CN107027259A - One kind communication radiating shell - Google Patents
One kind communication radiating shell Download PDFInfo
- Publication number
- CN107027259A CN107027259A CN201710220015.2A CN201710220015A CN107027259A CN 107027259 A CN107027259 A CN 107027259A CN 201710220015 A CN201710220015 A CN 201710220015A CN 107027259 A CN107027259 A CN 107027259A
- Authority
- CN
- China
- Prior art keywords
- heat conducting
- conducting pipe
- semi
- solid
- radiating shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/04—Metal casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
Abstract
Radiating shell is communicated this application discloses one kind, at least include aluminium base and heat conducting pipe, wherein, the structure that the heat conducting pipe is inlayed by semi-solid alloy material with suspending is embedded in the correspondence position of the aluminium base, IC component installation location of the correspondence position close to the communication radiating shell.The work calories of IC elements can be imported rapidly by aluminium base by the efficient heat transfer medium in heat conducting pipe and be shed by fin, so as to improve heat conduction efficiency.
Description
Technical field
The present invention relates to light-alloy die-casting production field, more particularly to a kind of radiating shell.
Background technology
With the raising of 4G/5G wireless communication base station signal electrical part integration degrees, shell pressur casting size increases therewith
Greatly, equipment becomes increasingly to weigh, cooling requirements also more and more higher.Domestic and overseas operators propose high heat conduction, light weight to wireless base station
Change, the clear and definite index request of low cost.Aluminum alloy die casting is wireless key base station structural material, is the electronics member of inside of base station
Device and circuit board, which are fixed, provides basis, is base station signal transmitting while electric elements work calories is exported by fin
The main parts size of casing radiating and cooling；Pass through heightened heat dissipation to improve in the volume radiating efficiency of base station housing, structure design
Piece, is thinned the measures such as fin, because of the limitation of diecasting aluminum-silicon alloy material thermal conductivity, to the radiating shell of same size, Dan Cong
The structural change of fin can not meet the high cooling requirements of base station enclosure, it is necessary to consider radiating shell other structures form to carry
The radiating efficiency of high radiating shell.
The content of the invention
The application provides a kind of communication radiating shell, can improve the radiating efficiency of radiating shell.
Radiating shell is communicated this application discloses one kind, at least including aluminium base and heat conducting pipe, wherein, the heat conducting pipe leads to
The correspondence position that the structure that semi-solid alloy material inlays to suspend is embedded in the aluminium base is crossed, the correspondence position is close to described
Communicate the IC component installation location of radiating shell.
Alternatively, in above-mentioned communication radiating shell, the shell of the heat conducting pipe uses stainless steel, the shell of heat conducting pipe
Interior sealing has high heat conduction medium.
Alternatively, the structure that the heat conducting pipe is inlayed by semi-solid alloy material with suspending is embedded in the aluminium base
Correspondence position includes：
The heat conducting pipe is suspended using semi-solid rheological extrusion process using default semisolid pressure casting mould and is embedded in
In the correspondence position of aluminium base, the semisolid pressure casting mould includes cover half, cover half support member, dynamic model and dynamic model support member.
Alternatively, the cover half support member and dynamic model support member are flake, using semi-solid alloy material, the semi-solid alloy
Material is identical with the material of the semi solid slurry of casting in semi-solid rheological extrusion process.
Alternatively, the semi-solid alloy material is semi-solid aluminium alloy.
Because technical scheme is using semi-solid rheological extrusion process processing heat conducting pipe and the edge of aluminium diecasting
Embedding structure, i.e., suspend heat conducting pipe and inlay into aluminium base so that heat conducting pipe gapless, unhinderedly whole are wrapped in aluminium base
In, so as to which the work calories of IC elements is imported rapidly into aluminium base and by dissipating by the efficient heat transfer medium in heat conducting pipe
Backing sheds, so as to improve heat conduction efficiency.
Brief description of the drawings
Fig. 1 is the cross-sectional view of communication radiating shell in the embodiment of the present application；
In figure, 1 is aluminium base, and 2 be installation base, and 3 be IC electronic components, and 4 be conducting resinl, and 5 be heat conducting pipe, and 6 be heat conduction
The stainless steel casing of pipe, 7 be the high heat conduction medium of heat conducting pipe interior sealing, and 8 be housing fins；
Fig. 2 is the structure for the semisolid pressure casting mould for being used for the aluminium base that die casting is embedded with heat conducting pipe in the embodiment of the present application
Schematic diagram；
Fig. 2 (a) is the structural representation before matched moulds；
Fig. 2 (b) is the structural representation after matched moulds；
Fig. 3 is the semisolid communication radiating shell casting schematic diagram of the fixed heat conducting pipe of suspension in the embodiment of the present application.
Embodiment
For the object, technical solutions and advantages of the present invention are more clearly understood, below in conjunction with accompanying drawing to skill of the present invention
Art scheme is described in further detail.It should be noted that in the case where not conflicting, in embodiments herein and embodiment
Feature can arbitrarily be mutually combined.
Embodiment 1
The present embodiment provides a kind of communication radiating shell, mainly includes heat conducting pipe and aluminium base, wherein, heat conducting pipe was utilized
The structure that semi-solid alloy material is inlayed according to suspending is embedded in the correspondence position of aluminium base, does not expose outside aluminium base, this pair
The IC component installation locations of radiating shell should be located proximate to.Alternatively, above-mentioned heat conducting pipe includes shell and internal heat-conducting medium.Its
In, the shell of heat conducting pipe, which can be used, has high intensity, the stainless steel material of high corrosion-resistant.Internal heat-conducting medium can then be used
High heat conduction medium, is sealed in above-mentioned stainless steel casing.
With reference to example, above-mentioned communication radiating shell is discussed in detail implements structure and its operation principle.
Fig. 1 show a kind of cross section for realizing structure that radiating shell is communicated in practical application, and it includes aluminium base
(1), heat conducting pipe (5) and housing fins (8), heat conducting pipe (5) are divided into stainless steel casing (6) and high heat conduction medium (7) again.Its
In, heat conducting pipe (5) is embedded near the installation base of aluminium base (1) (2) with the structure inlayed that suspends.Installation base (2) is
The position of IC electronic components (3) is installed, IC elements (3) are closely attached to the installation base (2) of housing aluminium base by conducting resinl (4)
On.
As seen from the above, in the communication radiating shell that the present embodiment is provided, the stainless steel casing (6) of heat conducting pipe and radiating
Housing aluminium base (1) is directly contacted, so, and the work calories of IC electronic components (3) can be transferred to by conducting resinl (4) installs convex
Platform (2), then the stainless steel casing (6) of heat conducting pipe (5) is transferred to again by the high heat conduction of heat conducting pipe interior sealing by housing aluminium base (1)
Housing fins (8) are given in the rapid heat conduction of medium (7), final radiating to external environment.
It is noted that heat conducting pipe suspends, why the correspondence position inlayed is close to IC component installation locations, be in order to
Heat conduction preferably is carried out to the work calorieses of IC elements, thus the specific scope of this correspondence position can be not particularly limited, only
Heat conducting pipe is conducive to quickly to transmit the work calories of IC elements.
Alternatively, in the present embodiment, the structure that heat conducting pipe is inlayed by semi-solid alloy material with suspending is embedded in aluminium base
In the correspondence position of plate, implementing for this structure can be by special installation position limiting structure, i.e., using semi-solid rheological pressure
Casting process realizes the suspension mosaic texture of heat conducting pipe and aluminium diecasting.
Realization is described below and realizes the communication radiating shell of heat conducting pipe suspension fixed (suspend and inlay) in aluminium base
Press casting procedure, comprises the following steps：
Step 1: the support member fixed designed for heat conducting pipe, support member includes cover half support member and dynamic model support member；
Step 2: the mounting structure position of design mould support member；
Step 3: preheating heat conducting pipe；
Step 4: heat conducting pipe is fixed on into matched moulds in cover half support member, dynamic model support member withstands heat conducting pipe；
Step 5: producing semi solid slurry；
Step 6: inlaying heat conducting pipe die casting with Semi-solid Process Die Casting, i.e., quickly cast, poured with semi solid slurry
After casting, cover half support member and dynamic model support member are melted with semi solid slurry to be cast as one, and realizes suspension edge of the heat conducting pipe in aluminium base
Embedding structure.
Wherein, to realize heat conducting pipe suspension structure in die casting substrate, reasonable mould is devised, as shown in Fig. 2 wherein
Including cover half, dynamic model and member structure：Support design is divided into cover half support member and dynamic model support member two parts again, and cover half support member is fixed
It is used to fix heat conducting pipe in mould, dynamic model support member is used to withstand heat conducting pipe dynamic model support member in dynamic model, and after mould, such as Fig. 2 (a) institutes
Show.2 cover half support members are arranged in cover half die cavity during die casting, then heat conducting pipe are caught in cover half support member, cover half support member screens
Gradient, so, heat conducting pipe can be fixed in cover half support member with interference, to avoid board shake during matched moulds from causing heat conducting pipe to come off
The problem of off normal；Dynamic model support member is on dynamic model, and dynamic model support member withstands heat conducting pipe after matched moulds.Cover half support member and dynamic model support member are in mould
Heat conducting pipe is tightly blocked in tool, impulsive force will not make heat conducting pipe move off normal when aluminium liquid quickly fills type, shown in such as Fig. 2 (b).
In addition, being combined closely to realize that heat conducting pipe and aluminium casting substrate suspend, stud recommends the shape that fries batter in a thin layer, and uses semisolid
Alloy material is processed, the semi-solid alloy material and the material phase of the semi solid slurry of casting in semi-solid rheological extrusion process
Together.So, laminar stud is melted in semi solid slurry cavity filling process, and stud just makes heat conducting pipe and aluminium base after dissolving
Without cut-off contact, stud position there will not be hole, and overall heat conducting pipe is not exposed, so as to reach the purpose that suspension is inlayed.
And semisolid pressure casting part is organized as granular crystal, alloy molecular gap is small, and tissue density is big, is conducive to electronic component
Heat derives.Semi solid slurry Die Casting, aluminium base density ＞ 2.7g/cm3 are used in the present embodiment, fin thickness is
1.0mm, the heat conduction efficiency of the communication radiating shell of fine and close microstructure of semisolid+thin-walled fin+pre-buried heat conducting pipe of part can
To improve 10-30%.
Carried out according to aforesaid operations after die casting, the suspension formed is inlaid with the semisolid communication radiating shell casting of heat conducting pipe
Part is as shown in Figure 3, it can be seen that heat conducting pipe is embedded in not exposed in aluminium casting substrate, and heat conducting pipe and aluminium base are combined closely, and are led
Stud without other materials around heat pipe, has accomplished that the suspension of heat conducting pipe is pre-buried.This suspension is inlaid with the communication radiating of heat conducting pipe
Shell product meets highly integrated IC devices work calories export and required, reach through center communication assembling test, heat conductivility
Expected purpose, 5G is highly integrated for communication, the design of Large Copacity architecture of base station part and 4G extending capacity reformation provide actual production
Experience foundation.
From above-described embodiment as can be seen that wishing high thermal conductivity factor during semisolid radiating shell use, but by
To the radiating shell alloy material normally produced and the limitation of technique, the thermal conductivity factor of the semi-solid alloy used only has
145w/mk, therefore, the application use the mode of pre-buried heat pipe to improve heat conduction efficiency in structure design, i.e., in radiation shell
The heat conducting pipe that high heat conduction leads medium is embedded with body, so as to so that housing localized thermal conductivity reaches 150-160w/mk, improve
Heat transfer efficiency.
One of ordinary skill in the art will appreciate that all or part of step in the above method can be instructed by program
Related hardware is completed, and described program can be stored in computer-readable recording medium, such as read-only storage, disk or CD
Deng.Alternatively, all or part of step of above-described embodiment can also use one or more integrated circuits to realize.Accordingly
Each module/unit in ground, above-described embodiment can be realized in the form of hardware, it would however also be possible to employ the shape of software function module
Formula is realized.The application is not restricted to the combination of the hardware and software of any particular form.
It is described above, it is only the preferred embodiments of the present invention, is not intended to limit the scope of the present invention.It is all this
Within the spirit and principle of invention, any modification, equivalent substitution and improvements done etc. should be included in the protection model of the present invention
Within enclosing.
Claims (5)
1. one kind communication radiating shell, at least including aluminium base and heat conducting pipe, wherein, the heat conducting pipe passes through semi-solid alloy material
The structure that matter is inlayed with suspending is embedded in the correspondence position of the aluminium base, and the correspondence position is close to the communication radiating shell
IC component installation location.
2. radiating shell is communicated as claimed in claim 1, it is characterised in that
The shell of the heat conducting pipe uses stainless steel, and the shell interior sealing of heat conducting pipe has high heat conduction medium.
3. radiating shell is communicated as claimed in claim 1 or 2, it is characterised in that the heat conducting pipe passes through semi-solid alloy material
The correspondence position that the structure that matter is inlayed with suspending is embedded in the aluminium base includes：
The heat conducting pipe is suspended using semi-solid rheological extrusion process using default semisolid pressure casting mould, and it is described to be embedded in
In the correspondence position of aluminium base, the semisolid pressure casting mould includes cover half, cover half support member, dynamic model and dynamic model support member.
4. radiating shell is communicated as claimed in claim 3, it is characterised in that
The cover half support member and dynamic model support member are flake, and using semi-solid alloy material, the semi-solid alloy material is solid with half
The material of the semi solid slurry of casting is identical in state rheo-diecasting technique.
The material of the semi solid slurry of casting is identical.
5. radiating shell is communicated as claimed in claim 4, it is characterised in that
The semi-solid alloy material is semi-solid aluminium alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710220015.2A CN107027259B (en) | 2017-04-06 | 2017-04-06 | A kind of communication radiating shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710220015.2A CN107027259B (en) | 2017-04-06 | 2017-04-06 | A kind of communication radiating shell |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107027259A true CN107027259A (en) | 2017-08-08 |
| CN107027259B CN107027259B (en) | 2018-11-27 |
Family
ID=59527734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710220015.2A Active CN107027259B (en) | 2017-04-06 | 2017-04-06 | A kind of communication radiating shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107027259B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019165961A1 (en) * | 2018-12-14 | 2019-09-06 | 珠海市润星泰电器有限公司 | Semi-solid die-cast heat dissipation casing |
| CN110708926A (en) * | 2019-09-06 | 2020-01-17 | 华为技术有限公司 | Preparation method of shell, shell and electronic equipment |
| US11752548B2 (en) | 2018-12-14 | 2023-09-12 | Zhuhai Runxingtai Electrical Co., Ltd | Die casting method for filtering cavity |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1536657A (en) * | 2003-04-04 | 2004-10-13 | 刘俊富 | Method for making thermal superconducting radiating module |
| US20070251676A1 (en) * | 2006-04-28 | 2007-11-01 | Foxconn Technology Co., Ltd. | Heat dissipation apparatus |
| CN205949825U (en) * | 2016-08-29 | 2017-02-15 | 肇庆高新区鸿胜模具制造有限公司 | Die casting die with a tub location is inlayed in die -casting |
-
2017
- 2017-04-06 CN CN201710220015.2A patent/CN107027259B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1536657A (en) * | 2003-04-04 | 2004-10-13 | 刘俊富 | Method for making thermal superconducting radiating module |
| US20070251676A1 (en) * | 2006-04-28 | 2007-11-01 | Foxconn Technology Co., Ltd. | Heat dissipation apparatus |
| CN205949825U (en) * | 2016-08-29 | 2017-02-15 | 肇庆高新区鸿胜模具制造有限公司 | Die casting die with a tub location is inlayed in die -casting |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019165961A1 (en) * | 2018-12-14 | 2019-09-06 | 珠海市润星泰电器有限公司 | Semi-solid die-cast heat dissipation casing |
| US11752548B2 (en) | 2018-12-14 | 2023-09-12 | Zhuhai Runxingtai Electrical Co., Ltd | Die casting method for filtering cavity |
| CN110708926A (en) * | 2019-09-06 | 2020-01-17 | 华为技术有限公司 | Preparation method of shell, shell and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107027259B (en) | 2018-11-27 |
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