CN107764425B - A kind of manufacturing method of ocean temperature and the integrated sheet type sensor chip of pressure - Google Patents
A kind of manufacturing method of ocean temperature and the integrated sheet type sensor chip of pressure Download PDFInfo
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- CN107764425B CN107764425B CN201710886471.0A CN201710886471A CN107764425B CN 107764425 B CN107764425 B CN 107764425B CN 201710886471 A CN201710886471 A CN 201710886471A CN 107764425 B CN107764425 B CN 107764425B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 238000005245 sintering Methods 0.000 claims abstract description 43
- 239000011521 glass Substances 0.000 claims abstract description 34
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 10
- 239000002184 metal Substances 0.000 claims abstract description 10
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 10
- 238000004140 cleaning Methods 0.000 claims abstract description 7
- 238000007650 screen-printing Methods 0.000 claims abstract description 7
- 239000000126 substance Substances 0.000 claims abstract description 7
- 238000009966 trimming Methods 0.000 claims abstract description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 94
- 239000000919 ceramic Substances 0.000 claims description 81
- 238000000034 method Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 7
- 238000012545 processing Methods 0.000 claims description 7
- 239000002002 slurry Substances 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 5
- 238000005553 drilling Methods 0.000 claims description 4
- 238000007639 printing Methods 0.000 claims description 3
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 claims description 2
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
- 239000013535 sea water Substances 0.000 abstract description 9
- 238000005259 measurement Methods 0.000 abstract description 7
- 230000009189 diving Effects 0.000 abstract description 3
- 230000010354 integration Effects 0.000 abstract 1
- 238000001514 detection method Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000011160 research Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- -1 distance changes Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000008447 perception Effects 0.000 description 1
- 230000001932 seasonal effect Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
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- Measuring Fluid Pressure (AREA)
Abstract
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Priority Applications (1)
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CN201710886471.0A CN107764425B (en) | 2017-11-17 | 2017-11-17 | A kind of manufacturing method of ocean temperature and the integrated sheet type sensor chip of pressure |
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CN201710886471.0A CN107764425B (en) | 2017-11-17 | 2017-11-17 | A kind of manufacturing method of ocean temperature and the integrated sheet type sensor chip of pressure |
Publications (2)
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CN107764425A CN107764425A (en) | 2018-03-06 |
CN107764425B true CN107764425B (en) | 2019-07-26 |
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CN201710886471.0A Active CN107764425B (en) | 2017-11-17 | 2017-11-17 | A kind of manufacturing method of ocean temperature and the integrated sheet type sensor chip of pressure |
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Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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RU2682080C1 (en) * | 2018-05-28 | 2019-03-14 | Федеральное государственное бюджетное научное учреждение "Институт природно-технических систем" (ИПТС) | Method for measuring temperature, pressure and density section in liquid |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4262532A (en) * | 1979-09-13 | 1981-04-21 | General Electric Company | Pressure and temperature sensor |
CN103177836A (en) * | 2013-03-16 | 2013-06-26 | 东莞市安培龙电子科技有限公司 | Thermistor manufactured by ceramic thin films and manufacturing method of thermistor |
CN103187677A (en) * | 2011-12-31 | 2013-07-03 | 辽宁省轻工科学研究院 | Manufacturing method for zinc oxide base multilayer pressure-sensitive planar array for filtering connector |
CN104198079A (en) * | 2014-07-30 | 2014-12-10 | 肇庆爱晟电子科技有限公司 | Quick response thermosensitive chip with high precision and reliability and manufacturing method thereof |
WO2014205395A1 (en) * | 2013-06-20 | 2014-12-24 | The Regents Of The University Of Michigan | Microdischarge-based transducer |
CN105439643A (en) * | 2015-11-16 | 2016-03-30 | 徐州中韵新材料科技有限公司 | Method for preparing copper/ceramic composite substrate on basis of low-melting-point glass powder |
CN105606247A (en) * | 2015-12-31 | 2016-05-25 | 广东爱晟电子科技有限公司 | High-temperature-resistant quick-response thermistor and temperature sensor including the same |
CN106233111A (en) * | 2014-04-23 | 2016-12-14 | 恩德莱斯和豪瑟尔两合公司 | There is the pressure transducer of ceramic platform |
CN107328440A (en) * | 2017-07-17 | 2017-11-07 | 中国电子科技集团公司第四十九研究所 | Deeply integrated sensor of thermohaline based on thick-film technique technology and preparation method thereof |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060018361A1 (en) * | 2004-07-23 | 2006-01-26 | Hardwicke Canan U | Sensor and method for making same |
KR101355397B1 (en) * | 2012-05-18 | 2014-01-28 | 가우스텍 주식회사 | Composition for sensor element, temperature sensor comprising the same and method for manufacturing thereof |
-
2017
- 2017-11-17 CN CN201710886471.0A patent/CN107764425B/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4262532A (en) * | 1979-09-13 | 1981-04-21 | General Electric Company | Pressure and temperature sensor |
CN103187677A (en) * | 2011-12-31 | 2013-07-03 | 辽宁省轻工科学研究院 | Manufacturing method for zinc oxide base multilayer pressure-sensitive planar array for filtering connector |
CN103177836A (en) * | 2013-03-16 | 2013-06-26 | 东莞市安培龙电子科技有限公司 | Thermistor manufactured by ceramic thin films and manufacturing method of thermistor |
WO2014205395A1 (en) * | 2013-06-20 | 2014-12-24 | The Regents Of The University Of Michigan | Microdischarge-based transducer |
CN106233111A (en) * | 2014-04-23 | 2016-12-14 | 恩德莱斯和豪瑟尔两合公司 | There is the pressure transducer of ceramic platform |
CN104198079A (en) * | 2014-07-30 | 2014-12-10 | 肇庆爱晟电子科技有限公司 | Quick response thermosensitive chip with high precision and reliability and manufacturing method thereof |
CN105439643A (en) * | 2015-11-16 | 2016-03-30 | 徐州中韵新材料科技有限公司 | Method for preparing copper/ceramic composite substrate on basis of low-melting-point glass powder |
CN105606247A (en) * | 2015-12-31 | 2016-05-25 | 广东爱晟电子科技有限公司 | High-temperature-resistant quick-response thermistor and temperature sensor including the same |
CN107328440A (en) * | 2017-07-17 | 2017-11-07 | 中国电子科技集团公司第四十九研究所 | Deeply integrated sensor of thermohaline based on thick-film technique technology and preparation method thereof |
Non-Patent Citations (2)
Title |
---|
A Flexible Bimodal Sensor Array for Simultaneous Sensing of Pressure and Temperature;Nguyen Thanh Tien 等;《Advanced Materials》;20140228(第26期);796–804 |
一种基于 MEMS 技术的冗余 Pt 温度传感器研究;姜国光 等;《传感器与微系统》;20120731;第31卷(第7期);23-25、29 |
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Address after: 150001 Nantong Avenue, Harbin, Harbin, Heilongjiang Applicant after: HARBIN ENGINEERING University Applicant after: SHANGHAI FLAGSHIP MARINE TECHNOLOGY CO.,LTD. Applicant after: HARBIN HANGSHI TECHNOLOGY DEVELOPMENT CO.,LTD. Applicant after: Beijing Aircraft Technology Development Co.,Ltd. Address before: 201306 No. 5 Lane 218, Haiji Sixth Road, Nanhui New Town, Pudong New Area, Shanghai Applicant before: SHANGHAI FLAGSHIP MARINE TECHNOLOGY CO.,LTD. Applicant before: HARBIN ENGINEERING University Applicant before: HARBIN HANGSHI TECHNOLOGY DEVELOPMENT CO.,LTD. Applicant before: Beijing Aircraft Technology Development Co.,Ltd. |
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Effective date of registration: 20220708 Address after: 150006 southwest of Nancheng Seventh Avenue and Nancheng Second Road, Hanan industrial new town, Harbin, Heilongjiang Province Patentee after: HARBIN JINGFANG ELECTRIC EQUIPMENT TECHNOLOGY CO.,LTD. Address before: 150001 Nantong Avenue, Harbin, Harbin, Heilongjiang Patentee before: HARBIN ENGINEERING University Patentee before: SHANGHAI FLAGSHIP MARINE TECHNOLOGY CO.,LTD. Patentee before: HARBIN HANGSHI TECHNOLOGY DEVELOPMENT CO.,LTD. Patentee before: Beijing Aircraft Technology Development Co.,Ltd. |
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Denomination of invention: A manufacturing method for integrated chip sensor chips for seawater temperature and pressure Effective date of registration: 20231019 Granted publication date: 20190726 Pledgee: Harbin Kechuang Financing Guarantee Co.,Ltd. Pledgor: HARBIN JINGFANG ELECTRIC EQUIPMENT TECHNOLOGY CO.,LTD. Registration number: Y2023230000088 |