CN107734895B - Electronic device, housing and preparation method thereof - Google Patents
Electronic device, housing and preparation method thereof Download PDFInfo
- Publication number
- CN107734895B CN107734895B CN201711145432.1A CN201711145432A CN107734895B CN 107734895 B CN107734895 B CN 107734895B CN 201711145432 A CN201711145432 A CN 201711145432A CN 107734895 B CN107734895 B CN 107734895B
- Authority
- CN
- China
- Prior art keywords
- shell
- positioning
- wall
- electronic device
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000002360 preparation method Methods 0.000 title abstract description 8
- 239000000463 material Substances 0.000 claims abstract description 91
- 239000002184 metal Substances 0.000 claims abstract description 33
- 238000004519 manufacturing process Methods 0.000 claims abstract description 24
- 239000000919 ceramic Substances 0.000 claims abstract description 20
- 230000004308 accommodation Effects 0.000 claims abstract description 4
- 239000003292 glue Substances 0.000 claims description 40
- 238000000034 method Methods 0.000 claims description 16
- 229920003023 plastic Polymers 0.000 claims description 13
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 238000003754 machining Methods 0.000 description 12
- 238000001746 injection moulding Methods 0.000 description 10
- 238000005266 casting Methods 0.000 description 7
- 239000000843 powder Substances 0.000 description 7
- 239000012780 transparent material Substances 0.000 description 7
- 239000007769 metal material Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The invention relates to electronic equipment, a shell and a preparation method thereof, relates to the technical field of electronic equipment, and mainly solves the technical problem that the production yield is lower when a metal shell is processed. An electronic device housing, comprising: a housing of a first material, the inner wall of which is formed with an accommodation space; the embedded part of second material sets up on the inner wall of shell, has at least one location structure that is used for fixing a position external part on the embedded part, and wherein, first material is ceramic, or first material is metal. Compared with the prior art, the ceramic shell can meet the requirements of consumers, meanwhile, the precise structure on the shell of the electronic equipment is located in the embedded part, the processing is easy, and the shell yield of split assembly is high.
Description
Technical Field
The present invention relates to the field of electronic devices, and in particular, to an electronic device, a housing, and a method for manufacturing the same.
Background
The appearance of electronic devices such as cell phones, watches, tablet computers, etc., is a major concern for consumers.
The inventor finds that, in the process of implementing the invention, since the volume of the electronic equipment is usually limited, the precision of parts inside the electronic equipment is higher, in general, the electronic equipment shell adopts an integrally formed plastic shell or an integrally formed metal shell, and since the inner wall of the integrally formed shell is provided with a supporting structure of the parts inside, such as a bolt hole, a buckle and other precise structures, the tolerance requirement of the precise structure is higher, the reject ratio is lower for the plastic shell, but the tolerance is higher for the metal shell when the precise structure such as the bolt hole, the buckle and the like is formed, so that the reject ratio is higher, the method for solving the reject ratio is that professional machining precise equipment is required, and the cost of the machining precise equipment is usually higher, so that the production cost of the metal shell is higher.
Disclosure of Invention
In view of the above, the present invention provides an electronic device, a housing and a manufacturing method thereof, which can improve the production yield without increasing the production cost when processing the metal housing.
In order to achieve the above purpose, the present invention mainly provides the following technical solutions:
in one aspect, an embodiment of the present invention provides an electronic device housing, including:
a housing of a first material, wherein an accommodating space is formed on the inner wall of the housing;
the embedded part of second material, embedded part sets up on the inner wall of shell, have at least one location structure that is used for fixing a position external part on the embedded part, wherein, first material is ceramic, perhaps first material is the metal.
The aim and the technical problems of the invention can be further realized by adopting the following technical measures.
Optionally, the electronic device housing described above, wherein the first material and the second material are different materials, and the second material is a plastic material.
Optionally, the electronic device casing, wherein the inner wall of the housing includes a first positioning wall having a ring shape, the outer wall of the embedded component includes a second positioning wall having a ring shape, the second positioning wall having a ring shape is inserted into the first positioning wall having a ring shape, and the first positioning wall and the second positioning wall are adhered by glue.
Optionally, in the electronic device housing, an annular groove is formed on an annular surface of the first positioning wall and/or an annular surface of the second positioning wall.
Optionally, the electronic device casing, wherein the casing is provided with a first positioning part;
the embedded part is provided with a second positioning part, and the first positioning part and the second positioning part are mutually positioned.
Optionally, the electronic device housing, wherein the positioning structure includes: at least one of bolt holes, clamping columns and data line interfaces.
Optionally, the electronic device housing is a watch housing, a mobile phone housing, or a tablet computer housing.
In another aspect, an embodiment of the present invention provides an electronic device, including:
the electronic equipment shell;
and an electronic component disposed in the accommodation space.
In still another aspect, an embodiment of the present invention provides a method for manufacturing a housing of an electronic device, including:
preparing a shell made of a first material, wherein an accommodating space is formed in the shell, the first material is ceramic or the first material is metal, and the shell is formed by a metal powder injection molding or casting process;
preparing an embedded part of a second material, wherein the embedded part is provided with a positioning structure for positioning an external part, the first material is ceramic, and the second material and the first material are different materials;
and adhering the embedded part to the inner wall of the shell to form the electronic equipment shell.
The aim and the technical problems of the invention can be further realized by adopting the following technical measures.
Optionally, in the foregoing manufacturing method, the second material is a transparent plastic material, and the bonding the embedded component to the inner wall of the housing forms the electronic device housing, specifically:
setting the shadowless glue between the transparent embedded part made of plastic material and the inner wall of the shell;
and irradiating the embedded part by ultraviolet light to solidify the shadowless glue, and fixing the shell and the embedded part to form the electronic equipment shell.
By means of the technical scheme, the electronic equipment, the shell and the preparation method thereof provided by the technical scheme of the invention have at least the following advantages:
according to the technical scheme provided by the embodiment of the invention, the shell of the electronic equipment comprises the shell made of the first material and the embedded part made of the second material, the material of the embedded part can be selected from materials easy to process a precise structure, so that the tolerance of a positioning structure on the processed embedded part can easily meet the requirement, the shell is made of a ceramic material, the electronic equipment with the ceramic shell can be produced, and compared with the prior art, the requirement of a consumer on the ceramic shell can be met, meanwhile, the precise structure on the shell of the electronic equipment is positioned on the embedded part, the processing is easy, and the shell yield of split assembly is higher.
Generally, the overall precision of a shell formed by a metal powder injection molding or casting process is not high, a positioning structure with higher requirements on machining precision is required on a shell prepared from metal, professional machining precision equipment is also required, the cost of the machining precision equipment is generally high, the production cost of the metal shell is high, and in the prior art, the material of an embedded part can be selected from materials with easy machining precision structures, so that the tolerance of the positioning structure on the machined embedded part can easily meet the requirements, the shell is made of metal materials, the electronic equipment with the metal shell can be produced, and compared with the prior art, the requirement of a consumer metal shell can be met, meanwhile, the precision structure on the shell of the electronic equipment is positioned on the embedded part, the machining is easy, and the shell yield of split assembly is high. The second material may be a material that is easy to machine and form the precision component, for example, a plastic material may be a transparent or non-transparent material, and the embedded component is formed by injection molding.
The foregoing description is only an overview of the present invention, and is intended to provide a better understanding of the present invention, as it is embodied in the following description, with reference to the preferred embodiments of the present invention and the accompanying drawings.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to designate like parts throughout the figures. In the drawings:
fig. 1 is a schematic structural view of an electronic device housing according to an embodiment of the present invention;
fig. 2 is a schematic structural view of a housing shell of an electronic device according to an embodiment of the present invention;
fig. 3 is a schematic structural view of an embedded component of an electronic device housing according to an embodiment of the present invention;
fig. 4 is a schematic flow chart of a method for manufacturing an electronic device housing according to an embodiment of the present invention;
fig. 5 is a schematic flow chart of a specific electronic device housing preparation method according to an embodiment of the present invention.
Detailed Description
In order to further describe the technical means and effects adopted by the invention to achieve the preset aim, the following detailed description refers to the specific implementation, structure, characteristics and effects of the electronic device, the shell and the preparation method thereof according to the invention with reference to the accompanying drawings and the preferred embodiment. In the following description, different "an embodiment" or "an embodiment" do not necessarily refer to the same embodiment. Furthermore, the particular features, structures, or characteristics of one or more embodiments may be combined in any suitable manner.
The term "and/or" is herein merely an association relation describing an associated object, meaning that three relations may exist, e.g. a and/or B, specifically understood as: the composition may contain both a and B, and may contain a alone or B alone, and any of the above three cases may be provided.
As shown in fig. 1, 2 and 3, an electronic device housing, such as a watch case, a mobile phone case, or a tablet computer case, according to an embodiment of the present invention, is applied to an electronic device, where the housing includes: a housing 10 of a first material and an embedded part 20 of a second material.
The inner wall of the housing 10 is formed with a receiving space, the embedded component 20 is disposed on the inner wall 10a of the housing 10, and the embedded component 20 has at least one positioning structure 21 for positioning an external component, where the first material is ceramic.
According to the technical scheme provided by the embodiment of the invention, the shell of the electronic equipment comprises the shell made of the first material and the embedded part made of the second material, the material of the embedded part can be selected from materials easy to process a precise structure, so that the tolerance of a positioning structure on the processed embedded part can easily meet the requirement, the shell is made of a ceramic material, the electronic equipment with the ceramic shell can be produced, and compared with the prior art, the requirement of a consumer on the ceramic shell can be met, meanwhile, the precise structure on the shell of the electronic equipment is positioned on the embedded part, the processing is easy, and the shell yield of split assembly is higher.
Wherein, the number of external parts, the number of location structure can all be at least 1, for example, external parts can include: the circuit board, corresponding, the positioning structure 21 includes at least one of bolt holes 211, clamping holes 212, clamping columns 213 and data line interfaces 214 matched with the circuit board. The external components may include: the data line plug corresponds to the positioning structure and comprises a data line interface matched with the data line plug. Wherein, the second material can be selected from the materials that are easy to process and shape the precise component, such as metal material, plastic material, etc., the plastic material can be transparent or non-transparent material, the embedded component is formed by injection molding process, and the second material and the first material are different materials.
The electronic components inside the electronic equipment can be accommodated in the accommodating space of the shell, and the inner wall of the shell and the shell can be positioned by the positioning piece or clamped, stuck and the like.
Glue can be used between shell and the embedded part to paste, glue can be selected from AB glue etc., in AB glue paste, it takes longer time to mix glue, it is comparatively time-consuming, in order to improve production efficiency, the second material can be selected from transparent material preparation, glue chooses for use shadowless glue (also known as photosensitive glue, ultraviolet curing glue), shadowless glue is a kind of adhesive that just can solidify through ultraviolet irradiation, because the shell adopts pottery, light can't see through, select the embedded part of transparent material, in the in-process of using shadowless glue to paste shell and embedded part, accessible irradiation transparent embedded part will be shadowless glue solidification in ultraviolet irradiation, easy production.
Generally, the inner wall of the housing comprises a first positioning wall 11 having a ring shape, and then the outer wall of the embedded part comprises a second positioning wall 22 having a ring shape, the second positioning wall 22 having a ring shape is inserted into the first positioning wall 11 having a ring shape, and the first positioning wall 11 and the second positioning wall 22 are adhered by glue. The first positioning wall and the second positioning wall can be in clearance fit, and the first positioning wall and the second positioning wall can be circular annular walls, rectangular annular walls or the like. In the embodiment provided by the invention, the annular surface of the first positioning wall is provided with the annular groove, the shadowless glue can be filled into the groove, and the pasting yield can be improved. In practice, the annular groove can be independently formed on the annular surface of the second positioning wall, or the annular groove can be formed on the first positioning wall and the second positioning wall at the same time. Preferably, the annular groove can be formed on the second positioning wall, and in the process of using ultraviolet irradiation, ultraviolet rays can penetrate through the bottom of the groove with a thinner thickness, and the shadowless glue can be cured by using ultraviolet rays with weaker light rays.
In order to be convenient for accurately positioning the shell and the embedded part between the two, a first positioning part is arranged on the shell, a second positioning part is arranged on the embedded part, and the first positioning part and the second positioning part are mutually positioned. The first positioning part can be a plug, and the second component can be a slot; of course, the first positioning component may also be a slot, and the corresponding second positioning component may be a plug, but is not limited thereto.
In another embodiment of the present invention, the electronic device housing is different from the electronic device housing in the above embodiment in that the material of the housing is not ceramic, the first material may be metal, and the housing is formed by metal powder injection molding or casting.
An electronic device housing, comprising: a housing of a first material, wherein an accommodating space is formed on the inner wall of the housing; the embedded part of the second material is arranged on the inner wall of the shell, and the embedded part is provided with at least one positioning structure for positioning the external part, wherein the first material is metal. Specifically, the shell is formed by a metal powder injection molding or casting process, and the second material and the first material are different materials.
Generally, the overall precision of a shell formed by a metal powder injection molding or casting process is not high, a positioning structure with higher requirements on machining precision is required on a shell prepared from metal, professional machining precision equipment is also required, the cost of the machining precision equipment is generally high, the production cost of the metal shell is high, and in the prior art, the material of an embedded part can be selected from materials with easy machining precision structures, so that the tolerance of the positioning structure on the machined embedded part can easily meet the requirements, the shell is made of metal materials, the electronic equipment with the metal shell can be produced, and compared with the prior art, the requirement of a consumer metal shell can be met, meanwhile, the precision structure on the shell of the electronic equipment is positioned on the embedded part, the machining is easy, and the shell yield of split assembly is high. The second material may be a material that is easy to machine and form the precision component, for example, a plastic material may be a transparent or non-transparent material, and the embedded component is formed by injection molding.
As shown in fig. 4, a method for manufacturing an electronic device housing according to an embodiment of the present invention may manufacture the electronic device housing described in the above embodiment, where the manufacturing method includes:
100. preparing a shell made of a first material, wherein an accommodating space is formed in the shell, and the first material is ceramic or metal;
specifically, the shell is formed by a metal powder injection molding or casting process;
200. preparing an embedded part of a second material, wherein the embedded part is provided with a positioning structure for positioning an external part, and the second material and the first material are different materials;
wherein, the number of external parts, the number of location structure can all be at least 1, for example, external parts can include: the circuit board corresponds, and the location structure includes at least one in bolt hole, screens post, the data line interface with circuit board complex. The external components may include: the data line plug corresponds to the positioning structure and comprises a data line interface matched with the data line plug. Wherein, the second material can be selected from materials which are easy to process and shape the precise component, such as metal materials, plastic materials and the like.
300. And adhering the embedded part to the inner wall of the shell to form the electronic equipment shell.
In the technical scheme provided by the embodiment of the invention, the shell of the electronic equipment comprises the shell made of the first material and the embedded part made of the second material, the material of the embedded part can be selected from materials easy to process a precise structure, so that the tolerance of a positioning structure on the processed embedded part is easy to meet the requirement, the shell is made of ceramic or metal materials, the electronic equipment with the ceramic shell and the metal shell can be produced, and compared with the prior art, the requirements of consumers on the ceramic shell and the metal shell can be met, meanwhile, the precise structure on the shell of the electronic equipment is positioned on the embedded part, the processing is easy, and the shell yield of split assembly is higher. The embedded part is adhered to the inner wall of the shell through glue, so that the production process is convenient and the production efficiency is high.
Glue can be used between shell and the embedded part to paste, glue can select AB glue etc. in the AB glue paste, need spend longer time and mix glue, comparatively take time, in order to improve production efficiency, the second material can select transparent material preparation, will the embedded part glues on the inner wall of shell, forms electronic equipment casing, as shown in fig. 5, specifically is:
121. setting the shadowless glue between the transparent embedded part made of plastic material and the inner wall of the shell;
in the production process, the shadowless glue can be smeared on the inner wall of the embedded part and/or the inner wall of the shell, and then the inner wall of the embedded part and the inner wall of the shell are combined, so that the glue is clamped between the inner wall of the shell and the embedded part.
122. And irradiating the embedded part by ultraviolet light to solidify the shadowless glue, and fixing the shell and the embedded part to form the electronic equipment shell.
The parameters such as the intensity and time of the ultraviolet irradiation can be adjusted according to the shape, thickness, material, etc. of the embedded component.
The glue adopts shadowless glue (also called photosensitive glue and ultraviolet curing glue), the shadowless glue is an adhesive which can be cured by ultraviolet light irradiation, and because the shell adopts ceramic or metal, light cannot penetrate, and the embedded part prepared from transparent materials is selected, the shadowless glue can be cured by irradiating the transparent embedded part in the ultraviolet light irradiation in the process of sticking the shell and the embedded part by using the shadowless glue, and the production is easy.
An embodiment of the present invention provides an electronic device, such as a wristwatch, a mobile phone, or a tablet computer, including: an electronic device housing and an electronic component.
The housing includes: a housing made of a first material and an embedded component made of a second material. The inner wall of the shell is provided with an accommodating space, the embedded part is arranged on the inner wall of the shell, the embedded part is provided with at least one positioning structure for positioning the external part, wherein the first material is ceramic or metal, the shell is formed by metal powder injection molding or casting process, and the second material and the first material are different materials. An electronic component is disposed in the accommodation space.
The electronic device housing in this embodiment may be the electronic device housing in the foregoing embodiment, which is not described in detail in this embodiment.
The electronic equipment provided by the embodiment of the invention has the advantages that the shell adopts the ceramic shell or the metal shell, the production and the processing are easy, and the yield is higher.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments.
It will be appreciated that the relevant features of the apparatus described above may be referred to with respect to each other. In addition, the "first", "second", and the like in the above embodiments are for distinguishing the embodiments, and do not represent the merits and merits of the embodiments.
In the description provided herein, numerous specific details are set forth. However, it is understood that embodiments of the invention may be practiced without these specific details. In some instances, well-known structures and techniques have not been shown in detail in order not to obscure an understanding of this description.
Similarly, it should be appreciated that in the foregoing description of exemplary embodiments of the invention, various features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure and aiding in the understanding of one or more of the various inventive aspects. However, the disclosed apparatus should not be construed as reflecting the intention of: i.e., the claimed invention requires more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive aspects lie in less than all features of a single foregoing disclosed embodiment. Thus, the claims following the detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment of this invention.
Those skilled in the art will appreciate that the components of the apparatus of the embodiments may be adaptively changed and disposed in one or more apparatuses different from the embodiments. The components of the embodiments may be combined into one component, and furthermore they may be divided into a plurality of sub-components. All of the features disclosed in this specification (including any accompanying claims, abstract and drawings), and all of the elements of any apparatus so disclosed, may be combined in any combination, except combinations where at least some of such features are mutually exclusive. Each feature disclosed in this specification (including any accompanying claims, abstract and drawings), may be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise.
Furthermore, those skilled in the art will appreciate that while some embodiments described herein include some features but not others included in other embodiments, combinations of features of different embodiments are meant to be within the scope of the invention and form different embodiments. For example, in the following claims, any of the claimed embodiments can be used in any combination. Various component embodiments of the present invention may be implemented in hardware, or in a combination thereof.
It should be noted that the above-mentioned embodiments illustrate rather than limit the invention, and that those skilled in the art will be able to design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of elements or components not listed in a claim. The word "a" or "an" preceding a component or assembly does not exclude the presence of a plurality of such components or assemblies. The invention may be implemented by means of an apparatus comprising several distinct elements. In the claims enumerating several means, several of these means may be embodied by one and the same item of hardware. The use of the words first, second, etc. do not denote any order. These words may be interpreted as names.
The above description is only of the preferred embodiments of the present invention, and is not intended to limit the present invention in any way, but any simple modification, equivalent variation and modification made to the above embodiments according to the technical substance of the present invention still fall within the scope of the technical solution of the present invention.
Claims (6)
1. A method of manufacturing a housing for an electronic device, comprising:
preparing a shell of a first material, wherein a first positioning wall which is used for accommodating a space and is annular is formed on the inner wall of the shell, and the first material is ceramic or metal;
preparing an embedded part of a second material, wherein the embedded part is provided with a positioning structure for positioning an external part, and an annular second positioning wall is formed on the outer wall of the embedded part, and the second material is a transparent plastic material;
an annular groove is formed in the second positioning wall;
filling shadowless glue into the annular groove;
connecting the housing with the second positioning wall of the embedded component through the first positioning wall;
and irradiating the annular groove by ultraviolet light to solidify the shadowless glue, and fixing the shell and the embedded part to form the electronic equipment shell.
2. An electronic device housing, based on the method for manufacturing an electronic device housing according to claim 1, comprising:
a housing of a first material, wherein an accommodating space is formed on the inner wall of the housing;
the embedded part is arranged on the inner wall of the shell and is provided with at least one positioning structure for positioning the external part, wherein the first material is ceramic or metal, and the second material is transparent plastic;
the inner wall of the shell comprises a first annular positioning wall, the outer wall of the embedded part comprises a second annular positioning wall, the second annular positioning wall is inserted into the first annular positioning wall, and the first positioning wall and the second positioning wall are adhered through shadowless glue;
the annular surface of the first positioning wall and/or the annular surface of the second positioning wall is provided with an annular groove, and the shadowless glue is filled into the annular groove.
3. The electronic device housing of claim 2, wherein the housing is configured to receive the electronic device,
the shell is provided with a first positioning part;
the embedded part is provided with a second positioning part, and the first positioning part and the second positioning part are mutually positioned.
4. The electronic device housing of claim 2, wherein the housing is configured to receive the electronic device,
the positioning structure comprises: at least one of bolt holes, clamping columns and data line interfaces.
5. The electronic device housing of claim 2, wherein the housing is configured to receive the electronic device,
the electronic equipment shell is a watch shell or a mobile phone shell or a tablet computer shell.
6. An electronic device, comprising:
an electronic device housing as claimed in any one of claims 2 to 5;
and an electronic component disposed in the accommodation space.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711145432.1A CN107734895B (en) | 2017-11-17 | 2017-11-17 | Electronic device, housing and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711145432.1A CN107734895B (en) | 2017-11-17 | 2017-11-17 | Electronic device, housing and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107734895A CN107734895A (en) | 2018-02-23 |
| CN107734895B true CN107734895B (en) | 2023-11-24 |
Family
ID=61217241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711145432.1A Active CN107734895B (en) | 2017-11-17 | 2017-11-17 | Electronic device, housing and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107734895B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101588685A (en) * | 2008-05-21 | 2009-11-25 | 深圳富泰宏精密工业有限公司 | Machine shell and portable electronic device using same |
| CN101655724A (en) * | 2008-08-21 | 2010-02-24 | 英业达股份有限公司 | Heterogeneous shell combining structure |
| CN203558977U (en) * | 2013-06-17 | 2014-04-23 | 戴洪斌 | Watch device using special glazed ceramic |
| CN104935701A (en) * | 2015-07-03 | 2015-09-23 | 东莞誉铭新工业有限公司 | Assembly structure for a metal decorating part of mobile phone front shell and processing and assembling method thereof |
| CN105182723A (en) * | 2015-08-14 | 2015-12-23 | 莆田市金辉煌珠宝首饰有限公司 | Jade gold-inlaid dial |
| CN205726793U (en) * | 2016-06-14 | 2016-11-23 | 维沃移动通信有限公司 | A kind of waterproof case and a kind of electronic equipment |
| CN106911824A (en) * | 2017-03-06 | 2017-06-30 | 广东长盈精密技术有限公司 | Ceramic shell processing technology, ceramic shell and electronic equipment |
| CN106961812A (en) * | 2017-03-21 | 2017-07-18 | 广东欧珀移动通信有限公司 | Electronic installation and its assembly method |
| CN107026925A (en) * | 2017-03-29 | 2017-08-08 | 广东欧珀移动通信有限公司 | Manufacture method, front shell assemblies and the mobile terminal of front shell assemblies |
| CN207604061U (en) * | 2017-11-17 | 2018-07-10 | 出门问问信息科技有限公司 | Electronic equipment, housing |
-
2017
- 2017-11-17 CN CN201711145432.1A patent/CN107734895B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101588685A (en) * | 2008-05-21 | 2009-11-25 | 深圳富泰宏精密工业有限公司 | Machine shell and portable electronic device using same |
| CN101655724A (en) * | 2008-08-21 | 2010-02-24 | 英业达股份有限公司 | Heterogeneous shell combining structure |
| CN203558977U (en) * | 2013-06-17 | 2014-04-23 | 戴洪斌 | Watch device using special glazed ceramic |
| CN104935701A (en) * | 2015-07-03 | 2015-09-23 | 东莞誉铭新工业有限公司 | Assembly structure for a metal decorating part of mobile phone front shell and processing and assembling method thereof |
| CN105182723A (en) * | 2015-08-14 | 2015-12-23 | 莆田市金辉煌珠宝首饰有限公司 | Jade gold-inlaid dial |
| CN205726793U (en) * | 2016-06-14 | 2016-11-23 | 维沃移动通信有限公司 | A kind of waterproof case and a kind of electronic equipment |
| CN106911824A (en) * | 2017-03-06 | 2017-06-30 | 广东长盈精密技术有限公司 | Ceramic shell processing technology, ceramic shell and electronic equipment |
| CN106961812A (en) * | 2017-03-21 | 2017-07-18 | 广东欧珀移动通信有限公司 | Electronic installation and its assembly method |
| CN107026925A (en) * | 2017-03-29 | 2017-08-08 | 广东欧珀移动通信有限公司 | Manufacture method, front shell assemblies and the mobile terminal of front shell assemblies |
| CN207604061U (en) * | 2017-11-17 | 2018-07-10 | 出门问问信息科技有限公司 | Electronic equipment, housing |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107734895A (en) | 2018-02-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9442520B2 (en) | Resin-encapsulated portable media device | |
| US8300395B2 (en) | Housing and electronic device using same | |
| KR20190034597A (en) | Overmolded electronic components for transaction cards and method for manufacturing same | |
| CN202276566U (en) | Portable electronic device and casing assembly thereof | |
| CN105205474A (en) | Fingerprint recognition device and mobile terminal | |
| CN107734895B (en) | Electronic device, housing and preparation method thereof | |
| CN103841300A (en) | Method for manufacturing camera module, and camera module | |
| CN105323693B (en) | A kind of loudspeaker assemble method | |
| US20130143045A1 (en) | Device housing and method for making the same | |
| CN207604061U (en) | Electronic equipment, housing | |
| CN106295589A (en) | Fingerprint module and terminal unit and the processing method of this fingerprint module with it | |
| CN205071079U (en) | Pressfitting system utensil is glued to mobile terminal and point of being applied to it | |
| CN110050332A (en) | Electron device package | |
| CN112297544A (en) | Preparation method of ceramic shell, ceramic shell and electronic equipment | |
| US20130278123A1 (en) | Device housing and method for making the same | |
| CN202956522U (en) | Lens unit and lighting device possessing same | |
| CN206433267U (en) | Circuit board exposure structure | |
| CN106055034A (en) | Decoration component fixing method and terminal with decoration component | |
| CN104394664A (en) | Method for reinforcing reliability of plastic-substrate-contained three-dimensional circuit, and apparatus prepared by using the same | |
| CN108697018A (en) | Method for producing shell, shell and electronic equipment | |
| US20100068455A1 (en) | Decorative film and shell incorporating the same | |
| CN206480002U (en) | A kind of assembled fixture of fingerprint module | |
| CN206640889U (en) | Steel disc front shell assemblies and terminal device in mould | |
| CN106535527A (en) | In-mold steel disc front casing assembly and terminal equipment | |
| CN207070241U (en) | A kind of compound module of ultra-thin water-proof sound-transmitting |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |