CN107741447A - The chip oxygen sensor ceramic chip that a kind of zirconia ceramics burns altogether with aluminium oxide ceramics - Google Patents
The chip oxygen sensor ceramic chip that a kind of zirconia ceramics burns altogether with aluminium oxide ceramics Download PDFInfo
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- CN107741447A CN107741447A CN201711115583.2A CN201711115583A CN107741447A CN 107741447 A CN107741447 A CN 107741447A CN 201711115583 A CN201711115583 A CN 201711115583A CN 107741447 A CN107741447 A CN 107741447A
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- G—PHYSICS
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/403—Cells and electrode assemblies
- G01N27/406—Cells and probes with solid electrolytes
- G01N27/407—Cells and probes with solid electrolytes for investigating or analysing gases
- G01N27/4071—Cells and probes with solid electrolytes for investigating or analysing gases using sensor elements of laminated structure
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/403—Cells and electrode assemblies
- G01N27/406—Cells and probes with solid electrolytes
- G01N27/407—Cells and probes with solid electrolytes for investigating or analysing gases
- G01N27/409—Oxygen concentration cells
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Abstract
The present invention relates to a kind of chip oxygen sensor ceramic chip.The chip oxygen sensor ceramic chip that a kind of zirconia ceramics burns altogether with aluminium oxide ceramics, the chip oxygen sensor ceramic chip includes protective layer, first aluminium oxide ceramics matrix, external electrode pin, interior electrode pin, platinum external electrode, zirconium oxide conversion zone, electrode in platinum, external electrode through hole platinum wire, interior electrode through hole platinum wire, second aluminium oxide ceramics matrix, alchlor ceramic matrix, heater, 4th aluminium oxide ceramics matrix, first heating through hole platinum wire, second heating through hole platinum wire, first heating electrode pin and the second heating electrode pin.Fabrication processing of the present invention more simplifies;In addition, greatly improve the insulating resistance value and insulating properties of external electrode pin, interior electrode pin respectively between the first heating electrode pin and the second heating electrode pin.
Description
Technical field
The present invention relates to a kind of chip oxygen sensor ceramic chip.
Background technology
Chip oxygen sensor is a kind of relatively new lambda sensor that latest developments are got up, it have the response time it is short,
The advantages that size is small, manufacturing cost is low, dependable performance, it is that automobile industry realizes that energy-conservation (raising fuel economy), emission reduction (are reduced
Vehicle exhaust noxious gas emission) important spare part.Oxygen sensor chip is chip oxygen sensor core the most, is also simultaneously
The part to play a major role.Lambda sensor can determine oxygen content in engine exhaust, determine whether gasoline is complete with air
Burning.Electronic controller realizes the closed-loop control with air excess factor=1 for target according to the feedback information of lambda sensor,
There is the transformation efficiency of maximum to ensure three-way catalytic converter to tri- kinds of HC emissions, CO and NOx pollutants.
Current chip oxygen sensor ceramic chip includes protective layer, external electrode pin, interior electrode pin, external electrode, oxygen
Change zirconium conversion zone, interior electrode, first through hole wire, reference gas channel layer, zirconium oxide substrate layer, the first insulating barrier, heater, second
Insulating barrier, the first heating electrode pin, the second heating electrode pin, the second through hole wire and heated oxide zirconium base lamella.Its work
Make principle still:Under 12V voltages, heater can be within 12S, and oxidizing zirconium conversion zone provides more than 700 DEG C of temperature.
Containing the zirconium oxide conversion zone that yttrium is stable, at 300 DEG C and more than, in the catalytic action of external electrode and interior electrode platinum metal,
When the oxygen concentration on two surfaces of zirconium oxide conversion zone differs, zirconium oxide conversion zone can conduction oxonium ion, the shifting of oxonium ion
It is dynamic, form electric current and voltage.
Automobile using chip oxygen sensor ceramic chip has very high requirement to insulation, and same kind of products at abroad requires insulated electro
Zu≤30M Ω, at present home products Jue edge electricity Zu≤1M Ω.At present, zirconium oxide conversion zone produces electricity with interior electrode through hole wire
Flow signal;Zirconia base can produce current signal with heating wires;These interference signals influence chip oxygen and pass ceramic sensor core
Current signal between piece external electrode pin and interior electrode pin, so as to influence to insulate.
The content of the invention
In order to solve above-mentioned technical problem, it is an object of the invention to provide a kind of chip oxygen sensor of high-insulativity pottery
Porcelain core piece, the chip oxygen sensor ceramic chip avoid the influence of electric current, improve insulation.
In order to realize above-mentioned purpose, present invention employs following technical scheme:
The chip oxygen sensor ceramic chip that a kind of zirconia ceramics burns altogether with aluminium oxide ceramics, chip oxygen sensor pottery
It is anti-that porcelain core piece includes protective layer, the first aluminium oxide ceramics matrix, external electrode pin, interior electrode pin, platinum external electrode, zirconium oxide
Answer layer, electrode, external electrode through hole platinum wire, interior electrode through hole platinum wire, the second aluminium oxide ceramics matrix, the 3rd in platinum
Aluminium oxide ceramics matrix, heater, the 4th aluminium oxide ceramics matrix, the first heating through hole platinum wire, the second heating through hole platinum
Golden wire, the first heating electrode pin and the second heating electrode pin;Described protective layer and the first aluminium oxide ceramics matrix point
The left and right top of zirconium oxide conversion zone Fu Gai be arranged on, described external electrode pin, interior electrode pin are arranged on the first oxidation
The top of aluminium ceramic matrix, described external electrode through hole platinum wire pass through the first aluminium oxide ceramics matrix, external electrode through hole platinum
The upper end of golden wire is connected with described external electrode pin, and lower end is connected with platinum external electrode, described interior electrode through hole
Platinum wire passes through the first aluminium oxide ceramics matrix and zirconium oxide conversion zone, and upper end is connected with described interior electrode pin, under
End is connected with electrode in platinum;The second described aluminium oxide ceramics matrix is arranged on the lower section of zirconium oxide conversion zone, second
Reference air flue is provided with aluminium oxide ceramics matrix;Described heater is arranged on alchlor ceramic matrix and the 4th oxidation
Between aluminium ceramic matrix, alchlor ceramic matrix is arranged on the lower section of the second aluminium oxide ceramics matrix, the first heating electrode
Pin and the second heating electrode pin are separately positioned on the lower section of the 4th aluminium oxide ceramics matrix, the described first heating through hole platinum
Golden wire, the second heating through hole platinum wire are each passed through the 4th aluminium oxide ceramics matrix, and lower end connects the first heating electricity respectively
Pole pin and the second heating electrode pin, upper end connects the two poles of the earth of heater respectively.
The present invention is as a result of above-mentioned technical scheme, and except zirconium oxide conversion zone, base layer is all using aluminum oxide
Ceramics, alumina insulating layer need not be made in the upper and lower layer of platinum heater, fabrication processing more simplifies;3rd oxygen
Change aluminium ceramic matrix and do not produce current signal with heating through hole platinum wire, while also pass through alchlor ceramic matrix and its
Above structure realizes insulation, greatly improves external electrode pin, interior electrode pin and adds respectively with the first heating electrode pin and second
Insulating resistance value and insulating properties between thermode pin.
Brief description of the drawings
Fig. 1 is the structural representation of the present invention.
Fig. 2 is the structural representation of comparative example of the present invention.
Embodiment
The embodiment of the present invention is made a detailed explanation below in conjunction with the accompanying drawings.
The chip oxygen sensor ceramic chip that a kind of zirconia ceramics as described in Figure 1 burns altogether with aluminium oxide ceramics, the piece
Formula oxygen sensor ceramic chip include protective layer 1, the first aluminium oxide ceramics matrix 10A, external electrode pin 2, interior electrode pin 3,
Platinum external electrode 4, zirconium oxide conversion zone 5, electrode 6, external electrode through hole platinum wire 7, interior electrode through hole platinum wire in platinum
8th, the second aluminium oxide ceramics matrix 10B, alchlor ceramic matrix 10C, heater 11, the 4th aluminium oxide ceramics matrix 10D,
First heating through hole platinum wire 14, second heats through hole platinum wire 15, first and heats the heating electricity of electrode pin 12 and second
Pole pin 13;The described aluminium oxide ceramics matrix 10A of protective layer 1 and first be covered each by being arranged on a left side for zirconium oxide conversion zone 5,
Upper right side, described external electrode pin 2, interior electrode pin 3 are arranged on the first aluminium oxide ceramics matrix 10A top, described
External electrode through hole platinum wire 7 passes through the first aluminium oxide ceramics matrix 10A, the upper end of external electrode through hole platinum wire 7 with it is described
External electrode pin 2 be connected, lower end is connected with platinum external electrode 4, described interior electrode through hole platinum wire 8 pass through first
Aluminium oxide ceramics matrix 10A and zirconium oxide conversion zone 5, upper end are connected with described interior electrode pin 3, lower end and electricity in platinum
Pole 6 is connected;The second described aluminium oxide ceramics matrix 10B is arranged on the lower section of zirconium oxide conversion zone 5, is made pottery in the second aluminum oxide
Reference air flue 9 is provided with porcelain basal body 10B;Described heater 11 is arranged on alchlor ceramic matrix 10C and the 4th oxygen
Between changing aluminium ceramic matrix 10D, alchlor ceramic matrix 10C is arranged on the second aluminium oxide ceramics matrix 10B lower section, the
One heating electrode pin 12 and second heats the lower section that electrode pin 13 is separately positioned on the 4th aluminium oxide ceramics matrix 10D, institute
The the first heating through hole platinum wire 14, second stated heats through hole platinum wire 15 and is each passed through the 4th aluminium oxide ceramics matrix
10D, lower end connect the first heating electrode pin 12 and the second heating electrode pin 13 respectively, and upper end connects heater 11 respectively
The two poles of the earth.
Megger test method:Chip oxygen sensor ceramic chip is under 430 DEG C of states, using megger test
Instrument, under 25V AC, external electrode pin 2, interior electrode pin 3 heat electrode pin with the first heating electrode pin 12 and second respectively
Insulating resistance value between 13.
Comparative example
A kind of chip oxygen sensor ceramic chip of high-insulativity as shown in Figure 2, the chip oxygen sensor ceramic chip
Led including protective layer 1, external electrode pin 2, interior electrode pin 3, external electrode 4, zirconium oxide conversion zone 5, interior electrode 6, first through hole
Line 7, reference gas channel layer 8, zirconium oxide substrate layer 9, the first insulating barrier 10, heater 11, the second insulating barrier 12, first heating electrode
Pin 14, second heats electrode pin 15, the second through hole wire 16 and heated oxide zirconium base lamella 13;External electrode 4 is arranged on guarantor
Between sheath 1 and zirconium oxide conversion zone 5, interior electrode 6 is arranged between zirconium oxide conversion zone 5 and reference gas channel layer 8, described oxygen
Change and first through hole is provided with zirconium conversion zone 5, interior electrode 6 passes through the first through hole wire 7 and the dispatch from foreign news agency that are arranged in first through hole
The pin 2 of pole 4 is connected;Described heater 11 is arranged on the first insulating barrier 10 and the second insulating barrier 12, and in the second insulating barrier
12 on heated oxide zirconium base lamella 13 with being provided with two the second through holes, and the two poles of the earth of heater 11 are respectively by being arranged on two the
The second through hole wire 16 in two through holes heats electrode pin 15 with the first described heating electrode pin 14 and second and is connected;
One layer of aluminium oxide ceramics of first through hole and the coated with uniform of the second through hole.The first described insulating barrier 10 and the second insulating barrier
12 material of main part is zirconia ceramics, and at least uniformly coats one layer of aluminium oxide ceramics in the upper surface of material of main part.Oxidation
Zirconium base lamella 9 selects one or more layers zirconium oxide substrate.
Megger test method:Chip oxygen sensor ceramic chip is under 430 DEG C of states, using megger test
Instrument, under 25V AC, external electrode pin 2, interior electrode pin 3 heat electrode pin with the first heating electrode pin 14, second respectively
Resistance value between 15.
Domestic exemplar 1~3 is the structure for being not provided with aluminium oxide ceramics.
Claims (1)
- A kind of 1. chip oxygen sensor ceramic chip that zirconia ceramics burns altogether with aluminium oxide ceramics, it is characterised in that the chip Oxygen sensor ceramic chip includes protective layer (1), the first aluminium oxide ceramics matrix (10A), external electrode pin (2), interior electrode and drawn Pin (3), platinum external electrode (4), zirconium oxide conversion zone (5), electrode (6), external electrode through hole platinum wire (7), interior electricity in platinum Pole through hole platinum wire (8), the second aluminium oxide ceramics matrix (10B), alchlor ceramic matrix (10C), heater (11), 4th aluminium oxide ceramics matrix (10D), the first heating through hole platinum wire (14), the second heating through hole platinum wire (15), the One heating electrode pin (12) and the second heating electrode pin (13);Described protective layer (1) and the first aluminium oxide ceramics matrix (10A) is covered each by being arranged on the left and right top of zirconium oxide conversion zone (5), described external electrode pin (2), interior electrode pin (3) top of the first aluminium oxide ceramics matrix (10A) is arranged on, described external electrode through hole platinum wire (7) passes through the first oxygen Change aluminium ceramic matrix (10A), the upper end of external electrode through hole platinum wire (7) is connected with described external electrode pin (2), lower end It is connected with platinum external electrode (4), described interior electrode through hole platinum wire (8) passes through the first aluminium oxide ceramics matrix (10A) With zirconium oxide conversion zone (5), upper end is connected with described interior electrode pin (3), and lower end is connected with electrode in platinum (6); The second described aluminium oxide ceramics matrix (10B) is arranged on the lower section of zirconium oxide conversion zone (5), in the second aluminium oxide ceramics matrix Reference air flue (9) is provided with (10B);Described heater (11) is arranged on alchlor ceramic matrix (10C) and the 4th Between aluminium oxide ceramics matrix (10D), alchlor ceramic matrix (10C) is arranged on the second aluminium oxide ceramics matrix (10B) Lower section, first heating electrode pin (12) and second heat electrode pin (13) be separately positioned on the 4th aluminium oxide ceramics matrix The lower section of (10D), the described first heating through hole platinum wire (14), the second heating through hole platinum wire (15) are each passed through the Four aluminium oxide ceramics matrixes (10D), lower end connect the first heating electrode pin (12) and the second heating electrode pin (13) respectively, Upper end connects the two poles of the earth of heater (11) respectively.
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CN201711115583.2A CN107741447A (en) | 2017-11-13 | 2017-11-13 | The chip oxygen sensor ceramic chip that a kind of zirconia ceramics burns altogether with aluminium oxide ceramics |
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CN201711115583.2A CN107741447A (en) | 2017-11-13 | 2017-11-13 | The chip oxygen sensor ceramic chip that a kind of zirconia ceramics burns altogether with aluminium oxide ceramics |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108503391A (en) * | 2018-04-10 | 2018-09-07 | 珠海惠友电子有限公司 | A kind of manufacturing process of ceramic heating part |
CN108760822A (en) * | 2018-06-06 | 2018-11-06 | 成都科锐传感技术有限公司 | A kind of chip oxygen sensor and preparation method thereof containing two parts zirconia structure |
CN108956741A (en) * | 2018-06-06 | 2018-12-07 | 成都科锐传感技术有限公司 | A kind of automobile-used chip oxygen sensor of Novel double-battery type motor and preparation method thereof |
CN109613099A (en) * | 2018-12-12 | 2019-04-12 | 厦门海赛米克新材料科技有限公司 | Chip oxygen sensing device, the exhaust pipe of engine and motor vehicle |
CN111505080A (en) * | 2019-01-31 | 2020-08-07 | 苏州工业园区传世汽车电子有限公司 | Chip external electrode for chip oxygen sensor and preparation method thereof |
CN114646683A (en) * | 2020-12-18 | 2022-06-21 | 江苏惟哲新材料有限公司 | Ceramic humidity sensor |
CN115598189A (en) * | 2022-10-08 | 2023-01-13 | 浙江百岸科技有限公司(Cn) | Nitrogen-oxygen sensor chip with hidden circuit |
-
2017
- 2017-11-13 CN CN201711115583.2A patent/CN107741447A/en not_active Withdrawn
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108503391A (en) * | 2018-04-10 | 2018-09-07 | 珠海惠友电子有限公司 | A kind of manufacturing process of ceramic heating part |
CN108760822A (en) * | 2018-06-06 | 2018-11-06 | 成都科锐传感技术有限公司 | A kind of chip oxygen sensor and preparation method thereof containing two parts zirconia structure |
CN108956741A (en) * | 2018-06-06 | 2018-12-07 | 成都科锐传感技术有限公司 | A kind of automobile-used chip oxygen sensor of Novel double-battery type motor and preparation method thereof |
CN108956741B (en) * | 2018-06-06 | 2020-05-01 | 成都科锐传感技术有限公司 | Preparation method of double-battery type chip oxygen sensor for motorcycle |
CN109613099A (en) * | 2018-12-12 | 2019-04-12 | 厦门海赛米克新材料科技有限公司 | Chip oxygen sensing device, the exhaust pipe of engine and motor vehicle |
CN111505080A (en) * | 2019-01-31 | 2020-08-07 | 苏州工业园区传世汽车电子有限公司 | Chip external electrode for chip oxygen sensor and preparation method thereof |
CN111505080B (en) * | 2019-01-31 | 2024-05-31 | 苏州工业园区传世汽车电子有限公司 | Chip external electrode for chip oxygen sensor and preparation method thereof |
CN114646683A (en) * | 2020-12-18 | 2022-06-21 | 江苏惟哲新材料有限公司 | Ceramic humidity sensor |
CN114646683B (en) * | 2020-12-18 | 2024-04-23 | 江苏惟哲新材料有限公司 | Ceramic humidity sensor |
CN115598189A (en) * | 2022-10-08 | 2023-01-13 | 浙江百岸科技有限公司(Cn) | Nitrogen-oxygen sensor chip with hidden circuit |
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Application publication date: 20180227 |