CN107741242B - The preparation method of shield type sensor terminal - Google Patents
The preparation method of shield type sensor terminal Download PDFInfo
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- CN107741242B CN107741242B CN201710802173.9A CN201710802173A CN107741242B CN 107741242 B CN107741242 B CN 107741242B CN 201710802173 A CN201710802173 A CN 201710802173A CN 107741242 B CN107741242 B CN 107741242B
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- positive electrode
- electrode layer
- type sensor
- shield type
- layer
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
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- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
Abstract
The present invention provides a kind of preparation method of shield type sensor terminal, comprising the following steps: prepares the coiled material of composite layer；It is in single shield type sensor by coiled material cutting；Cut off the material of part on positive electrode layer；Plus end is squeezed on positive electrode layer, the surface that the lower surface of plus end is exposed with positive electrode layer is bonded conducting；Negative terminal is squeezed into from the side of shield type sensor, across the hollowed out area of positive electrode layer, until the other side of shield type sensor.It the advantage is that and realize face contact conducting；Negative terminal passes through the hollowed out area in positive electrode and is connected through entire shield type sensor with negative electrode；Increase two layers of transversal metal covering；Increase the terminal for squeezing into ground electrode, as long as redundant terminals can work normally, the ground of the sensor is still reliably connected；Improve the electrical contact performance of terminal.
Description
Technical field
The present invention relates to a kind of preparation methods of shield type sensor terminal.
Background technique
Under conditions of roll-to-roll production full-shield type sensor, sensor is often juxtaposed in a width appropriate
Single sensor is cut by degree again after producing and completing.Due to the relationship of material thickness, even if using state-of-the-art right
Neat technology, with the increase of distance, shielded layer can form increasing error with corresponding stratum.So in the mistake of production
Shielded layer is often all covered electrode by Cheng Zhong, and is abandoned hollow out and gone out some patterns.Such processing mode is beating metal end
One of technique is increased when sub-, i.e., is stripped out positive electrode correspondingly, then into the processing for beating terminal.
Beat in this way terminal mode although avoid with the contact on metal ground, but because terminal and metal be longitudinal
Transversal face contact, under the influence of subsequent technique (such as solder terminal) and use environment (pullling stress), terminal part is often
Small displacement be will form to cause the open circuit of sensor, prevent its signal from drawing, i.e., so-called " poor contact " situation.
The situation causes certain fraction defective.
Summary of the invention
A kind of preparation method of shield type sensor terminal of offer of the invention, solves existing technical problem, with gram
Take the defect of the prior art.
The present invention provides a kind of preparation method of shield type sensor terminal, comprising the following steps:
Step A, the coiled material of composite layer is prepared；Composite layer include at least one layer of positive electrode layer, at least one layer of positive electrode layer with
And the non-conductive layer between positive electrode layer, positive electrode layer；Have in positive electrode layer in the corresponding position of each shield type sensor
Hollowed out area；
Step B, by coiled material cutting be in single shield type sensor, the positive electrode layer of each shield type sensor have to
A few hollowed out area；
Step C, the material for cutting off part on positive electrode layer, is completely exposed the metal surface of positive electrode layer；
Step D, terminal is squeezed into；
Step D-1, plus end is squeezed on positive electrode layer, the surface that the lower surface of plus end is exposed with positive electrode layer is bonded
Conducting；
Step D-2, negative terminal is squeezed into from the side of shield type sensor, across the hollowed out area of positive electrode layer, until screen
Cover the other side of type sensor.
Further, the present invention provides a kind of preparation method of shield type sensor terminal, can also have the following features:
Step D-2 is before squeezing into negative terminal, in positive electrode layer hollowed out area position, any one surface of shield type sensor or two
One layer of conductive layer of surface mount；Negative terminal squeezes into shield type sensor from conductive layer, across the hollowed out area of positive electrode layer, until
The other side.
Further, the present invention provides a kind of preparation method of shield type sensor terminal, can also have the following features:
The width of conductive layer is not more than the width of positive electrode layer hollowed out area.
Further, the present invention provides a kind of preparation method of shield type sensor terminal, can also have the following features:
It is bonded between positive electrode layer, positive electrode layer, non-conductive layer in step A using colloid.
Further, the present invention provides a kind of preparation method of shield type sensor terminal, can also have the following features:
Step C is carried out before colloid is fully cured.
Further, the present invention provides a kind of preparation method of shield type sensor terminal, can also have the following features:
The surface of the excision mode of the material of part on step C positive electrode layer, vertical screen type sensor is cut to positive electrode layer, then
Material on positive electrode layer is removed.
Further, the present invention provides a kind of preparation method of shield type sensor terminal, can also have the following features:
After removing material, it is processed by shot blasting on exposed positive electrode layer surface.
Further, the present invention provides a kind of preparation method of shield type sensor terminal, can also have the following features:
The quantity of negative terminal is at least two.
Further, the present invention provides a kind of preparation method of shield type sensor terminal, can also have the following features:
It further include step E, the welding lead on plus end and any one negative terminal.
The present invention provides a kind of preparation method of shield type sensor terminal, and positive electrode part is led with plus end face contact
It is logical；Negative terminal passes through the hollowed out area in positive electrode and is connected through entire shield type sensor with negative electrode；In corresponding ground electrode
One layer of metal tape of the bonding partially of position increases two layers of transversal metal covering；Increase the terminal for squeezing into ground electrode, Yi Xieduan
Son is idle, and as redundant terminals, remaining terminal can weld or stress；Other terminals by external condition damage when
It waits, as long as redundant terminals can work normally, the ground of the sensor is still reliably connected；Improve the electrical contact performance of terminal.
Detailed description of the invention
Fig. 1 is the cross-sectional structure figure of the compound layer coiled material of shield type sensor.
Fig. 2 is the cross-sectional structure figure of single shield type sensor.
Fig. 3 is the shield type sensor cross-section structure chart for cutting off the material of part on positive electrode layer.
Fig. 4 is the structure chart for having welded the shield type sensor of terminal.
Detailed description of the invention:
- 20 insulating layer -30 of -10 positive electrode layer of insulating protective layer
Insulation -50 sensing element layer -60 of colloid of positive electrode layer -40
- 80 conductive tape -90 of -70 insulating protective layer of positive electrode layer
- 100 negative terminal -200 of -41 plus end of hollowed out area
Specific embodiment
The present invention will be further described in the following with reference to the drawings and specific embodiments.
Step A, the coiled material of composite layer is prepared.
Fig. 1 is the cross-sectional structure figure of the compound layer coiled material of shield type sensor.
As shown in Figure 1, the compound layer coiled material of the shield type sensor in the present embodiment, by insulating protective layer 10, negative electrode
Layer 20, insulating layer 30, positive electrode layer 40, insulation colloid 50, sensing element layer 60, positive electrode layer 70, insulating protective layer 80 are successively
It is laminated.There is hollowed out area 41 in the corresponding position of each shield type sensor in positive electrode layer 40.
The number of plies and material of the compound layer coiled material of shield type sensor can be set according to actual needs, and be not limited to this implementation
The structure indicated in example.Non-conducting material between positive electrode layer 40 and positive electrode layer 20,70 is referred to as non-conductive layer.Each function
There is one layer of insulation colloid to guarantee the bonding between each layer between ergosphere, present case only draws the insulation colloid on positive electrode
50 to illustrate the contents of the present invention.
It step B, is in single shield type sensor by coiled material cutting.
Fig. 2 is the cross-sectional structure figure of single shield type sensor.
Dotted line of the coiled material in Fig. 1 is cut into single shield type sensor as shown in Figure 2.Each shield type sensor
Positive electrode layer 40 all have a hollowed out area 41.Hollowed out area 41 on positive electrode layer 40, which is one, a fixed length and width
Pocket, guarantee the entire electrode of sense film be still to be connected.
General each shield type sensor is identical, that is to say, that hollowed out area is placed equidistant in coiled material.
Certainly, the multiple hollowed out areas 41 of setting be can according to need in the positive electrode layer 40 of each shield type sensor, so as to negative terminal
It can beat in different positions.This when, hollowed out area 41 was not just individually to be evenly distributed with, when prepared by coiled material with a shield type
Hollowed out area in sensor is uniformly distributed at an entirety.
Step C, the material of part on positive electrode layer is cut off.
Fig. 3 is the shield type sensor cross-section structure chart for cutting off the material of part on positive electrode layer.
Before insulation colloid 50 is fully cured, along the surface of dotted line vertical screen type sensor shown in Fig. 2 to positive electricity
Pole layer cutting, then removes the material on positive electrode layer.
So-called to be fully cured, the colloid that exactly insulate needs certain curing time, is just able to achieve firm bonding effect.?
It is connected before being fully cured, between positive electrode layer 40 and sensing element layer 60 not exclusively secured.Because the type for the colloid that insulate is very
It is more, it gives one example, such as a kind of insulation colloid, in the environment of 60 degree, needing to solidify 3 days can just be fully cured.So walk
Rapid C is just carried out in the case where solidifying 1 to 2 day.That is the one third of time is fully cured to three points in insulation colloid
Two time in, carry out the material of part on excision positive electrode layer.This ensure that insulation colloid has certain adhesiveness,
But also the insulation colloid can be torn.
Still some insulation colloid 50 is bonded in the surface of positive electrode layer 40 after tearing.Blade or sand can be used at this time
The devices such as wheel are processed by shot blasting the surface of positive electrode layer 40, expose positive electrode layer metal completely.
Step D, terminal is squeezed into.
Fig. 4 is the structure chart for having welded the shield type sensor of terminal.
As shown in figure 4, step D-1, squeezing into plus end
Plus end is squeezed on positive electrode layer 40, the surface that the lower surface of plus end 100 is exposed with positive electrode layer 40 is bonded
Conducting.
The case where senser element Jing Guo polishing treatment does not beat plus end is that metal terminal and positive electrode are only longitudinal
Contact, the way of contact are easy in actual use because of the case where various extraneous physical actions cause poor contact.This
The shield type sensor of invention, the positive electrode layer of plus end 100 and sensor after positive electrode layer surface is processed by shot blasting
Metal be face contact, significantly enhance reliability.
Step D-2, negative terminal is squeezed into.
In 41 position of the hollowed out area of positive electrode layer 40, the upper and lower surface of shield type sensor pastes one layer of conductive layer；When
Right conductive layer can wrap up the surrounding of entire sensor to realize.In the present embodiment, conductive layer is conductive tape 90, can be copper
Foil or any electric conductor.The width of conductive layer is not more than the width of positive electrode layer hollowed out area.Terminal position so easily.
The metal layer of the conduction forms connected structure and additional thickness up and down.
In the present embodiment, there are three negative terminals 200 for shield type sensor tool, all squeeze into shielding from the conductive tape 90 of side
Type sensor, across the hollowed out area of positive electrode layer 40 41, until the conductive tape 90 of the other side.Negative terminal 200 and conducting resinl
Band 90 realizes face contact conducting.
In actual use, the effect of redundant terminals need to could be formed using 2 or more terminals.It can be seen that a terminal by
To pullling, after the cross section of the physical factors such as Overheating Treatment and negative electrode disconnects, sensing elements table still can use
Terminal that the metal on conductive tape that face paste is closed does not do any processing with another keeps face contact.It is big in this way
The reliability of terminal is improved greatly.
It should be noted that step D-1 squeeze into plus end and step D-2 to squeeze into negative terminal subdivision successive.
Step E, the welding lead on plus end 100 and any one negative terminal 200.When welding, conductive layer 90 can also be risen
To protecting the insulating protective layer 10,80 of two sides not to be burned.
It further illustrates, before some materials on step C excision positive electrode layer, and the packet of conductive layer can be carried out
It wraps up in, then squeezes into negative terminal.Two processes not impression progress relatively, but conventional will not operate in this way.In addition, welding step can
It is directly welded after corresponding terminal with squeezing into, it is not necessary to which whole terminals, which have been beaten, to be welded.Of course, it is possible to terminal and conducting wire
After first welding, then squeeze into shield type sensor.
Claims (9)
1. a kind of preparation method of shield type sensor terminal, it is characterised in that: the following steps are included:
Step A, the coiled material of composite layer is prepared；Composite layer includes at least one layer of positive electrode layer, at least one layer of positive electrode layer and just
Non-conductive layer between electrode layer, positive electrode layer；There is hollow out in the corresponding position of each shield type sensor in positive electrode layer
Region；
It step B, is in single shield type sensor by coiled material cutting, the positive electrode layer of each shield type sensor has at least one
A hollowed out area；
Step C, the material for cutting off part on positive electrode layer, is completely exposed the metal surface of positive electrode layer；
Step D, terminal is squeezed into；
Step D-1, plus end is squeezed on positive electrode layer, the lower surface of the plus end surface exposed with positive electrode layer, which is bonded, leads
It is logical；
Step D-2, negative terminal is squeezed into from the side of shield type sensor, across the hollowed out area of positive electrode layer, until shield type
The other side of sensor.
2. the preparation method of shield type sensor terminal as described in claim 1, it is characterised in that:
Step D-2 is before squeezing into negative terminal, in positive electrode layer hollowed out area position, any one surface of shield type sensor or
Two surface mounts, one layer of conductive layer；
Negative terminal squeezes into shield type sensor from conductive layer, across the hollowed out area of positive electrode layer, until the other side.
3. the preparation method of shield type sensor terminal as claimed in claim 2, it is characterised in that: the width of conductive layer is little
Width in positive electrode layer hollowed out area.
4. the preparation method of shield type sensor terminal as described in claim 1, it is characterised in that: the positive electrode in step A
Layer, positive electrode layer are bonded using colloid between non-conductive layer.
5. the preparation method of shield type sensor terminal as claimed in claim 4, it is characterised in that: step C is complete in colloid
It is carried out before solidification.
6. the preparation method of shield type sensor terminal as claimed in claim 5, it is characterised in that: in step C, positive electrode layer
The excision mode of the material of upper part are as follows: the surface of vertical screen type sensor is cut to positive electrode layer, then by positive electrode layer
On material remove.
7. the preparation method of shield type sensor terminal as claimed in claim 6, it is characterised in that: after removing material, naked
The positive electrode layer surface of dew is processed by shot blasting.
8. the preparation method of shield type sensor terminal as claimed in claim 2, it is characterised in that: the quantity of negative terminal is extremely
It is two few.
9. the preparation method of shield type sensor terminal as claimed in claim 8, it is characterised in that:
It further include step E, the welding lead on plus end and any one negative terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710802173.9A CN107741242B (en) | 2017-09-07 | 2017-09-07 | The preparation method of shield type sensor terminal |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710802173.9A CN107741242B (en) | 2017-09-07 | 2017-09-07 | The preparation method of shield type sensor terminal |
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| CN107741242A CN107741242A (en) | 2018-02-27 |
| CN107741242B true CN107741242B (en) | 2019-09-10 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04106884A (en) * | 1990-08-27 | 1992-04-08 | Shin Etsu Polymer Co Ltd | Connector and connection of electrode |
| WO2004054442A1 (en) * | 2002-12-13 | 2004-07-01 | Leonhard Lang Kg | Medical electrode |
| CN103843079A (en) * | 2011-07-29 | 2014-06-04 | 泰科电子日本合同会社 | Ptc device |
| CN105092114A (en) * | 2015-04-28 | 2015-11-25 | 深圳市豪恩声学股份有限公司 | Pressure sensor, intelligent shoe pad, intelligent shoe, and manufacturing method of pressure sensor |
| CN105870319A (en) * | 2016-04-26 | 2016-08-17 | 贝骨新材料科技（上海）有限公司 | Roll-to-roll manufacturing method of long-strip piezoelectric film sensor |
-
2017
- 2017-09-07 CN CN201710802173.9A patent/CN107741242B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04106884A (en) * | 1990-08-27 | 1992-04-08 | Shin Etsu Polymer Co Ltd | Connector and connection of electrode |
| WO2004054442A1 (en) * | 2002-12-13 | 2004-07-01 | Leonhard Lang Kg | Medical electrode |
| CN103843079A (en) * | 2011-07-29 | 2014-06-04 | 泰科电子日本合同会社 | Ptc device |
| CN105092114A (en) * | 2015-04-28 | 2015-11-25 | 深圳市豪恩声学股份有限公司 | Pressure sensor, intelligent shoe pad, intelligent shoe, and manufacturing method of pressure sensor |
| CN105870319A (en) * | 2016-04-26 | 2016-08-17 | 贝骨新材料科技（上海）有限公司 | Roll-to-roll manufacturing method of long-strip piezoelectric film sensor |
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| Publication number | Publication date |
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| CN107741242A (en) | 2018-02-27 |
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