CN107677312B - A kind of chip seawater conductivity-temperature-depth system - Google Patents
A kind of chip seawater conductivity-temperature-depth system Download PDFInfo
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- CN107677312B CN107677312B CN201710881275.4A CN201710881275A CN107677312B CN 107677312 B CN107677312 B CN 107677312B CN 201710881275 A CN201710881275 A CN 201710881275A CN 107677312 B CN107677312 B CN 107677312B
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- 239000013535 sea water Substances 0.000 title claims abstract description 29
- 238000002955 isolation Methods 0.000 claims abstract description 16
- 239000002184 metal Substances 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 16
- 238000009413 insulation Methods 0.000 claims description 13
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000012528 membrane Substances 0.000 claims description 3
- 238000011161 development Methods 0.000 abstract description 8
- 230000009189 diving Effects 0.000 abstract description 4
- 238000001514 detection method Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 238000013461 design Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005259 measurement Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000010923 batch production Methods 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000003750 conditioning effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000009966 trimming Methods 0.000 description 2
- -1 and distance changes Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008447 perception Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C13/00—Surveying specially adapted to open water, e.g. sea, lake, river or canal
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Hydrology & Water Resources (AREA)
- Engineering & Computer Science (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Testing Or Calibration Of Command Recording Devices (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
A kind of chip seawater conductivity-temperature-depth system, belongs to sensor technical field.A kind of chip seawater conductivity-temperature-depth system, including chip temperature, pressure, conductivity sensor, electrical isolation cage supporter and the electronic measuring device being attached thereto, the chip temperature, pressure, conductivity sensor are placed in inside the electrical isolation cage supporter, the cage supporter has four horizontal stripe brackets, for fix three sheet type sensors and connection electronic measuring device, keep seawater unimpeded flow through sensor.The reliable detection of ocean temperature, salinity, depth may be implemented in the present invention, and compact-sized, miniature portable, operating mode multiplicity, diving speed is fast in the seawater, is suitable for the application fields such as ocean engineering, marine settings, ocean development.
Description
Technical field
The present invention relates to a kind of seawater conductivity-temperature-depth systems, and in particular to a kind of chip seawater conductivity-temperature-depth system belongs to sensor skill
Art field.
Background technique
Ocean temperature, salinity, depth are three important parameters of the basic hydrographic information in ocean, are utilized in marine resources development
Aspect, the accurate perception of these parameters promote being developed to for China's ocean development cause for accelerating Ocean Development Technology research
It closes important；In terms of science and techniques of defence, the acquisition of seawater thermohaline depth data, in naval vessel, the voyage conditions of submarine, tactics
Attack defending ability etc. it is closely related.Currently, due to seawater conductivity-temperature-depth system can easily and fast, accurate must obtain seawater
Temperature, salinity, the information of depth become a big hot spot of research.However, the present generally existing volume of thermohaline deep investigation instrument
Greatly, sensor structure layout it is unreasonable, from the problems such as great, diving speed is slow, have certain influence to the accuracy of measurement result,
And high production cost, micromation, the chip type development of conductivity-temperature-depth system are still at an early stage, and mass large-scale production is still deposited
In some problems, it is not able to satisfy the demand of each application field still.
Summary of the invention
It has been given below about brief overview of the invention, in order to provide about the basic of certain aspects of the invention
Understand.It should be appreciated that this summary is not an exhaustive overview of the invention.It is not intended to determine pass of the invention
Key or pith, nor is it intended to limit the scope of the present invention.Its purpose only provides certain concepts in simplified form,
Taking this as a prelude to a more detailed description discussed later.
In consideration of it, manufacturing cumbersome, performance the purpose of the present invention is to solve traditional seawater conductivity-temperature-depth system structural volume is big
Difference, diving speed is slow, at high cost problem, a kind of chip seawater conductivity-temperature-depth system provided, with compact-sized, it is small-sized just
The advantages of taking, sensitive accurate, measurement efficiency height, can reduce production cost.
The present invention provides a kind of chip seawater conductivity-temperature-depth systems, including chip temperature sensor, chip pressure sensor, piece
Formula conductivity sensor, electrical isolation cage supporter and electronic measuring device；Electronic measuring device is placed in electrical isolation cage support
On body；The chip temperature sensor, chip pressure sensor and chip conductivity sensor are disposed in parallel in electrical isolation cage
In supporter；The chip temperature sensor, chip pressure sensor and chip conductivity sensor by electrode outlet line with
Electronic measuring device connection.
Further: the chip conductivity sensor include round insulation substrate and be formed on thereon for detecting conductance
The metal electrode figure of rate；Chip temperature sensor include round insulation substrate and be formed on thereon for detecting the metal of temperature
Thermistor figure；Chip pressure sensor include round insulation substrate and be formed on thereon for detecting the metallic membrane of pressure
Figure.It is suitable for such as thick film or film process or the manufacture of similar method.Since these methods can perform well in
Batch production, therefore must can effectively reduce production cost.
Further: the round insulation substrate is ceramic substrate.
Further: the electrical isolation cage supporter includes two end plates and four horizontal stripe brackets, two end plates it is outer
It encloses and is used as support to link together by four horizontal stripe brackets.
Further: in four horizontal stripe brackets, the definition that is located above is the first horizontal stripe bracket, underlying fixed
It is third horizontal stripe bracket and the 4th horizontal stripe bracket that justice, which is the second horizontal stripe bracket, the definition positioned at middle part, the second horizontal stripe bracket,
Third horizontal stripe bracket and the 4th horizontal stripe support width are equal, and the width of the first horizontal stripe bracket is greater than the width of the second horizontal stripe bracket.
Further: the electronic measuring device is fixed on the first horizontal stripe bracket, is equipped with hole on the first horizontal stripe bracket, electricity
Pole lead-out wire passes through hole and connect with electronic measuring device.
Further: the chip conductivity sensor, chip temperature sensor and chip pressure sensor are being electrically insulated
Concentric, spaced set in cage supporter.
The utility model has the advantages that
Thermohaline depth sensor of the invention uses chip type structure, has abandoned previous lengthy and jumbled complicated, mechanical bulky structure
Form, conductivity-temperature-depth system provided by the invention is compact and flexible, compact-sized, miniature portable, and diving speed is fast in the seawater, measurement effect
Rate is high, and can substantially reduce production cost, realizes batch production.
Seawater conductivity-temperature-depth system provided by the invention use cage framework, sheet type sensor can be played fixed function and
Seawater can be allowed so unblocked that pass through, it can be ensured that detect validity, the real-time of environment.
Thermohaline depth sensor of the invention can be immediately placed in seabed or pull out sea, due to of the invention in motion process
Small in size, sensor uses slice structure, avoids seawater and generates positive/negative-pressure to sheet type sensor, influences the accurate of measurement result
Property.
The present invention is suitable for the application fields such as ocean engineering, marine settings, ocean development.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of seawater conductivity-temperature-depth system described in the embodiment of the present invention；
Fig. 2 is the exemplary diagram of chip temperature sensor embodiment 1 of the invention；
Fig. 3 is the exemplary diagram of chip conductivity sensor embodiment 1 of the invention；
Fig. 4 is the exemplary diagram of chip pressure sensor embodiment 1 of the invention；
Fig. 5 is rectangular-ambulatory-plane metal thermo-sensitive resistance pattern schematic diagram of the invention；
Fig. 6 is double snakelike metal thermo-sensitive resistance pattern schematic diagrames of the invention；
Fig. 7 is the structural block diagram of electronic measuring device of the invention.
In figure: electrical isolation cage supporter 2；Electronic measuring device 3；Electrode outlet line 4；First horizontal stripe bracket 5；Third is horizontal
Bracket 6；4th horizontal stripe bracket 7；Second horizontal stripe bracket 8；Chip conductivity sensor 9；Chip temperature sensor 10；Chip pressure
Force snesor 11.
Specific embodiment
Exemplary embodiment of the invention is described hereinafter in connection with attached drawing.For clarity and conciseness,
All features of actual implementation mode are not described in the description.It should be understood, however, that developing any this actual implementation
Much decisions specific to embodiment must be made during example, to realize the objectives of developer, for example, symbol
Restrictive condition those of related to system and business is closed, and these restrictive conditions may have with the difference of embodiment
Changed.In addition, it will also be appreciated that although development is likely to be extremely complex and time-consuming, to having benefited from the present invention
For those skilled in the art of disclosure, this development is only routine task.
Here, and also it should be noted is that, in order to avoid having obscured the present invention because of unnecessary details, in the accompanying drawings
Illustrate only with closely related apparatus structure and/or processing step according to the solution of the present invention, and be omitted and the present invention
The little other details of relationship.
Embodiment 1: a kind of chip seawater conductivity-temperature-depth system, including chip temperature sensor 10, chip pressure sensor 11, piece
Formula conductivity sensor 9, electrical isolation cage supporter 2 and electronic measuring device 3；Electronic measuring device 3 is placed in electrical isolation cage
On supporter 2；The chip temperature sensor 10, chip pressure sensor 11 and chip conductivity sensor 9 are disposed in parallel in
It is electrically insulated in cage supporter 2；The chip temperature sensor 10, chip pressure sensor 11 and chip conductivity sensor 9
It is connect by electrode outlet line 4 with electronic measuring device 3.Referring to Fig. 1.
More specifically: the chip conductivity sensor 9 include round insulation substrate and be formed on thereon for detecting electricity
The metal electrode figure of conductance；Chip temperature sensor 10 include round insulation substrate and be formed on thereon for detecting temperature
Metal thermo-sensitive resistance pattern；Chip pressure sensor 11 include round insulation substrate and be formed on thereon for detecting the gold of pressure
Belong to diaphragm figure.The round insulation substrate is ceramic substrate.- Fig. 4 referring to fig. 2.
It is snakelike metal thermo-sensitive resistance pattern, both ends connection electrode lead-out wire 4 in Fig. 2.
It is four electrode metal electrode patterns in Fig. 3, four electrodes are separately connected electrode outlet line, and four electrodes are from left to right successively
It is defined as first electrode 9-1, second electrode 9-2, third electrode 9-3 and the 4th electrode 9-4, wherein second electrode and third electrode
For voltage electrode, first electrode and the 4th electrode are galvanic electrode, why are designed to four electrodes, are because can make electricity in this way
Piezoelectricity pole and galvanic electrode separate, and it is serious to avoid electrode polarization caused by electrode is shared as two electrode conductivity detection methods
Bad phenomenon, electrode spacing is 3mm in figure, and electrode width is 1mm, improve electric conductivity to increase conductive area,
The width of the galvanic electrode electrode of excitation (apply) can suitably be increased, the width design of first electrode and the 4th electrode is at 4mm
It is also a kind of improved design.
Fig. 4 is chip pressure sensor exemplary diagram, and middle part is circular metal pressure-sensitive electrode 11-1, periphery setting protection ring
11-2, circular metal pressure-sensitive electrode 11-1 and protection ring 11-2 are separately connected electrode outlet line；Protection ring has been to eliminate round gold
Belong to what the 11-1 edge effect of pressure-sensitive electrode acted on, protection ring encirclement circular metal pressure-sensitive electrode 11-1, the two equipotential, and with
It is without electrical connection.In addition being blocked on protection ring for the non-homogeneous field strength of the electrode periphery occurred in practice after protection ring
Periphery.Pole plate is smaller at a distance from protection ring, and barriering effect is better, and unilateral distance can be 0.25mm.
More specifically: the electrical isolation cage supporter 2 includes two end plates and four horizontal stripe brackets, two end plates it is outer
It encloses and is used as support to link together by four horizontal stripe brackets.In four horizontal stripe brackets, the definition being located above is first
Horizontal stripe bracket 5, it is underlying be defined as the second horizontal stripe bracket 8, positioned at the definition at middle part be that third horizontal stripe bracket 6 and the 4th are horizontal
Bracket 7, the second horizontal stripe bracket 8, third horizontal stripe bracket 6 and 7 width of the 4th horizontal stripe bracket are equal, the first horizontal stripe bracket 5
Width be greater than the second horizontal stripe bracket 8 width.The electronic measuring device 3 is fixed on the first horizontal stripe bracket 5, the first horizontal stripe
Hole is equipped on bracket 5, electrode outlet line 4 passes through hole and connect with electronic measuring device 3.The chip conductivity sensor 9, chip
Temperature sensor 10 and chip the pressure sensor 11 concentric, spaced set in electrical isolation cage supporter 2.
Chip conductivity-temperature-depth system detects ocean temperature, salinity, the working principle of depth:
Based on the working principle of metal thermo-sensitive resistance, when ambient temperature variation, metal thermo-sensitive resistance will occur
Variation is realized through the operating circuit in lead-out wire access electronic measuring device by studying the physical quantity with temperature phase sensitive
Ocean temperature detection.
Working principle based on capacitance pressure transducer, deforms when metallic membrane, which is under pressure, to be acted on, with
The increase diaphragm of pressure is gradually reduced at a distance from substrate, and distance changes, and capacitor will change.It is accessed through electrode outlet line
Operating circuit in electronic measuring device can be studied further sea water advanced by the physical quantity of measurement and pressure phase sensitive
Variation.
Based on four electrode conductivity testing principles, apply exchange source forcing at galvanic electrode both ends, sea water conductivity changes
When, the output voltage at voltage electrode both ends changes correspondingly, and four electrodes of conductivity sensor equally access electronics through lead-out wire
Operating circuit in measuring device, by measuring and the physical quantity of conductivity phase sensitive and can with the physical quantity of temperature phase sensitive
To study the variation of salinity.
Embodiment 2: being with the difference of embodiment 1, the metal thermo-sensitive for being used to detect temperature of chip temperature sensor 10
Resistance pattern is different, can design diversified figure, figure as shown in Figure 5 and Figure 6, and Fig. 5 is rectangular-ambulatory-plane metal thermo-sensitive
Resistance pattern, Fig. 6 are double snakelike metal thermo-sensitive resistance patterns.All effective the length-width ratio for increasing thick-film resistor of these designs,
Save space.Laser trimming is that the mature and effective method of accurate adjustment, the thick film of design are carried out to thick-film resistor precision
Resistance will be such that resistance precision further increases after printing and being sintered by laser resistor trimming, and the graphic designs of the present embodiment increase
While length-width ratio, fine tuning coefficient is improved, increases laser continuous fine adjustment range.Round insulation substrate diameter is 20mm.
Thick-film resistor figure specific size can designed, designed according to demand.
Embodiment 3: being with the difference of embodiment 1,2, and electronic measuring device 3 includes data acquisition module, AD data turn
Change the mold block, singlechip microcontroller module, power module, display module, communication module, memory module, temperature signal regulation electricity
Road, pressure signal conditioning circuit；Driving source and chip conductivity sensor 9, chip temperature sensor 10 and chip pressure sensing
Device 11 connects, and temperature signal regulation circuit is connect with chip temperature sensor 10, and pressure signal conditioning circuit and chip pressure pass
Sensor 11 connects, and driving source successively connects with chip conductivity sensor 9, chip temperature sensor 10 and chip pressure sensor 11
Connect data acquisition module, AD data conversion module, singlechip microcontroller module, power module, display module, communication module,
Memory module is connect with singlechip microcontroller module.Referring to Fig. 7.Above-mentioned each constituent element, those skilled in the art
It voluntarily selects according to demand.
Although disclosed embodiment is as above, its content is only to facilitate understand technical side of the invention
Case and the embodiment used, are not intended to limit the present invention.Any those skilled in the art to which this invention pertains, not
Under the premise of being detached from disclosed core technology scheme, any modification and change can be made in form and details in implementation
Change, but protection scope defined by the present invention, the range that the appended claims that must still be subject to limits.
Claims (7)
1. a kind of chip seawater conductivity-temperature-depth system, it is characterised in that: including chip temperature sensor (10), chip pressure sensor
(11), chip conductivity sensor (9), electrical isolation cage supporter (2) and electronic measuring device (3)；Electronic measuring device (3)
It is placed on electrical isolation cage supporter (2)；The chip temperature sensor (10), chip pressure sensor (11) and chip conductance
Rate sensor (9) is disposed in parallel in electrical isolation cage supporter (2)；The chip temperature sensor (10), chip pressure pass
Sensor (11) and chip conductivity sensor (9) are connect by electrode outlet line (4) with electronic measuring device (3).
2. a kind of chip seawater conductivity-temperature-depth system according to claim 1, it is characterised in that: the chip conductivity sensor
(9) include round insulation substrate and be formed on thereon for detecting the metal electrode figure of conductivity；Chip temperature sensor
(10) include round insulation substrate and be formed on thereon for detecting the metal thermo-sensitive resistance pattern of temperature；Chip pressure sensor
(11) include round insulation substrate and be formed on thereon for detecting the metallic membrane figure of pressure.
3. a kind of chip seawater conductivity-temperature-depth system according to claim 2, it is characterised in that: the round insulation substrate is pottery
Ceramic chip.
4. a kind of chip seawater conductivity-temperature-depth system according to claim 2, it is characterised in that: the electrical isolation cage supporter
It (2) include two end plates and four horizontal stripe brackets, the periphery of two end plates is connected to one as support by four horizontal stripe brackets
It rises.
5. a kind of chip seawater conductivity-temperature-depth system according to claim 4, it is characterised in that: in four horizontal stripe brackets,
The definition being located above is the first horizontal stripe bracket (5), underlying be defined as the second horizontal stripe bracket (8), determine positioned at middle part
Justice is third horizontal stripe bracket (6) and the 4th horizontal stripe bracket (7), the second horizontal stripe bracket (8), third horizontal stripe bracket (6) and the
Four horizontal stripe bracket (7) width are equal, and the width of the first horizontal stripe bracket (5) is greater than the width of the second horizontal stripe bracket (8).
6. a kind of chip seawater conductivity-temperature-depth system according to claim 5, it is characterised in that: the electronic measuring device (3)
It is fixed on the first horizontal stripe bracket (5), hole is equipped on the first horizontal stripe bracket (5), electrode outlet line (4) passes through hole and electronic surveying
Device (3) connection.
7. a kind of chip seawater conductivity-temperature-depth system according to claim 1, it is characterised in that: the chip conductivity sensor
(9), chip temperature sensor (10) and chip pressure sensor (11) it is concentric in electrical isolation cage supporter (2), etc. between
Away from setting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710881275.4A CN107677312B (en) | 2017-09-26 | 2017-09-26 | A kind of chip seawater conductivity-temperature-depth system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710881275.4A CN107677312B (en) | 2017-09-26 | 2017-09-26 | A kind of chip seawater conductivity-temperature-depth system |
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| CN107677312A CN107677312A (en) | 2018-02-09 |
| CN107677312B true CN107677312B (en) | 2019-03-12 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110057442A (en) * | 2019-03-14 | 2019-07-26 | 天津大学 | The inexpensive acoustic pressure detection method for carrying out USB line as sensor in liquid |
| CN111982335B (en) * | 2020-08-20 | 2022-05-17 | 德州尧鼎光电科技有限公司 | Spiral type liquid conductivity adjustable temperature sensor |
| CN114636441B (en) * | 2022-02-23 | 2023-06-09 | 国家海洋技术中心 | Multi-parameter sensor suitable for underwater low-temperature high-pressure environment and testing method thereof |
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2017
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