CN106911824A - Ceramic shell processing technology, ceramic shell and electronic equipment - Google Patents
Ceramic shell processing technology, ceramic shell and electronic equipment Download PDFInfo
- Publication number
- CN106911824A CN106911824A CN201710128459.3A CN201710128459A CN106911824A CN 106911824 A CN106911824 A CN 106911824A CN 201710128459 A CN201710128459 A CN 201710128459A CN 106911824 A CN106911824 A CN 106911824A
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- China
- Prior art keywords
- ceramic
- plastic parts
- ceramic shell
- ceramic package
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000919 ceramic Substances 0.000 title claims abstract description 144
- 238000005516 engineering process Methods 0.000 title claims description 10
- 239000004033 plastic Substances 0.000 claims abstract description 62
- 238000000034 method Methods 0.000 claims abstract description 14
- 238000001746 injection moulding Methods 0.000 claims abstract description 9
- 239000004568 cement Substances 0.000 claims description 11
- 239000003513 alkali Substances 0.000 claims description 10
- 239000000243 solution Substances 0.000 claims description 10
- 239000002253 acid Substances 0.000 claims description 9
- 238000001035 drying Methods 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 150000001412 amines Chemical class 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000008447 perception Effects 0.000 abstract description 3
- 238000011031 large-scale manufacturing process Methods 0.000 abstract description 2
- 238000000926 separation method Methods 0.000 abstract description 2
- 239000007788 liquid Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 5
- 239000004734 Polyphenylene sulfide Substances 0.000 description 4
- 230000001413 cellular effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000007654 immersion Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 229920000069 polyphenylene sulfide Polymers 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- -1 but Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920001707 polybutylene terephthalate Polymers 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 235000014653 Carica parviflora Nutrition 0.000 description 2
- 241000243321 Cnidaria Species 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 241000256844 Apis mellifera Species 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 206010054949 Metaplasia Diseases 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000007603 infrared drying Methods 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000015689 metaplastic ossification Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C2045/1486—Details, accessories and auxiliary operations
- B29C2045/14868—Pretreatment of the insert, e.g. etching, cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2709/00—Use of inorganic materials not provided for in groups B29K2703/00 - B29K2707/00, for preformed parts, e.g. for inserts
- B29K2709/02—Ceramics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3431—Telephones, Earphones
- B29L2031/3437—Cellular phones
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The present invention relates to a kind of ceramic shell.It is applied to electronic equipment, including the plastic parts of ceramic package and injection moulding on the ceramic package.Due to making plastic parts be combined with ceramic package by way of injection moulding, plastic parts crab-bolt can form very strong snap-in force between the two on ceramic package, and both are difficult to produce separation in the presence of having impacted, and improve the stability of ceramic shell structure.Plastic parts is integrally formed with ceramic package, simplifies the overall structure of ceramic shell, and whole ceramic shell becomes more frivolous, improves the outside perception of ceramic shell.Meanwhile, injection moulding speed is fast so that the process-cycle of ceramic shell is short, reduces cost of labor, and can further reduce production cost to improve the competitiveness of product in market by large-scale production.When the electronic equipments such as mobile phone, intelligent watch and palm PC use the ceramic shell, the weight saving of whole electronic equipment, while improve the technique aesthetic feeling of electronic equipment.
Description
Technical field
The present invention relates to smart machine skinning technique field, more particularly to a kind of ceramic shell processing technology, ceramic case
Body and electronic equipment.
Background technology
With the continuous popularization and the continuous improvement of consumers' aesthetic level of smart mobile phone, the notice of user is from original
The direction that Practical Performance is gradually learned to outward appearance and art designing is shifted, and not only requires that mobile phone is practical, while also requiring its thickness increasingly
Thin, texture is become better and better, and color is more and more bright-coloured.Both possessed the texture of metal due to ceramics mobile phone shell processed, there is glass-mirror again
Gloss, and ice-cold sense of touch upper its unique jewelry texture of collocation of ceramic surface, than traditional metal and plastic cellphone shell
More for the electromagnetic shielding that wear-resisting pro-skin, air-tightness are more preferable and smaller, so more and more welcomed by the people, mobile phone industry
The ceramic epoch will be entered.
It is general, plastic parts is fixed with the inner surface of ceramic package by way of viscose glue, but, plastic parts and ceramics
Easily come off between shell, there is the defects such as following process difficulty is big.
The content of the invention
Based on this, it is necessary to provide a kind of ceramic shell that can improve structural stability, the electronics comprising the ceramic shell
Equipment and ceramic shell processing technology.
A kind of ceramic shell, is applied to electronic equipment, including ceramic package and injection moulding are on the ceramic package
Plastic parts.
Wherein in one embodiment, the plastic parts includes PPS resin plastic parts or PBT resin plastic parts.
Wherein in one embodiment, the knot matched somebody with somebody with the plastic parts and merge and carry pit is provided with the ceramic package
Conjunction face, the sectional dimension of the pit is A, wherein 20nm≤A≤40nm.
Wherein in one embodiment, the value of the pit sectional dimension A is 30nm.
Wherein in one embodiment, the faying face includes First terrace, and vertical with the First terrace connects
The second step face for connecing, is provided with the lug coordinated with the First terrace and the second step face on the plastic parts.
Wherein in one embodiment, the cross section of the ceramic package is rectangle, and the plastic parts is connected to described
On ceramic package two ends corresponding with the rectangular short side.
Wherein in one embodiment, the plastic rubber member surface keeps setpoint distance with the ceramic package surface.
Wherein in one embodiment, the quantity of the plastic parts is two.
A kind of electronic equipment, including any of the above-described ceramic shell.
A kind of ceramic shell processing technology, comprises the following steps:
Ceramic package is put into alkali lye and soaks setting time;
Ceramic package is put into acid solution and soaks setting time;
Ceramic package is put into solution containing amine substance and soaks setting time to form pit to corrode;
By ceramic package pure water rinsing and drying;
Plastic cement is penetrated into pit by Shooting Technique to form the plastic parts with ceramic package integrally connected;
Cooling.
Ceramic shell, electronic equipment and ceramic shell processing technology that the present invention is provided, due to the side by injection moulding
Formula makes plastic parts be combined with ceramic package, and plastic parts crab-bolt can form very strong snap-in force, two between the two on ceramic package
Person is difficult to produce separation in the presence of having impacted, and improves the stability of ceramic shell structure.Plastic parts and ceramic package one
It is body formed, the overall structure of ceramic shell is simplified, whole ceramic shell becomes more frivolous, improves the outside of ceramic shell
Perception.Meanwhile, injection moulding speed is fast so that the process-cycle of ceramic shell is short, reduces cost of labor, and can pass through scale
Metaplasia is produced and further reduce production cost to improve the market competitiveness of electronic equipment.
Brief description of the drawings
The decomposition texture schematic diagram of the ceramic shell that Fig. 1 is provided for an embodiment;
The assembling structure schematic diagram of the ceramic shell that Fig. 2 is provided for an embodiment;
Fig. 3 is the C-C cross section structure diagrams in Fig. 2;
Fig. 4 is mplifying structure schematic diagram at B in Fig. 3;
The processing process figure of the ceramic shell that Fig. 5 is provided for an embodiment.
Specific embodiment
For the ease of understanding the present invention, the present invention is described more fully below with reference to relevant drawings.In accompanying drawing
Give better embodiment of the invention.But, the present invention can be realized in many different forms, however it is not limited to herein
Described implementation method.On the contrary, the purpose for providing these implementation methods is to make to understand more the disclosure
Plus it is thorough comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can directly on another element
Or can also there is element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or may be simultaneously present centering elements.Term as used herein " interior ", " outward ", "left", "right" and
For illustrative purposes only, it is unique implementation method to be not offered as similar statement.
Refering to Fig. 1, a kind of ceramic shell 10 can be applied to mobile phone, in the electronic equipment such as intelligent watch or palm PC, this
The explanation by taking mobile phone shell as an example of ceramic shell 10 in embodiment.
Refering to Fig. 1 and Fig. 2, ceramic shell 10 (mobile phone shell) includes ceramic package 100 and plastic parts 200, it is clear that ceramics are outer
Shell 100 is made of ceramic material, specifically, ceramic package 100 can use zirconium oxide and aluminium oxide ceramics, this kind of ceramic material
Material has preferably elasticity and wearability, can well resist outside scraping, easy to clean, while making the thickness of whole mobile phone shell
It is thinning.Plastic parts 200 by way of injection moulding with the integrally connected of ceramic package 100.
In other embodiments, ceramic package 100 can also be raw material system by ceramic powder, organic functions auxiliary material and solvent
Pure, crude alcohol mixture can be made using butanol, deionized water, poly- second two into, solvent.By ceramic powder, organic functions auxiliary material and
Solvent is made ceramic size as a form of gel, in the mold cavity that ceramic size as a form of gel injection is specified, the side shone using infrared light
Formula obtains ceramic package blank by ceramic size coagulation forming as a form of gel, again by sintering, finally, by the way of jet cutting
Clout processing is carried out to ceramic package blank and the finished product of ceramic package 100 is formed.
In certain embodiments, plastic parts 200 is using PPS resin material (Polyphenylene sulfide, polyphenylene sulfide
Ether) it is made.In other embodiments, plastic parts 200 can (Polybutylene terephthalate gather using PBT resin
Mutual-phenenyl two acid bromide two alcohol ester) material is made.
Refering to Fig. 2 to Fig. 4, faying face 110 is provided with ceramic package 100, pits are provided with faying face 110
120, pit 120 is shaped as " coral reef " structure, plastic cement by injector by plastic-injection to the pit 120, after shaping
Plastic parts 200 " crab-bolt effect " will be produced with pit 120 and will be confined on the surface of ceramic package 100, plastic parts 200 with
Close occluding relation is formed between ceramic package 100, impulsive force has good resistivity, plastic parts 200 and pottery to external world
Ceramic shell 100 is not readily separated, and improves the stability and reliability for connecting between the two.
Specifically, the sectional dimension of pit 120 is A, the wherein span of A is 20nm≤A≤40nm.In some implementations
In example, the value of the sectional dimension A of pit 120 is 30nm.
The faying face 110 set on ceramic package 100 includes First terrace 111 and second step face 112.First step
Face 111 extends along vertical mode, and the one end in second step face 112 is connected with the bottom of First terrace 111, second step face
112 other end is horizontally extending, and First terrace 111 and second step face 112 vertically connect.
Refering to Fig. 3 and Fig. 4, lug 210 is provided with the two ends of the plastic parts 200 after shaping, the bottom surface of the lug 210 with
Second step face 112 is fitted, and the side of lug 210 is fitted with First terrace 111.Due to setting First terrace 111 and the
Two step surfaces 112, ceramic shell 10 can well resist the impulsive force of horizontal direction and vertical direction, further improve plastic parts
Bonding strength between 200 and ceramic package 100, it is ensured that the impact resistance of ceramic shell 10.
Refering to Fig. 1, the quantity of plastic parts 200 two, the cross section of ceramic package 100 is rectangle, and plastic parts 200 is connected
On the two ends corresponding with rectangular short side of ceramic package 100.When plastic parts 200 and ceramic package 100 are integrally formed, modeling
The side long of glue part 200 is parallel with the short side of ceramic package 100, and the short side of plastic parts 200 is parallel with the side long of ceramic package 100.
Due to making plastic parts 200 be combined with ceramic package 100 by way of injection, the crab-bolt of plastic parts 200 is outside ceramics
On shell 100, very strong snap-in force can be formed between the two, improve the stability of the structure of ceramic shell 10.Plastic parts 200 and pottery
Ceramic shell 100 is integrally formed, and simplifies the internal structure of ceramic shell 10, and whole ceramic shell 10 becomes more frivolous, improves
The outside perception of ceramic shell 10.Meanwhile, injection moulding speed is fast so that the process-cycle of ceramic shell 10 is short, reduces
Cost of labor, and production cost can further be reduced to improve the competitiveness of product in market by large-scale production.
In certain embodiments, the upper surface of plastic parts 200 keeps setpoint distance with the upper surface of ceramic package 100.One
As, in the vertical direction, the upper surface of the upper surface less than ceramic package 100 of plastic parts 200.
The present invention also provides a kind of electronic equipment, and the electronic equipment can be mobile phone, intelligent watch or palm PC etc..Electricity
Sub- equipment includes above-mentioned ceramic shell 10, and when above-mentioned ceramic shell 10 is used on mobile phone, mobile phone will be more lightening, and more
Rich technique aesthetic feeling.Meanwhile, also effectively prevent the problem of signal shielding, it is ensured that transmitting-receiving ability of the antenna for mobile phone to signal.
Refering to Fig. 5, the present invention also provides a kind of processing technology of ceramic shell 10.The processing technology mainly includes following step
Suddenly:
Be put into for ceramic package 100 setting time soaked in the alkali lye of certain pH value by S310, the first step, and alkali lye can be with
The grease being attached on ceramic package 100 and other pollutants produce chemical reaction, effectively clear so as to be carried out to ceramic package 100
Wash, ceramic package 100 soaks one minute or so in alkali lye.Ceramic package 100 in the immersion process of alkali lye, Ke Yitong
Cross stirring alkali lye or rock the mode of ceramic package 100, produce both and be fully contacted to improve immersion effect, it is ensured that ceramics are outer
Shell 100 realizes complete degreasing.
S320, second step takes out ceramic package 100 from alkali lye, then puts it into immersion in the acid solution of certain pH value
For a period of time, the alkali lye that acid solution can be remained on ceramic package 100 carries out neutralisation treatment.Meanwhile, in the corrosiveness of acid solution
Under, larger-size cellular nano hole can be etched on the inner surface of ceramic package 100, it will be understood that if immersion
Time is too short, and the blank of pit 120 cannot etch to be formed, or even cannot remove the alkali lye of residual;If long soaking time, acid
Liquid can form excessive corrosion to ceramic package 100, and the size in cellular nano hole is significantly increased, to whole ceramic package 100
Matrix forms excessive erosion effect.Therefore, ceramic package 100 soaks 3~5 minutes or so from acid solution.S330, the 3rd
Step, ceramic package 100 is taken out from acid solution, and puts it into leaching in solution containing amine substance (T liquid, Taiseiplas liquid)
Bubble, T liquid will etch the cellular nano hole of reduced size on larger cellular nano hole, finally in ceramic package 100
Faying face 110 on formed honeybee coral reef structure pit 120.The need for actual conditions, the step can be repeatedly.
S340, the 4th step takes out ceramic package 100 from T liquid, and ceramic package 100 is rinsed with pure water, with
The T liquid remained in the surface other parts of ceramic package 100 is washed away, ceramic package 100 is dried again after flushing, for example with
The method of infrared drying, ceramic package 100 absorbs infrared ray by moisture drying, and the method has rate of drying soon and quality is good
A little.It is of course also possible to use the method for microwave drying, generation distance is collided and rubbed after hydrone absorbs microwave, so that
It is heat energy by microwave energy, heat energy forms drying to moisture evaporation.It is noted that will adhere in pit 120
A certain amount of T liquid.
Plastic cement by the clamping of ceramic package 100 in mold cavity, pit is injected to by injection machine by S350, the 5th step
In 120, due to adhering to a certain amount of T liquid in pit 120, when the plastic cement of melting enters in pit 120, T liquid occurs with plastic cement
Ester and the exothermic chemical reaction of amine, have delayed the solidification of plastic cement, promote the place-exchange of T liquid and melt plastic cement, so that melting
The continual entrance of plastic cement pit 120 in, the plastic cement of melting will be filled with whole pit 120, and (surface of pit 120 can be with
The plastic cement of melting keeps sufficiently contact), it is ensured that exist between the plastic parts 200 and ceramic package 100 after curing molding enough
Contact area, improve adhesion between the two.
S360, the 6th step, the ceramic package 100 that will be connected with plastic parts 200 cools down certain hour in mold cavity, so
The ceramic shell 10 after shaping is taken out from mold cavity afterwards.During cooling, can by the way of the natural cooling in normal temperature,
, using by the way of air-cooled, the cooling velocity of ceramic shell 10 can also can be so improved, while not using in intermediary time period
Stress concentration phenomenon can be produced between plastic parts 200 and ceramic package 100, the stabilization of the structure of ceramic shell 10 is further ensured that
Property.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope of this specification record is all considered to be.
Embodiment described above only expresses several embodiments of the invention, and its description is more specific and detailed, but simultaneously
Can not therefore be construed as limiting the scope of the patent.It should be pointed out that coming for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of ceramic shell, is applied to electronic equipment, it is characterised in that including ceramic package and injection moulding in the ceramics
Plastic parts on shell.
2. ceramic shell according to claim 1, it is characterised in that the plastic parts includes PPS resin plastic parts or PBT
Resin plastic parts.
3. ceramic shell according to claim 1, it is characterised in that be provided with the ceramic package and the plastic parts
With the faying face with pit is merged, the sectional dimension of the pit is A, wherein 20nm≤A≤40nm.
4. ceramic shell according to claim 3, it is characterised in that the value of the pit sectional dimension A is 30nm.
5. ceramic shell according to claim 1, it is characterised in that the faying face includes First terrace, and with institute
First terrace second step face connected vertically is stated, is provided with the plastic parts and the First terrace and described second
The lug that step surface coordinates.
6. ceramic shell according to claim 1, it is characterised in that the cross section of the ceramic package is rectangle, institute
Plastic parts is stated to be connected on ceramic package two ends corresponding with the rectangular short side.
7. ceramic shell according to claim 1, it is characterised in that the plastic rubber member surface and the ceramic package surface
Keep setpoint distance.
8. ceramic shell according to claim 1, it is characterised in that the quantity of the plastic parts is two.
9. a kind of electronic equipment, it is characterised in that including the ceramic shell any one of claim 1 to 8.
10. a kind of ceramic shell processing technology, it is characterised in that comprise the following steps:
Ceramic package is put into alkali lye and soaks setting time;
Ceramic package is put into acid solution and soaks setting time;
Ceramic package is put into solution containing amine substance and soaks setting time to form pit to corrode;
By ceramic package pure water rinsing and drying;
Plastic cement is penetrated into pit by Shooting Technique to form the plastic parts with ceramic package integrally connected;
Cooling.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201710128459.3A CN106911824B (en) | 2017-03-06 | 2017-03-06 | Ceramic shell processing technology, ceramic shell and electronic equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710128459.3A CN106911824B (en) | 2017-03-06 | 2017-03-06 | Ceramic shell processing technology, ceramic shell and electronic equipment |
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Publication Number | Publication Date |
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CN106911824A true CN106911824A (en) | 2017-06-30 |
CN106911824B CN106911824B (en) | 2024-04-30 |
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CN107734895A (en) * | 2017-11-17 | 2018-02-23 | 出门问问信息科技有限公司 | Electronic equipment, housing and preparation method thereof |
CN108481653A (en) * | 2018-01-29 | 2018-09-04 | 东莞市立华塑胶制品有限公司 | A kind of production method and cell phone rear cover of cell phone rear cover |
CN109531913A (en) * | 2017-09-21 | 2019-03-29 | 谷崧精密工业股份有限公司 | Ceramoplastic complex and its manufacturing method |
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WO2020010811A1 (en) * | 2018-07-12 | 2020-01-16 | 歌尔股份有限公司 | Ceramic-plastic composite part and preparation method therefor |
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