CN107734895A - Electronic equipment, housing and preparation method thereof - Google Patents
Electronic equipment, housing and preparation method thereof Download PDFInfo
- Publication number
- CN107734895A CN107734895A CN201711145432.1A CN201711145432A CN107734895A CN 107734895 A CN107734895 A CN 107734895A CN 201711145432 A CN201711145432 A CN 201711145432A CN 107734895 A CN107734895 A CN 107734895A
- Authority
- CN
- China
- Prior art keywords
- shell
- insert portion
- casting
- electronic device
- inwall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 109
- 238000005266 casting Methods 0.000 claims abstract description 47
- 239000002184 metal Substances 0.000 claims abstract description 32
- 229910052751 metal Inorganic materials 0.000 claims abstract description 32
- 239000000919 ceramic Substances 0.000 claims abstract description 22
- 239000003292 glue Substances 0.000 claims description 35
- 229920003023 plastic Polymers 0.000 claims description 15
- 239000004033 plastic Substances 0.000 claims description 10
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 25
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000012545 processing Methods 0.000 abstract description 3
- 239000011257 shell material Substances 0.000 description 87
- 239000000843 powder Substances 0.000 description 7
- 230000000875 corresponding effect Effects 0.000 description 6
- 238000001746 injection moulding Methods 0.000 description 6
- 238000003754 machining Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000007769 metal material Substances 0.000 description 5
- 239000012780 transparent material Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The present invention is on a kind of electronic equipment, housing and preparation method thereof, is related to technical field of electronic equipment, mainly solving the technical problems that during processing metal shell, production yield rate is relatively low.Casting of electronic device, including：The shell of first material, the inwall of shell is formed with receiving space；The insert portion of second material, insert portion are arranged on the inwall of shell, have at least one location structure for localized external part on insert portion, wherein, the first material is ceramics, or the first material is metal.Relative to prior art, can meet the needs of consumer's ceramic package, meanwhile, the fine structure on casting of electronic device is located at insert portion, easy to process, and the shell yield rate of separable assembled is higher.
Description
Technical field
The present invention relates to technical field of electronic equipment, more particularly to a kind of electronic equipment, housing and preparation method thereof.
Background technology
The electronic equipments such as mobile phone, wrist-watch, tablet personal computer, its outward appearance are the main focus of consumer.
Inventor has found during the present invention is realized, because the volume of electronic equipment in itself is generally limited, in electronics
The precision of the parts of device interior is higher, common, casting of electronic device using integrally formed plastic casing or
It is integrally formed metal shell, due to forming the supporting construction of inner components, such as bolt on the inwall of integrated casing
The fine structures such as hole, buckle, the tolerance of fine structure is higher, and for plastic casing, fraction defective is relatively low, but for metal
Shell, when being molded such as bolt hole, buckle fine structure, tolerance is larger, causes fraction defective higher, and it is higher to solve fraction defective
Method is to need the machining precision equipment of specialty, and the cost for machining precision equipment is generally higher so that the life of metal shell
Produce costly.
The content of the invention
In view of this, the present invention provides a kind of electronic equipment, housing and preparation method thereof, when processing metal shell, no
On the basis of increasing production cost, production yield is improved.
To reach above-mentioned purpose, present invention generally provides following technical scheme：
On the one hand, embodiments of the invention provide a kind of electronic equipment housing, including：
The shell of first material, the inwall of the shell is formed with receiving space；
The insert portion of second material, the insert portion are arranged on the inwall of the shell, on the insert portion
With at least one location structure for localized external part, wherein, first material is ceramics, or first material
For metal.
The object of the invention to solve the technical problems can be also applied to the following technical measures to achieve further.
Optionally, foregoing casting of electronic device, wherein first material and second material are different materials,
Second material uses plastic material.
Optionally, foregoing casting of electronic device, wherein the inwall of the shell includes the first positionable wall in a ring, institute
Stating the outer wall of insert portion includes the second positionable wall in a ring, and the second annular positionable wall inserts the first positionable wall of annular,
Pasted between first positionable wall and second positionable wall by glue.
Optionally, foregoing casting of electronic device, wherein the ring of the annular surface of the first positionable wall and/or the second positionable wall
Shape surface offers annular groove.
Optionally, foregoing casting of electronic device, wherein being provided with the first location division on the shell；
The second location division is provided with the insert portion, first location division and second location division are mutually fixed
Position.
Optionally, foregoing casting of electronic device, wherein the location structure includes：Bolt hole, card hole, screen post,
At least one of data line interface.
Optionally, foregoing casting of electronic device, wherein the casting of electronic device be Watchcase or phone housing or
Panel computer shell.
On the other hand, embodiments of the invention provide a kind of electronic equipment, including：
Above-mentioned casting of electronic device；
Electronic unit, it is arranged in the receiving space.
Another further aspect, embodiments of the invention provide the preparation method of a kind of electronic equipment housing, including：
The shell of the first material is prepared, the shell is interior, and formed with for receiving space, first material is ceramics, or
First material is metal, and the shell is molded by metal powder injection molding or casting technique；
The insert portion of the second material is prepared, there is the location structure for localized external part on the insert portion,
Wherein, first material is ceramics, and second material is different materials from first material；
The insert portion is bonded on the inwall of the shell, forms the casting of electronic device.
The object of the invention to solve the technical problems can be also applied to the following technical measures to achieve further.
Optionally, foregoing preparation method, wherein second material is transparent plastic material, it is described described to embed
Part is bonded on the inwall of the shell, forms the casting of electronic device, is specially：
Shadowless glue is arranged between the insert portion of transparent plastic material and the inwall of shell；
By insert portion described in ultraviolet light irradiation, solidify shadowless glue, the shell and the insert portion are consolidated
It is shaped as the casting of electronic device.
By above-mentioned technical proposal, electronic equipment that technical solution of the present invention provides, housing and preparation method thereof at least have
There are following advantages：
In technical scheme provided in an embodiment of the present invention, the shell of electronic equipment includes the shell and second of the first material
Two parts of insert portion of material, the material of insert portion can be selected the material of fine structure easy to process, make what is processed
The tolerance of location structure on insert portion is content with very little requirement, and shell uses ceramic material, can produce the electricity of ceramic package
Sub- equipment, relative to prior art, can meet the needs of consumer's ceramic package, meanwhile, the accurate knot on casting of electronic device
Structure is located at insert portion, easy to process, and the shell yield rate of separable assembled is higher.
Common, the shell overall precision being molded by metal powder injection molding or casting technique is not high, is prepared in metal
Shell on the higher location structure of requirement on machining accuracy, it is also necessary to professional machining precision equipment, machine precision equipment
Cost it is generally higher so that the producing cost of metal shell is higher, referring now to prior art, in the embodiment of the present invention, embeds
The material of fine structure easy to process can be selected in the material of part, makes the tolerance of location structure on the insert portion that processes easy
In meeting requirement, shell uses metal material, can produce the electronic equipment of metal shell, relative to prior art, can meet
The demand of consumer's metal shell, meanwhile, the fine structure on casting of electronic device is located at insert portion, easy to process, split
The shell yield rate of assembling is higher.The material of precise part easily processed into type can be selected in second material, such as from plastics material
Matter etc., plastic material can use transparent or nontransparent material, insert portion are molded by Shooting Technique.
Described above is only the general introduction of technical solution of the present invention, in order to better understand the technological means of the present invention,
And can be practiced according to the content of specification, below with presently preferred embodiments of the present invention and coordinate accompanying drawing describe in detail as after.
Brief description of the drawings
By reading the detailed description of hereafter preferred embodiment, it is various other the advantages of and benefit it is common for this area
Technical staff will be clear understanding.Accompanying drawing is only used for showing the purpose of preferred embodiment, and is not considered as to the present invention
Limitation.And in whole accompanying drawing, identical part is denoted by the same reference numerals.In the accompanying drawings：
Fig. 1 is the structural representation for a kind of electronic equipment housing that embodiments of the invention provide；
Fig. 2 is the structural representation for a kind of electronic equipment housing shell that embodiments of the invention provide；
Fig. 3 is the structural representation for a kind of electronic equipment housing insert portion that embodiments of the invention provide；
Fig. 4 is the schematic flow sheet for a kind of electronic equipment housing preparation method that embodiments of the invention provide；
Fig. 5 is a kind of schematic flow sheet for specific casting of electronic device preparation method that embodiments of the invention provide.
Embodiment
Further to illustrate the present invention to reach the technological means and effect that predetermined goal of the invention is taken, below in conjunction with
Accompanying drawing and preferred embodiment, to according to electronic equipment proposed by the present invention, housing and preparation method thereof its embodiment, knot
Structure, feature and its effect, describe in detail as after.In the following description, what different " embodiment " or " embodiment " referred to differs
Surely it is the same embodiment.In addition, the special characteristic, structure or feature in one or more embodiments can be by any suitable form groups
Close.
The terms "and/or", only a kind of incidence relation for describing affiliated partner, expression may have three kinds of passes
System, for example, A and/or B, is specifically interpreted as：A and B can be included simultaneously, can be with individualism A, can also individualism
B, can possess above-mentioned three kinds of any situations.
As shown in Figure 1, Figure 2 and Figure 3, a kind of electronic equipment housing that one embodiment of the present of invention proposes, outside wrist-watch
Shell or phone housing or panel computer shell etc., applied to electronic equipment, shell includes：The shell 10 and second of first material
The insert portion 20 of material.
The inwall of the shell 10 is arranged on the inwall of the shell 10 formed with receiving space, the insert portion 20
On 10a, there is at least one location structure 21 for localized external part on the insert portion 20, wherein, described first
Material is ceramics.
In technical scheme provided in an embodiment of the present invention, the shell of electronic equipment includes the shell and second of the first material
Two parts of insert portion of material, the material of insert portion can be selected the material of fine structure easy to process, make what is processed
The tolerance of location structure on insert portion is content with very little requirement, and shell uses ceramic material, can produce the electricity of ceramic package
Sub- equipment, relative to prior art, can meet the needs of consumer's ceramic package, meanwhile, the accurate knot on casting of electronic device
Structure is located at insert portion, easy to process, and the shell yield rate of separable assembled is higher.
Wherein, the number of external component, the number of location structure can be at least one, for example, external component may include
Have：Circuit board, corresponding, location structure 21 includes bolt hole 211, card hole 212, screen post 213, the number coordinated with circuit board
According at least one of line interface 214.External component may include have：Data cable plug, corresponding, location structure includes and data
The data line interface that line plug coordinates.Wherein, the second material can be selected the material of precise part easily processed into type, such as from
Metal material, plastic material etc., plastic material can use transparent or nontransparent material, insertion part are molded by Shooting Technique
Part, second material are different materials from first material.
Can accommodate the electronic component of electronic equipment internal in the receiving space of shell, the inwall and shell of shell it
Between can be positioned by keeper, can also pass through the modes such as clamping, stickup.
Glue can be used to paste between shell and insert portion, AB glue etc. can be selected in glue, it is necessary to spend in AB glue stickup
Long period mixture glue, more time-consuming, in order to improve production efficiency, the second material can be selected transparent material and prepare, glue
From shadowless glue (also known as light-sensitive emulsion, ultraviolet cured adhesive), shadowless glue is a kind of by ultraviolet light irradiation ability curable one
Class adhesive, because shell uses ceramics, light can not be passed through, from the insert portion of transparent material, glued using shadowless glue
During pasting shell and insert portion, in ultraviolet illumination, shadowless glue can be solidified by irradiating transparent insert portion, easily
In production.
Common, the inwall of shell includes the first positionable wall 11 in a ring, then, the outer wall of the insert portion includes
The second positionable wall 22 in a ring, the second annular positionable wall 22 insert the first positionable wall 11 of annular, first positionable wall
Pasted between 11 and second positionable wall 22 by glue.Between the size of first positionable wall and the second positionable wall can gap match somebody with somebody
Close, both can rounded ring wall or rectangle ring wall etc..In the first positionable wall and the second positionable wall is pasted using shadowless glue, glue
The water capacity easily flows down from relatively smooth ceramic package inwall, flows through real to the position for placing miscellaneous part, provided by the invention one
Apply in example, the annular surface of the first positionable wall offers annular groove, and shadowless glue can be filled to groove, can improve stickup into
Product rate.In implementation, annular groove also can individually be opened in the annular surface of the second positionable wall, or in the first positionable wall and
Annular groove is opened up on two positionable walls simultaneously.Preferably, annular groove can be opened on the second positionable wall, shone using ultraviolet
Hit, the bottom portion of groove transmission of ultraviolet-transparent thinner thickness, can be used the weaker UV light of light can be to without shadow
Adhesive curing.
For the ease of by shell and insert portion precise positioning between the two, being provided with the first positioning on the housing
Portion, the second location division is provided with the insert portion, first location division is mutually located with second location division.First
Location division can be plug, corresponding, and second component can be slot；Certainly, the first positioning element is alternatively slot, corresponding, the
Two positioning elements can be plug, but be not limited to this.
In another embodiment provided by the invention, it is with casting of electronic device difference in above-described embodiment, outside
Shell material matter is not Ceramics, and the first material is alternatively metal, and shell is molded by metal powder injection molding or casting technique.
Casting of electronic device, including：The shell of first material, the inwall of the shell is formed with receiving space；Second material
The insert portion of matter, the insert portion are arranged on the inwall of the shell, have at least one use on the insert portion
In the location structure of localized external part, wherein first material is metal.Specifically, the shell is by metal powder injection
Shaping or casting technique shaping, second material is different materials from first material.
Common, the shell overall precision being molded by metal powder injection molding or casting technique is not high, is prepared in metal
Shell on the higher location structure of requirement on machining accuracy, it is also necessary to professional machining precision equipment, machine precision equipment
Cost it is generally higher so that the producing cost of metal shell is higher, referring now to prior art, in the embodiment of the present invention, embeds
The material of fine structure easy to process can be selected in the material of part, makes the tolerance of location structure on the insert portion that processes easy
In meeting requirement, shell uses metal material, can produce the electronic equipment of metal shell, relative to prior art, can meet
The demand of consumer's metal shell, meanwhile, the fine structure on casting of electronic device is located at insert portion, easy to process, split
The shell yield rate of assembling is higher.The material of precise part easily processed into type can be selected in second material, such as from plastics material
Matter etc., plastic material can use transparent or nontransparent material, insert portion are molded by Shooting Technique.
As shown in figure 4, the preparation method for a kind of electronic equipment housing that one embodiment of the present of invention proposes, can be prepared
The casting of electronic device described in embodiment is stated, preparation method includes：
100th, the shell of the first material is prepared, the shell is interior formed with for receiving space, and first material is pottery
Porcelain, or first material are metal；
Specifically, the shell is molded by metal powder injection molding or casting technique；
200th, the insert portion of the second material is prepared, there is the positioning knot for localized external part on the insert portion
Structure, wherein, second material is different materials from first material；
Wherein, the number of external component, the number of location structure can be at least one, for example, external component may include
Have：Circuit board, corresponding, location structure is including in the bolt hole with circuit board cooperation, card hole, screen post, data line interface
At least one.External component may include have：Data cable plug, corresponding, location structure includes what is coordinated with data cable plug
Data line interface.Wherein, the material of precise part easily processed into type can be selected in the second material, such as from metal material, modeling
Expect material etc..
300th, the insert portion is bonded on the inwall of the shell, forms the casting of electronic device.
In technical scheme provided in an embodiment of the present invention, the shell of electronic equipment includes the shell and second of the first material
Two parts of insert portion of material, the material of insert portion can be selected the material of fine structure easy to process, make what is processed
The tolerance of location structure on insert portion is content with very little requirement, and shell can be produced outside ceramics using ceramics or metal material
The electronic equipment of shell, metal shell, relative to prior art, can meet the needs of consumer's ceramic package, metal shell, together
When, the fine structure on casting of electronic device is located at insert portion, and easy to process, the shell yield rate of separable assembled is higher.It is logical
Cross glue to be bonded at the insert portion on the inwall of the shell, production process is more convenient, and production efficiency is higher.
Glue can be used to paste between shell and insert portion, AB glue etc. can be selected in glue, it is necessary to spend in AB glue stickup
Long period mixture glue, more time-consuming, in order to improve production efficiency, the second material can be selected transparent material and prepare, described
The insert portion is bonded on the inwall of the shell, forms the casting of electronic device, as shown in figure 5, being specially：
121st, shadowless glue is arranged between the insert portion of transparent plastic material and the inwall of shell；
In production, first shadowless glue can be applied on the inwall of insert portion and/or shell, then by insert portion and outside
The inwall pairing of shell, makes glue be sandwiched between the inwall of shell and insert portion.
122nd, by insert portion described in ultraviolet light irradiation, solidify shadowless glue, by the shell and the insertion part
Part is fixed to form the casting of electronic device.
Therefore the parameters such as the intensity of ultraviolet illumination, time can adjust according to the shape of insert portion, thickness, material etc..
For glue from shadowless glue (also known as light-sensitive emulsion, ultraviolet cured adhesive), shadowless glue is that one kind passes through ultraviolet light irradiation
Just curable a kind of adhesive, because shell uses ceramics or metal, light not to pass through, from transparent material preparation
Embedding part,, can be by irradiating in transparent in ultraviolet illumination during shell and insert portion is pasted using shadowless glue
Embedding part solidifies shadowless glue, is readily produced.
The a kind of electronic equipment that one embodiment of the present of invention proposes, such as wrist-watch or mobile phone or tablet personal computer, electronics are set
It is standby to include：Casting of electronic device and electronic unit.
Shell includes：Insert portion prepared by shell and the second material prepared by the first material.The inwall of the shell
Formed with receiving space, the insert portion is arranged on the inwall of the shell, is had on the insert portion at least one
For the location structure of localized external part, wherein, first material is ceramics, or first material is metal, described
Shell is molded by metal powder injection molding or casting technique, and second material is different materials from first material.
Electronic unit is arranged in the receiving space.
Casting of electronic device in the present embodiment can use the casting of electronic device in above-described embodiment, in the present embodiment not
Repeat again.
Electronic equipment provided in an embodiment of the present invention, housing employ ceramic package or metal shell, are readily produced simultaneously
Processing, yield rate are higher.
In the above-described embodiments, the description to each embodiment all emphasizes particularly on different fields, and does not have the portion being described in detail in some embodiment
Point, it may refer to the associated description of other embodiment.
It is understood that the correlated characteristic in said apparatus can be referred to mutually.In addition, in above-described embodiment " the
One ", " second " etc. is to be used to distinguish each embodiment, and does not represent the quality of each embodiment.
In the specification that this place provides, numerous specific details are set forth.It is to be appreciated, however, that the implementation of the present invention
Example can be put into practice in the case of these no details.In some instances, known structure and skill is not been shown in detail
Art, so as not to obscure the understanding of this description.
Similarly, it will be appreciated that in order to simplify the disclosure and help to understand one or more of each inventive aspect,
Above in the description to the exemplary embodiment of the present invention, each feature of the invention is grouped together into single implementation sometimes
In example, figure or descriptions thereof.However, the device of the disclosure should be construed to reflect following intention：I.e. required guarantor
The application claims of shield features more more than the feature being expressly recited in each claim.It is more precisely, such as following
Claims reflect as, inventive aspect is all features less than single embodiment disclosed above.Therefore,
Thus the claims for following embodiment are expressly incorporated in the embodiment, wherein each claim is in itself
Separate embodiments all as the present invention.
Those skilled in the art, which are appreciated that, to be carried out adaptively to the part in the device in embodiment
Change and they are arranged in one or more devices different from the embodiment.Can be the component combination in embodiment
Into a part, and multiple subassemblies can be divided into addition.Except at least some in such feature are mutual
Outside repulsion, any combinations can be used to the institute disclosed in this specification (including adjoint claim, summary and accompanying drawing)
There are feature and all parts of so disclosed any device to be combined.Unless expressly stated otherwise, this specification (including
Adjoint claim, summary and accompanying drawing) disclosed in each feature can by provide identical, equivalent or similar purpose substitute it is special
Levy to replace.
In addition, it will be appreciated by those of skill in the art that although some embodiments described herein include other embodiments
In included some features rather than further feature, but the combination of the feature of different embodiments means in of the invention
Within the scope of and form different embodiments.For example, in the following claims, embodiment claimed is appointed
One of meaning mode can use in any combination.The present invention all parts embodiment can be realized with hardware, or
Realized with combinations thereof.
It should be noted that the present invention will be described rather than limits the invention for above-described embodiment, and ability
Field technique personnel can design alternative embodiment without departing from the scope of the appended claims.In the claims,
Any reference symbol between bracket should not be configured to limitations on claims.Word "comprising" does not exclude the presence of not
Part or component listed in the claims.Word "a" or "an" before part or component does not exclude the presence of multiple
Such part or component.The present invention can realize by means of including the device of some different parts.It is some listing
In the claim of part, several in these parts can be embodied by same part item.Word first,
The use of second grade does not indicate that any order.These words can be construed to title.
The above described is only a preferred embodiment of the present invention, any formal limitation not is made to the present invention, according to
Any simple modification, equivalent change and modification made according to the technical spirit of the present invention to above example, still falls within this hair
In the range of bright technical scheme.
Claims (10)
1. a kind of electronic equipment housing, it is characterised in that including：
The shell of first material, the inwall of the shell is formed with receiving space；
The insert portion of second material, the insert portion are arranged on the inwall of the shell, are had on the insert portion
At least one location structure for localized external part, wherein, first material is ceramics, or first material is gold
Category.
2. casting of electronic device according to claim 1, it is characterised in that
First material and second material are different materials, and second material uses plastic material.
3. casting of electronic device according to claim 1, it is characterised in that
The inwall of the shell includes the first positionable wall in a ring, and second that the outer wall of the insert portion is included in a ring is fixed
Position wall, the first positionable wall of the second annular positionable wall insertion annular, between first positionable wall and second positionable wall
Pasted by glue.
4. casting of electronic device according to claim 3, it is characterised in that
The annular surface of the annular surface of first positionable wall and/or the second positionable wall offers annular groove.
5. casting of electronic device according to claim 1, it is characterised in that
The first location division is provided with the shell；
The second location division is provided with the insert portion, first location division is mutually located with second location division.
6. casting of electronic device according to claim 1, it is characterised in that
The location structure includes：At least one of bolt hole, card hole, screen post, data line interface.
7. casting of electronic device according to claim 1, it is characterised in that
The casting of electronic device is Watchcase or phone housing or panel computer shell.
8. a kind of electronic equipment, it is characterised in that including：
Any described casting of electronic device in the claims 1-7；
Electronic unit, it is arranged in the receiving space.
9. the preparation method of a kind of electronic equipment housing, it is characterised in that including：
The shell of the first material is prepared, the shell is interior formed with for receiving space, and first material is ceramic or described
First material is metal；
The insert portion of the second material is prepared, there is the location structure for localized external part on the insert portion, wherein,
First material is ceramics, and second material is different materials from first material；
The insert portion is bonded on the inwall of the shell, forms the casting of electronic device.
10. preparation method according to claim 9, it is characterised in that
Second material is transparent plastic material, described to be bonded at the insert portion on the inwall of the shell, is formed
The casting of electronic device, it is specially：
Shadowless glue is arranged between the insert portion of transparent plastic material and the inwall of shell；
By insert portion described in ultraviolet light irradiation, solidify shadowless glue, the shell and the insert portion are fixed into shape
Into the casting of electronic device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711145432.1A CN107734895B (en) | 2017-11-17 | 2017-11-17 | Electronic device, housing and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711145432.1A CN107734895B (en) | 2017-11-17 | 2017-11-17 | Electronic device, housing and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107734895A true CN107734895A (en) | 2018-02-23 |
| CN107734895B CN107734895B (en) | 2023-11-24 |
Family
ID=61217241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711145432.1A Active CN107734895B (en) | 2017-11-17 | 2017-11-17 | Electronic device, housing and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107734895B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101588685A (en) * | 2008-05-21 | 2009-11-25 | 深圳富泰宏精密工业有限公司 | Machine shell and portable electronic device using same |
| CN101655724A (en) * | 2008-08-21 | 2010-02-24 | 英业达股份有限公司 | Heterogeneous shell combining structure |
| CN203558977U (en) * | 2013-06-17 | 2014-04-23 | 戴洪斌 | Watch device using special glazed ceramic |
| CN104935701A (en) * | 2015-07-03 | 2015-09-23 | 东莞誉铭新工业有限公司 | Assembly structure for a metal decorating part of mobile phone front shell and processing and assembling method thereof |
| CN105182723A (en) * | 2015-08-14 | 2015-12-23 | 莆田市金辉煌珠宝首饰有限公司 | Jade gold-inlaid dial |
| CN205726793U (en) * | 2016-06-14 | 2016-11-23 | 维沃移动通信有限公司 | A kind of waterproof case and a kind of electronic equipment |
| CN106911824A (en) * | 2017-03-06 | 2017-06-30 | 广东长盈精密技术有限公司 | Ceramic shell processing technology, ceramic shell and electronic equipment |
| CN106961812A (en) * | 2017-03-21 | 2017-07-18 | 广东欧珀移动通信有限公司 | Electronic installation and its assembly method |
| CN107026925A (en) * | 2017-03-29 | 2017-08-08 | 广东欧珀移动通信有限公司 | Manufacture method, front shell assemblies and the mobile terminal of front shell assemblies |
| CN207604061U (en) * | 2017-11-17 | 2018-07-10 | 出门问问信息科技有限公司 | Electronic equipment, housing |
-
2017
- 2017-11-17 CN CN201711145432.1A patent/CN107734895B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101588685A (en) * | 2008-05-21 | 2009-11-25 | 深圳富泰宏精密工业有限公司 | Machine shell and portable electronic device using same |
| CN101655724A (en) * | 2008-08-21 | 2010-02-24 | 英业达股份有限公司 | Heterogeneous shell combining structure |
| CN203558977U (en) * | 2013-06-17 | 2014-04-23 | 戴洪斌 | Watch device using special glazed ceramic |
| CN104935701A (en) * | 2015-07-03 | 2015-09-23 | 东莞誉铭新工业有限公司 | Assembly structure for a metal decorating part of mobile phone front shell and processing and assembling method thereof |
| CN105182723A (en) * | 2015-08-14 | 2015-12-23 | 莆田市金辉煌珠宝首饰有限公司 | Jade gold-inlaid dial |
| CN205726793U (en) * | 2016-06-14 | 2016-11-23 | 维沃移动通信有限公司 | A kind of waterproof case and a kind of electronic equipment |
| CN106911824A (en) * | 2017-03-06 | 2017-06-30 | 广东长盈精密技术有限公司 | Ceramic shell processing technology, ceramic shell and electronic equipment |
| CN106961812A (en) * | 2017-03-21 | 2017-07-18 | 广东欧珀移动通信有限公司 | Electronic installation and its assembly method |
| CN107026925A (en) * | 2017-03-29 | 2017-08-08 | 广东欧珀移动通信有限公司 | Manufacture method, front shell assemblies and the mobile terminal of front shell assemblies |
| CN207604061U (en) * | 2017-11-17 | 2018-07-10 | 出门问问信息科技有限公司 | Electronic equipment, housing |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107734895B (en) | 2023-11-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108349131B (en) | Multilayer structure for electronic devices and related manufacturing method | |
| KR102340625B1 (en) | Electronic assembly manufacturing method and electronic assembly | |
| CN104941216B (en) | A kind of splice | |
| CN104159424B (en) | Portable electronic device housing with outer glass surfaces | |
| CN103415822B (en) | Around the insert-molded of the glass component of portable electric appts | |
| CN202025099U (en) | Shading piece-embedded type optical lens and optics lens thereof | |
| CN101848609A (en) | Manufacturing method of shell | |
| US20220087029A1 (en) | Method for Manufacturing a Circuit Having a Lamination Layer Using Laser Direct Structuring Process | |
| US20160118712A1 (en) | Housing, electronic device using same, and method for making same | |
| EP2369905A2 (en) | Housing and electronic device using same | |
| CN110024117A (en) | The bare die learning bridge being connect with copper post for system in package equipment | |
| CN101478862A (en) | Process for blind hole, buried hole, and filled hole of multi-layered high density interconnected printed circuit board | |
| AU2016200741A1 (en) | Component protective overmolding | |
| EP2290716A3 (en) | Cover for optoelectronic components | |
| CN102958301A (en) | Portable electronic device and shell thereof | |
| CN103984221A (en) | Smart watch with embedded main board | |
| WO2009002125A3 (en) | Method for manufacturing transparent plastic film and transparent plastic film manufactured by the method | |
| US20130108830A1 (en) | Composite plate structure and manufacturing method thereof | |
| CN207604061U (en) | Electronic equipment, housing | |
| CN107734895A (en) | Electronic equipment, housing and preparation method thereof | |
| US20100085690A1 (en) | Device housing with decorative pattern and method of manufacturing same | |
| TW201417982A (en) | Assembling method for housing of electronic device and assembly of housing of electronic device | |
| CN104297831B (en) | Optical fingerprint sensor chip module grating and preparation method thereof | |
| CN202956522U (en) | Lens unit and lighting device possessing same | |
| US20100068455A1 (en) | Decorative film and shell incorporating the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |