CN107742753A - A kind of encapsulating structure of battery, method for packing and detection method - Google Patents
A kind of encapsulating structure of battery, method for packing and detection method Download PDFInfo
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- CN107742753A CN107742753A CN201710805484.0A CN201710805484A CN107742753A CN 107742753 A CN107742753 A CN 107742753A CN 201710805484 A CN201710805484 A CN 201710805484A CN 107742753 A CN107742753 A CN 107742753A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/4285—Testing apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/48—Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
The invention discloses a kind of encapsulating structure of battery, method for packing and detection method, including transmitting package module and reception package module；Launch package module transmitting detection ultrasonic wave, detection ultrasonic wave forms information ultrasonic wave after passing through battery, receives package module receive information ultrasonic wave, and be detection signal by information Ultrasonic transformation；Transmitting package module includes transmission piezoelectric chip, paster single-chip microcomputer, paster radiated element, emission power signaling interface and thermo-sensitive resistor；Receiving package module includes receiving piezoelectric chip, signal amplification component, Signal Processing Element, signal sampling element, reception power supply signal interface；Transmitting package module and receive package module and be symmetrically fixed on the relative both sides of battery and mutually correspond to.The advantages of the present invention are：The features such as high with susceptibility, the degree of accuracy is high, securely and reliably, can be distributed, and cost is low；Coupling is improved, reduces manufacturing cost；Realize the real-time monitoring to the state-of-charge of battery.
Description
Technical field
The present invention relates to detection field, the more particularly to a kind of encapsulating structure of battery, method for packing and detection method.
Background technology
The development of energy storage technology arrives greatly electric automobile, unmanned aerial vehicle, communication base station, distributed electrical small to wrist-watch, mobile phone
Net, renewable energy system application in play great effect.Energy storage technology minimum energy storage unit is battery, currently
Common energy-storage battery has lead-acid accumulator, nickel-hydrogen accumulator, Ni-Cr battery, sodium-sulphur battery and lithium ion battery etc..Most
Application in, the recycling health status of battery be directed not only to application system conventional maintenance and it is reliable use, and be related to
Safe to use, the problem of being a general concern of battery, while be also to be very difficult to monitoring and effective guarantee at present；
The monitoring of current battery mainly estimates battery pack by temperature sensor, current sensor, voltage sensor
State-of-charge, to monitor the health status of battery pack.But for the state-of-charge of battery pack, voltage, electric current, temperature by
The characteristics of therebetween connecing measurement, although its with battery charged and health status exist associate contact it is not direct, only with electricity
Three pressure, electric current, temperature physical messages are difficult to the charged and health status of battery is carried out directly to monitor and predict.
The content of the invention
In order to solve the above problems, the present invention provides a kind of encapsulating structure of battery, method for packing and detection method.This
Technical scheme forms information ultrasonic wave after passing through battery, connect using package module transmitting detection ultrasonic wave, detection ultrasonic wave is launched
Package module receive information ultrasonic wave is received, and is detection signal by information Ultrasonic transformation, staff can pass through detection signal
Judge the state-of-charge of battery；
It is the composition of its both positive and negative polarity active material, close with the change of its state-of-charge because in battery charge and discharge process
The physical parameters such as degree, crystal structure domain change, during the sound of its corresponding acoustic propagation, the parameter such as amplitude also change therewith,
Therefore by detecting the change of ultrasound parameter, the state-of-charge of battery can be accurately detected, therefore the technical program has sensitivity
The features such as degree is high, and the degree of accuracy is high, securely and reliably, can be distributed, and cost is low；And due to transmitting package module and receive package module
The relative both sides of battery are separately fixed at, is formed and is integrated with battery, transmitting package module is improved and receives package module
Coupling between battery, and reduce manufacturing cost；Passed through using computer to transmitting package module and reception Encapsulation Moulds
Block is monitored in real time to the state-of-charge of battery, improves the inspecting force to battery, and then is advantageous to ensure making for battery
Use the life-span.
Simultaneously as battery (state-of-charge=100%) in fully charged state, the wave amplitude of the waveform of detection signal are
Maximum M, and battery (state-of-charge=0%) in complete discharge condition, the wave amplitude of the waveform of detection signal is minimum value N,
Therefore, the technical program is according to this principle, and under the different state-of-charges of battery, repetition JS1-JS6 steps are charged to obtain
Corresponding relation between the wave amplitude of the waveform of state and detection signal, and charged-wave amplitude relation curve is drawn, staff can join
The wave amplitude of the waveform of current detection signal is judged according to charged-wave amplitude relation curve, and then judges the lotus of present battery
Electricity condition；
And by using signal sampling element, the waveform profiles of Signal Processing Element output can be divided in a long time
When sample, and the sampled signal timesharing that it is obtained is exported to computer, staff to use element timesharing according to signal
The waveform of the detection signal of output, to judge the change of the state-of-charge within this time to battery, and then realize to battery
State-of-charge dynamic monitoring.
A kind of encapsulating structure of battery in the present invention, including transmitting package module and reception package module；
The transmitting package module transmitting detection ultrasonic wave, the detection ultrasonic wave form information ultrasound after passing through battery
Ripple, the reception package module receive described information ultrasonic wave, and are detection signal by described information Ultrasonic transformation；
The transmitting package module includes transmission piezoelectric chip, paster single-chip microcomputer, paster radiated element, emission power signal
Interface and thermo-sensitive resistor；
The reception package module includes receiving piezoelectric chip, signal amplification component, Signal Processing Element, signal sampling member
Part, receive power supply signal interface；
The transmitting package module and the package module both sides that to be symmetrically fixed on the battery relative are received, the transmitting is pressed
Electric chip and reception piezoelectric chip are mutually corresponding.
In such scheme, the paster single-chip microcomputer connects with the paster radiated element and emission power signaling interface respectively
Connect, the transmission piezoelectric chip is connected with the paster radiated element；
Emission power signaling interface is used to connect power supply and signal source；The power supply is by emission power signaling interface to institute
Paster single-chip microcomputer output electric energy is stated, the signal source exports electricity by the emission power signaling interface to the paster single-chip microcomputer
Signal；
The transmission piezoelectric according to the FREQUENCY CONTROL of the electric signal is brilliant by paster radiated element for the paster single-chip microcomputer
Piece, the transmission piezoelectric chip is set to export detection ultrasonic wave to the battery；The frequency and the telecommunications of the detection ultrasonic wave
Number frequency it is corresponding.
In such scheme, the transmitting package module also includes communication interface, the communication interface and the paster monolithic
Machine connects；The communication interface is connected with computer, and the computer controls the paster single-chip microcomputer by the communication interface
Start or stop；The paster single-chip microcomputer detects ultrasonic wave by communication interface to computer export；The thermo-sensitive resistor is also
It is connected with the paster single-chip microcomputer, is exported for sensing the temperature of the battery and forming temperature signal to the paster monolithic
Machine, the paster single-chip microcomputer export the temperature signal to the computer by communication interface.
In such scheme, the transmitting package module also includes transmitting circuit plate, transmitting metal disk and emission lines；
The transmitting circuit plate has the transmitting through hole for connecting the transmitting circuit plate both sides, and the transmitting metal disk is consolidated
Be scheduled on it is described transmitting through hole one end, the transmission piezoelectric chip positioned at it is described transmitting through hole in, and with the transmitting round metal
Piece connects, and the transmitting metal disk has the transmitting port for connecting the transmitting metal disk both sides；
One end of the emission lines is connected with the transmission piezoelectric chip, and the other end of the emission lines passes through the transmitting
Port is connected with the paster radiated element；The transmission piezoelectric chip is backwards to a side surface of the transmitting metal disk and institute
Transmitting circuit backboard is stated to the surface of the transmitting sheet metal side to be located in same level；The paster single-chip microcomputer, paster
Radiated element, emission power signaling interface, communication interface and thermo-sensitive resistor are separately fixed at the wiring board towards the transmitting
On one side surface of metal disk；
Ground wire of the transmitting metal disk also with the transmitting circuit plate is connected.
In such scheme, the reception piezoelectric chip, signal amplification component, Signal Processing Element, signal sampling element, connect
Receive power supply signal interface to be sequentially connected in series, the reception power supply signal interface is connected with computer；
It is letter by information Ultrasonic transformation that the reception piezoelectric chip, which is received through information ultrasonic wave, the reception piezoelectric chip,
Information signal is exported to signal amplification component, and the signal amplification component is amplified to described information signal, and is exported to described
Signal Processing Element, the Signal Processing Element are handled the described information signal after amplification, obtain described information signal
Waveform profiles, the sampling element sampled to the waveform profiles to obtain detection signal；The reception power supply signal
Interface exports the detection signal to computer.
In such scheme, the reception package module also includes receiving circuit plate, receives metal disk and receives line；
The receiving circuit plate has the receiving through-hole for connecting the receiving circuit plate both sides, and the reception metal disk is consolidated
Be scheduled on one end of the receiving through-hole, the reception piezoelectric chip is located in the receiving through-hole, and with the reception round metal
Piece connects, and the metal disk that receives has the reception port for connecting the reception metal disk both sides；
Described one end for receiving line is connected with the reception piezoelectric chip, and the other end for receiving line passes through the reception
Port is connected with the paster receiving element；The piezoelectric chip that receives is backwards to a side surface of the reception metal disk and institute
Receiving circuit backboard is stated to the surface of the reception sheet metal side to be located in same level；The signal amplification component, letter
Number treatment element, signal sampling element, receive power supply signal interface and be separately fixed at the wiring board towards the reception metal
On one side surface of disk；
The ground wire that metal disk is received also with the receiving circuit plate is connected.
A kind of method for packing of battery, for encapsulating a kind of encapsulating structure of above-mentioned battery on battery, including it is following
Step：
FS1. perforate and transmitting through hole is formed on transmitting circuit plate, prepares the round metal that diameter is more than transmitting through hole internal diameter
Piece, and the transmitting metal disk is fixed on one end of the transmitting through hole by screw or bonding agent；In transmitting metal
Disk upper shed simultaneously forms transmitting port；
FS2. transmission piezoelectric chip is placed in transmitting through hole, and connected transmission piezoelectric chip by screw or bonding agent
It is connected on transmitting metal disk, and makes transmission piezoelectric chip backwards to a side surface of the transmitting metal disk, with the transmitting
Wiring board be located in same level backwards to the surface of the transmitting metal disk side, it is described launch metal disk also with it is described
Ground wire connection on transmitting circuit plate；One end of emission lines is connected with transmission piezoelectric chip, then the other end by emission lines
Through the transmitting port；
FS3. by paster single-chip microcomputer respectively with the paster radiated element, emission power signaling interface, communication interface and temperature
Quick resistance connection, the paster radiated element are also connected with the emission lines backwards to one end of the transmission piezoelectric chip；Again will
The paster single-chip microcomputer, paster radiated element, emission power signaling interface and communication interface are separately fixed at the wiring board court
To on a side surface of the transmitting metal disk, transmitting package module is made；
FS4. perforate and receiving through-hole is formed on receiving circuit plate, prepares the round metal that diameter is more than receiving through-hole internal diameter
Piece, and the reception metal disk is fixed on one end of the receiving through-hole by screw or bonding agent；Receiving metal
Disk upper shed simultaneously forms reception port；
FS5. piezoelectric chip will be received to be placed in receiving through-hole, and piezoelectric chip will be received by screw or bonding agent and connected
It is connected on and receives on metal disk, and make reception piezoelectric chip backwards to a side surface of the reception metal disk, with the reception
Wiring board be located in same level backwards to the surface of the reception metal disk side, it is described receive metal disk also with it is described
Ground wire connection on receiving circuit plate；The one end for receiving line is connected with receiving piezoelectric chip, then the other end that line will be received
Through the reception port；
FS6. signal amplification component, Signal Processing Element, signal sampling element, reception power supply signal interface are connected successively
Connect, the signal amplification component is also connected with the reception line backwards to one end of the reception piezoelectric chip；Again by the signal
Amplifier element, Signal Processing Element, signal sampling element, reception power supply signal interface are separately fixed at the wiring board towards institute
State on the side surface for receiving metal disk, reception package module is made；
FS7. the transmitting circuit backboard is connect to the side of transmitting metal disk, and the receiving circuit backboard to described
The side for receiving metal disk is separately fixed on two relative sides of battery, completes the encapsulation of battery.
In such scheme, in FS7, the transmitting circuit plate and receiving circuit plate are mutually aligned, transmission piezoelectric chip and
It is mutually corresponding to receive piezoelectric chip, the transmitting circuit plate and receiving circuit plate are connected by bonding agent with the battery.
A kind of a kind of detection method of battery, the encapsulating structure of above-mentioned battery, comprises the following steps：
JS1. by communication interface and receive power supply signal interface and be connected respectively with computer, by emission power signaling interface and
Power supply connects with signal source, and computer is also by receiving power supply signal interface to signal amplification component, Signal Processing Element, signal
Sampling element provides electric energy；
JS2. operation computer makes startup and closing of the computer by communication interface control paster single-chip microcomputer；Operation
Signal source makes the signal source export electric signal to paster single-chip microcomputer by emission power signaling interface；Power supply passes through emission power
Signaling interface provides electric energy to paster single-chip microcomputer；
JS3. the paster single-chip microcomputer controls the transmission piezoelectric chip by paster radiated element, and according to the telecommunications
Number frequency make the transmission piezoelectric chip to the battery export detection ultrasonic wave；It is described detection ultrasonic wave frequency with it is described
The frequency of electric signal is corresponding；Meanwhile the paster single-chip microcomputer detects ultrasonic wave to computer export by communication interface and shown；
Staff can confirm the waveform for the detection ultrasonic wave that package module exports occurs by computer；
JS4. the detection ultrasonic wave forms information ultrasonic wave after passing through battery, receives piezoelectric chip reception described information and surpasses
Sound wave, and be that information signal is exported to signal amplification component by described information Ultrasonic transformation；
JS5. the signal amplification component is amplified to described information signal, and is exported to Signal Processing Element；It is described
Signal Processing Element is handled the information signal after amplification, obtains the waveform profiles of described information signal, sampling element pair
The waveform profiles are sampled to obtain detection signal；The reception power supply signal interface exports the detection signal to meter
Calculation machine is simultaneously shown；Staff can observe the waveform for receiving the detection signal that package module is exported by computer；
JS6. staff can judge the charged of battery by the waveform of contrasting detection ultrasonic wave and the waveform of detection signal
State.
In such scheme, it can also be followed the steps below in the JS6：
JS61. sense the temperature of the battery using thermo-sensitive resistor and form temperature signal and export to the paster monolithic
Machine, the paster single-chip microcomputer export the temperature signal to the computer by communication interface, and staff is with reference to institute
On the premise of the temperature for stating battery, the waveform of contrasting detection ultrasonic wave and the waveform of detection signal, and judge the charged shape of battery
State.
The advantages of the present invention are：The present invention provide a kind of encapsulating structure of battery, method for packing and
Detection method, there is the features such as susceptibility is high, and degree of accuracy height securely and reliably, can be distributed, and cost is low；Improve transmitting encapsulation
Coupling between module and reception package module and battery, and reduce manufacturing cost；Realize the state-of-charge to battery
Real-time monitoring, improve the inspecting force to battery, so be advantageous to ensure battery service life.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, without having to pay creative labor, may be used also
To obtain other accompanying drawings according to these accompanying drawings.
Fig. 1 is the position relationship schematic diagram between the present invention a kind of encapsulating structure and battery of battery；
Fig. 2 is to launch structural representation of the package module backwards to battery side in a kind of encapsulating structure of battery of the present invention；
Fig. 3 is transmitting structural representation of the package module towards battery side in a kind of encapsulating structure of battery of the present invention；
Fig. 4 is that structural representation of the package module backwards to battery side is received in a kind of encapsulating structure of battery of the present invention；
Fig. 5 is reception structural representation of the package module towards battery side in a kind of encapsulating structure of battery of the present invention；
Fig. 6 is the schematic diagram connected between a kind of encapsulating structure of battery of the present invention and computer, power supply and signal source.
In figure：1st, launch package module 2, receive package module 3, battery
4th, computer 5, power supply 6, signal source
7th, emission lines 8, reception line
11st, transmission piezoelectric chip 12, paster single-chip microcomputer 13, paster radiated element
14th, emission power signaling interface 15, thermo-sensitive resistor 16, communication interface
17th, transmitting circuit plate 18, transmitting through hole 19, transmitting metal disk
10th, port is launched
21st, piezoelectric chip 22, signal amplification component 23, Signal Processing Element are received
24th, signal sampling element 25, reception power supply signal interface 26, receiving circuit plate
27th, receiving through-hole 28, reception metal disk 29, reception port
Embodiment
With reference to the accompanying drawings and examples, the embodiment of the present invention is further described.Following examples are only
For clearly illustrating technical scheme, and can not be limited the scope of the invention with this.
As shown in figures 1 to 6, the present invention is a kind of encapsulating structure of battery, including transmitting package module 1 and reception Encapsulation Moulds
Block 2；
Launch the transmitting detection ultrasonic wave of package module 1, detection ultrasonic wave forms information ultrasonic wave after passing through battery 3, received
The receive information ultrasonic wave of package module 2, and be detection signal by information Ultrasonic transformation；
Launching package module 1 includes transmission piezoelectric chip 11, paster single-chip microcomputer 12, paster radiated element 13, emission power
Signaling interface 14 and thermo-sensitive resistor 15；
Receive package module 2 and adopted including receiving piezoelectric chip 21, signal amplification component 22, Signal Processing Element 23, signal
Sample element 24, receive power supply signal interface 25；
Transmitting package module 1 and reception package module 2 are symmetrically fixed on the relative both sides of battery 3, transmission piezoelectric chip 11
It is mutually corresponding with piezoelectric chip 21 is received.
Specifically, paster single-chip microcomputer 12 is connected with paster radiated element 13 and emission power signaling interface 14 respectively, transmitting
Piezoelectric chip 11 is connected with paster radiated element 13；
Emission power signaling interface 14 is used to connect power supply 5 and signal source 6；Power supply 5 passes through emission power signaling interface 14
Electric energy is exported to paster single-chip microcomputer 12, signal source 6 exports electric signal by emission power signaling interface 14 to paster single-chip microcomputer 12；
FREQUENCY CONTROL transmission piezoelectric chip 11 of the paster single-chip microcomputer 12 by paster radiated element 13 according to electric signal, makes hair
Penetrate piezoelectric chip 11 and export detection ultrasonic wave to battery 3；The frequency for detecting ultrasonic wave is corresponding with the frequency of electric signal.
The operation principle of above-mentioned technical proposal is：Using the transmitting detection ultrasonic wave of package module 1 is launched, detection ultrasonic wave is worn
Information ultrasonic wave is formed after crossing battery 3, receives the receive information ultrasonic wave of package module 2, and is detection by information Ultrasonic transformation
Signal, staff can judge the state-of-charge of battery 3 by detection signal, have susceptibility high, the degree of accuracy is high, safely may be used
Lean on, can be distributed, the features such as cost is low, have been widely adopted and used；And due to transmitting package module 1 and receive package module
2 are separately fixed at the relative both sides of battery 3, are formed and are integrated with battery 3, improve transmitting package module 1 and receive encapsulation
Coupling between module 2 and battery 3, and reduce manufacturing cost；Passed through using computer 4 to launching package module 1 and connecing
Receive package module 2 to monitor the state-of-charge of battery 3 in real time, improve the inspecting force to battery 3, and then be advantageous to protect
Hinder the service life of battery 3.
Further, transmitting package module 1 also includes communication interface 16, and communication interface 16 is connected with paster single-chip microcomputer 12；
Communication interface 16 is connected with computer 4, and computer 4 controls starting or stoping for paster single-chip microcomputer 12 by communication interface 16；Patch
Piece single-chip microcomputer 12 exports detection ultrasonic wave by communication interface 16 to computer 4；Thermo-sensitive resistor 15 also connects with paster single-chip microcomputer 12
Connect, exported for sensing the temperature of battery 3 and forming temperature signal to paster single-chip microcomputer 12, paster single-chip microcomputer 12 is by temperature signal
Exported by communication interface 16 to computer 4.
Further, launching package module 1 also includes transmitting circuit plate 17, transmitting metal disk 19 and emission lines 7；
Transmitting circuit plate 17 has the transmitting through hole 18 of the both sides of connection transmitting circuit plate 17, and transmitting metal disk 19 is fixed on
Launch one end of through hole 18, transmission piezoelectric chip 11 is connected in transmitting through hole 18, and with transmitting metal disk 19, transmitting gold
Belong to the transmitting port 10 that disk 19 has connection transmitting metal disk 19 both sides；
One end of emission lines 7 is connected with transmission piezoelectric chip 11, and the other end of emission lines 7 passes through transmitting port 10 and paster
Radiated element 13 connects；Transmission piezoelectric chip 11 is sent out backwards backwards to the side surface for launching metal disk 19 with transmitting circuit plate 17
The surface for penetrating sheet metal side is located in same level；Paster single-chip microcomputer 12, paster radiated element 13, emission power signal connect
Mouth 14, communication interface 16 and thermo-sensitive resistor 15 are separately fixed on a side surface of wiring board direction transmitting metal disk 19；
Launch ground wire of the metal disk 19 also with transmitting circuit plate 17 to be connected.
Preferably, 17 long 66mm of transmitting circuit plate, wide 33mm, thick 2mm；Launch a diameter of 28.5mm of through hole 18；Paster
Single-chip microcomputer 12 is MC9S08DZ60 single-chip microcomputers；Launch a diameter of 30mm, thick 0.4mm of metal disk 19；Launch the straight of port 10
Footpath is 1.5mm；
Communication interface 16 is the wired networking realized by 485 or CAN, and communication interface 16 can also be real by bluetooth or very high frequency(VHF)
Existing wireless networking.
Preferably, paster single-chip microcomputer 12, paster radiated element 13, emission power signaling interface 14, communication interface 16 and temperature
Quick resistance 15 can be connected by welding or bonding agent with transmitting circuit plate 17.
Specifically, receive piezoelectric chip 21, signal amplification component 22, Signal Processing Element 23, signal sampling element 24, connect
Receive power supply signal interface 25 to be sequentially connected in series, receive power supply signal interface 25 and be connected with computer 4；
Receive piezoelectric chip 21 to receive through information ultrasonic wave, receive piezoelectric chip 21 and believe information Ultrasonic transformation for information
Number output is amplified to information signal to signal amplification component 22, signal amplification component 22, and is exported to Signal Processing Element
23, Signal Processing Element 23 is handled the information signal after amplification, obtains the waveform profiles of information signal, sampling element pair
Waveform profiles are sampled to obtain detection signal；Power supply signal interface 25 is received to export detection signal to computer 4.
Further, receiving package module 2 also includes receiving circuit plate 26, receives metal disk 28 and receives line 8；
Receiving circuit plate 26 has the receiving through-hole 27 of the both sides of connection receiving circuit plate 26, receives metal disk 28 and is fixed on
One end of receiving through-hole 27, receiving piezoelectric chip 21 is located in receiving through-hole 27, and is connected with receiving metal disk 28, receives gold
Belong to the reception port 29 that there is disk 28 connection to receive the both sides of metal disk 28；
The one end for receiving line 8 is connected with receiving piezoelectric chip 21, and the other end for receiving line 8 passes through reception port 29 and paster
Receiving element connects；Piezoelectric chip 21 is received to receive backwards with receiving circuit plate 26 backwards to the side surface for receiving metal disk 28
The surface of sheet metal side is located in same level；Signal amplification component 22, Signal Processing Element 23, signal sampling element
24th, power supply signal interface 25 is received to be separately fixed on a side surface of wiring board direction reception metal disk 28；
Ground wire of the metal disk 28 also with receiving circuit plate 26 is received to be connected.
Preferably, 26 long 66mm of receiving circuit plate, wide 33mm, thick 2mm；A diameter of 28.5mm of receiving through-hole 27；Receive
A diameter of 30mm of metal disk 28, thick 0.4mm；Receive a diameter of 1.5mm of port 29.
Preferably, signal amplification component 22, Signal Processing Element 23, signal sampling element 24, reception power supply signal interface
25 can be connected by welding or bonding agent with receiving circuit plate 26.
Preferably, signal source 6 can be also connected with computer 4, and computer 4 controls paster single-chip microcomputer by control signal source 6
The frequency or wave amplitude of 12 electric signals received.
A kind of method for packing of battery, for encapsulating the encapsulating structure of above-mentioned battery 3 on battery 3, comprise the following steps：
FS1. perforate and transmitting through hole 18 is formed on transmitting circuit plate 17, prepares diameter and be more than transmitting through hole 18 internal diameter
Metal disk, and be fixed on by screw or bonding agent by metal disk 19 is launched on one end of transmitting through hole 18；In transmitting gold
The category upper shed of disk 19 simultaneously forms transmitting port 10；
FS2. transmission piezoelectric chip 11 is placed in transmitting through hole 18, and it is by screw or bonding agent that transmission piezoelectric is brilliant
Piece 11 be connected to transmitting metal disk 19 on, and make transmission piezoelectric chip 11 backwards to launch metal disk 19 a side surface, with
Transmitting circuit plate 17 be located in same level backwards to the surface for launching metal disk 19 side, launch metal disk 19 also with hair
The ground wire connection penetrated on wiring board 17；One end of emission lines 7 is connected with transmission piezoelectric chip 11, then by the another of emission lines 7
One end passes through transmitting port 10；
FS3. by paster single-chip microcomputer 12 respectively with paster radiated element 13, emission power signaling interface 14, communication interface 16
Connected with thermo-sensitive resistor 15, paster radiated element 13 is also connected with emission lines 7 backwards to one end of transmission piezoelectric chip 11；Again will patch
Piece single-chip microcomputer 12, paster radiated element 13, emission power signaling interface 14 and communication interface 16 are separately fixed at wiring board direction
On the side surface for launching metal disk 19, transmitting package module 1 is made；
FS4. perforate and receiving through-hole 27 is formed on receiving circuit plate 26, prepares diameter and be more than the internal diameter of receiving through-hole 27
Metal disk, and be fixed on by screw or bonding agent by metal disk 28 is received on one end of receiving through-hole 27；Receiving gold
The category upper shed of disk 28 simultaneously forms reception port 29；
FS5. piezoelectric chip 21 will be received to be placed in receiving through-hole 27, and piezo crystals will be received by screw or bonding agent
Piece 21 be connected to receive metal disk 28 on, and make reception piezoelectric chip 21 backwards to receive metal disk 28 a side surface, with
Receiving circuit plate 26 is located in same level backwards to the surface for receiving the side of metal disk 28, receives metal disk 28 also with connecing
Receive the ground wire connection on wiring board 26；The one end for receiving line 8 is connected with receiving piezoelectric chip 21, then the another of line 8 will be received
One end, which passes through, receives port 29；
FS6. by signal amplification component 22, Signal Processing Element 23, signal sampling element 24, reception power supply signal interface 25
It is sequentially connected, signal amplification component 22 is also connected with receiving line 8 backwards to the one end for receiving piezoelectric chip 21；Signal is amplified into member again
Part 22, Signal Processing Element 23, signal sampling element 24, reception power supply signal interface 25 are separately fixed at wiring board towards reception
On one side surface of metal disk 28, it is made and receives package module 2；
FS7. by transmitting circuit plate 17 backwards to the side for launching metal disk 19, and receiving circuit plate 26 is backwards to reception metal
The side of disk 28 is separately fixed on two relative sides of battery 3, completes the encapsulation of battery 3.
Preferably, in FS7, transmitting circuit plate 17 and receiving circuit plate 26 are mutually aligned, and transmission piezoelectric chip 11 and are connect
It is mutually corresponding to receive piezoelectric chip 21, transmitting circuit plate 17 and receiving circuit plate 26 are connected by bonding agent with battery 3.
A kind of detection method of battery, using the encapsulating structure of above-mentioned battery 3, comprise the following steps：
JS1. communication interface 16 and reception power supply signal interface 25 are connected with computer 4 respectively, by emission power signal
Interface 14 is connected with power supply 5 and signal source 6, and computer 4 is also by receiving power supply signal interface 25 to signal amplification component 22, letter
Number treatment element 23, signal sampling element 24 provide electric energy；
JS2. operation computer 4 makes startup and closing of the computer 4 by the control paster of communication interface 16 single-chip microcomputer 12；Behaviour
Making signal source 6 makes signal source 6 export electric signal to paster single-chip microcomputer 12 by emission power signaling interface 14；Power supply 5 passes through hair
Radio signal interface 14 provides electric energy to paster single-chip microcomputer 12；
JS3. paster single-chip microcomputer 12 controls transmission piezoelectric chip 11 by paster radiated element 13, and according to the frequency of electric signal
Rate makes transmission piezoelectric chip 11 export detection ultrasonic wave to battery 3；The frequency for detecting ultrasonic wave is corresponding with the frequency of electric signal；Together
When, paster single-chip microcomputer 12 exports detection ultrasonic wave to computer 4 by communication interface 16 and shown；Staff can pass through calculating
Machine 4 confirms the waveform of the detection ultrasonic wave of package module output occurs；
JS4. detect after ultrasonic wave passes through battery 3 and form information ultrasonic wave, receive the receive information ultrasonic wave of piezoelectric chip 21,
And information Ultrasonic transformation is exported to signal amplification component 22 for information signal；
JS5. signal amplification component 22 is amplified to information signal, and is exported to Signal Processing Element 23；Signal transacting
Element 23 is handled the information signal after amplification, obtains the waveform profiles of information signal, and sampling element enters to waveform profiles
Row is sampled to obtain detection signal；Receive power supply signal interface 25 detection signal is exported to computer 4 and shown；Staff
The waveform for receiving the detection signal that package module 2 is exported can be observed by computer 4；
JS6. staff by the waveform of contrasting detection ultrasonic wave and the waveform of detection signal, can judge the lotus of battery 3
Electricity condition；Wherein, battery 3 (state-of-charge=100%) in fully charged state, the wave amplitude of the waveform of detection signal is maximum
Value M, and battery 3 (state-of-charge=0%) in complete discharge condition, the wave amplitude of the waveform of detection signal is minimum value N, because
This, under the different state-of-charges of battery 3, can repeat above-mentioned JS1-JS6 steps, to obtain state-of-charge according to this principle
Corresponding relation between the wave amplitude of the waveform of detection signal, and charged-wave amplitude relation curve is drawn, staff can refer to lotus
Electricity-wave amplitude relation curve is judged the wave amplitude of the waveform of current detection signal, and then judges the charged shape of present battery 3
State；
And by using signal sampling element 24, the waveform profiles that can be exported in a long time to Signal Processing Element 23 enter
Row time sharing sampling, and the sampled signal timesharing that it is obtained is exported to computer 4, staff to use element according to signal
The waveform of the detection signal of timesharing output, to judge the change of the state-of-charge within this time to battery 3, and then realization pair
The dynamic monitoring of the state-of-charge of battery 3.
Preferably, can also be followed the steps below in JS6：
JS61. sense the temperature of battery 3 using thermo-sensitive resistor 15 and form temperature signal and export to paster single-chip microcomputer 12, patch
Piece single-chip microcomputer 12 exports temperature signal to computer 4 by communication interface 16, and staff is before the temperature of reference battery 3
Put, the waveform of contrasting detection ultrasonic wave and the waveform of detection signal, and judge the state-of-charge of battery 3, to improve battery 3
The detection accuracy of state-of-charge.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
God any modification, equivalent substitution and improvements made etc., should be included in the scope of the protection with principle.
Claims (10)
1. a kind of encapsulating structure of battery, it is characterised in that including transmitting package module and receive package module；
The transmitting package module transmitting detection ultrasonic wave, the detection ultrasonic wave form information ultrasonic wave, institute after passing through battery
State and receive package module reception described information ultrasonic wave, and be detection signal by described information Ultrasonic transformation；
The transmitting package module includes transmission piezoelectric chip, paster single-chip microcomputer, paster radiated element, emission power signaling interface
And thermo-sensitive resistor；
It is described reception package module include receive piezoelectric chip, signal amplification component, Signal Processing Element, signal sampling element,
Receive power supply signal interface；
The transmitting package module and the package module both sides that to be symmetrically fixed on the battery relative are received, the transmission piezoelectric crystalline substance
Piece and reception piezoelectric chip are mutually corresponding.
A kind of 2. encapsulating structure of battery according to claim 1, it is characterised in that the paster single-chip microcomputer respectively with institute
State paster radiated element to connect with emission power signaling interface, the transmission piezoelectric chip is connected with the paster radiated element；
Emission power signaling interface is used to connect power supply and signal source；The power supply is by emission power signaling interface to the patch
Piece single-chip microcomputer exports electric energy, and the signal source exports telecommunications by the emission power signaling interface to the paster single-chip microcomputer
Number；
Paster single-chip microcomputer transmission piezoelectric chip according to the FREQUENCY CONTROL of the electric signal by paster radiated element, makes
The transmission piezoelectric chip exports detection ultrasonic wave to the battery；The frequency and the frequency of the electric signal of the detection ultrasonic wave
Rate is corresponding.
3. the encapsulating structure of a kind of battery according to claim 2, it is characterised in that the transmitting package module also includes
Communication interface, the communication interface are connected with the paster single-chip microcomputer；The communication interface is connected with computer, the computer
Starting or stoping for the paster single-chip microcomputer is controlled by the communication interface；The paster single-chip microcomputer is by communication interface to meter
Calculation machine output detection ultrasonic wave；The thermo-sensitive resistor is also connected with the paster single-chip microcomputer, for sensing the temperature of the battery
And formed temperature signal export it is to the paster single-chip microcomputer, the paster single-chip microcomputer that the temperature signal is defeated by communication interface
Go out to the computer.
4. the encapsulating structure of a kind of battery according to claim 3, it is characterised in that the transmitting package module also includes
Transmitting circuit plate, transmitting metal disk and emission lines；
The transmitting circuit plate has the transmitting through hole for connecting the transmitting circuit plate both sides, and the transmitting metal disk is fixed on
One end of the transmitting through hole, the transmission piezoelectric chip connect in the transmitting through hole, and with the transmitting metal disk
Connect, the transmitting metal disk has the transmitting port for connecting the transmitting metal disk both sides；
One end of the emission lines is connected with the transmission piezoelectric chip, and the other end of the emission lines passes through the transmitting port
It is connected with the paster radiated element；The transmission piezoelectric chip is backwards to a side surface of the transmitting metal disk and the hair
Ray road backboard is located in same level to the surface of the transmitting sheet metal side；The paster single-chip microcomputer, paster transmitting
Element, emission power signaling interface, communication interface and thermo-sensitive resistor are separately fixed at the wiring board towards the transmitting metal
On one side surface of disk；
Ground wire of the transmitting metal disk also with the transmitting circuit plate is connected.
5. the encapsulating structure of a kind of battery according to claim 1, it is characterised in that the reception piezoelectric chip, signal
Amplifier element, Signal Processing Element, signal sampling element, reception power supply signal interface are sequentially connected in series, the reception power supply
Signaling interface is connected with computer；
The reception piezoelectric chip, which receives, believes information Ultrasonic transformation for information through information ultrasonic wave, the reception piezoelectric chip
Number output is amplified to described information signal to signal amplification component, the signal amplification component, and is exported to the signal
Treatment element, the Signal Processing Element are handled the described information signal after amplification, obtain the ripple of described information signal
Shape profile, the sampling element are sampled to the waveform profiles to obtain detection signal；The reception power supply signal interface
The detection signal is exported to computer.
6. the encapsulating structure of a kind of battery according to claim 5, it is characterised in that the reception package module also includes
Receiving circuit plate, receive metal disk and receive line；
The receiving circuit plate has the receiving through-hole for connecting the receiving circuit plate both sides, and the reception metal disk is fixed on
One end of the receiving through-hole, the reception piezoelectric chip are located in the receiving through-hole, and connect with the reception metal disk
Connect, the metal disk that receives has the reception port for connecting the reception metal disk both sides；
Described one end for receiving line is connected with the reception piezoelectric chip, and the other end for receiving line passes through the reception port
It is connected with the paster receiving element；The piezoelectric chip that receives connects backwards to a side surface of the reception metal disk with described
Take-up road backboard is located in same level to the surface of the reception sheet metal side；At the signal amplification component, signal
Reason element, signal sampling element, reception power supply signal interface are separately fixed at the wiring board towards the reception metal disk
A side surface on；
The ground wire that metal disk is received also with the receiving circuit plate is connected.
A kind of 7. method for packing of battery, for encapsulating a kind of battery any one of claim 1-6 on battery
Encapsulating structure, it is characterised in that comprise the following steps：
FS1. perforate and transmitting through hole is formed on transmitting circuit plate, prepares the metal disk that diameter is more than transmitting through hole internal diameter,
And the transmitting metal disk is fixed on one end of the transmitting through hole by screw or bonding agent；In transmitting metal disk
Upper shed simultaneously forms transmitting port；
FS2. transmission piezoelectric chip is placed in transmitting through hole, and be connected to transmission piezoelectric chip by screw or bonding agent
Launch on metal disk, and make transmission piezoelectric chip backwards to a side surface of the transmitting metal disk, with the transmitting circuit
Backboard be located in same level to the surface of the transmitting metal disk side, it is described launch metal disk also with the transmitting
Ground wire connection on wiring board；One end of emission lines is connected with transmission piezoelectric chip, then the other end of emission lines is passed through
The transmitting port；
FS3. by paster single-chip microcomputer respectively with the paster radiated element, emission power signaling interface, communication interface and temperature sensitive electricity
Resistance connection, the paster radiated element are also connected with the emission lines backwards to one end of the transmission piezoelectric chip；Again by described in
Paster single-chip microcomputer, paster radiated element, emission power signaling interface and communication interface are separately fixed at the wiring board towards institute
On the side surface for stating transmitting metal disk, transmitting package module is made；
FS4. perforate and receiving through-hole is formed on receiving circuit plate, prepares the metal disk that diameter is more than receiving through-hole internal diameter,
And the reception metal disk is fixed on one end of the receiving through-hole by screw or bonding agent；Receiving metal disk
Upper shed simultaneously forms reception port；
FS5. piezoelectric chip will be received to be placed in receiving through-hole, and be connected to by screw or bonding agent by piezoelectric chip is received
Receive on metal disk, and make reception piezoelectric chip backwards to a side surface of the reception metal disk, with the receiving circuit
Backboard be located in same level to the surface of the reception metal disk side, it is described receive metal disk also with the reception
Ground wire connection on wiring board；The one end for receiving line is connected with receiving piezoelectric chip, then the other end for receiving line is passed through
The reception port；
FS6. signal amplification component, Signal Processing Element, signal sampling element, reception power supply signal interface are sequentially connected, institute
Signal amplification component is stated also to be connected backwards to one end of the reception piezoelectric chip with the reception line；The signal is amplified into member again
Part, Signal Processing Element, signal sampling element, reception power supply signal interface are separately fixed at the wiring board towards the reception
On one side surface of metal disk, reception package module is made；
FS7. the transmitting circuit backboard is received into gold to the side of transmitting metal disk, and the receiving circuit backboard to described
The side of category disk is separately fixed on two relative sides of battery, completes the encapsulation of battery.
A kind of 8. method for packing of battery according to claim 7, it is characterised in that in FS7, the transmitting circuit plate
It is mutually aligned with receiving circuit plate, transmission piezoelectric chip and reception piezoelectric chip are mutually corresponding, the transmitting circuit plate and reception
Wiring board is connected by bonding agent with the battery.
9. a kind of detection method of battery, using a kind of encapsulating structure of battery any one of claim 1-6, it is special
Sign is, comprises the following steps：
JS1. communication interface and reception power supply signal interface are connected with computer respectively, by emission power signaling interface and power supply
Connected with signal source, computer is also by receiving power supply signal interface to signal amplification component, Signal Processing Element, signal sampling
Element provides electric energy；
JS2. operation computer makes startup and closing of the computer by communication interface control paster single-chip microcomputer；Operation signal
Source makes the signal source export electric signal to paster single-chip microcomputer by emission power signaling interface；Power supply passes through emission power signal
Interface provides electric energy to paster single-chip microcomputer；
JS3. the paster single-chip microcomputer controls the transmission piezoelectric chip by paster radiated element, and according to the electric signal
Frequency makes the transmission piezoelectric chip export detection ultrasonic wave to the battery；The frequency and the telecommunications of the detection ultrasonic wave
Number frequency it is corresponding；Meanwhile the paster single-chip microcomputer detects ultrasonic wave to computer export by communication interface and shown；Work
Personnel can confirm the waveform for the detection ultrasonic wave that package module exports occurs by computer；
JS4. the detection ultrasonic wave forms information ultrasonic wave after passing through battery, receives piezoelectric chip and receives described information ultrasound
Ripple, and be that information signal is exported to signal amplification component by described information Ultrasonic transformation；
JS5. the signal amplification component is amplified to described information signal, and is exported to Signal Processing Element；The signal
Treatment element is handled the information signal after amplification, obtains the waveform profiles of described information signal, sampling element is to described
Waveform profiles are sampled to obtain detection signal；The reception power supply signal interface exports the detection signal to computer
And show；Staff can observe the waveform for receiving the detection signal that package module is exported by computer；
JS6. staff by the waveform of contrasting detection ultrasonic wave and the waveform of detection signal, can judge the charged shape of battery
State.
A kind of 10. detection method of battery according to claim 9, it is characterised in that can also be carried out in the JS6 with
Lower step：
JS61. sense the temperature of the battery using thermo-sensitive resistor and form temperature signal and export to the paster single-chip microcomputer, institute
State paster single-chip microcomputer to export the temperature signal to the computer by communication interface, staff is with reference to the battery
Temperature on the premise of, the waveform of contrasting detection ultrasonic wave and the waveform of detection signal, and judge the state-of-charge of battery.
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