CN109613099A - Chip oxygen sensing device, the exhaust pipe of engine and motor vehicle - Google Patents
Chip oxygen sensing device, the exhaust pipe of engine and motor vehicle Download PDFInfo
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- CN109613099A CN109613099A CN201811517939.XA CN201811517939A CN109613099A CN 109613099 A CN109613099 A CN 109613099A CN 201811517939 A CN201811517939 A CN 201811517939A CN 109613099 A CN109613099 A CN 109613099A
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- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 title claims abstract description 322
- 239000001301 oxygen Substances 0.000 title claims abstract description 321
- 229910052760 oxygen Inorganic materials 0.000 title claims abstract description 321
- 239000007789 gas Substances 0.000 claims abstract description 37
- 230000036961 partial effect Effects 0.000 claims abstract description 9
- 239000010410 layer Substances 0.000 claims description 181
- 239000003792 electrolyte Substances 0.000 claims description 61
- 230000006698 induction Effects 0.000 claims description 61
- 238000010438 heat treatment Methods 0.000 claims description 53
- 239000011241 protective layer Substances 0.000 claims description 32
- 239000004020 conductor Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 description 28
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 19
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 12
- 239000000919 ceramic Substances 0.000 description 11
- 239000000446 fuel Substances 0.000 description 11
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 11
- 238000010586 diagram Methods 0.000 description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 8
- 238000004080 punching Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000009413 insulation Methods 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 238000005086 pumping Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 230000000670 limiting effect Effects 0.000 description 3
- 238000007766 curtain coating Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229910052573 porcelain Inorganic materials 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000005439 thermosphere Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000007784 solid electrolyte Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/403—Cells and electrode assemblies
- G01N27/406—Cells and probes with solid electrolytes
- G01N27/407—Cells and probes with solid electrolytes for investigating or analysing gases
- G01N27/4071—Cells and probes with solid electrolytes for investigating or analysing gases using sensor elements of laminated structure
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/403—Cells and electrode assemblies
- G01N27/406—Cells and probes with solid electrolytes
- G01N27/4067—Means for heating or controlling the temperature of the solid electrolyte
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/403—Cells and electrode assemblies
- G01N27/406—Cells and probes with solid electrolytes
- G01N27/407—Cells and probes with solid electrolytes for investigating or analysing gases
- G01N27/41—Oxygen pumping cells
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- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Molecular Biology (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Measuring Oxygen Concentration In Cells (AREA)
Abstract
The present invention provides chip oxygen sensing device, the exhaust pipe of engine and motor vehicles.The chip oxygen sensing device includes: chip oxygen sensor；Pump oxygen component, the pump oxygen component is electrically connected with the heater lead in the chip oxygen sensor, partial pressure on the heater lead is for applying pump oxygen electric current to the pump oxygen component, and the pump oxygen component is for conveying fresh oxygen into the reference air flue of the chip oxygen sensor.The chip oxygen sensing device structure is simple, cost is relatively low, of less demanding to airtightness, without additional configuration additional circuit auxiliary element, that is, may make the oxygen in reference gas road more fresh, and then realize the concentration for relatively accurately measuring oxygen.
Description
Technical field
The present invention relates to automobile sensor technical fields, and in particular, to chip oxygen sensing device, the exhaust pipe of engine and
Motor vehicle.
Background technique
Chip oxygen sensing device is the sensing element applied on the exhaust pipe of engine near ternary catalyzing unit, it utilizes electricity
Oxygen concentration in motor-vehicle tail-gas is converted into electric signal and input control unit by the solid electrolyte component of the principles of chemistry
(ECU), make engine reach ideal air-fuel ratio by the correction-compensation of control closed loop fuel injection, improve vehicular emission
With raising fuel economy.The working principle of chip oxygen sensing device is to utilize Nernst equation, in working electrode and tail gas side
Tail gas contact, while reference electrode is in contact with the reference gas in reference side, at high temperature induction electrolyte layer two sides due to
Oxygen concentration difference and generate potential difference.Therefore, the fresh work to lambda sensor of oxygen concentration plays conclusive work in reference gas
With.However, current chip oxygen sensing device realizes that the fresh efficiency of oxygen concentration in reference gas is lower, and structure is complicated,
Higher cost also results in chip oxygen sensing device mechanical strength variation.
Thus, the relevant technologies of existing chip oxygen sensing device still have much room for improvement.
Summary of the invention
The present invention is directed to solve at least some of the technical problems in related technologies.For this purpose, of the invention
One purpose is to propose that a kind of structure is simple, cost is relatively low, of less demanding to airtightness, auxiliary without additional configuration additional circuit
Help element i.e. and may make that the oxygen in reference gas road is more fresh or can preferably realize and relatively accurately measures the dense of oxygen
The chip oxygen sensing device of degree.
In one aspect of the invention, the present invention provides a kind of chip oxygen sensing devices.According to an embodiment of the invention,
The chip oxygen sensing device includes: chip oxygen sensor；Oxygen component is pumped, in the pump oxygen component and the chip oxygen sensor
Heater lead is electrically connected, and the partial pressure on the heater lead is for applying pump oxygen electric current, the pump to the pump oxygen component
Oxygen component is for conveying fresh oxygen into the reference air flue of the chip oxygen sensor.Inventors have found that the chip oxygen passes
Induction device structure is simple, cost is relatively low, of less demanding to airtightness, without additional configuration additional circuit auxiliary element, can make
The oxygen obtained in reference air flue is more fresh, and then realizes the concentration for relatively accurately measuring oxygen.
According to an embodiment of the invention, the pump oxygen component includes: pump oxygen electrolyte layer, the pump oxygen electrolyte layer setting
On the lower surface of the chip oxygen sensor；Electrode in oxygen is pumped, electrode is arranged in the pump oxygen electrolyte layer in the pump oxygen
Upper surface on；Oxygen external electrode is pumped, the pump oxygen external electrode is arranged on the lower surface of the pump oxygen electrolyte layer.
According to an embodiment of the invention, the pump oxygen component further include: the first ventilative protective layer, the described first ventilative protection
Layer is arranged on the lower surface of the pump oxygen external electrode；First insulating layer, the first insulating layer setting are electrolysed in the pump oxygen
On the lower surface that matter layer is not covered by the described first ventilative protective layer, and cover outside the pump oxygen being electrically connected with the pump oxygen external electrode
Contact conductor.
According to an embodiment of the invention, the chip oxygen sensor includes the induction electrolyte being stacked from top to bottom
The upper and lower surface of layer, at least one air flue layer and heating layer, the induction electrolyte layer is respectively arranged with induction external electrode and sense
Answer interior electrode, be provided with reference air flue on the air flue layer, be arranged on the upper surface of the heating layer having heaters and it is described plus
Hot device lead, the heater lead is electrically connected with the heater and extends along the length direction of the heating layer, described to add
First through hole is additionally provided on thermosphere, the pump oxygen component conveys by the first through hole into the reference air flue fresh
Oxygen.
According to an embodiment of the invention, the first through hole is in the heating layer on the length direction of the heating layer
On orthographic projection and the heater lead there are gaps between the orthographic projection on the heating layer.
According to an embodiment of the invention, on the length direction of the heating layer, the gas adjacent with the heating layer
Reference air flue in channel layer is in the orthographic projection of orthographic projection and the heater lead on the heating layer on the heating layer
Between there are gaps.
According to an embodiment of the invention, gas port is provided on the induction electrolyte layer, positioned at the gas of top layer
Reference air flue in channel layer is connected with the gas port.
According to an embodiment of the invention, the quantity of the heater is multiple, and in the width direction of the heating layer,
Multiple heaters are symmetrically distributed in the two sides of the reference air flue.
According to an embodiment of the invention, the chip oxygen sensor further include: the second ventilative protective layer, described second is ventilative
Protective layer is arranged on the upper surface of the induction external electrode；Second insulating layer, the second insulating layer are arranged in the induction
On the upper surface that electrolyte layer is not covered by the described second ventilative protective layer, and cover the sense being electrically connected with the induction external electrode
Answer external electrode lead.
According to an embodiment of the invention, further include: the second through-hole, second through-hole run through the heating layer and the pump
Oxygen electrolyte layer, for drawing pump oxygen external electrode lead；Third through-hole, the third through-hole through the pump oxygen electrolyte layer with
First insulating layer, for drawing pump oxygen internal electrode lead-wire；Fourth hole, the fourth hole run through the heating layer, institute
Pump oxygen electrolyte layer and first insulating layer are stated, for drawing the heater lead；Fifth hole, the fifth hole pass through
The second insulating layer is worn, for drawing induction external electrode lead；6th through-hole, the 6th through-hole is through second insulation
Layer and the induction electrolyte layer, for drawing induction internal electrode lead-wire.
In another aspect of the invention, the present invention provides a kind of exhaust pipes of engine.According to an embodiment of the invention,
At least one mentioned-above chip oxygen sensing device is provided near the ternary catalyzing unit of the exhaust pipe of engine.Inventor
It was found that the concentration of oxygen can be relatively accurately measured in the tail gas of exhaust pipe of engine discharge, so that user can be with
Make engine reach ideal air-fuel ratio by the correction-compensation of control closed loop fuel injection, and then improves motor vehicle row
Put and improve fuel economy.
In an additional aspect of the present invention, the present invention provides a kind of motor vehicles.According to an embodiment of the invention, this is motor-driven
Vehicle includes the mentioned-above exhaust pipe of engine.Inventors have found that the engine of the motor vehicle can achieve ideal sky
Ratio is fired, and then improves the fuel economy of the motor vehicle.
Detailed description of the invention
Fig. 1 shows the schematic diagram of the section structure of the chip oxygen sensing device of one embodiment of the invention.
Fig. 2 a shows the electrical block diagram that the working principle of oxygen component is pumped in chip oxygen sensing device of the present invention.
Fig. 2 b shows the circuit structure signal of the working principle of chip oxygen sensor in chip oxygen sensing device of the present invention
Figure.
Fig. 3 shows the schematic diagram of the section structure of the chip oxygen sensing device of another embodiment of the present invention.
Fig. 4 shows the schematic diagram of the section structure of the chip oxygen sensing device of another embodiment of the invention.
Fig. 5 shows the schematic diagram of the section structure of the chip oxygen sensing device of further embodiment of the present invention.
Fig. 6 shows the schematic diagram of the section structure of the chip oxygen sensing device of further embodiment of the present invention.
Fig. 7 shows the schematic diagram of the section structure of the chip oxygen sensing device of further embodiment of the present invention.
Fig. 8 shows the structural decomposition diagram of the chip oxygen sensing device of one embodiment of the invention.
Fig. 9 shows that the cross-section structure along line A-A of the chip oxygen sensing device in the embodiment of Fig. 8 of the present invention is illustrated
Figure.
Appended drawing reference:
10: chip oxygen sensing device 100: chip oxygen sensor 110: induction electrolyte layer 111: gas port 120: sense
Answer interior electrode 121: induction internal electrode lead-wire 130: induction external electrode 131: induction external electrode lead 140,140a, 140b:
Air flue layer 141,141a, 141b: reference air flue 150: heating layer 151,151a, 151b, 151c, 151d: heater 152,
152a, 152b: heater lead 153: the ventilative protective layer 170 of first through hole 160: the second: second insulating layer 200: pump oxygen
Component 210: pump oxygen electrolyte layer 220: electrode 221 in pump oxygen: pump oxygen internal electrode lead-wire 230: pump oxygen external electrode 231: pump
Ventilative 250: the first insulating layer of protective layer, 300: the second through-hole 400 of oxygen external electrode lead 240: the first: third through-hole 500:
Fourth hole 600: 700: the six through-hole of fifth hole
Specific embodiment
The embodiment of the present invention is described below in detail.The embodiments described below is exemplary, and is only used for explaining this hair
It is bright, and be not considered as limiting the invention.Particular technique or condition are not specified in embodiment, according to text in the art
It offers described technology or conditions or is carried out according to product description.Reagents or instruments used without specified manufacturer,
For can be with conventional products that are commercially available.
In one aspect of the invention, the present invention provides a kind of chip oxygen sensing devices.According to an embodiment of the invention,
Referring to Fig.1, which includes: chip oxygen sensor 100；Pump oxygen component 200, the pump oxygen component 200 and
Heater lead in the chip oxygen sensor 100 is electrically connected (to be drawn it should be noted that heater is not shown in Figure 1
Line；In addition, the straight line expression in Fig. 1 between chip oxygen sensor 100 and pump oxygen component 200 is electrically connected, only Fig. 1 shows herein
Such electrical connection out only shows the position in chip oxygen sensing device 10 between each structure and component in other accompanying drawings and closes
System, does not show that electrical connection), the partial pressure on the heater lead is electric for giving the pump oxygen component 200 to apply pump oxygen
Stream, the pump oxygen component 200 are used to (reference gas be not shown in Figure 1 to the reference air flue of the chip oxygen sensor 100
Road) the fresh oxygen of middle conveying.Inventors have found that 10 structure of chip oxygen sensing device is simple, cost is relatively low, airtightness is wanted
It asks not high, without additional configuration additional circuit auxiliary element, that is, may make the oxygen in reference gas road more fresh, and then realize
Relatively accurately measure the concentration of oxygen.
According to an embodiment of the invention, referring to Fig. 2 a, in the chip oxygen sensing device, setting pump oxygen component and chip oxygen
Heater lead in sensor is electrically connected, so that chip oxygen sensor is at work, control unit is applied to chip oxygen sensing
The resistance that a part partial pressure of the voltage U of heater in device acts on heater (acts on the partial pressure note of the resistance of heater
For U1), and be electrically connected due to pumping oxygen component with heater lead, another part voltage (is denoted as U2, it should be noted that this
Locate U2=U-U1, it will be understood by those skilled in the art that U1With U2Relationship can be according to heater resistance R1With pump oxygen component and plus
The resistance R of hot device lead2Between relationship determine) be applied on the pump oxygen component and heater lead so that pump oxygen component
In there is electric current so that pump oxygen component work normally, fresh oxygen is transported to the reference of the chip oxygen sensor
In air flue, so that the chip oxygen sensing device may make in reference gas road without additional configuration additional circuit auxiliary element
Oxygen it is more fresh, and then realize the concentration for relatively accurately measuring oxygen, and structure is simple, cost is relatively low, wants to airtightness
Ask not high, it is easy to accomplish industrialized production.
In some embodiments of the invention, referring to Fig. 2 a and Fig. 8, in the chip oxygen sensing device 10, oxygen group is pumped
Part is electrically connected with the heater lead 152b in chip oxygen sensor, so that chip oxygen sensor 10 is at work, control unit
A part partial pressure of the voltage U for the heater 151 being applied in chip oxygen sensor 10 acts on the resistance of heater 151, and
Since pump oxygen component is electrically connected with heater lead 152b, another part voltage U2It is applied to the pump oxygen component and heating
On device lead.The partial pressure being applied on the pump oxygen component is with the partial pressure being applied on the heater lead according to pump oxygen component
It determines with the resistance sizes of heater lead, specifically, carries out in the chip oxygen sensing device 10 in use, can pass through
Resistance is adjusted to come so that pump there are several microamperes to pass through to the electric current of few tens of microamps in oxygen component, and then pump oxygen component can be made normal
Work, fresh oxygen is transported in the reference air flue of the chip oxygen sensor so that the chip oxygen sensing device without
Additional circuit auxiliary element need to be additionally configured, that is, may make the oxygen in reference gas road more fresh, and then realization is more accurate
The concentration of ground measurement oxygen.
According to an embodiment of the invention, referring to Fig. 2 b, in the chip oxygen sensing device 10, chip oxygen sensor 100
Resistance R0With voltage U0Between relationship, it is no longer excessive superfluous herein for the relationship of resistance and voltage in conventional chip oxygen sensor
It states.
According to an embodiment of the invention, the pump oxygen component may include: pump oxygen electrolyte layer 210, described referring to Fig. 3
Pump oxygen electrolyte layer 210 is arranged on the lower surface of the chip oxygen sensor 100；Pump electrode 220 in oxygen, electricity in the pump oxygen
Pole 220 is arranged on the upper surface of the pump oxygen electrolyte layer 210；Oxygen external electrode 230 is pumped, the pump oxygen external electrode 230 is arranged
On the lower surface of the pump oxygen electrolyte layer 210.10 structure of chip oxygen sensing device is simple as a result, cost is relatively low, to close
Closing property is of less demanding, without additional configuration additional circuit auxiliary element, that is, may make the oxygen in reference gas road more fresh, into
And further realize the concentration for relatively accurately measuring oxygen.
According to an embodiment of the invention, forming the pump oxygen electrolyte layer 210 in the pump oxygen component, electrode 220 in pump oxygen
With the material and pump oxygen electrolyte layer 210 of pump oxygen external electrode 230, the thickness for pumping electrode 220 and pump oxygen external electrode 230 in oxygen
Deng being the material and thickness of conventional pumps oxygen component, for example, it is equal to form the material of electrode 220 and pump oxygen external electrode 230 in pump oxygen
It can be platinum etc., the material for forming pump oxygen electrolyte layer 210 can be Zirconia electrolytic etc., and pump oxygen electrolyte layer 210, pump
The thickness of electrode 220 and pump oxygen external electrode 230, those skilled in the art can carry out flexible choice according to actual needs in oxygen,
It no longer excessively repeats herein.
According to an embodiment of the invention, the pump oxygen component can also include: the first ventilative protective layer 240 referring to Fig. 4,
The first ventilative protective layer 240 is arranged on the lower surface of the pump oxygen external electrode 230；And first insulating layer 250, it is described
The lower surface that the pump oxygen electrolyte layer 210 is not covered by the described first ventilative protective layer 240 is arranged in first insulating layer 250
On, and the pump oxygen external electrode lead being electrically connected with the pump oxygen external electrode 230 is covered (it should be noted that not showing in Fig. 4
Oxygen external electrode lead is pumped out).The first ventilative protective layer 240 can play protection well to pump oxygen external electrode 230 and make as a result,
With, and since the described first ventilative protective layer 240 is that gas can be by playing good guarantor to pump oxygen external electrode 230
While shield acts on, the normal work of pump oxygen component will not be had an impact；First insulating layer 250 can be for pump oxygen electrolysis
It matter layer 210 and plays a very good protection with the pump oxygen external electrode lead that be electrically connected of pump oxygen external electrode 230, breathes freely due to first
250 pairs of pump oxygen components of protective layer 240 and the first insulating layer play a very good protection jointly, will not influence pump oxygen component just
Often work, and structure is simple, cost is relatively low, therefore chip oxygen sensing device can be made without additional configuration additional circuit auxiliary
Element may make the oxygen in reference gas road more fresh, and then further realize the concentration for relatively accurately measuring oxygen.
According to an embodiment of the invention, as long as the material for forming the first ventilative protective layer 240 can be can permit gas
Pass through, and can also play a protective role to the pump oxygen external electrode 230, such as forms the material of the first ventilative protective layer
Material can be porous aluminas；The material for forming the first insulating layer 250 can be aluminium oxide etc..Material source is extensive, easy as a result,
, and cost is relatively low, and the insulation performance of chip oxygen sensing device 10 can be made preferable.
According to an embodiment of the invention, the chip oxygen sensor 10 includes the sense being stacked from top to bottom referring to Fig. 5
Answer electrolyte layer 110, at least one air flue layer 140 and heating layer 150, the upper and lower surface difference of the induction electrolyte layer 110
It is provided with induction external electrode 130 and incudes interior electrode 120, be provided with reference air flue 141, the heating on the air flue layer 140
Having heaters 151 and the heater lead 152, the heater lead 152 and the heating are set on the upper surface of layer 150
Device 151 is electrically connected and extends along the length direction of the heating layer 150, is additionally provided with first through hole along the heating layer 150
153, the pump oxygen component conveys fresh oxygen into the reference air flue 141 by the first through hole 153.Institute as a result,
The structure for stating chip oxygen sensing device 10 is relatively simple, cost is relatively low, by offering first through hole 153 on heating layer 150, pumps
Oxygen component conveys fresh oxygen into the reference air flue 141, so that the oxygen in reference air flue 141 is more fresh, in turn
Realize that the chip oxygen sensing device 10 can relatively accurately measure the concentration of oxygen.
According to an embodiment of the invention, electrode in forming the induction electrolyte layer 110 in the chip oxygen sensor, incuding
120 and induction external electrode 130 material and induction electrolyte layer 110, incude in electrode 120 and incude external electrode 130 thickness
Degree etc. is the material and thickness of conventional chip oxygen sensor, incudes interior electrode 120 and induction external electrode 130 for example, being formed
Material all can be platinum, the material for forming induction electrolyte layer 110 can incude electrolyte layer for Zirconia electrolytic etc.
110, the thickness of electrode 120 and induction external electrode 130, those skilled in the art can carry out flexibly according to actual needs in incuding
Selection, no longer excessively repeats herein.
According to an embodiment of the invention, forming the material of the air flue layer 140 and the heating layer can make pottery for aluminium oxide
Porcelain.Hardness is higher as a result, and the mechanical property of chip oxygen sensing device 10 can be made preferable, excellent insulation performance, and material comes
Source is extensive, is easy to get, and cost is relatively low.
According to an embodiment of the invention, the number of the air flue layer may be multiple, reference Fig. 6, below with described
The case where tool of formula oxygen sensing device 10 is there are two air flue layer 140a, 140b to be illustrated.The sensing dress of chip oxygen shown in Fig. 6
Setting 10 tools, there are two air flue layer 140a, 140b, corresponding, are respectively arranged with reference on two air flue layers 140a, 140b
Air flue 141a, 141b.In some embodiments of the invention, on the length direction of the heating layer 150, the first through hole
153 in the orthographic projection on the heating layer 150 and the heater lead 152 between the orthographic projection on the heating layer 150
There are gaps.In other embodiments of the invention, on the length direction of the heating layer 150, with the heating layer 150
Orthographic projection and the heater lead of the reference air flue 141a on the heating layer 150 in the adjacent air flue layer 140a
152 there are gaps between the orthographic projection on the heating layer 150.Thus, it is possible to which the heater lead 152 is avoided to block institute
First through hole 153 or reference air flue are stated, the service performance of the chip oxygen sensing device 10 is preferable, and the service life is long, good reliability.
According to an embodiment of the invention, being provided with gas port 111 referring to Fig. 6 on the induction electrolyte layer 110, being located at
Reference air flue 141b in the air flue layer 140b of top layer is connected with the gas port 111.As a result, compared to related skill
In art, gas port is arranged in the side edge of the reference air flue of chip oxygen sensing device, the setting of gas port 110 is electrolysed in induction
On matter layer 110, the distance that ambient atmos reach in the gas passage of chip oxygen sensor 10 is shorter, and chip oxygen can be made to sense
Gas exchange rate in device 10 is very fast, and then the performance of chip oxygen sensor 10 is preferable.
According to an embodiment of the invention, referring to Fig. 7, the chip oxygen sensor 100 further include: the second ventilative protective layer
160, the second ventilative protective layer 160 is arranged on the upper surface of the induction external electrode 130；Second insulating layer 170, it is described
The upper surface that the induction electrolyte layer 110 is not covered by the described second ventilative protective layer 160 is arranged in second insulating layer 170
On, and the induction external electrode lead being electrically connected with the induction external electrode 130 is covered (it should be noted that not showing in Fig. 7
External electrode lead is incuded out).The second ventilative protective layer 160 can play protection well to induction external electrode 130 and make as a result,
With, and since the described second ventilative protective layer 160 is that gas can be by playing good guarantor to induction external electrode 130
While shield acts on, the normal work of chip oxygen sensor 100 will not be had an impact；Second insulating layer 170 can be for
Induction electrolyte layer 110 and the induction external electrode lead being electrically connected with induction external electrode 130 play a very good protection, due to
Second ventilative protective layer 160 and second insulating layer 170 play a very good protection jointly to chip oxygen sensor 100, will not
The normal work of chip oxygen sensor 100 is influenced, therefore the long service life of chip oxygen sensing device can be made, it is further real
Now relatively accurately measure the concentration of oxygen.
According to an embodiment of the invention, as long as the material for forming the second ventilative protective layer 160 can be can permit gas
Pass through, and can also play a protective role to the induction external electrode 130, such as forms the second ventilative protective layer 160
Material can be porous aluminas；The material for forming second insulating layer 170 can be aluminium oxide etc..Material source is wide as a result,
It is general, be easy to get, and cost is relatively low, and the insulation performance of chip oxygen sensing device 10 can be made preferable.
According to an embodiment of the invention, the quantity of the heater 151 is multiple, and in the heating layer referring to Fig. 9
In 150 width direction, multiple heater 151a, 151b, 151c, 151d are symmetrically distributed in described reference air flue 141a, 141b
Two sides.Chip oxygen sensing device 10 is symmetrical structure as a result, and sintering stress reduces, and bending degree and mechanical property can be shown
It writes and improves, and then the chip oxygen sensing device 10 can satisfy the severe operating condition of petrol engine and can overcome well strong
Strong vibration is to chip oxygen sensing device 10 itself and the accuracy bring adverse effect measured to oxygen.
According to an embodiment of the invention, the chip oxygen sensing device 10 further include: the second through-hole, second through-hole pass through
The heating layer and the pump oxygen electrolyte layer are worn, for drawing the pump oxygen external electrode lead；Third through-hole, the third are logical
The pump oxygen electrolyte layer and first insulating layer are run through in hole, for drawing pump oxygen internal electrode lead-wire；Fourth hole, described
Four through-holes run through the heating layer, the pump oxygen electrolyte layer and first insulating layer, for drawing the heater lead；
Fifth hole, the fifth hole runs through the second insulating layer, for drawing the induction external electrode lead；6th through-hole,
6th through-hole runs through the second insulating layer and the induction electrolyte layer, for drawing induction internal electrode lead-wire.As a result,
It can be capable of forming circuit, chip oxygen between each structure and component in the pump oxygen component 200 in chip oxygen sensing device 10
Sensor 100 can also form current loop, to realize fresh to conveying in the reference air flue in chip oxygen sensor 100
Oxygen may make the oxygen in reference gas road more fresh to realize without additional configuration additional circuit auxiliary element, into
And realize the concentration for relatively accurately measuring oxygen.In an embodiment of the present invention, the second through-hole in chip oxygen sensing device 10,
How third through-hole, fourth hole, fifth hole and the 6th through-hole specifically make chip oxygen sensor 100 and pump oxygen component
Current loop is formed in 200, is carried out specifically below in conjunction with a specific embodiment of the invention and attached drawing 8 and attached drawing 9
It is bright.
In a specific embodiment of the invention, referring to Fig. 8 and Fig. 9, which is from top to bottom wrapped
Chip oxygen sensor and pump oxygen component are included, in chip oxygen sensor and pump oxygen component, forms induction electrolyte layer 110 and pump oxygen
The material of electrolyte layer 210 is zirconia material, forms pump oxygen external electrode 230, pump oxygen external electrode lead 231, pumps electrode in oxygen
220, pump oxygen internal electrode lead-wire 221, heater 151, heater lead 152a, 152b, electrode 120 in induction, incude in electrode
Lead 121, incudes the material of external electrode lead 131 for platinum at induction external electrode 130, and the material for forming other structures all can be
Alumina material.In addition, being respectively arranged with the second ventilative protection in induction external electrode 130 and the outer surface for pumping oxygen external electrode 230
Layer 160 and the first ventilative protective layer 240.Reference air flue 141a, 141b are respectively arranged on air flue layer 140a, 140b.Heating layer
First through hole 153 is provided on 150, the first through hole 153 is not present with orthographic projection of the heater 151 on heating layer 150
Overlapping.It is provided with gas port 110 on the induction electrolyte layer 110, the reference in the air flue layer 140b of top layer
Air flue 141b is connected with the gas port 110, and the realization external world is communicated with reference air flue.Second through-hole 300 adds through described
Thermosphere 150 and the pump oxygen electrolyte layer 210, for drawing 230 lead of pump oxygen external electrode；Third through-hole 400 runs through institute
Pump oxygen electrolyte layer 210 and first insulating layer 250 are stated, for drawing pump oxygen internal electrode lead-wire 221；Fourth hole 500 passes through
The heating layer 150, the pump oxygen electrolyte layer 210 and first insulating layer 250 are worn, for drawing the heater lead
152b；Fifth hole 600 runs through the second insulating layer 170, for drawing the induction external electrode lead 131；6th through-hole
700 run through the second insulating layer 170 and the induction electrolyte layer 110, for drawing induction internal electrode lead-wire 121, as a result,
It can be capable of forming circuit, chip oxygen between each structure and component in the pump oxygen component 200 in chip oxygen sensing device 10
Sensor 100 can also form current loop, to realize fresh to conveying in the reference air flue in chip oxygen sensor 100
Oxygen may make the oxygen in reference gas road more fresh to realize without additional configuration additional circuit auxiliary element, into
And realize the concentration for relatively accurately measuring oxygen.
According to an embodiment of the invention, the production method of chip oxygen sensing device of the present invention may include: curtain coating,
Punching, silk-screen, punching and lamination.It is simple, convenient as a result, it is easy to accomplish, it is easy to industrialized production.
According to an embodiment of the invention, the purpose of the curtain coating is to make zirconia ceramics ceramic chips, aluminium oxide ceramics
Material of the ceramic chips as structure and component in chip oxygen sensor device, specifically, zirconia ceramics ceramic chips, aluminium oxide pottery
Porcelain ceramic chips can be to be made of film strips tape casting technology, and thickness range can be 0.1mm~0..25mm.?
In some embodiments of the present invention, as zirconia ceramics ceramic chips of the material of structure and component in chip oxygen sensing device,
The thickness of aluminium oxide ceramics green ceramic chip can be 0.1mm, 0.15mm, 0.2mm, 0.25mm etc..Resulting chip oxygen is made as a result,
The thickness of sensor device is suitable, structure is simple, particularly suitable for be assemblied in the exhaust pipe of engine ternary catalyzing unit it is attached
Closely, convenient for relatively accurately measuring the concentration of oxygen.
According to an embodiment of the invention, the purpose of the punching is forming induction electrolyte layer, the first insulating layer, the
Two insulating layers, heating layer and pump oxygen electrolyte layer above make mentioned-above second through-hole, third through-hole, fourth hole,
Fifth hole and the 6th through-hole, in some embodiments of the invention, the first through hole can also be made by punching,
Specifically, the mode of punching can be is carried out by the way of mechanical punching.In some embodiments of the invention, each to guarantee
The connection of lead, the circular aperture that each through-hole can be 0.15~0.3mm for 1~4 diameter.Specifically, of each through-hole
Number can be 2, and diameter can be 0.15mm, 0.2mm, 0.25mm, 0.3mm etc..It is simple, convenient as a result, it is easy real
It is existing, it is easy to industrialized production.
According to an embodiment of the invention, the silk-screen be using screen printing technique on chip oxygen sensing device 10 silk
Print platinum slurry.For example, it may be in induction 110 upper and lower surface of electrolyte layer difference silk-screen induction external electrode 130 and induction
Electrode 120, the upper surface silk-screen heater 151 of heating layer 150 and heater lead 152, pump 210 upper and lower surface of oxygen electrolyte layer
Electrode 220 and pump oxygen external electrode 230 in silk-screen pump oxygen respectively pump electrode 220 and pump oxygen external electrode in oxygen for example, referring to Fig. 8
230 are in contact by pump oxygen internal electrode lead-wire 221 with the both ends for pumping oxygen external electrode lead 231 and heater lead 152b respectively.
Furthermore it is also possible to realize filling perforation by silk-screen on the position of each through-hole.Thus, it is possible to make in chip oxygen sensing device 10
Current loop is formed, and simple, convenient, it is easy to accomplish.
According to an embodiment of the invention, the punching is using punching or to cut technology in the first insulating layer 250 and second
It is punched out square hole on insulating layer 170, the first ventilative protective layer 240 is inlayed for subsequent production and the second ventilative protective layer 160 is used.
In addition, being also punched out reference air flue on air flue layer, it can also be and be punched out first through hole on heating layer 150.
According to an embodiment of the invention, the lamination is each structure that will make the chip oxygen sensing device 10, portion
Part, stacks gradually together, and chip oxygen sensing device 10 is made by equal static pressure, cutting, dumping and sintering process.It is above each
Process conditions, parameter of a step etc. are common process condition, parameter, no longer excessively repeat herein.
In another aspect of the invention, the present invention provides a kind of exhaust pipes of engine.According to an embodiment of the invention,
At least one mentioned-above chip oxygen sensing device is provided near the ternary catalyzing unit of the exhaust pipe of engine.Inventor
It was found that the concentration of oxygen can be relatively accurately measured in the tail gas of exhaust pipe of engine discharge, so that user can be with
Make engine reach ideal air-fuel ratio by the correction-compensation of control closed loop fuel injection, and then improves motor vehicle row
Put and improve fuel economy.
It is closed according to an embodiment of the invention, being connected between the structure of the ternary catalyzing unit, component, each structure and component
Setting position, quantity and the distribution etc. of system and ternary catalyzing unit on the exhaust pipe of engine, are in the related technology
The setting of conventional three-way catalyst converter, those skilled in the art can carry out flexible choice according to actual needs, no longer excessive herein
It repeats.
According to an embodiment of the invention, as long as the chip oxygen sensor, which meets its position, to be arranged in the exhaust pipe of engine
Ternary catalyzing unit near, quantity and distribution are specifically set and are not particularly restricted, those skilled in the art can be with
Flexible choice is carried out according to actual needs.
According to an embodiment of the invention, it will be understood by those skilled in the art that it includes front institute that the exhaust pipe of engine, which removes,
Other than the ternary catalyzing unit stated and the mentioned-above chip oxygen sensing device being arranged near the ternary catalyzing unit, may be used also
To include structure and component that other conventional engine exhaust pipes have, no longer excessively repeat herein.
According to an embodiment of the invention, the chip oxygen sensing device is electrically connected by electrode pin with external circuit.As a result,
It is powered by external circuit to chip oxygen sensing device, chip oxygen sensing device is worked normally.
In an additional aspect of the present invention, the present invention provides a kind of motor vehicles.According to an embodiment of the invention, this is motor-driven
Vehicle includes the mentioned-above exhaust pipe of engine.Inventors have found that the engine of the motor vehicle can achieve ideal sky
Ratio is fired, and then improves the fuel economy of the motor vehicle.
According to an embodiment of the invention, it will be understood by those skilled in the art that it includes noted earlier for removing in the motor vehicle
The exhaust pipe of engine other than, can also include the structure that has of other conventional maneuver vehicles and component, no longer excessively repeat herein.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise ", " axial direction ", " radial direction ", " circumferential direction " be orientation based on the figure or
Positional relationship is merely for convenience of description of the present invention and simplification of the description, rather than the device or element of indication or suggestion meaning must
There must be specific orientation, be constructed and operated in a specific orientation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more of the features.In the description of the present invention, the meaning of " plurality " is two or more,
Unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc.
Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be mechanical connect
It connects, is also possible to be electrically connected；It can be directly connected, can also can be in two elements indirectly connected through an intermediary
The interaction relationship of the connection in portion or two elements.It for the ordinary skill in the art, can be according to specific feelings
Condition understands the concrete meaning of above-mentioned term in the present invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature in the second feature " on " or " down " can be with
It is that the first and second features directly contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature be directly above or diagonally above the second feature, or be merely representative of
First feature horizontal height is higher than second feature.Fisrt feature can be under the second feature " below ", " below " and " below "
One feature is directly under or diagonally below the second feature, or is merely representative of first feature horizontal height less than second feature.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are not
It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be in office
It can be combined in any suitable manner in one or more embodiment or examples.In addition, without conflicting with each other, the skill of this field
Art personnel can tie the feature of different embodiments or examples described in this specification and different embodiments or examples
It closes and combines.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, modifies, replacement and variant.
Claims (12)
1. a kind of chip oxygen sensing device characterized by comprising
Chip oxygen sensor；
Oxygen component is pumped, the pump oxygen component is electrically connected with the heater lead in the chip oxygen sensor, and the heater draws
For applying pump oxygen electric current to the pump oxygen component, the pump oxygen component is used for the chip oxygen sensor partial pressure on line
Fresh oxygen is conveyed in reference air flue.
2. chip oxygen sensing device according to claim 1, which is characterized in that the pump oxygen component includes:
Oxygen electrolyte layer is pumped, the pump oxygen electrolyte layer is arranged on the lower surface of the chip oxygen sensor；
Electrode in oxygen is pumped, electrode is arranged on the upper surface of the pump oxygen electrolyte layer in the pump oxygen；
Oxygen external electrode is pumped, the pump oxygen external electrode is arranged on the lower surface of the pump oxygen electrolyte layer.
3. chip oxygen sensing device according to claim 2, which is characterized in that the pump oxygen component further include:
First ventilative protective layer, the first ventilative protective layer are arranged on the lower surface of the pump oxygen external electrode；
First insulating layer, the first insulating layer setting are not covered by the described first ventilative protective layer in the pump oxygen electrolyte layer
Lower surface on, and cover and pump the pump oxygen external electrode lead that is electrically connected of oxygen external electrode with described.
4. chip oxygen sensing device according to claim 3, which is characterized in that the chip oxygen sensor include from up to
Under the induction electrolyte layer, at least one air flue layer and the heating layer that are stacked,
The upper and lower surface of the induction electrolyte layer is respectively arranged with induction external electrode and incudes interior electrode,
It is provided with reference air flue on the air flue layer,
Having heaters and the heater lead, the heater lead and the heating are set on the upper surface of the heating layer
Device is electrically connected and extends along the length direction of the heating layer,
First through hole is additionally provided on the heating layer, the pump oxygen component is by the first through hole into the reference air flue
Convey fresh oxygen.
5. chip oxygen sensing device according to claim 4, which is characterized in that on the length direction of the heating layer,
The first through hole on the heating layer orthographic projection and the heater lead between the orthographic projection on the heating layer
There are gaps.
6. chip oxygen sensing device according to claim 5, which is characterized in that on the length direction of the heating layer,
Orthographic projection and the heater of the reference air flue on the heating layer in the air flue layer adjacent with the heating layer is drawn
There are gaps between the orthographic projection on the heating layer for line.
7. chip oxygen sensing device according to claim 6, which is characterized in that be provided with gas on the induction electrolyte layer
Road junction, the reference air flue in the air flue layer of top layer are connected with the gas port.
8. chip oxygen sensing device according to claim 4, which is characterized in that the quantity of the heater is multiple, and
In the width direction of the heating layer, multiple heaters are symmetrically distributed in the two sides of the reference air flue.
9. chip oxygen sensing device according to claim 4, which is characterized in that the chip oxygen sensor further include:
Second ventilative protective layer, the second ventilative protective layer are arranged on the upper surface of the induction external electrode；
Second insulating layer, the second insulating layer setting are not covered by the described second ventilative protective layer in the induction electrolyte layer
Upper surface on, and cover and incude the induction external electrode lead that is electrically connected of external electrode with described.
10. chip oxygen sensing device according to claim 9, which is characterized in that further include:
Second through-hole, second through-hole runs through the heating layer and the pump oxygen electrolyte layer, for drawing outside the pump oxygen
Contact conductor；
Third through-hole, the third through-hole run through the pump oxygen electrolyte layer and first insulating layer, for drawing in pump oxygen
Contact conductor；
Fourth hole, the fourth hole run through the heating layer, the pump oxygen electrolyte layer and first insulating layer, are used for
Draw the heater lead；
Fifth hole, the fifth hole runs through the second insulating layer, for drawing the induction external electrode lead；
6th through-hole, the 6th through-hole run through the second insulating layer and the induction electrolyte layer, for drawing in induction
Contact conductor.
11. a kind of exhaust pipe of engine, which is characterized in that be provided near the ternary catalyzing unit of the exhaust pipe of engine to
A few chip oxygen sensing device according to any one of claims 1 to 10.
12. a kind of motor vehicle, which is characterized in that including the exhaust pipe of engine described in claim 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811517939.XA CN109613099A (en) | 2018-12-12 | 2018-12-12 | Chip oxygen sensing device, the exhaust pipe of engine and motor vehicle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811517939.XA CN109613099A (en) | 2018-12-12 | 2018-12-12 | Chip oxygen sensing device, the exhaust pipe of engine and motor vehicle |
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| CN109613099A true CN109613099A (en) | 2019-04-12 |
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| CN201811517939.XA Pending CN109613099A (en) | 2018-12-12 | 2018-12-12 | Chip oxygen sensing device, the exhaust pipe of engine and motor vehicle |
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Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000121604A (en) * | 1998-10-13 | 2000-04-28 | Ngk Spark Plug Co Ltd | Gas sensor |
| WO2001029546A2 (en) * | 1999-10-20 | 2001-04-26 | Delphi Technologies, Inc. | Method and device for pumping oxygen into a gas sensor |
| US6723217B1 (en) * | 1999-10-20 | 2004-04-20 | Delphi Technologies, Inc. | Method and device for pumping oxygen into a gas sensor |
| US20040084309A1 (en) * | 2002-11-01 | 2004-05-06 | Ngk Spark Plug Co., Ltd. | Gas sensor having a laminate comprising solid electrolyte layers and alumina substrate |
| CN106370712A (en) * | 2016-09-28 | 2017-02-01 | 成都凯天电子股份有限公司 | Zirconium sheet type chip oxygen sensor and preparation method thereof |
| CN106706727A (en) * | 2016-12-30 | 2017-05-24 | 莱鼎电子材料科技有限公司 | Chip-type wide-range automobile oxygen sensor and preparation method thereof |
| CN107741447A (en) * | 2017-11-13 | 2018-02-27 | 嘉兴佳利电子有限公司 | The chip oxygen sensor ceramic chip that a kind of zirconia ceramics burns altogether with aluminium oxide ceramics |
| CN108120756A (en) * | 2018-01-29 | 2018-06-05 | 上海艾瓷传感科技有限公司 | A kind of sensing element of micro lambda sensor |
| CN108318563A (en) * | 2018-01-29 | 2018-07-24 | 上海艾瓷传感科技有限公司 | A kind of oxygenerator oxygen concentration detection sensor |
| CN108732224A (en) * | 2018-06-06 | 2018-11-02 | 成都科锐传感技术有限公司 | A kind of Novel double-battery matrix formula broad domain oxygen sensor and preparation method thereof |
| CN108872349A (en) * | 2018-06-21 | 2018-11-23 | 西安创联电气科技（集团）有限责任公司 | The test method and device of nitrogen oxide sensor ceramic chip gas sensing property |
| CN108956741A (en) * | 2018-06-06 | 2018-12-07 | 成都科锐传感技术有限公司 | A kind of automobile-used chip oxygen sensor of Novel double-battery type motor and preparation method thereof |
| CN209745869U (en) * | 2018-12-12 | 2019-12-06 | 厦门海赛米克新材料科技有限公司 | sheet type oxygen sensing device, engine exhaust pipe and motor vehicle |
-
2018
- 2018-12-12 CN CN201811517939.XA patent/CN109613099A/en active Pending
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000121604A (en) * | 1998-10-13 | 2000-04-28 | Ngk Spark Plug Co Ltd | Gas sensor |
| WO2001029546A2 (en) * | 1999-10-20 | 2001-04-26 | Delphi Technologies, Inc. | Method and device for pumping oxygen into a gas sensor |
| US6723217B1 (en) * | 1999-10-20 | 2004-04-20 | Delphi Technologies, Inc. | Method and device for pumping oxygen into a gas sensor |
| US20040084309A1 (en) * | 2002-11-01 | 2004-05-06 | Ngk Spark Plug Co., Ltd. | Gas sensor having a laminate comprising solid electrolyte layers and alumina substrate |
| CN106370712A (en) * | 2016-09-28 | 2017-02-01 | 成都凯天电子股份有限公司 | Zirconium sheet type chip oxygen sensor and preparation method thereof |
| CN106706727A (en) * | 2016-12-30 | 2017-05-24 | 莱鼎电子材料科技有限公司 | Chip-type wide-range automobile oxygen sensor and preparation method thereof |
| CN107741447A (en) * | 2017-11-13 | 2018-02-27 | 嘉兴佳利电子有限公司 | The chip oxygen sensor ceramic chip that a kind of zirconia ceramics burns altogether with aluminium oxide ceramics |
| CN108120756A (en) * | 2018-01-29 | 2018-06-05 | 上海艾瓷传感科技有限公司 | A kind of sensing element of micro lambda sensor |
| CN108318563A (en) * | 2018-01-29 | 2018-07-24 | 上海艾瓷传感科技有限公司 | A kind of oxygenerator oxygen concentration detection sensor |
| CN108732224A (en) * | 2018-06-06 | 2018-11-02 | 成都科锐传感技术有限公司 | A kind of Novel double-battery matrix formula broad domain oxygen sensor and preparation method thereof |
| CN108956741A (en) * | 2018-06-06 | 2018-12-07 | 成都科锐传感技术有限公司 | A kind of automobile-used chip oxygen sensor of Novel double-battery type motor and preparation method thereof |
| CN108872349A (en) * | 2018-06-21 | 2018-11-23 | 西安创联电气科技（集团）有限责任公司 | The test method and device of nitrogen oxide sensor ceramic chip gas sensing property |
| CN209745869U (en) * | 2018-12-12 | 2019-12-06 | 厦门海赛米克新材料科技有限公司 | sheet type oxygen sensing device, engine exhaust pipe and motor vehicle |
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