CN107764425B - A kind of manufacturing method of ocean temperature and the integrated sheet type sensor chip of pressure - Google Patents
A kind of manufacturing method of ocean temperature and the integrated sheet type sensor chip of pressure Download PDFInfo
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- CN107764425B CN107764425B CN201710886471.0A CN201710886471A CN107764425B CN 107764425 B CN107764425 B CN 107764425B CN 201710886471 A CN201710886471 A CN 201710886471A CN 107764425 B CN107764425 B CN 107764425B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 238000005245 sintering Methods 0.000 claims abstract description 43
- 239000011521 glass Substances 0.000 claims abstract description 34
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 10
- 239000002184 metal Substances 0.000 claims abstract description 10
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 10
- 238000004140 cleaning Methods 0.000 claims abstract description 7
- 238000007650 screen-printing Methods 0.000 claims abstract description 7
- 239000000126 substance Substances 0.000 claims abstract description 7
- 238000009966 trimming Methods 0.000 claims abstract description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 94
- 239000000919 ceramic Substances 0.000 claims description 81
- 238000000034 method Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 7
- 238000012545 processing Methods 0.000 claims description 7
- 239000002002 slurry Substances 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 5
- 238000005553 drilling Methods 0.000 claims description 4
- 238000007639 printing Methods 0.000 claims description 3
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 claims description 2
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
- 239000013535 sea water Substances 0.000 abstract description 9
- 238000005259 measurement Methods 0.000 abstract description 7
- 230000009189 diving Effects 0.000 abstract description 3
- 230000010354 integration Effects 0.000 abstract 1
- 238000001514 detection method Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000011160 research Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- -1 distance changes Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000008447 perception Effects 0.000 description 1
- 230000001932 seasonal effect Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Abstract
The manufacturing method of a kind of ocean temperature and the integrated sheet type sensor chip of pressure, comprising the following steps: a, chemical cleaning；B, laser boring；C, silk-screen printing figure；D, it dries；E, printed glass sintering feed；F, once sintered；G, double sintering；H, laser resistor trimming；I, it is sintered three times；J, platinum lead is spoted weld on the metal lead wire column of electronic detecting device, produces the sensor for being able to detect ocean temperature and pressure；Inventive sensor chip structure is compact, miniature portable, sensitive accurate, together by temperature and pressure sensor integration, can measure two parameters simultaneously and reduce production cost, and diving speed is fast in the seawater, and measurement efficiency is high.
Description
Technical field:
The present invention relates to technical field of sensor manufacture, and in particular to a kind of ocean temperature and the integrated chip sensing of pressure
The manufacturing method of device chip.
Background technique:
Ocean temperature, pressure are two important parameters of the basic hydrographic information in ocean, in marine resources development use aspects,
For the accurate perception of the two parameters for accelerating Ocean Development Technology research, promote China's ocean development cause is developed to pass weight
It wants；In terms of science and techniques of defence, the acquisition of the data such as ocean temperature, pressure, with naval vessel, the voyage conditions of submarine, tactics
On attack defending ability etc. it is closely related.
In addition, the measurement of ocean temperature and pressure is to research oceanography, marine environmental monitoring, seasonal climate prediction and sea
Foreign fishery etc. has highly important Practical significance, is technical indicator indispensable in marine hydrometeorology observation and investigation；
However, now domestic temperature, the generally existing volume of pressure sensor is big, topology layout is unreasonable, from it is great the problems such as, to survey
The accuracy of amount result has certain influence, and high production cost, and ocean temperature, chip type, integrates the micromation of pressure sensor
It is still at an early stage to change development, mass large-scale production still has some problems, is not able to satisfy each application field still
Demand.
Summary of the invention:
Invention overcomes above-mentioned the deficiencies in the prior art, provides a kind of ocean temperature and the integrated piece of pressure
The manufacturing method of formula sensor chip；Sensor chip in the present invention is compact-sized, miniature portable, sensitive accurate, by temperature
It is integrated with pressure sensor, two parameters can be measured simultaneously and reduces production cost, diving speed is fast in the seawater, surveys
Amount efficiency is high.
Technical solution of the present invention:
The manufacturing method of a kind of ocean temperature and the manufacturing method of the integrated sheet type sensor chip of pressure, including following step
It is rapid:
A, chemical cleaning: pressure ceramic substrate, temperature ceramic substrate, glass ring and substrate ceramic substrate are changed simultaneously
Learn cleaning；
B, laser boring: using laser drilling, made a call on pressure ceramic substrate and temperature ceramic substrate respectively two groups it is micro-
Fairlead；
C, silk-screen printing figure: using thick film screen typography, and sense is printed on a surface of pressure ceramic substrate
Press electrode pattern；The printing thermal resistance pattern on a surface of temperature ceramic substrate；
D, dry: with baking oven to after silk-screen printing figure pressure ceramic substrate and temperature ceramic substrate dry；
E, it printed glass sintering feed: after drying, is burnt in pressure-sensitive electrode pattern periphery with thick-film technique printed circle ring glass
Ramming material；
F, once sintered: by glass ring cowling on the pressure ceramic substrate for being printed with glass sintering material, pushed down with metal block,
It is put into sintering furnace and is sintered；
G, double sintering: four groups of leads are stained with platinum electrocondution slurry, are respectively put into pressure ceramic substrate and temperature ceramic
In micro- fairlead of processing on substrate, make exit of the platinum electrocondution slurry respectively with pressure-sensitive electrode pattern and thermistor figure
Bonding, then puts into a sintering furnace sintering；
H, laser resistor trimming: after the sintering of temperature ceramic substrate, by laser resistance adjuster to the resistance in thermistor figure
Carry out laser resistor trimming；
I, it is sintered three times: it is Nian Jie with glass ring on one side in substrate ceramic piece two sides all printed circle ring glass sintering feeds, one
Face is Nian Jie with the temperature ceramic substrate of thermistor figure is printed on, and is pushed down with metal block, is put into sintering furnace and is sintered；
J, platinum lead is spoted weld on the metal lead wire column of electronic detecting device, produce be able to detect ocean temperature and
The sensor of pressure.
Further, the pressure ceramic substrate, glass ring, substrate ceramic substrate and the temperature ceramic substrate successively glue
It connects and concentric setting.
Further, the pressure ceramic substrate, temperature ceramic substrate and the substrate ceramic substrate selected in the step a
With a thickness of 0.25~2mm, the glass ring with a thickness of 0.2mm.
Further, the diameter of micro- fairlead is 0.1~0.15mm in the step b.
Further, the drying temperature in the step d is 200~300 DEG C.
Further, in the step e circular ring shape glass sintering material with a thickness of 5~15um.
Further, the sintering temperature in the step f is 300~400 DEG C.
Further, the sintering temperature in the step g is 300~400 DEG C.
Further, the sintering temperature in the step i is 400~500 DEG C
The beneficial effects of the present invention are:
The present invention carries out chemical cleaning to each ceramic substrate first, can guarantee the ceramic substrate basic as chip
The cleannes of itself can reach the requirement as sensor chip, and punched, guaranteed as lead by laser drilling
The accuracy of the diameter of the size in hole；
Pressure ceramic substrate of the present invention is printed on pressure-sensitive electrode on one side, and temperature ceramic substrate is printed on thermistor figure on one side
Shape；Across glass ring between pressure ceramic substrate and substrate ceramic piece；Pressure-sensitive cavity is formed, when there is pressure effect, electrode draws
Line leads to the outside that overpenetrated miniature fairlead picks out potsherd；For sensitive seawater pressure potsherd, glass ring, substrate pottery
Tile, temperature ceramic substrate is concentric bonds together, while guaranteeing the stabilization of sensor chip portion, optimal settings core
The configuration design of piece part guarantees the compact of sensor, and dive is flexible, easy to carry；
Encapsulation of the invention uses glass paste sintering process, while guaranteeing that encapsulation is stablized, detects temperature and pressure
It integrates, while measuring two parameters, it is efficiently convenient, it is very suitable to in-site measurement, and simplify procedure of processing, shortened
The process-cycle of sensor；
Temperature and pressure is detected and is integrated by the present invention, while while two parameters of detection, enormously simplifying procedure of processing
With the volume of sensor chip, the structure of chip can guarantee that sensor diving speed in the seawater, measurement efficiency greatly improve.
Detailed description of the invention:
Fig. 1 is work flow diagram of the invention；
Fig. 2 is the structural schematic diagram for the sheet type sensor chip that ocean temperature and pressure integrate in the present invention；
Fig. 3 is the structural schematic diagram of pressure ceramic substrate in the present invention；
Fig. 4 is the structural schematic diagram of temperature ceramic substrate in the present invention；
Fig. 5 is the whole explosive view for the sheet type sensor chip that ocean temperature and pressure integrate in the present invention；
In figure: 1- pressure ceramic substrate；2- temperature ceramic substrate；3- glass ring；4- substrate ceramic substrate；5- pressure-sensitive electrode
Figure；6- thermistor figure.
Specific embodiment:
Below with reference to attached drawing, the present invention is described in detail.
In conjunction with shown in Fig. 1 to Fig. 5, the integrated sheet type sensor chip of a kind of ocean temperature and pressure disclosed in the present embodiment
Manufacturing method manufacturing method, comprising the following steps:
A, chemical cleaning: to pressure ceramic substrate 1, temperature ceramic substrate 2, glass ring and 3 substrate ceramic substrates 4 simultaneously into
Row chemical cleaning, the pressure ceramic substrate, temperature ceramic substrate and substrate ceramic substrate with a thickness of 0.25~2mm, it is described
Glass ring with a thickness of 0.2mm；
B, laser boring: using laser drilling, made a call on pressure ceramic substrate and temperature ceramic substrate respectively two groups it is micro-
Fairlead, the diameter of micro- fairlead are 0.1~0.15mm；
C, silk-screen printing figure: using thick film screen typography, and sense is printed on a surface of pressure ceramic substrate
Press electrode pattern 5；The printing thermal resistance pattern 6 on a surface of temperature ceramic substrate；
D, dry: with baking oven to after silk-screen printing figure pressure ceramic substrate and temperature ceramic substrate dry, dry
Dry temperature is 200~300 DEG C；
E, printed glass sintering feed: being 5~15um in pressure-sensitive electrode pattern periphery thick-film technique print thickness after drying
Circular ring shape glass sintering material；
F, once sintered: by glass ring cowling on the pressure ceramic substrate for being printed with glass sintering material, pushed down with metal block,
It is put into sintering furnace and is sintered, sintering temperature is 300~400 DEG C；
G, double sintering: four groups of leads are stained with platinum electrocondution slurry, are respectively put into pressure ceramic substrate and temperature ceramic
In micro- fairlead of processing on substrate, make exit of the platinum electrocondution slurry respectively with pressure-sensitive electrode pattern and thermistor figure
Bonding, then puts into a sintering furnace sintering, and sintering temperature is 300~400 DEG C；
H, laser resistor trimming: after the sintering of temperature ceramic substrate, by laser resistance adjuster to the resistance in thermistor figure
Carry out laser resistor trimming；
I, it is sintered three times: it is Nian Jie with glass ring on one side in substrate ceramic piece two sides all printed circle ring glass sintering feeds, one
Face is Nian Jie with the temperature ceramic substrate of thermistor figure is printed on, and is pushed down with metal block, is put into sintering furnace and is sintered, sintering temperature
It is 400~500 DEG C；
J, platinum lead is spoted weld on the metal lead wire column of electronic detecting device, produce be able to detect ocean temperature and
The sensor of pressure.
Specifically, the pressure ceramic substrate, glass ring, substrate ceramic substrate and the temperature ceramic substrate are successively bonded
And concentric setting.
Specifically, wherein pressure-sensitive electrode pattern is a kind of functional electrode, it is printed on pressure ceramic substrate by thick-film technique,
For experiencing the capacitance variation signal that pressure change generates in seawater；Thermistor figure is to be printed on ceramics by thick-film technique
Thermistor element on substrate produces in pressure-sensitive electrode pattern for experiencing the electric signal generated that changes of the temperature in seawater
Signal is passed to detection circuit by lead by raw electric signal.
Specifically, the working principle based on thermistor figure, when ambient temperature variation, the resistance value of thermistor figure
It will change, through the signal detection processing circuit in lead-out wire access Subsequent electronic measuring device, pass through research and temperature
The physical quantity of phase sensitive come realize ocean temperature detect.
Specifically, the working principle based on pressure-sensitive electrode pattern, deforms when metallic membrane, which is under pressure, to be acted on, with
The increase diaphragm of pressure be gradually reduced at a distance from substrate, distance changes, and capacitor will change；It is connect through electrode outlet line
Enter the signal detection processing circuit in Subsequent electronic measuring device, realizes seawater by studying with the physical quantity of pressure phase sensitive
Pressure detecting.
Specifically, the pressure ceramic substrate, the temperature ceramic substrate and the substrate ceramic substrate are disc
Ceramic substrate and size is identical；The vertical sea level assembly of slice structure pressure sensor, can guarantee that sensor is fast in the seawater
Fast dive measurement and Rapid lifting measurement, solve and detect quick dive existing for sea water advanced pressure sensor at present and mention
The additional force generated during drawing influences, and substantially increases marine information measurement efficiency.
Above embodiments are exemplary description of this patent, do not limit its protection scope, those skilled in the art
Member can also be changed its part, as long as it does not exceed the essence of this patent, within the protection scope of the present patent.
Claims (9)
1. a kind of manufacturing method for the sheet type sensor chip that ocean temperature and pressure integrate, it is characterised in that: including following step
It is rapid:
A, chemical cleaning: pressure ceramic substrate, temperature ceramic substrate, glass ring and substrate ceramic substrate are carried out simultaneously chemical clear
It washes；
B, laser boring: laser drilling is used, plays two groups of micro- leads respectively on pressure ceramic substrate and temperature ceramic substrate
Hole；
C, silk-screen printing figure: using thick film screen typography, and pressure-sensitive electricity is printed on a surface of pressure ceramic substrate
Pole figure shape；The printing thermal resistance pattern on a surface of temperature ceramic substrate；
D, dry: with baking oven to after silk-screen printing figure pressure ceramic substrate and temperature ceramic substrate dry；
E, printed glass sintering feed: after drying, in pressure-sensitive electrode pattern periphery thick-film technique printed circle ring glass sintering feed；
F, once sintered: by glass ring cowling on the pressure ceramic substrate for being printed with glass sintering material, to be pushed down, be put into metal block
It is sintered in sintering furnace；
G, double sintering: four groups of leads are stained with platinum electrocondution slurry, are respectively put into pressure ceramic substrate and temperature ceramic substrate
On processing micro- fairlead in, keep platinum electrocondution slurry viscous with the exit of pressure-sensitive electrode pattern and thermistor figure respectively
It connects, then puts into a sintering furnace sintering；
H, laser resistor trimming: after the sintering of temperature ceramic substrate, the resistance in thermistor figure is carried out by laser resistance adjuster
Laser resistor trimming；
I, three times be sintered: it is Nian Jie with glass ring on one side in substrate ceramic piece two sides all printed circle ring glass sintering feeds, on one side with
It is printed on the temperature ceramic substrate bonding of thermistor figure, is pushed down with metal block, is put into sintering furnace and is sintered；
J, platinum lead is spoted weld on the metal lead wire column of electronic detecting device, produces and is able to detect ocean temperature and pressure
Sensor.
2. the manufacturing method for the sheet type sensor chip that a kind of ocean temperature according to claim 1 and pressure integrate,
Be characterized in that: the pressure ceramic substrate, glass ring, substrate ceramic substrate and the temperature ceramic substrate are successively bonded and coaxial
Heart setting.
3. the manufacturing method for the sheet type sensor chip that a kind of ocean temperature according to claim 1 and pressure integrate,
Be characterized in that: the pressure ceramic substrate, temperature ceramic substrate and the substrate ceramic substrate selected in the step a with a thickness of
0.25~2mm, the glass ring with a thickness of 0.2mm.
4. the manufacturing method for the sheet type sensor chip that a kind of ocean temperature according to claim 1 and pressure integrate,
Be characterized in that: the diameter of micro- fairlead is 0.1~0.15mm in the step b.
5. the manufacturing method for the sheet type sensor chip that a kind of ocean temperature according to claim 1 and pressure integrate,
Be characterized in that: the drying temperature in the step d is 200~300 DEG C.
6. the manufacturing method for the sheet type sensor chip that a kind of ocean temperature according to claim 1 and pressure integrate,
It is characterized in that: circular ring shape glass sintering material with a thickness of 5~15um in the step e.
7. the manufacturing method for the sheet type sensor chip that a kind of ocean temperature according to claim 1 and pressure integrate,
Be characterized in that: the sintering temperature in the step f is 300~400 DEG C.
8. the manufacturing method for the sheet type sensor chip that a kind of ocean temperature according to claim 1 and pressure integrate,
Be characterized in that: the sintering temperature in the step g is 300~400 DEG C.
9. the manufacturing method for the sheet type sensor chip that a kind of ocean temperature according to claim 1 and pressure integrate,
Be characterized in that: the sintering temperature in the step i is 400~500 DEG C.
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| CN201710886471.0A CN107764425B (en) | 2017-11-17 | 2017-11-17 | A kind of manufacturing method of ocean temperature and the integrated sheet type sensor chip of pressure |
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| RU2682080C1 (en) * | 2018-05-28 | 2019-03-14 | Федеральное государственное бюджетное научное учреждение "Институт природно-технических систем" (ИПТС) | Method for measuring temperature, pressure and density section in liquid |
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Address after: 150001 Nantong Avenue, Harbin, Harbin, Heilongjiang Applicant after: HARBIN ENGINEERING University Applicant after: SHANGHAI FLAGSHIP MARINE TECHNOLOGY CO.,LTD. Applicant after: HARBIN HANGSHI TECHNOLOGY DEVELOPMENT CO.,LTD. Applicant after: Beijing Aircraft Technology Development Co.,Ltd. Address before: 201306 No. 5 Lane 218, Haiji Sixth Road, Nanhui New Town, Pudong New Area, Shanghai Applicant before: SHANGHAI FLAGSHIP MARINE TECHNOLOGY CO.,LTD. Applicant before: HARBIN ENGINEERING University Applicant before: HARBIN HANGSHI TECHNOLOGY DEVELOPMENT CO.,LTD. Applicant before: Beijing Aircraft Technology Development Co.,Ltd. |
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Effective date of registration: 20220708 Address after: 150006 southwest of Nancheng Seventh Avenue and Nancheng Second Road, Hanan industrial new town, Harbin, Heilongjiang Province Patentee after: HARBIN JINGFANG ELECTRIC EQUIPMENT TECHNOLOGY CO.,LTD. Address before: 150001 Nantong Avenue, Harbin, Harbin, Heilongjiang Patentee before: HARBIN ENGINEERING University Patentee before: SHANGHAI FLAGSHIP MARINE TECHNOLOGY CO.,LTD. Patentee before: HARBIN HANGSHI TECHNOLOGY DEVELOPMENT CO.,LTD. Patentee before: Beijing Aircraft Technology Development Co.,Ltd. |
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Denomination of invention: A manufacturing method for integrated chip sensor chips for seawater temperature and pressure Effective date of registration: 20231019 Granted publication date: 20190726 Pledgee: Harbin Kechuang Financing Guarantee Co.,Ltd. Pledgor: HARBIN JINGFANG ELECTRIC EQUIPMENT TECHNOLOGY CO.,LTD. Registration number: Y2023230000088 |