦投射於加工物上。於雷射加工過程中,加工物因處於有氧的大氣環境下,在雷射投射加工物上產生之高溫而使加工物表面燃燒而產生焦黑現象,以致加工物受到焦黑的碳污染,不利於加工物的品質。In the early days, when cutting, scribing and drilling a soft circuit board, a hard circuit board, a ceramic substrate, an aluminum plate, a copper plate, etc. with a laser emitter, the laser emitter was mainly directly focused and projected onto the workpiece. In the process of laser processing, the processed object is in aerobic atmosphere, and the high temperature generated on the laser projecting material causes the surface of the processed object to burn to produce a blackening phenomenon, so that the processed object is contaminated by coke black carbon, which is disadvantageous to The quality of the processed product.
為防止加工物於雷射加工過程中產生焦黑現象,現有的雷射加工設備係令承載加工物的工作台與其上方的雷射發射器設置於可啟閉的大型腔體內,先對腔體抽真空,使腔體內部達到接近實質無氧的環境下,再由腔體內部的雷射發射器對其下方的加工物進行雷射加工,以期避免加工物因雷射加工而產生焦黑現象。In order to prevent the blackening phenomenon of the processed object during the laser processing, the existing laser processing equipment is such that the working table carrying the processed object and the laser emitting device above it are disposed in the large openable cavity, and the cavity is firstly pumped. The vacuum is used to make the interior of the cavity reach a near-substantially oxygen-free environment, and then the laser beam is processed by the laser emitter inside the cavity to avoid the blackening phenomenon of the processed object due to laser processing.
惟前述將工作台與其上方的雷射發射器設置於可啟閉的大型腔體之設計,雖可改善加工物雷射加工產生焦黑現象之問題,但是,對雷射加工前,須對腔體先行抽真空,因腔體體積過大,抽真空作業耗時,且難以達到較佳無氧加工環境,以致有作業效果不彰之缺陷。However, the above-mentioned design of the laser transmitter above the workbench and the large-sized cavity that can be opened and closed can improve the problem of blackening caused by laser processing of the workpiece, but the cavity must be applied before the laser processing. The vacuum is first applied, because the volume of the cavity is too large, the vacuuming operation takes time, and it is difficult to achieve a better oxygen-free processing environment, so that there is a defect that the operation effect is not good.
本發明之主要目的在於提供一種無碳污染雷射加工裝置及方法,希藉此設計改善現有雷射加工製程中須使用一大型的真空腔體將工件及雷射發射器罩蓋於內,抽真空作業費時,且難以達到較佳無氧加工環境之缺點。The main object of the present invention is to provide a carbon-free pollution laser processing apparatus and method, which is designed to improve the existing laser processing process by using a large vacuum chamber to cover the workpiece and the laser emitter, and vacuuming The operation is time consuming and it is difficult to achieve the disadvantages of a better anaerobic processing environment.
為達成前揭目的,本發明所提出之無碳污染雷射加工裝置係包含:一工作台,該工作台頂部具有一提供加工物置放定位之工作表面;一工件隔離腔體,係可啟閉的罩蓋於工作台之工作表面上密合,而能形成一僅供加工物置入其中之密閉工件隔離腔室,工件隔離腔體包含一光學板材以及設於光學板材周邊的側板,所述密閉工件隔離腔室連通一真空抽氣孔,真空抽氣孔用以外接真空抽氣設備;以及一雷射發射器,係設置於工作台與工件隔離腔體正上方,所述雷射發射器可發出雷射光穿過工件隔離腔體之光學板材再聚焦投射於工件隔離腔室內之加工物上。In order to achieve the foregoing object, the carbon-free pollution laser processing apparatus of the present invention comprises: a workbench having a working surface for providing a positioning position of the workpiece; and a workpiece isolation cavity capable of opening and closing The cover is tightly closed on the working surface of the worktable, and can form a closed workpiece isolation chamber into which the workpiece is placed. The workpiece isolation cavity comprises an optical plate and a side plate disposed around the periphery of the optical plate, the sealing The workpiece isolation chamber is connected to a vacuum suction hole, and the vacuum suction hole is connected to the vacuum extraction device; and a laser emitter is disposed directly above the workbench and the workpiece isolation cavity, and the laser emitter can emit a lightning The optical plate that projects through the workpiece isolation cavity is then focused onto the workpiece in the workpiece isolation chamber.
本發明所提出之無碳污染雷射加工方法,係包含以下步驟:將加工物隔離於一密閉的工件隔離腔室內之步驟,係使用一工作台提供加工物定位其上,所述工件隔離腔室係使用一頂部具有光學板材之工件隔離腔體罩蓋於一工作台上所構成;抽真空步驟,係對所述工件隔離腔室內部抽氣而達到實質無氧的環境;雷射加工與抽氣步驟,係令雷射發射器自工件隔離腔體上方發出雷射光,雷射光穿透工件隔離腔體頂部的光學板材後再聚焦投射於加工物上進行雷射加工,同時對工件隔離腔室持續施以抽氣作用而排出加工物被雷射加工所產生的殘屑,直至加工物加工完成;以及加工物取出之步驟,係解除工件隔離腔室之抽氣狀態,令外界空氣導入工件隔離腔室內部,使工件隔離腔體可以開啟再取出加工物。The carbon-free pollution laser processing method of the present invention comprises the steps of: isolating the workpiece into a closed workpiece isolation chamber, and using a workbench to provide a workpiece positioning thereon, the workpiece isolation chamber The chamber is formed by using a workpiece isolation cavity cover having an optical plate on the top of a workbench; the vacuuming step is to evacuate the interior of the workpiece isolation chamber to achieve a substantially oxygen-free environment; laser processing and The pumping step is to cause the laser emitter to emit laser light from above the workpiece isolation cavity, the laser light penetrates the optical plate on the top of the workpiece isolation cavity, and then is focused and projected onto the workpiece for laser processing, and the workpiece isolation cavity is simultaneously The chamber continuously performs the pumping action to discharge the debris generated by the laser processing until the processing of the workpiece is completed; and the step of removing the workpiece is to release the pumping state of the workpiece isolation chamber, and the outside air is introduced into the workpiece. The inside of the chamber is isolated so that the workpiece isolation chamber can be opened and the workpiece can be taken out.
藉此無碳污染雷射加工裝置與方法設計,其特點是利用一小型的工件隔離腔體結合工件台構成一僅供加工物位於其中隔離之密閉工件隔離腔室,不影響原有雷射加工方式,且對該工件隔離腔室抽氣形成一實質無氧的環境時,可利用小型化的工件隔離腔室,縮短對隔離腔室抽氣形成實質無氧環境之作業時間,且可達到良好的無氧環境品質,另利用工件隔離腔體頂部的光學板材提供雷射發射器自工件隔離腔體外側發出雷射光穿透其中再聚焦投射於加工物上進行雷射加工,雷射光施加於實質無氧環境中的加工物上無燃燒反應,使加工物無焦黑現象而無碳污染,確保加工物的加工品質。The carbon-free pollution laser processing device and method design is characterized in that a small workpiece isolation cavity is combined with the workpiece table to form a closed workpiece isolation chamber in which the processed object is isolated, without affecting the original laser processing. In a manner, when the workpiece isolation chamber is evacuated to form a substantially oxygen-free environment, the miniaturized workpiece isolation chamber can be utilized to shorten the operation time for forming a substantially oxygen-free environment for the isolation chamber to be evacuated, and can achieve good The anaerobic environment quality, and the use of the optical plate on the top of the workpiece isolation cavity provides the laser emitter to emit laser light from the outside of the workpiece isolation cavity, and then focus and project on the workpiece for laser processing, and the laser light is applied to the essence. There is no combustion reaction on the processed material in the anaerobic environment, so that the processed product has no blackening phenomenon and no carbon pollution, thereby ensuring the processing quality of the processed product.
本發明之次一目的係令該工件隔離腔體設置氮氣噴氣孔,用以在工件隔離腔室抽真空之後,對工件隔離腔室灌入氮氣,於後續雷射加工步驟中,使加工物處於實質無氧的氮氣氣氛環境更能防止加工物雷射加工產生燃燒之功用。The second object of the present invention is to provide a nitrogen gas injection hole in the workpiece isolation cavity for injecting nitrogen into the workpiece isolation chamber after the workpiece isolation chamber is evacuated, and the workpiece is placed in the subsequent laser processing step. The substantially anaerobic nitrogen atmosphere environment is more resistant to the burning effect of the processed laser processing.
再者,本發明尚可進一步於加工物在工件隔離腔室之實質無氧的氮氣氣氛環境中進行雷射加工與抽氣時,同時自工件隔離腔室上段之光學板材下方之氮氣阻隔排孔灌入氮氣,用以阻隔加工物被雷射加工所產生之粉塵附著於工件隔離腔體頂部的光學板材,再搭配抽氣作用排出粉塵,以維持光學板材之雷射光穿透率。Furthermore, the present invention can further perform the laser processing and evacuation in the environment of the substantially oxygen-free nitrogen atmosphere of the workpiece isolation chamber, and at the same time, the nitrogen barrier hole below the optical plate of the upper portion of the workpiece isolation chamber. Nitrogen is injected to block the optical material generated by the laser processing of the workpiece from being attached to the top of the workpiece isolation chamber, and then the dust is discharged by the pumping action to maintain the laser light transmittance of the optical sheet.
如圖1所示,係揭示本發明無碳污染雷射加工裝置之一較佳實施例,配合參看圖1與圖4所示,所述無碳污染雷射加工裝置係包含:一工作台1、一工件隔離腔體2與一雷射發射器3,其中:所述工作台1包含一工作表面10,工作表面10位於工作台1頂部,用以提供待雷射加工之加工物4置放定位其上。As shown in FIG. 1 , a preferred embodiment of the carbon-free pollution laser processing apparatus of the present invention is disclosed. Referring to FIG. 1 and FIG. 4 , the carbon-free pollution laser processing apparatus includes: a workbench 1 a workpiece isolation cavity 2 and a laser emitter 3, wherein: the workbench 1 comprises a work surface 10, and the work surface 10 is located at the top of the workbench 1 for providing the workpiece 4 to be laser processed Position it on it.
所述工件隔離腔體2係可啟閉的罩蓋於工作台1之工作表面10上密合,並能形成一僅供加工物4置入其中之密閉工件隔離腔室20,工件隔離腔體2之大小尺寸略大於僅供加工物,工件隔離腔體2之高度係參酌使用之雷射發射器而設定,工件隔離腔體2之高度約為30~100mm為佳,所述工件隔離腔體2頂部具有一光學板材21,於光學板材21周邊設置複數側板22而構成一罩形體,所述光學板材21選自石英玻璃、光學玻璃與光學壓克力等高純度、無色、無雜質之光學板材中之任一種,提供雷射光可穿透。The workpiece isolation cavity 2 is an openable and closable cover that is tightly attached to the working surface 10 of the workbench 1, and can form a closed workpiece isolation chamber 20 into which the workpiece 4 is placed. The workpiece isolation cavity The size of the 2 is slightly larger than that of the workpiece only, and the height of the workpiece isolation cavity 2 is set according to the laser emitter to be used. The height of the workpiece isolation cavity 2 is preferably about 30 to 100 mm, and the workpiece isolation cavity is preferably used. 2 has an optical plate 21 at the top, and a plurality of side plates 22 are arranged around the optical plate 21 to form a cover body. The optical plate 21 is selected from the group consisting of high purity, colorless and impurity-free optics such as quartz glass, optical glass and optical acrylic. Any of the plates provides laser light penetration.
前述中,如圖1所示,所述工件隔離腔體2之側板22上設有一真空抽氣孔23,或者,如圖2所示,所述工作台1上設置一延伸至工作表面10的真空抽氣孔11,所述真空抽氣孔11、23連通工件隔離腔室20,並能外接真空抽氣設備,用以對工件隔離腔室20進行抽氣;另於工件隔離腔體2之側板22上設有一氮氣噴氣孔24,氮氣噴氣孔24用以外接氮氣供應源,該工件隔離腔體2之側板22鄰近光學板材21處設有複數個間隔排列之氮氣阻隔排孔25,所述氮氣阻隔排孔25用以外接氮氣供應源;所述工件隔離腔體2可於四周側板22底面設置氣密墊26,工件隔離腔體2罩蓋於工作台1上以氣密墊接觸工作表面10而密合。In the foregoing, as shown in FIG. 1, a vacuum suction hole 23 is disposed on the side plate 22 of the workpiece isolation cavity 2, or, as shown in FIG. 2, the table 1 is provided with a vacuum extending to the working surface 10. The air venting holes 11 and 23 communicate with the workpiece isolation chamber 20, and can be externally connected to the vacuum suction device for pumping the workpiece isolation chamber 20; and the side plate 22 of the workpiece isolation cavity 2 A nitrogen gas injection hole 24 is provided, and the nitrogen gas injection hole 24 is provided with an external nitrogen supply source. The side plate 22 of the workpiece isolation cavity 2 is provided with a plurality of spaced-apart nitrogen gas barrier holes 25 adjacent to the optical plate 21, the nitrogen gas barrier row. The hole 25 is provided with an external nitrogen supply source; the workpiece isolation chamber 2 can be provided with a gas-tight pad 26 on the bottom surface of the surrounding side plate 22, and the workpiece isolation cavity 2 is covered on the work table 1 to be intimately contacted by the airtight pad to the working surface 10 Hehe.
所述雷射發射器3係設置於工作台1與工件隔離腔體2正上方,所述雷射發射器3可為各式可發出不同波長的雷射光之雷射發出器,如:波長1064nm之IR雷射發射器、波長532nm之GREEN雷射發射器或波長355nm之UV雷射發射器等,所述雷射發射器3可發出雷射光30穿過工件隔離腔體2的光學板材21再聚焦投射於工件隔離腔室20內之加工物4上。The laser emitter 3 is disposed directly above the workbench 1 and the workpiece isolation cavity 2. The laser emitter 3 can be a variety of laser emitters that can emit different wavelengths of laser light, such as a wavelength of 1064 nm. An IR laser emitter, a GREEN laser emitter with a wavelength of 532 nm or a UV laser emitter with a wavelength of 355 nm, etc., the laser emitter 3 can emit laser light 30 through the optical plate 21 of the workpiece isolation cavity 2 The focus is projected onto the workpiece 4 in the workpiece isolation chamber 20.
如圖3所示,係揭示本發明無碳污染雷射加工方法之一較佳實施例的流程圖,配合參閱圖5所示,所述無碳污染雷射加工方法係包含以下步驟:將加工物4隔離於密閉的工件隔離腔室20內之步驟,係將加工物4放置於工作台1上,再將頂部具有光學板材21的工件隔離腔體2罩設於加工物4外側,工件隔離腔體2略大於加工物4,使加工物4被隔離於工件隔離腔體2與工作台1密合所形成之密閉的工件隔離腔室20內,所述加工物4適用於玻璃物件、軟性電路板、硬式電路板、陶瓷基板、鋁板、銅板、......等;抽真空步驟,係對所述工件隔離腔室20內部抽氣,使工件隔離腔室20內部之加工物4處於一實質無氧的環境;雷射加工與抽氣步驟,係令雷射發射器3自工件隔離腔體2上方對工件隔離腔室20內之加工物4施以雷射加工,所述雷射加工可為對加工物4的切割、劃線或鑽孔等,同時對工件隔離腔室20持續施以抽氣作用而排出加工物4被雷射加工所產生的殘屑,直至加工物4加工完成,其中係令位於工件隔離腔體2上方的雷射發射器3發出雷射光30,雷射光30穿透工件隔離腔體2頂部的光學板材21後再聚焦投射於加工物4上進行雷射加工,其中雷射光30穿透工件隔離腔體2頂部之光學板材21時,尚未聚焦,而係聚焦投射於加工物4上,故雷射光30穿透光學板材21之部位非熱集中點,再者,藉由工件隔離腔室20為實質無氧的環境,能有效避免加工物4因被雷射加工而燃燒產生焦黑現象,達到無碳污染之功用;以及加工物4取出之步驟,係解除工件隔離腔室20之抽氣狀態,令外界空氣導入工件隔離腔室20內部,使工件隔離腔體2可以開啟再取出加工物4。As shown in FIG. 3, a flow chart of a preferred embodiment of the carbon-free pollution laser processing method of the present invention is disclosed. Referring to FIG. 5, the carbon-free pollution laser processing method includes the following steps: processing The step of isolating the object 4 in the closed workpiece isolation chamber 20 is to place the workpiece 4 on the table 1, and then cover the workpiece isolation chamber 2 having the optical plate 21 on the outside of the workpiece 4, and the workpiece is isolated. The cavity 2 is slightly larger than the workpiece 4, so that the workpiece 4 is isolated in the sealed workpiece isolation chamber 20 formed by the workpiece isolation chamber 2 and the table 1 being tightly combined. The workpiece 4 is suitable for glass objects and softness. a circuit board, a hard circuit board, a ceramic substrate, an aluminum plate, a copper plate, etc.; a vacuuming step of pumping the inside of the workpiece isolation chamber 20 to isolate the workpiece from the inside of the workpiece 20 In a substantially anaerobic environment; the laser processing and pumping steps cause the laser emitter 3 to apply laser processing to the workpiece 4 in the workpiece isolation chamber 20 from above the workpiece isolation chamber 2, the lightning The shooting process can be cutting, scribing or drilling the workpiece 4, etc. The workpiece isolation chamber 20 is continuously subjected to suction to discharge the debris generated by the laser processing of the workpiece 4 until the processing of the workpiece 4 is completed, wherein the laser emitter 3 located above the workpiece isolation chamber 2 is disposed. The laser light 30 is emitted, and the laser light 30 penetrates the optical plate 21 at the top of the workpiece isolation cavity 2 and is then focused and projected onto the workpiece 4 for laser processing. The laser light 30 penetrates the optical plate 21 at the top of the workpiece isolation cavity 2. At the time, the focus is not focused, but the focus is projected on the workpiece 4, so that the laser light 30 penetrates the non-heat concentration point of the optical plate 21, and further, the workpiece isolation chamber 20 is substantially anaerobic, which is effective. The process 4 is prevented from being burned by laser processing to produce a blackening phenomenon to achieve the function of no carbon pollution; and the step of removing the processed object 4 is to release the pumping state of the workpiece isolation chamber 20, and the outside air is introduced into the workpiece isolation chamber. Inside the 20, the workpiece isolation chamber 2 can be opened and the workpiece 4 can be taken out.
如圖4與圖5所示,所述無碳污染雷射加工方法中,於抽真空步驟之後,尚可進一步包含一對工件隔離腔室20灌入氮氣,其中可經由工件隔離腔體2側板22上之氮氣噴氣孔24灌入氮氣,使工件隔離腔室20達到實質無氧且具有避免燃燒功用的氮氣氣氛環境,再進行雷射加工與抽氣步驟,達到避免加工物4因被雷射加工而產生焦黑現象之較佳無碳污染效果。As shown in FIG. 4 and FIG. 5, in the carbon-free pollution laser processing method, after the vacuuming step, a pair of workpiece isolation chambers 20 may further be filled with nitrogen gas, wherein the side plate of the cavity 2 can be isolated via the workpiece. The nitrogen gas injection hole 24 on the 22 is filled with nitrogen gas, so that the workpiece isolation chamber 20 reaches a substantially oxygen-free environment and has a nitrogen atmosphere environment for avoiding combustion function, and then the laser processing and pumping steps are performed to avoid the workpiece 4 being irradiated by the laser. The preferred carbon-free pollution effect of processing produces a blackening phenomenon.
所述無碳污染雷射加工方法中,加工物4於工件隔離腔室20內之實質無氧的氮氣氣氛環境中進行雷射加工與抽氣步驟時,同時自工件隔離腔室20上段之光學板材21下方之氮氣阻隔排孔25灌入氮氣,用以阻隔加工物4被雷射加工所產生之粉塵附著於工件隔離腔體2頂部的光學板材21,再搭配抽氣作用排出粉塵,以維持光學板材21之雷射光穿透率。In the carbon-free pollution laser processing method, when the workpiece 4 is subjected to a laser processing and pumping step in a substantially oxygen-free nitrogen atmosphere in the workpiece isolation chamber 20, the optical portion from the upper portion of the workpiece isolation chamber 20 is simultaneously The nitrogen barrier hole 25 under the plate 21 is filled with nitrogen gas to block the dust generated by the laser processing of the workpiece 4 from adhering to the optical plate 21 at the top of the workpiece isolation chamber 2, and then exhausting the dust with the pumping action to maintain The laser light transmittance of the optical sheet 21.
以上所述,僅是揭示本發明之較佳實施例,並非對本發明作任何形式上的限制,任何所屬技術領域中具有通常知識者在不脫離本發明所提出的技術特徵的範圍內,利用本發明所揭示技術內容所作出局部更動或修飾的等效實施例,均仍屬於本發明技術特徵的範圍內。The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any one of ordinary skill in the art can use the present invention without departing from the technical features of the present invention. Equivalent embodiments of the local changes or modifications made by the disclosed technology are still within the scope of the technical features of the present invention.
1...工作台1. . . Workbench
10...工作表面10. . . Working surface
11...真空抽氣孔11. . . Vacuum pumping hole
2...工件隔離腔體2. . . Workpiece isolation cavity
20...工件隔離腔室20. . . Workpiece isolation chamber
21...光學板材twenty one. . . Optical sheet
22...側板twenty two. . . Side panel
23...真空抽氣孔twenty three. . . Vacuum pumping hole
24...氮氣噴氣孔twenty four. . . Nitrogen gas jet
25...氮氣阻隔排孔25. . . Nitrogen barrier hole
26...氣密墊26. . . Airtight cushion
3...雷射發射器3. . . Laser transmitter
30...雷射光30. . . laser
4...加工物4. . . Machining
圖1係本發明無碳污染雷射加工裝置之一較佳實施例的平面示意圖。BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a plan view showing a preferred embodiment of a carbon-free contamination laser processing apparatus of the present invention.
圖2係本發明無碳污染雷射加工裝置之一較佳實施例的平面示意圖。2 is a plan view showing a preferred embodiment of the carbon-free contamination laser processing apparatus of the present invention.
圖3係本發明無碳污染雷射加工方法之一較佳實施例的流程圖。3 is a flow chart of a preferred embodiment of the carbon-free contamination laser processing method of the present invention.
圖4係本發明無碳污染雷射加工方法之另一較佳實施例的流程圖。4 is a flow chart of another preferred embodiment of the carbon-free contamination laser processing method of the present invention.
圖5係本發明無碳污染雷射加工方法之實施狀態參考圖。Fig. 5 is a reference view showing an implementation state of the carbon-free contamination laser processing method of the present invention.
1...工作台1. . . Workbench
10...工作表面10. . . Working surface
2...工件隔離腔體2. . . Workpiece isolation cavity
20...工件隔離腔室20. . . Workpiece isolation chamber
21...光學板材twenty one. . . Optical sheet
22...側板twenty two. . . Side panel
23...真空抽氣孔twenty three. . . Vacuum pumping hole
24...氮氣噴氣孔twenty four. . . Nitrogen gas jet
25...氮氣阻隔排孔25. . . Nitrogen barrier hole
26...氣密墊26. . . Airtight cushion
3...雷射發射器3. . . Laser transmitter
30...雷射光30. . . laser
4...加工物4. . . Machining
Claims (11)
Priority Applications (1)
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TW100141521A TW201318747A (en) | 2011-11-15 | 2011-11-15 | Carbon-pollution-free laser processing device and method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW100141521A TW201318747A (en) | 2011-11-15 | 2011-11-15 | Carbon-pollution-free laser processing device and method thereof |
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TW201318747A true TW201318747A (en) | 2013-05-16 |
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TW100141521A TW201318747A (en) | 2011-11-15 | 2011-11-15 | Carbon-pollution-free laser processing device and method thereof |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107303628A (en) * | 2016-04-20 | 2017-10-31 | 三星显示有限公司 | Laser-induced thermal etching equipment and the method that laser-induced thermal etching is carried out using laser-induced thermal etching equipment |
TWI613028B (en) * | 2016-09-09 | 2018-02-01 | 財團法人工業技術研究院 | Laser treatment device and laser scrap removal device |
CN108067749A (en) * | 2017-12-06 | 2018-05-25 | 广东省焊接技术研究所(广东省中乌研究院) | A kind of laser cutting method and system for amorphous thin ribbon |
-
2011
- 2011-11-15 TW TW100141521A patent/TW201318747A/en unknown
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN107303628A (en) * | 2016-04-20 | 2017-10-31 | 三星显示有限公司 | Laser-induced thermal etching equipment and the method that laser-induced thermal etching is carried out using laser-induced thermal etching equipment |
US11065723B2 (en) | 2016-04-20 | 2021-07-20 | Samsung Display Co., Ltd. | Laser etching apparatus and a method of laser etching using the same |
CN107303628B (en) * | 2016-04-20 | 2022-01-07 | 三星显示有限公司 | Laser etching equipment and method for performing laser etching by using same |
US11370065B2 (en) | 2016-04-20 | 2022-06-28 | Samsung Display Co., Ltd. | Laser etching apparatus and a method of laser etching using the same |
TWI613028B (en) * | 2016-09-09 | 2018-02-01 | 財團法人工業技術研究院 | Laser treatment device and laser scrap removal device |
CN108067749A (en) * | 2017-12-06 | 2018-05-25 | 广东省焊接技术研究所(广东省中乌研究院) | A kind of laser cutting method and system for amorphous thin ribbon |
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