CN107787147B - A kind of semisolid communication radiating shell and its production method - Google Patents
A kind of semisolid communication radiating shell and its production method Download PDFInfo
- Publication number
- CN107787147B CN107787147B CN201710857760.8A CN201710857760A CN107787147B CN 107787147 B CN107787147 B CN 107787147B CN 201710857760 A CN201710857760 A CN 201710857760A CN 107787147 B CN107787147 B CN 107787147B
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- CN
- China
- Prior art keywords
- copper coin
- semisolid
- radiating shell
- aluminum substrate
- production method
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/04—Metal casings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
- B22D17/007—Semi-solid pressure die casting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D19/00—Casting in, on, or around objects which form part of the product
- B22D19/0063—Casting in, on, or around objects which form part of the product finned exchangers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D19/00—Casting in, on, or around objects which form part of the product
- B22D19/16—Casting in, on, or around objects which form part of the product for making compound objects cast of two or more different metals, e.g. for making rolls for rolling mills
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
Abstract
The present invention provides a kind of semisolid communication radiating shell and its production methods, the semisolid communication radiating shell includes aluminum substrate and copper coin, it is provided with multiple boss and counterbore on first face of the copper coin, second face of the copper coin is embedded in the aluminum substrate, and the flush in the first face and the aluminum substrate of the copper coin.Semisolid communication radiating shell provided by the invention not only effectively increases the radiating efficiency of shell, and merged completely with semi solid slurry by designing the structures such as counterbore on copper coin, it is possible to prevente effectively from cracking detaches and influences radiating efficiency between copper coin and aluminum substrate in use.The production method of the radiating shell is easy to operate, may insure copper coin and the complete founding of semi solid slurry by this method, ensures the radiating efficiency of shell.
Description
Technical field
The present invention relates to Die Casting technical field more particularly to a kind of semisolid communication radiating shells and its producer
Method.
Background technology
The radiating shell inner cavity of communication base station is equipped with the electronic components such as IC, the heat generated in the electronic component course of work
It needs quickly to shed by radiating shell, to ensure the normal working temperature of sealing base station housing, it is ensured that each element can be normal
Work, avoids impacting element operating status and service life since temperature is excessively high.The work calories of electronic component
It is that the substrate contacted with element by shell sheds with housing fins.In order to improve the radiating efficiency of base station housing, usually exist
Using measures such as heightened heat dissipation piece, thinned cooling fins in structure design；And due to the fast development of communication, the crescendo of function day
Greatly, the operation of component is also more quick, and the requirement for heat dissipation is also higher and higher, because of diecasting aluminum-silicon alloy material thermal conductivity
Limitation, for the radiating shell of same size, only from the structure of cooling fin change cannot meet base station enclosure height dissipate
The requirement of heat.
Invention content
Present invention seek to address that problem as described above.It is an object of the present invention to provide a kind of solution problem above
Semisolid communicates radiating shell and its production method.Specifically, the present invention, which provides, disclosure satisfy that the half of electronic element radiating demand
Solid-state communicates radiating shell and its production method.
According to the first aspect of the invention, the present invention provides a kind of semisolids to communicate radiating shell, and the semisolid is logical
It includes aluminum substrate and copper coin to interrogate radiating shell, and multiple boss and counterbore are provided on the first face of the copper coin, the copper coin
Second face is embedded in the aluminum substrate, and the flush in the first face and the aluminum substrate of the copper coin.
Wherein, 2 ° of gradients are designed in the located cavity for the mold that the semisolid communication radiating shell uses.
Wherein, the thickness that copper coin is provided on the copper coin is 1.0mm, and the thickness of the boss is 0.8~1.2mm.
Wherein, the density of the aluminum substrate is more than 2.7g/cm3。
According to another aspect of the present invention, the present invention also provides a kind of semisolids as described above to communicate radiating shell
Production method, the production method include：
After the copper coin is preheated, it is fixed on mold；
Produce semi solid slurry；
The semisolid, which is produced, with semi-solid rheological die-casting process communicates radiating shell.
Wherein, the production method further includes heat treatment, and the process of thermal treatment is：
Scheduled duration is kept the temperature after semisolid communication radiating shell is heated to predetermined temperature.
Wherein, the predetermined temperature is 280 DEG C~350 DEG C, and the scheduled duration is 5~6 hours.
Wherein, the mold and the copper coin are excessively cooperation, fit clearance 0.5mm.
Wherein, 2 ° of gradients are designed in the located cavity of the mold.
Semisolid communication radiating shell provided by the invention not only effectively increases the radiating efficiency of shell, but also passes through copper
The structures such as counterbore are designed on plate to merge completely with semi solid slurry, it is possible to prevente effectively from use copper coin and aluminum substrate it
Between cracking separation and influence radiating efficiency.The production method of the radiating shell is easy to operate, may insure copper coin by this method
With the complete founding of semi solid slurry, ensure the radiating efficiency of shell.
Being described below for exemplary embodiment is read with reference to the drawings, other property features of the invention and advantage will
It is apparent from.
Description of the drawings
It is incorporated into specification and the attached drawing of a part for constitution instruction shows the embodiment of the present invention, and with
Principle for explaining the present invention together is described.In the drawings, similar reference numeral is for indicating similar element.Under
Attached drawing in the description of face is some embodiments of the present invention, rather than whole embodiments.Those of ordinary skill in the art are come
It says, it without creative efforts, can be obtain other attached drawings according to these attached drawings.
Fig. 1 schematically illustrates the structural schematic diagram of the semisolid communication radiating shell of the present invention.
Specific implementation mode
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
The every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.It needs
Illustrate, in the absence of conflict, the features in the embodiments and the embodiments of the present application mutually can be combined arbitrarily.
The present invention by using semi-solid rheological die-casting process by copper coin pressure casting inlay in the aluminum substrate of radiating shell, both
The radiating efficiency of shell can be improved by the higher copper coin of thermal coefficient, and can ensure that molten between copper coin and aluminum substrate
Cast stability.
Below in conjunction with the accompanying drawings, to communicating radiating shell and its production method progress in detail according to semisolid provided by the present invention
Thin description.
Fig. 1 shows a kind of structural schematic diagram of specific embodiment of semisolid communication radiating shell provided by the invention,
Shown in referring to Fig.1, it includes aluminum substrate 1 and copper coin 2 which, which communicates radiating shell, is provided on the first face of copper coin 2 multiple
Second face of boss 20 and counterbore, copper coin 2 is embedded in aluminum substrate 1, and the flush in the first face and aluminum substrate 1 of copper coin 2.
Since the coefficient of thermal expansion of aluminium and copper is different, for casting in solidification, the contact surface of copper and aluminium will appear body contraction
The purpose for improving shell heat transfer efficiency is not achieved to which the heat influenced between copper coin 2 and aluminum substrate 1 is transmitted in gap.Inventor
It realizes that the gapless between copper coin 2 and aluminum substrate 1 is combined closely, multiple counterbores is devised on copper coin 2 as fabrication hole,
When Die Casting semisolid communication radiating shell, by fill these fabrication holes with molten aluminum realize copper coin 2 and aluminum substrate 1 it
Between combine closely, and can effectively prevent the shell and generate splitting between copper coin 2 and aluminum substrate 1 in actual use
Trace, it is ensured that the radiating efficiency of shell.When in use, the electronic component in shell is fixed with multiple boss 20 on copper coin 2
Or contact, it is fully radiated by copper coin 2, to meet the radiating requirements of a large amount of communication devices.
Simultaneously, it is contemplated that mould steel is different with the coefficient of thermal expansion of copper, and semisolid communicates the mold that radiating shell uses
2 ° of gradients are designed in located cavity, come ensure between copper coin 2 and aluminum substrate 1 it is close merging and ensure after die casting this half
Solid-state communication radiating shell product size meets requirement.
Specifically, the thickness of copper coin 2 is 1.0mm, and the thickness of boss 20 is 0.8~1.2mm.The setting of such thickness
The intensity that ensure that copper coin and aluminum substrate cooperation contact site, can make the aluminum substrate of die casting and copper coin gapless combine closely,
Ensure copper coin and aluminum substrate will not occur in use to detach under heating status and gap occurs.Inventor passes through to product
It is heat-treated, also demonstrates the reasonability of copper coin design structure in the present invention.
Semisolid provided by the invention communicates radiating shell, and the density of aluminum substrate 1 is more than 2.7g/cm3, so closely
Microstructure of semisolid further provides the radiating efficiency of the radiating shell, is combined with copper coin 2, can make the radiating shell
Radiating efficiency improves 10%~30%.
Simultaneously the present invention also provides the production method that above-mentioned semisolid communicates radiating shell, which includes following
Step：
After copper coin 2 is preheated, it is fixed on mold；
Produce semi solid slurry；
Radiating shell is communicated with semi-solid rheological die-casting process production semisolid.
Wherein, the structure of copper coin 2 can communicate the purposes and its internal installation electronics of radiating shell according to the semisolid
The position of element and radiating requirements etc. are different and are designed, for example, can be changed according to actual demand boss 20 shape,
Quantity, area, distribution etc..
In addition, the production method further includes heat treatment, to ensure the compactness of die casting between copper coin 2 and semi solid slurry.
Specifically, which is：Scheduled duration is kept the temperature after semisolid communication radiating shell is heated to predetermined temperature.
Wherein, predetermined temperature is 280 DEG C~350 DEG C, and scheduled duration is 5~6 hours.In a typical embodiment,
Semisolid communication radiating shell after die casting is heated to 300 DEG C by inventor, and keeps the temperature 5 as a child, product from copper coin 2 not
It is equidirectional cut after, demonstrate combining closely between copper coin 2 and aluminum substrate 1, no any slight crack generates.
Specifically, in production, mold is excessively cooperation, fit clearance 0.5mm with copper coin 2.
Deviate in board dither process of the copper coin 2 in molding in order to prevent, is devised on mold and 2 shape of copper coin
The adaptable located cavity of shape with mold can effectively fix using the boss 20 on copper coin 2；And consider copper coin 2
It is different from the coefficient of thermal expansion of mould steel, 2 ° of gradients are designed in the located cavity of mold.Specifically, two of located cavity
20 tight fit of boss of opposite side and copper coin 2, fit clearance can be 0.05mm；Two of another direction of located cavity are right
Excessively coordinated between side and boss 20, fit clearance 0.5mm；The boss 20 of two diagonal positions on copper coin 2 carries out
Limit, remaining boss 20 can carry out the excessive cooperation in the gaps 0.5mm with mold, to ensure the accurate positionin of copper coin 2, simultaneously
Solves 2 deviation problem of copper coin in clamping process.
Semisolid pressure casting part is organized as granular crystal, and alloy molecular gap is small, and tissue density is big, is conducive to electronic component
Heat derives.The product semi solid slurry Die Casting of the present invention, 1 density > 2.7g/cm of aluminum substrate3, fin thickness
For 1.0mm, fine and close microstructure of semisolid and thin-walled cooling fin make the heat conduction efficiency of aluminium radiating shell improve 10-30%.
The present invention is closely tied using the high thermal conductivity and good 2 gapless of copper coin of thermal conductivity of semi solid aluminum die-cast product
It closes, embodies high heat conductivility.Semisolid Solder for Al-Cu Joint Welding composite radiating shell product is tested through assembly, and heat conductivility meets high
The integrated IC device work calories export of degree requires, and achieves the desired purpose, highly integrated, large capacity architecture of base station part for communication 5G
The extending capacity reformation of design and 4G provide foundation.
Descriptions above can combine implementation individually or in various ways, and these variants all exist
Within protection scope of the present invention.
It should be noted that herein, the terms "include", "comprise" or its any other variant are intended to non-row
His property includes, so that the process, method, article or equipment comprising a series of elements includes not only those elements, and
And further include other elements that are not explicitly listed, or further include for this process, method, article or equipment institute it is intrinsic
Element.In the absence of more restrictions, the element limited by sentence " including one ... ", it is not excluded that including described
There is also other identical elements in the process, method, article or equipment of element.
Finally it should be noted that：The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations.Although
Present invention has been described in detail with reference to the aforementioned embodiments, it will be understood by those of ordinary skill in the art that：It still may be used
With technical scheme described in the above embodiments is modified or equivalent replacement of some of the technical features；
And these modifications or replacements, various embodiments of the present invention technical solution that it does not separate the essence of the corresponding technical solution spirit and
Range.
Claims (9)
1. a kind of semisolid communicates radiating shell, which is characterized in that the semisolid communication radiating shell include aluminum substrate (1) and
Copper coin (2) is provided with multiple boss (20) and counterbore on the first face of the copper coin (2), and the second face of the copper coin (2) is embedded
In the aluminum substrate (1), and the flush in the first face of the copper coin (2) and the aluminum substrate (1), fill institute with molten aluminum
Counterbore is stated to realize combining closely between the copper coin (2) and aluminum substrate (1), in use, the electronic component in shell and institute
The multiple boss (21) stated on copper coin (2) are fixed or contact, and are fully radiated by the copper coin (2).
2. semisolid as described in claim 1 communicates radiating shell, which is characterized in that the semisolid communication radiating shell is adopted
2 ° of gradients are designed in the located cavity of mold.
3. semisolid as described in claim 1 communicates radiating shell, which is characterized in that the thickness of the copper coin (2) is
The thickness of 1.0mm, the boss (20) are 0.8~1.2mm.
4. semisolid as described in claim 1 communicates radiating shell, which is characterized in that the density of the aluminum substrate (1) is more than
2.7g/cm3。
5. the production method of the semisolid communication radiating shell as described in Claims 1 to 4, which is characterized in that the producer
Method includes：
After the copper coin (2) is preheated, it is fixed on mold；
Produce semi solid slurry；
The semisolid, which is produced, with semi-solid rheological die-casting process communicates radiating shell.
6. production method as claimed in claim 5, which is characterized in that the production method further includes heat treatment, at the heat
The technique of reason is：
Scheduled duration is kept the temperature after semisolid communication radiating shell is heated to predetermined temperature.
7. production method as claimed in claim 6, which is characterized in that the predetermined temperature is 280 DEG C~350 DEG C, described pre-
Periodically a length of 5~6 hours.
8. production method as claimed in claim 5, which is characterized in that the mold is excessively cooperation with the copper coin (2), is matched
Conjunction gap is 0.5mm.
9. production method as claimed in claim 5, which is characterized in that be designed with 2 ° of gradients in the located cavity of the mold.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710857760.8A CN107787147B (en) | 2017-09-21 | 2017-09-21 | A kind of semisolid communication radiating shell and its production method |
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| CN201710857760.8A CN107787147B (en) | 2017-09-21 | 2017-09-21 | A kind of semisolid communication radiating shell and its production method |
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| CN107787147A CN107787147A (en) | 2018-03-09 |
| CN107787147B true CN107787147B (en) | 2018-10-23 |
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| CN108650851A (en) * | 2018-05-21 | 2018-10-12 | 苏州春兴精工股份有限公司 | A kind of process of enhancing microwave product heat dissipation |
| CN109588013B (en) * | 2018-12-14 | 2020-03-03 | 珠海市润星泰电器有限公司 | Semi-solid state die-casting radiating shell |
| CN110708926B (en) * | 2019-09-06 | 2021-05-18 | 华为技术有限公司 | Preparation method of shell, shell and electronic equipment |
| CN112909696B (en) * | 2021-01-29 | 2022-05-20 | 南京创通管业有限公司 | Preparation process of embedded liner tube type copper-aluminum transition wire clamp |
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| KR20080077094A (en) * | 2006-01-13 | 2008-08-21 | 덴끼 가가꾸 고교 가부시키가이샤 | Aluminum/silicon carbide composite and heat radiation part making use of the same |
| CN101537479A (en) * | 2009-05-06 | 2009-09-23 | 北京科技大学 | Semi-solid forming process method for forming high silicon-aluminum alloy encapsulated shell structural member |
| CN102612304A (en) * | 2012-03-22 | 2012-07-25 | 深圳市华星光电技术有限公司 | Heat radiation base plate and manufacturing method thereof |
| CN203339226U (en) * | 2013-06-25 | 2013-12-11 | 深圳市安华光电技术有限公司 | Heat radiation structure of micro projector |
| US10118219B2 (en) * | 2013-10-09 | 2018-11-06 | Tohoku University | Semisolid casting/forging apparatus and method as well as a cast and forged product |
| TWI623074B (en) * | 2013-12-27 | 2018-05-01 | 財團法人工業技術研究院 | Electric conductive heat dissipation substrate |
| CN103831417A (en) * | 2014-03-11 | 2014-06-04 | 扬州宏福铝业有限公司 | Continuous semisolid forming method for high-silicon aluminum alloy encapsulation shell |
| DE112015000141B4 (en) * | 2014-03-31 | 2021-11-11 | Fuji Electric Co., Ltd. | Converter |
| CN104233013B (en) * | 2014-09-18 | 2016-10-26 | 珠海市润星泰电器有限公司 | A kind of alusil alloy of rheo-diecasting radiating shell and preparation method thereof |
| CN105127392B (en) * | 2015-09-21 | 2017-03-22 | 珠海市润星泰电器有限公司 | Semisolid extrusion die-casting method |
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