CN104977345A - Novel limited current type sheet-type oxygen sensor - Google Patents
Novel limited current type sheet-type oxygen sensor Download PDFInfo
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- CN104977345A CN104977345A CN201510389868.XA CN201510389868A CN104977345A CN 104977345 A CN104977345 A CN 104977345A CN 201510389868 A CN201510389868 A CN 201510389868A CN 104977345 A CN104977345 A CN 104977345A
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Abstract
A novel limited current type sheet-type oxygen sensor is characterized in that a chip main body is composed of six layers of zirconium flow-casting sheets, namely a first-layer flow-casting substrate (1), a second-layer flow-casting substrate (2), a third-layer flow-casting substrate (3), a fourth-layer flow-casting substrate (4), a fifth-layer flow-casting substrate (5), and a sixth-layer flow-casting substrate (6); the first-layer flow-casting substrate (1) closely clings to the second-layer flow-casting substrate (2); the oxygen sensor has a compact and solid structure, is sensitive to response, and can stably work at high temperatures; and besides, the preparation process is simple, the production efficiency is high, and the stability is good.
Description
Technical field
The present invention relates to a kind of chip oxygen sensor, be specifically a kind of rational in infrastructure, technique is simple, yield rate is high and the novel limited current type chip oxygen sensor that properties of product are stable.
Background technology
Current zirconium dioxide based sensor mainly comprises lambda sensor and NOx sensor, and the lambda sensor for air-fuel ration control is classified by principle of work, can be divided three classes: (1) concentration cell type; (2) galvanochemistry pump-type; (3) oxide semiconductor-type.In three kinds of lambda sensors, only have galvanochemistry pump-type lambda sensor in lean-burn systems, galvanochemistry pump-type lambda sensor is divided into again limit-current type oxygen sensor and broad domain oxygen sensor.
The lean burn control system of Toyota Company's first Application in 1984.The object of this system is, improves the utilization factor of fuel, in the harmful gas purging amount of guarantee lower than on the basis of setting.Control air-fuel ratio (14.7≤A/F≤23) in a limited scope to be very important, because by increasing air-fuel ratio, burn in the scope (A/F>20) of lean burn, the concentration of NOx can be made to be reduced within allowed band.If but continuation increase air-fuel ratio easily makes engine kill, causes output power to decline, simultaneously due to burn incompletely, pollutes but more serious.In order to control air-fuel ratio, in lean-burn systems, also to use lambda sensor to control the air-fuel ratio of engine exhaust.And its utilization is lean air fuel ratio sensor (i.e. limit-current type oxygen sensor).
Current domestic limit-current type oxygen sensor does not also break away from the situation of long-term dependence on import, mainly monopolize by the product of Japan, Japan's limit-current type oxygen sensor mainly adopts aluminium oxide and the superimposed manufacturing technology of zirconia cast sheet, the present invention is a kind of limit-current type oxygen sensor that ceramic main body carries out designing based on zirconium dioxide cast sheet, its structure is simple, preparation technology is simple, with low cost.
Summary of the invention
The technical problem to be solved in the present invention is to provide that a kind of structure is simple, process stabilizing, performance are good, the novel limited current type lambda sensor that cost is low.
The object of the invention is to be achieved through the following technical solutions:
1. a novel limited current type chip oxygen sensor, it is characterized in that: chip body is made up of 6 layers 250 μm thick zirconium cast sheet, for ground floor curtain coating substrate 1, second layer curtain coating substrate 2, third layer curtain coating substrate 3, 4th laminar flow epitaxial substrate 4, layer 5 curtain coating substrate 5, layer 6 curtain coating substrate 6, ground floor curtain coating substrate 1 and second layer curtain coating substrate 2 are close to, diffusion barrier layer curtain coating substrate 7 is distributed with from top to bottom successively in the top position, left side of ground floor curtain coating substrate 1 along chip body length direction, gas stablizes cavity 9, the head of chemical pumping external electrode 11, the upper surface insulation 10 of chemical pumping dispatch from foreign news agency polar curve is followed successively by from top to bottom in the top position, right side of ground floor curtain coating substrate 1, the afterbody of chemical pumping external electrode 11 and the lower surface insulation 12 of chemical pumping dispatch from foreign news agency polar curve, it is adhesive layer 8 that gas is stablized between cavity 9 two side portions connection diffusion barrier layer curtain coating substrate 7 and ground floor curtain coating substrate 1,
Be distributed with the head of chemical inner pump electrode 16 from top to bottom successively at the left side lower position of second layer curtain coating substrate 2 along chip body length direction, air reference channel 19, the upper surface insulation 15 of electrode wires in chemical pumping is distributed with from top to bottom successively in the lower right-hand side position of second layer curtain coating substrate 2, the afterbody of chemistry inner pump electrode 16, the upper surface insulation 17 of electrode wires in chemical pumping, air reference channel 19, it is third layer curtain coating substrate 3 that air reference channel 19 two side portions connects between second layer curtain coating substrate 2 and the 4th laminar flow epitaxial substrate 4; In order to derive the lead-in wire of chemical inner pump electrode 16, have ground floor curtain coating substrate chemistry inner pump electrode fairlead 13 at the pin place of ground floor curtain coating substrate 1, and have the chemical inner pump electrode fairlead 14 of second layer curtain coating substrate 2 at the pin place of second layer curtain coating substrate 2;
Heating electrode 21 is distributed with layer 5 curtain coating substrate 5 junction at the 4th laminar flow epitaxial substrate 4, and heating electrode upper surface insulation 20, heating electrode lower surface insulation 22;
Layer 5 curtain coating substrate 5 and layer 6 curtain coating substrate 6 are close to, in order to derive the lead-in wire of heating electrode 21, layer 5 curtain coating substrate 5 has layer 5 curtain coating substrate heating electrode fairlead 23, layer 6 curtain coating substrate 6 has layer 6 curtain coating substrate heating electrode fairlead 24; The lower surface of layer 6 curtain coating substrate 6 is provided with a heating pin electrode 26, is also provided with between layer 6 curtain coating substrate 6 lower surface and heating pin electrode 26 upper surface and heats pin insulation course 25.
Described ground floor curtain coating substrate 1, second layer curtain coating substrate 2, third layer curtain coating substrate the 3, four laminar flow epitaxial substrate 4, layer 5 curtain coating substrate 5, layer 6 curtain coating substrate 6 is zirconia curtain coating substrate, and its thickness is 250 ± 5um.
Described zirconia curtain coating substrate is main powder with 5mol yttria-stabilized zirconia, add solvent, spreading agent, cementing agent and plastifier, casting slurry is made by ball-milling method, through casting machine curtain coating drying and shaping, cut-parts, punching forms, and the mass ratio of described Zirconium powder, solvent, spreading agent, cementing agent, plastifier is: 1000:(300 ~ 500): (10 ~ 30): (50 ~ 80): (20 ~ 40).
Described diffusion barrier layer curtain coating substrate 7 is main powder with 5mol yttria-stabilized zirconia, take nano carbon black as pore creating material, add solvent, spreading agent, cementing agent and plastifier, casting slurry is made by ball-milling method, through casting machine curtain coating drying and shaping, cut-parts, punching forms, and the mass ratio of described Zirconium powder, carbon dust, solvent, spreading agent, cementing agent, plastifier is: 1000:(10 ~ 100): (300 ~ 500): (10 ~ 30): (50 ~ 80): (20 ~ 40).
Described adhesive layer 8 is PVA, PVB or layer of PVC.
Compared with prior art, the invention has the beneficial effects as follows: provide a kind of chip oxygen sensor, this lambda sensor compact conformation is solid, is quick on the draw, work that also can be stable under high temperature, and its preparation section is simple simultaneously, highly efficient in productivity, good stability.
Accompanying drawing explanation
Fig. 1 is the structural representation of the length direction of a kind of Novel chip-type oxygen sensor of the present invention.
Fig. 2 is the structural representation in the left side width direction of a kind of Novel chip-type oxygen sensor of the present invention.
Embodiment
Below in conjunction with specific embodiment, concrete technical scheme of the present invention is described.
Embodiment 1
A kind of novel limited current type chip oxygen sensor, it is characterized in that: chip body is made up of 6 layers 250 μm thick zirconium cast sheet, for ground floor curtain coating substrate 1, second layer curtain coating substrate 2, third layer curtain coating substrate 3, 4th laminar flow epitaxial substrate 4, layer 5 curtain coating substrate 5, layer 6 curtain coating substrate 6, ground floor curtain coating substrate 1 and second layer curtain coating substrate 2 are close to, diffusion barrier layer curtain coating substrate 7 is distributed with from top to bottom successively in the top position, left side of ground floor curtain coating substrate 1 along chip body length direction, gas stablizes cavity 9, the head of chemical pumping external electrode 11, the upper surface insulation 10 of chemical pumping dispatch from foreign news agency polar curve is followed successively by from top to bottom in the top position, right side of ground floor curtain coating substrate 1, the afterbody of chemical pumping external electrode 11 and the lower surface insulation 12 of chemical pumping dispatch from foreign news agency polar curve, it is adhesive layer 8 that gas is stablized between cavity 9 two side portions connection diffusion barrier layer curtain coating substrate 7 and ground floor curtain coating substrate 1,
Be distributed with the head of chemical inner pump electrode 16 from top to bottom successively at the left side lower position of second layer curtain coating substrate 2 along chip body length direction, air reference channel 19, the upper surface insulation 15 of electrode wires in chemical pumping is distributed with from top to bottom successively in the lower right-hand side position of second layer curtain coating substrate 2, the afterbody of chemistry inner pump electrode 16, the upper surface insulation 17 of electrode wires in chemical pumping, air reference channel 19, it is third layer curtain coating substrate 3 that air reference channel 19 two side portions connects between second layer curtain coating substrate 2 and the 4th laminar flow epitaxial substrate 4; In order to derive the lead-in wire of chemical inner pump electrode 16, have ground floor curtain coating substrate chemistry inner pump electrode fairlead 13 at the pin place of ground floor curtain coating substrate 1, and have the chemical inner pump electrode fairlead 14 of second layer curtain coating substrate 2 at the pin place of second layer curtain coating substrate 2;
Heating electrode 21 is distributed with layer 5 curtain coating substrate 5 junction at the 4th laminar flow epitaxial substrate 4, and heating electrode upper surface insulation 20, heating electrode lower surface insulation 22;
Layer 5 curtain coating substrate 5 and layer 6 curtain coating substrate 6 are close to, in order to derive the lead-in wire of heating electrode 21, layer 5 curtain coating substrate 5 has layer 5 curtain coating substrate heating electrode fairlead 23, layer 6 curtain coating substrate 6 has layer 6 curtain coating substrate heating electrode fairlead 24; The lower surface of layer 6 curtain coating substrate 6 is provided with a heating pin electrode 26, is also provided with between layer 6 curtain coating substrate 6 lower surface and heating pin electrode 26 upper surface and heats pin insulation course 25.
Described ground floor curtain coating substrate 1, second layer curtain coating substrate 2, third layer curtain coating substrate the 3, four laminar flow epitaxial substrate 4, layer 5 curtain coating substrate 5, layer 6 curtain coating substrate 6 is zirconia curtain coating substrate, and its thickness is 250um.
Described zirconia curtain coating substrate is main powder with 5mol yttria-stabilized zirconia, add solvent, spreading agent, cementing agent and plastifier, casting slurry is made by ball-milling method, through casting machine curtain coating drying and shaping, cut-parts, punching forms, and the mass ratio of described Zirconium powder, solvent, spreading agent, cementing agent, plastifier is: 1000:300:10:50:20.
Described diffusion barrier layer curtain coating substrate is main powder with 5mol yttria-stabilized zirconia, take nano carbon black as pore creating material, add solvent, spreading agent, cementing agent and plastifier, casting slurry is made by ball-milling method, through casting machine curtain coating drying and shaping, cut-parts, punching forms, and the mass ratio of described Zirconium powder, carbon dust, solvent, spreading agent, cementing agent, plastifier is: 1000:10:300:10:50:20.
Described adhesive layer 8 is PVA.
Embodiment 2
Novel limited current type chip oxygen sensor structure in embodiment 2 is identical with embodiment 1; Its curtain coating substrate thickness is 255um.
Described zirconia curtain coating substrate is main powder with 5mol yttria-stabilized zirconia, add solvent, spreading agent, cementing agent and plastifier, casting slurry is made by ball-milling method, through casting machine curtain coating drying and shaping, cut-parts, punching forms, and the mass ratio of described Zirconium powder, solvent, spreading agent, cementing agent, plastifier is: 1000:500:30:80:40.
Described diffusion barrier layer curtain coating substrate is main powder with 5mol yttria-stabilized zirconia, take nano carbon black as pore creating material, add solvent, spreading agent, cementing agent and plastifier, casting slurry is made by ball-milling method, through casting machine curtain coating drying and shaping, cut-parts, punching forms, and the mass ratio of described Zirconium powder, carbon dust, solvent, spreading agent, cementing agent, plastifier is: 1000:15:500:30:80:40.
Described adhesive layer 8 is PVB layer.
Embodiment 3
Novel limited current type chip oxygen sensor structure in embodiment 3 is identical with embodiment 1; Its curtain coating substrate thickness is 245um.
Described zirconia curtain coating substrate is main powder with 5mol yttria-stabilized zirconia, add solvent, spreading agent, cementing agent and plastifier, casting slurry is made by ball-milling method, through casting machine curtain coating drying and shaping, cut-parts, punching forms, and the mass ratio of described Zirconium powder, solvent, spreading agent, cementing agent, plastifier is: 1000:400:20:65:30.
Described diffusion barrier layer curtain coating substrate is main powder with 5mol yttria-stabilized zirconia, take nano carbon black as pore creating material, add solvent, spreading agent, cementing agent and plastifier, casting slurry is made by ball-milling method, through casting machine curtain coating drying and shaping, cut-parts, punching forms, and the mass ratio of described Zirconium powder, carbon dust, solvent, spreading agent, cementing agent, plastifier is: 1000:20:400:25:65:30.
Described adhesive layer 8 is layer of PVC.
The zirconia that this limiting-current sensor applies stabilized with yttrium oxide has the function leading oxonium ion at high operating temperatures, first certain heating voltage is led to heating electrode, sensor head is made to reach working temperature, tail gas by diffusion barrier layer stable be diffused in gas reaction cavity, interior electrode is connected with air, represent the oxygen concentration in air, owing to having difference in oxygen concentration between tail gas and air, so apply a voltage between chemical pumping internal and external electrode, external electrode connects positive pole, interior electrode connects negative pole, the stable movement of oxonium ion can be formed, form stable limiting current platform, each limiting current value represents an oxygen concentration value, thus reach the object of oxygen determination.Be specially vehicle exhaust by diffusion barrier layer 7 uniform and stable be diffused in reaction chamber 9, certain voltage is applied between chemical inner pump electrode 16 and chemical pumping external electrode 11, the displacement of oxonium ion will be formed, limiting current will be formed, size of current just can the concentration of oxygen in reaction end gas, thus reach test purpose.
Each performance parameter of lambda sensor embodiment prepared detects as follows:
A sensor flatness detects: lain in by sensor on the worktable of high-flatness, with Thickness measuring instrument, gets three points respectively test at the head of sensor, middle part, afterbody, and except protective seam region and track region, thickness difference is less than 0.20mm;
B sensor leakage is tested: by leakage tester, and apply the pressure of 380KPa to the air reference channel of sensor, leakage rate is less than 0.08ml/min;
C sensor strength test: destructive strength test is carried out to lambda sensor, lambda sensor bending strength is more than 790MPa;
D. sensor heating resistor test: by the normal temperature resistance value of multimeter by heating pin test heating electrode, resistance deviation is less than ± 0.5 Ω, can design from the heating resistor between 2 ~ 9 Ω according to vehicle difference;
E. sensor good insulation preformance;
F. this limit-current type oxygen sensor accurately can measure the scope of λ from 0.68 ~ air.
Therefore the claimed Limiting Current Oxygen Sensors of the present invention can replace the limit-current type oxygen sensor of import in the market.
Claims (5)
1. a novel limited current type chip oxygen sensor, it is characterized in that: chip body is made up of 6 layers of zirconium cast sheet, for ground floor curtain coating substrate (1), second layer curtain coating substrate (2), third layer curtain coating substrate (3), 4th laminar flow epitaxial substrate (4), layer 5 curtain coating substrate (5), layer 6 curtain coating substrate (6), ground floor curtain coating substrate (1) and second layer curtain coating substrate (2) are close to, diffusion barrier layer curtain coating substrate (7) is distributed with from top to bottom successively in the top position, left side of ground floor curtain coating substrate (1) along chip body length direction, gas stablizes cavity (9), the head of chemical pumping external electrode (11), upper surface insulation (10) of chemical pumping dispatch from foreign news agency polar curve is followed successively by from top to bottom in the top position, right side of ground floor curtain coating substrate (1), the afterbody of chemical pumping external electrode (11) and lower surface insulation (12) of chemical pumping dispatch from foreign news agency polar curve, it is adhesive layer (8) that gas is stablized between cavity (9) two side portions connection diffusion barrier layer curtain coating substrate (7) and ground floor curtain coating substrate (1),
Be distributed with the head of chemical inner pump electrode (16) from top to bottom successively at the left side lower position of second layer curtain coating substrate (2) along chip body length direction, air reference channel (19), upper surface insulation (15) of electrode wires in chemical pumping is distributed with from top to bottom successively in the lower right-hand side position of second layer curtain coating substrate (2), the afterbody of chemistry inner pump electrode (16), upper surface insulation (17) of electrode wires in chemical pumping, air reference channel (19); It is third layer curtain coating substrate (3) that air reference channel (19) two side portions connects between second layer curtain coating substrate (2) and the 4th laminar flow epitaxial substrate (4); In order to derive the lead-in wire of chemical inner pump electrode (16), have ground floor curtain coating substrate chemistry inner pump electrode fairlead (13) at the pin place of ground floor curtain coating substrate (1), and have the chemical inner pump electrode fairlead (14) of second layer curtain coating substrate (2) at the pin place of second layer curtain coating substrate (2);
Heating electrode (21) is distributed with in the 4th laminar flow epitaxial substrate (4) and layer 5 curtain coating substrate (5) junction, and heating electrode upper surface insulation (20), heating electrode lower surface insulation (22);
Layer 5 curtain coating substrate (5) and layer 6 curtain coating substrate (6) are close to, in order to derive the lead-in wire of heating electrode (21), layer 5 curtain coating substrate (5) has layer 5 curtain coating substrate heating electrode fairlead (23), layer 6 curtain coating substrate (6) has layer 6 curtain coating substrate heating electrode fairlead (24); The lower surface of layer 6 curtain coating substrate (6) is provided with a heating pin electrode (26), is also provided with between layer 6 curtain coating substrate (6) lower surface and heating pin electrode (26) upper surface and heats pin insulation course (25).
2. Novel chip-type oxygen sensor as claimed in claim 1, it is characterized in that: described ground floor curtain coating substrate (1), second layer curtain coating substrate (2), third layer curtain coating substrate (3), 4th laminar flow epitaxial substrate (4), layer 5 curtain coating substrate (5), layer 6 curtain coating substrate (6) is zirconia curtain coating substrate, and its thickness is 250 ± 5um.
3. Novel chip-type oxygen sensor as claimed in claim 2, it is characterized in that: described zirconia curtain coating substrate is main powder with 5mol yttria-stabilized zirconia, add solvent, spreading agent, cementing agent and plastifier, casting slurry is made by ball-milling method, through casting machine curtain coating drying and shaping, cut-parts, punching forms, and the mass ratio of described Zirconium powder, solvent, spreading agent, cementing agent, plastifier is: 1000:(300 ~ 500): (10 ~ 30): (50 ~ 80): (20 ~ 40).
4. Novel chip-type oxygen sensor as claimed in claim 1, it is characterized in that: described diffusion barrier layer curtain coating substrate (7) is main powder with 5mol yttria-stabilized zirconia, take nano carbon black as pore creating material, add solvent, spreading agent, cementing agent and plastifier, casting slurry is made by ball-milling method, through casting machine curtain coating drying and shaping, cut-parts, punching forms, described Zirconium powder, carbon dust, solvent, spreading agent, cementing agent, the mass ratio of plastifier is: 1000:(10 ~ 100): (300 ~ 500): (10 ~ 30): (50 ~ 80): (20 ~ 40).
5. Novel chip-type oxygen sensor as claimed in claim 1, is characterized in that: described adhesive layer (8) is PVA, PVB or layer of PVC.
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN108645907A (en) * | 2018-04-24 | 2018-10-12 | 武汉泽科宁电子科技有限公司 | A kind of carrying current formula linear oxygen sensors and manufacturing method |
CN110988084A (en) * | 2019-12-27 | 2020-04-10 | 苏州溢亮材料科技有限公司 | Durable sheet type oxygen sensor |
CN111257392A (en) * | 2019-12-27 | 2020-06-09 | 苏州溢亮材料科技有限公司 | Symmetrical structure potential type oxygen sensor |
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CN203949895U (en) * | 2014-06-16 | 2014-11-19 | 深圳市普利斯通传感科技有限公司 | A kind of chip wide domain oxygen sensor chip |
CN104251876A (en) * | 2014-09-18 | 2014-12-31 | 莱鼎电子材料科技有限公司 | Novel disc type oxygen sensor and preparation method and detection method thereof |
CN204302219U (en) * | 2014-09-18 | 2015-04-29 | 莱鼎电子材料科技有限公司 | A kind of Novel chip-type oxygen sensor |
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Patent Citations (3)
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CN203949895U (en) * | 2014-06-16 | 2014-11-19 | 深圳市普利斯通传感科技有限公司 | A kind of chip wide domain oxygen sensor chip |
CN104251876A (en) * | 2014-09-18 | 2014-12-31 | 莱鼎电子材料科技有限公司 | Novel disc type oxygen sensor and preparation method and detection method thereof |
CN204302219U (en) * | 2014-09-18 | 2015-04-29 | 莱鼎电子材料科技有限公司 | A kind of Novel chip-type oxygen sensor |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN108645907A (en) * | 2018-04-24 | 2018-10-12 | 武汉泽科宁电子科技有限公司 | A kind of carrying current formula linear oxygen sensors and manufacturing method |
CN108645907B (en) * | 2018-04-24 | 2023-10-24 | 武汉泽科宁电子科技有限公司 | Limit current type linear oxygen sensor and manufacturing method |
CN110988084A (en) * | 2019-12-27 | 2020-04-10 | 苏州溢亮材料科技有限公司 | Durable sheet type oxygen sensor |
CN111257392A (en) * | 2019-12-27 | 2020-06-09 | 苏州溢亮材料科技有限公司 | Symmetrical structure potential type oxygen sensor |
CN111257392B (en) * | 2019-12-27 | 2022-12-20 | 苏州溢亮材料科技有限公司 | Symmetrical structure potential type oxygen sensor |
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