JP2010093245A5 - Exposure apparatus, maintenance method, and device manufacturing method - Google Patents

Exposure apparatus, maintenance method, and device manufacturing method Download PDF

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JP2010093245A5
JP2010093245A5 JP2009210447A JP2009210447A JP2010093245A5 JP 2010093245 A5 JP2010093245 A5 JP 2010093245A5 JP 2009210447 A JP2009210447 A JP 2009210447A JP 2009210447 A JP2009210447 A JP 2009210447A JP 2010093245 A5 JP2010093245 A5 JP 2010093245A5
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gas
exposure apparatus
exposure
supply port
substrate
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JP2010093245A (en
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露光光で基板を露光する露光装置であって、
プロセスガスを放電空間へ導入して生成されたガスを供給可能な第1供給口を有し、前記第1供給口から供給された前記ガスと洗浄対象部材とを接触させて、前記洗浄対象部材をクリーニングするクリーニング装置を備えた露光装置。
An exposure apparatus for exposing a substrate with exposure light, comprising:
Has the generated by introducing a process gas into the discharge space gas first supply port capable of supplying, by contacting the cleaning target member and the gas supplied from the first supply port, said cleaning target member Exposure device equipped with a cleaning device to clean the
前記クリーニング装置は、前記第1供給口から前記ガスが供給された第1空間の周囲に第2ガスを供給する第2供給口と、前記第1空間のガスの少なくとも一部を排出する排気口とを有する請求項1記載の露光装置。 The cleaning device includes a second supply port for supplying a second gas to the periphery of the first space to which the gas is supplied from the first supply port, and an exhaust port for discharging at least a part of the gas in the first space. the exposure apparatus according to claim 1, wherein the organic and. 所定空間と、 Predetermined space,
前記所定空間に第1ガスを供給することによって、前記所定空間の環境を調整する調整装置と、をさらに備え、 And an adjusting device for adjusting an environment of the predetermined space by supplying the first gas to the predetermined space;
前記第2ガスは、前記第1ガスと実質的に同じ温度である請求項2に記載の露光装置。The exposure apparatus according to claim 2, wherein the second gas is at substantially the same temperature as the first gas.
前記第2ガスは、前記第1ガスと実質的に同じ種類である請求項2又は3記載の露光装置。 The exposure apparatus according to claim 2, wherein the second gas is substantially the same type as the first gas. 前記基板は、露光液体を介して、前記露光光で露光され、
前記洗浄対象部材は、露光液体と接触する請求項1〜のいずれか一項記載の露光装置。
The substrate is exposed to the exposure light through an exposure liquid,
The exposure apparatus according to any one of claims 1 to 4 , wherein the cleaning target member is in contact with an exposure liquid.
前記プロセスガスは、第1のプロセスガス及び第2のプロセスガスを含み、
前記クリーニング装置は、前記第1のプロセスガスを前記放電空間に供給するための第1供給路と、前記第2のプロセスガスを前記放電空間に供給するための第2供給路と、前記放電空間と前記第1供給路とが連通している第1状態と前記放電空間と前記第2供給路とが連通している第2状態とを切換可能な切換装置とを有し、
前記第1状態において、前記第1のプロセスガスが前記放電空間に導入されて生成されたガスを前記第1供給口から供給して前記洗浄対象部材をクリーニングし、
前記第2状態において、前記第2のプロセスガスが前記放電空間に導入されて生成されたガスを前記第1供給口から供給して部材と接触させ、前記部材の表面の露光液体に対する撥液性を高める請求項記載の露光装置。
The process gas includes a first process gas and a second process gas.
The cleaning device includes a first supply passage for supplying the first process gas into the discharge space, and a second supply path for supplying the second process gas to the discharge space, the discharge space And a switching device capable of switching between a first state in which the second supply path communicates with the first supply path, and a second state in which the discharge space communicates with the second supply path,
In the first state, and cleaning the cleaning target member by supplying the first process gas is generated is introduced into the discharge space gas from said first supply port,
In the second state, the second process gas is introduced into the discharge space and the gas generated is supplied from the first supply port and brought into contact with the member, and the liquid repellency of the surface of the member against the exposure liquid The exposure apparatus according to claim 5, wherein
前記第1のプロセスガスは、酸素を含み、
前記第2のプロセスガスは、フッ素化合物を含む請求項記載の露光装置。
The first process gas contains oxygen,
The exposure apparatus according to claim 6 , wherein the second process gas contains a fluorine compound.
前記第1のプロセスガス又は前記第2のプロセスガスは、アルゴンガス、クリプトンガス、キセノンガス、ラドンガス、ネオンガス、及び窒素ガスの少なくとも一つを含む請求項記載の露光装置。 8. The exposure apparatus according to claim 7, wherein the first process gas or the second process gas includes at least one of argon gas, krypton gas, xenon gas, radon gas, neon gas, and nitrogen gas. 前記第2状態において、前記第1供給口から供給された前記ガスと前記洗浄対象部材とを接触させて、前記洗浄対象部材の表面の前記露光液体に対する撥液性を高める請求項のいずれか一項記載の露光装置。 In the second state, wherein by contacting the cleaned member and the gas supplied from the first supply port, according to claim 6-8 to enhance the liquid repellency with respect to the exposure surface liquid of the cleaning target member An exposure apparatus according to any one of the preceding claims. 前記基板の露光中に、前記基板の表面の少なくとも一部は、前記洗浄対象部材と対向する請求項のいずれか一項記載の露光装置。 The exposure apparatus according to any one of claims 5 to 9 , wherein at least a part of the surface of the substrate faces the member to be cleaned during the exposure of the substrate. 前記洗浄対象部材は、多孔部材を含み、
前記多孔部材を介して露光液体が回収される請求項10記載の露光装置。
The member to be cleaned includes a porous member,
11. The exposure apparatus according to claim 10, wherein the exposure liquid is recovered through the porous member.
前記洗浄対象部材は、露光液体を供給可能な供給口、又は露光液体を回収可能な回収口、又はその両方を有する請求項10記載の露光装置。 11. The exposure apparatus according to claim 10 , wherein the member to be cleaned has a supply port capable of supplying an exposure liquid, a recovery port capable of recovering the exposure liquid, or both. 露光液体を回収可能な回収口と、
前記回収口に連通する回収流路とを備え、
前記洗浄対象部材の表面は、前記回収流路の内面を含む請求項11のいずれか一項記載の露光装置。
A recovery port capable of recovering the exposure liquid;
And a recovery channel communicating with the recovery port,
The exposure apparatus according to any one of claims 5 to 11 , wherein a surface of the cleaning target member includes an inner surface of the recovery flow channel.
前記回収口と真空源とを前記回収流路を介して接続し、前記第1供給口から供給された前記ガスを前記回収口から吸引することによって、前記第1供給口から供給された前記ガスと前記回収流路の内面とを接触させる請求項13記載の露光装置。 And said recovery port and the vacuum source is connected via the recovery flow passage, by sucking the gas supplied from the first supply port from said collection port, said gas supplied from the first supply port The exposure apparatus according to claim 13 , wherein the exposure device is in contact with the inner surface of the recovery flow channel. 露光液体を供給可能な供給口と、
前記供給口に連通する供給流路とを備え、
前記洗浄対象部材の表面は、前記供給流路の内面を含む請求項1113、及び14のいずれか一項記載の露光装置。
A supply port capable of supplying an exposure liquid;
And a supply channel communicating with the supply port,
The surface of the cleaning target member, the supply channel claims 5 to 11, including the inner surface of, 13, and an exposure apparatus according to any one claim of 14.
前記供給口と真空源とを前記供給流路を介して接続し、前記第1供給口から供給された前記ガスを前記供給口から吸引することによって、前記第1供給口から供給された前記ガスと前記供給流路の内面とを接触させる請求項15記載の露光装置。 And the supply port and the vacuum source is connected through the supply passage by sucking the gas supplied from the first supply port from said supply port, the gas supplied from the first supply port The exposure apparatus according to claim 15 , wherein the light source and the inner surface of the supply flow channel are brought into contact with each other. 前記洗浄対象部材は、前記露光光が照射可能な位置に移動可能である請求項1〜16のいずれか一項記載の露光装置。 The exposure apparatus according to any one of claims 1 to 16 , wherein the cleaning target member is movable to a position where the exposure light can be irradiated. 前記洗浄対象部材は、第1部材と、前記第1部材とギャップを介して配置された第2部材との少なくとも一方を含み、
前記第1供給口からの前記ガスは、前記ギャップ内に供給される請求項17記載の露光装置。
The member to be cleaned includes at least one of a first member and a second member disposed between the first member and a gap.
The exposure apparatus according to claim 17 , wherein the gas from the first supply port is supplied into the gap.
前記洗浄対象部材は、前記基板を保持可能な基板保持部材を含む請求項17又は18記載の露光装置。 The cleaning target member, an exposure apparatus according to claim 17 or 18, wherein comprising a substrate holding member capable of holding the substrate. 前記基板を保持可能な基板保持部材を備え、
前記洗浄対象部材は、前記基板保持部材に保持された基板の周囲の少なくとも一部に配置される請求項17又は18記載の露光装置。
A substrate holding member capable of holding the substrate;
The cleaning target member is at least partially are in the arrangement according to claim 17 or 18 exposure apparatus according around the substrate held by the substrate holding member.
前記洗浄対象部材は、前記露光光を受光可能な計測器の少なくとも一部を含む請求項1720のいずれか一項記載の露光装置。 The exposure apparatus according to any one of claims 17 to 20 , wherein the member to be cleaned includes at least a part of a measuring device capable of receiving the exposure light . 前記露光光が照射可能な位置に移動可能な可動部材を備え、
前記第1供給口は、前記可動部材に設けられている請求項1〜21のいずれか一項記載の露光装置。
A movable member movable to a position where the exposure light can be emitted;
The exposure apparatus according to any one of claims 1 to 21 , wherein the first supply port is provided in the movable member.
請求項1〜22のいずれか一項記載の露光装置を用いて基板を露光することと、
露光された基板を現像することと、を含むデバイス製造方法。
Exposing the substrate using the exposure apparatus according to any one of claims 1 to 22 ;
Developing the exposed substrate.
露光光で基板を露光する露光装置のメンテナンス方法であって、
プロセスガスを放電空間に導入して生成されたガスと洗浄対象部材とを接触させて前記洗浄対象部材をクリーニングすることを含むメンテナンス方法。
A maintenance method of an exposure apparatus for exposing a substrate with exposure light, comprising:
A maintenance method including: cleaning a member to be cleaned by bringing a generated gas into contact with a member to be cleaned by introducing a process gas into a discharge space .
JP2009210447A 2008-10-07 2009-09-11 Exposure apparatus, maintenance method, exposure method, and device manufacturing method Pending JP2010093245A (en)

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JP5120193B2 (en) * 2008-10-08 2013-01-16 株式会社ニコン Exposure apparatus, maintenance method, exposure method, and device manufacturing method
JP6777977B2 (en) * 2015-09-15 2020-10-28 キヤノン株式会社 Imprinting equipment, imprinting method and manufacturing method of goods
JP6942562B2 (en) * 2017-08-25 2021-09-29 キヤノン株式会社 Lithography equipment and manufacturing method of goods
JP7262939B2 (en) 2018-07-20 2023-04-24 キヤノン株式会社 Cleaning apparatus, imprint apparatus, lithographic apparatus, and cleaning method

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JP2001203135A (en) * 2000-01-20 2001-07-27 Semiconductor Leading Edge Technologies Inc Aligner cleaning method and aligner
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DE60323927D1 (en) * 2002-12-13 2008-11-20 Asml Netherlands Bv Lithographic apparatus and method of making a device
US7355672B2 (en) * 2004-10-04 2008-04-08 Asml Netherlands B.V. Method for the removal of deposition on an optical element, method for the protection of an optical element, device manufacturing method, apparatus including an optical element, and lithographic apparatus
US7385670B2 (en) * 2004-10-05 2008-06-10 Asml Netherlands B.V. Lithographic apparatus, cleaning system and cleaning method for in situ removing contamination from a component in a lithographic apparatus
US7986395B2 (en) * 2005-10-24 2011-07-26 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion lithography apparatus and methods
US7518128B2 (en) * 2006-06-30 2009-04-14 Asml Netherlands B.V. Lithographic apparatus comprising a cleaning arrangement, cleaning arrangement and method for cleaning a surface to be cleaned
US7473908B2 (en) * 2006-07-14 2009-01-06 Asml Netherlands B.V. Getter and cleaning arrangement for a lithographic apparatus and method for cleaning a surface
US8654305B2 (en) * 2007-02-15 2014-02-18 Asml Holding N.V. Systems and methods for insitu lens cleaning in immersion lithography
JP5017232B2 (en) * 2007-10-31 2012-09-05 エーエスエムエル ネザーランズ ビー.ブイ. Cleaning apparatus and immersion lithography apparatus

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