CN107728433B - Exposure illumination device - Google Patents
Exposure illumination device Download PDFInfo
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- CN107728433B CN107728433B CN201710661709.XA CN201710661709A CN107728433B CN 107728433 B CN107728433 B CN 107728433B CN 201710661709 A CN201710661709 A CN 201710661709A CN 107728433 B CN107728433 B CN 107728433B
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/7015—Details of optical elements
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
- G03F7/7005—Production of exposure light, i.e. light sources by multiple sources, e.g. light-emitting diodes [LED] or light source arrays
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70075—Homogenization of illumination intensity in the mask plane by using an integrator, e.g. fly's eye lens, facet mirror or glass rod, by using a diffusing optical element or by beam deflection
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- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The invention provides an exposure illumination device, the exposure illumination device 1 irradiates a light beam emitted from a light source 10 having a plurality of LED modules 11 discretely arranged at a predetermined interval to an exposure surface 80, a plurality of cone-shaped 1 st light guide bodies 20 are arranged on the emitting side of each of the plurality of LED modules 11, the plurality of cone-shaped 1 st light guide bodies 20 are gradually enlarged in size along the optical axis direction 70 of the light beam emitted from the LED module 11, the area of the emitting end surface 22 is set to be larger than the area of the incident end surface 21 of the light beam, and the size of the light beam emitted from the LED module 11 at the incident end surface 21 of the 1 st light guide body 20 is set to be larger than the incident end surface 21 of the 1 st light guide body 20. The exposure illumination device can ensure uniformity of brightness distribution and sufficient illumination intensity of light beams emitted from a light source with a plurality of LED assemblies discretely arranged at a specified interval, and can perform stable substrate exposure.
Description
Technical Field
The present invention relates to an exposure illumination apparatus, and more particularly, to an exposure illumination apparatus for irradiating an exposure surface with light beams emitted from a plurality of LED modules arranged discretely at intervals.
Background
Various exposure illumination apparatuses for exposing a substrate have been known. The exposure illumination device irradiates a light beam emitted from a light source to an exposure surface through an optical device such as a lens system, and exposes a substrate. For the light source of such an exposure illumination device, a light source having high brightness is selected. As shown in patent documents 1 and 2, for example, an ultraviolet lamp or a halogen lamp has been conventionally used.
However, an ultraviolet lamp or a halogen lamp used for an exposure illumination device is generally short in life although high brightness can be obtained. Therefore, the frequency of replacement increases, the cost increases, and the like, which become factors for increasing the manufacturing cost of the substrate.
For this reason, in recent years, the use of long-life LED modules has been studied. That is, in recent years, a large-capacity LED module capable of obtaining high luminance has been developed, and application thereof to an exposure illumination apparatus has been actively studied. For an exposure illumination device using such an LED module, for example, refer to a technique disclosed in patent document 3.
That is, in the exposure illumination device of document 3, a plurality of LED modules (chip LEDs) are used as light sources, and light beams emitted from the plurality of LED modules are irradiated to an exposure surface through a tapered rod lens (tapered light guide) or a rod lens (light guide). The LED assembly is arranged on the incident end face of the conical rod lens, and the size of the LED assembly is set to be smaller than that of the incident end face of the conical rod lens.
Documents of the prior art
Patent document
[ patent document 1] Japanese patent application laid-open No. 2007 & 017897
[ patent document 2] Japanese patent laid-open publication No. 2012 and 238673
[ patent document 3] Japanese patent application laid-open No. 2003-330109
Disclosure of Invention
Problems to be solved by the invention
However, when the exposure illumination apparatus described above uses LED modules as the light sources, the LED modules are discretely arranged at predetermined intervals due to problems of wiring and heat generation, as shown in fig. 8.
However, when the plurality of LED modules are thus discretely arranged and the size of the LED modules is set to be smaller than the size of the incident end face of the tapered rod lens as described above, the light flux also becomes discrete at the exit end face of the tapered rod lens or rod lens, and a surface light source cannot be obtained. As a result, the energy density between light beams emitted from adjacent LED modules is reduced, and the maximum illuminance cannot be obtained from the light beam from the light source, which may prevent stable substrate exposure.
Therefore, there is a strong demand for the development of an exposure illumination device capable of ensuring uniformity of luminance distribution of a light beam and performing stable substrate exposure at maximum illuminance even when a plurality of LED modules are used.
The present invention has been made in view of such circumstances, and an object thereof is to provide an illumination device capable of ensuring uniformity and sufficient illuminance of light beams emitted from a light source in which a plurality of LED modules are discretely arranged at intervals, and performing stable substrate exposure.
Means for solving the problems
In order to achieve the above object, the invention of claim 1 relating to an exposure illumination apparatus is an exposure illumination apparatus for irradiating a light beam emitted from a light source to an exposure surface, the light source having a plurality of LED modules discretely arranged at intervals, wherein the exposure illumination apparatus has a plurality of tapered 1 st light guides adjacent to each other on an emission side of each of the plurality of LED modules, a size of the plurality of tapered 1 st light guides is gradually enlarged in an optical axis direction of the light beam emitted from the LED module, a size of an emission end surface is set to be larger than a size of an incident end surface of the light beam, and a size of the light beam emitted from the LED module at the incident end surface of the 1 st light guide is set to be larger than the incident end surface of the 1 st light guide.
According to the present invention, a plurality of tapered 1 st light guide bodies are provided adjacent to each other on the emission side of each of the plurality of LED modules, the tapered 1 st light guide bodies are gradually enlarged in size in the optical axis direction of the light flux emitted from the LED module, and the size of the emission end face is set larger than the size of the incident end face of the light flux, and the size of the light flux emitted from the LED module at the incident end face of the 1 st light guide body is set larger than the incident end face of the 1 st light guide body. Therefore, the light flux having the same size as the incident end face can be incident from the incident end face of the 1 st light guide body, and the light flux emitted from the LED module can be repeatedly reflected and gradually increased in size in the 1 st tapered light guide body, so that even in a light source having a plurality of LED modules arranged at intervals, the light flux can be prevented from being dispersed at the emission end face of the 1 st light guide body, the light flux can be emitted from one large surface light source, and the like, and the energy density can be prevented from being reduced between light fluxes emitted from adjacent LED modules. In this way, it is possible to ensure uniformity and sufficient illuminance of the light beam emitted from the light source and perform stable substrate exposure.
In addition, in the cone-shaped 1 st light guide body, the light beam emitted from the LED module is repeatedly reflected while the reflection angle is reduced, and a light beam having a close parallelism can be easily generated, and as a result, the manufacturing efficiency of the substrate can be improved.
If the LED module is provided on the incident end surface of the 1 st light guide body and the size of the LED module is set larger than the incident end surface, the size of the light flux emitted from the LED module at the incident end surface of the 1 st light guide body can be surely set larger than the incident end surface of the 1 st light guide body.
If the size of the light beam emitted from the LED module at the incident end surface of the 1 st light guide body is set to be larger than the incident end surface of the 1 st light guide body by providing an optical member between each of the plurality of LED modules and the 1 st light guide body to re-image the light emitting surface of the LED module, even in the case where the size of the LED module is smaller than the incident end surface of the 1 st light guide body, the size of the light emitted from the LED module can be easily made larger than the size of the incident end surface of the 1 st light guide body, and the like, and the degree of freedom in selecting the size of the LED module can be secured.
By densely joining the end portions of the emission end surfaces to each other, and arranging a plurality of 1 st light guide bodies adjacent to each other in parallel in a direction perpendicular to the optical axis direction of the light flux, it is possible to further prevent the light flux from being dispersed at the emission end surface of the 1 st light guide body, and to cause the light flux to be emitted from one large surface light source or the like, and it is possible to more reliably prevent the energy density from being reduced between the light fluxes emitted from the adjacent LED modules.
The plurality of 1 st light guide bodies have parallel portions parallel to the optical axis direction on the light beam emission side, and if the parallel portions are joined to each other, the adjacent 1 st light guide bodies can be surface-joined to each other, so that a stable joined state can be ensured (claim 5).
The 1 st light guide may be a tapered rod.
If the second light guide is provided on the exit side of the first light guide 1, extends in parallel to the optical axis direction of the light beam, and has an entrance end face on which the light beam emitted from the first light guide 1 enters and an exit end face on which the incident light beam exits, set to be substantially equal in size, and uniformizes the light beam emitted from the first light guide 1, the light beam can be further prevented from being dispersed at the exit end face of the light guide, the light beam can be emitted from a large surface light source, and the like, and the light beam emitted from the first light guide 1 can be more reliably uniformized.
In the 2 nd light guide, an end portion of the incident end face of the 2 nd light guide can be joined to an end portion of the emission end face of the 1 st light guide.
If an optical member is provided between the 1 st light guide and the 2 nd light guide, and the 2 nd light guide converges the light flux emitted from the 1 st light guide by the optical member and enters the light flux, the size of the 2 nd light guide can be set to a size corresponding to the size of the converged light flux, and the like, and the 2 nd light guide can be made compact.
The 2 nd light guide may be a rod integrator or a fly-eye integrator.
Effects of the invention
According to the present invention, it is possible to perform stable substrate exposure while ensuring uniformity and sufficient illuminance of light beams emitted from a light source in which a plurality of LED modules are discretely arranged at intervals.
Drawings
Fig. 1 is a block diagram showing the overall configuration of an exposure illumination apparatus according to embodiment 1 of the present invention.
Fig. 2 is a configuration diagram showing the entire configuration of the light source of the same exposure illumination apparatus.
Fig. 3 is a diagram for explaining technical effects of the same embodiment 1.
Fig. 4 is another diagram for explaining technical effects of the same embodiment 1.
Fig. 5 is a block diagram showing the entire configuration of an exposure illumination apparatus according to embodiment 2 of the present invention.
Fig. 6 is a block diagram showing the entire configuration of an exposure illumination apparatus according to embodiment 3 of the present invention.
Fig. 7 is a block diagram showing the entire configuration of an exposure illumination apparatus according to embodiment 4 of the present invention.
Fig. 8 is a diagram for explaining a problem of a conventional exposure illumination apparatus using an LED module.
Description of the reference numerals
1: exposure illumination device
2: exposure illumination device
3: exposure illumination device
4: exposure illumination device
10: light source
11: LED component (chip LED)
12: substrate
20: 1 st light guide
21: incident end face
22: exit end face
23: parallel portion
24: joint surface
30: no. 2 light guide
31: incident end face
32: exit end face
40: optical member
50: 1 st relay lens
60: 2 nd relay lens
70: direction of optical axis
80: exposure surface
81: substrate
82: mask and method for manufacturing the same
110: optical member
111: 1 st relay lens
112: 2 nd relay lens
200: no. 2 light guide
201: incident end face
202: exit end face
300: no. 2 light guide
301: incident end face
301 a: 1 st Compound eye
301 b: lens and lens assembly
302: exit end face
302 a: 2 nd compound eye
302 b: lens and lens assembly
400: optical member
400 a: optical member
401: 1 st relay lens
401 a: relay lens
402: 2 nd relay lens
500: optical member
500 a: optical member
501: 1 st relay lens
501 a: relay lens
502: 2 nd relay lens
Detailed Description
Hereinafter, embodiments 1 to 4 of the present invention will be described in detail with reference to the drawings.
[ embodiment 1]
Embodiment 1 of the present invention will be described in detail with reference to fig. 1 to 4. Fig. 1 is a schematic diagram showing the overall configuration of an exposure illumination apparatus according to embodiment 1 of the present invention, fig. 2 is a front view showing the overall configuration of a light source in the exposure illumination apparatus, fig. 3 is a diagram for explaining technical effects of embodiment 1, fig. 4 is another diagram for explaining technical effects of embodiment 1, and a hatched portion in fig. 4 shows that a light beam is emitted while forming a large surface light source on an emission end surface 22 of a 1 st light guide 20.
An outline of an exposure illumination apparatus of the present invention will be described with reference to fig. 1. The exposure illumination device 1 includes a light source 10, a 1 st light guide 20, a 2 nd light guide 30, and an optical member 40, and is configured to expose an exposure surface 80 while uniformizing a luminance distribution of a light beam, while gradually increasing in size in a direction perpendicular to an optical axis direction 70 of the light beam emitted from the light source 10 along the optical axis direction 70. A substrate 81 to be exposed is provided on the exposure surface 80 through a mask 82. That is, the exposure of the present embodiment is a proximity exposure method using a non-contact exposure method in which exposure is performed with a gap between the substrate 81 and the mask 82 set to about several μm to about several hundred μm.
The light source 10 has a plurality of LED assemblies 11. The LED modules 11 are rectangular and, as shown in fig. 2, are discretely arranged at predetermined intervals in the height direction and the depth direction on the substrate 12. In the present invention, the LED assembly 11 is a chip LED. The LED module 11 is disposed directly outside the incident end face 21 of the 1 st light guide 20, and the size of the LED module 11 is set larger than the size in the height direction and the depth direction of the incident end face 21, respectively, so as to cover the entire incident end face 21. That is, the size of the light flux emitted from the LED module 11 at the incident end surface 21 of the 1 st light guide 20 in the direction perpendicular to the optical axis direction is set to be larger than the size of the incident end surface 21 of the 1 st light guide 20.
The 1 st light guide 20 is adjacently disposed on the emission side of each of the plurality of LED modules 11, and is a rod. More specifically, the 1 st light guide 20 is a tapered rod integrator composed of a columnar light guide (rod) or a tubular light guide (rod) whose inner surface is a reflection surface, and is formed of synthetic quartz or the like. That is, the 1 st light guide 20 is tapered, and the incident end face 21 and the emission end face 22 are rectangular. The 1 st light guide 20 is gradually enlarged in size in the optical axis direction 70 of the light flux emitted from the LED module 11, and the emission end surface 22 is set to be larger in size than the incident end surface 21 of the light flux. By configuring the 1 st light guide 20 in this manner, the size of the light flux emitted from the light source 10 in the direction perpendicular to the optical axis direction can be gradually increased.
Here, the end portions of the emission end surfaces 22 of the plurality of 1 st light guide bodies 20 are densely joined to each other and are arranged adjacent to each other in parallel in a direction perpendicular to the optical axis direction 70 of the light flux. More specifically, the plurality of 1 st light guides 20 have parallel portions 23 parallel to the optical axis direction 70 on the light beam emission side, and are densely joined to each other by the joining surfaces 24 of the parallel portions 23.
The 2 nd light guide 30 is provided on the emission side of the 1 st light guide 20, and the end portion of the incident end surface 31 of the 2 nd light guide 30 is joined to the end portion of the emission end surface 22 of the 1 st light guide 20. The 2 nd light guide 30 is a rod. More specifically, the 1 st light guide 30 is a rod integrator composed of a columnar light guide (rod) or a tubular light guide (rod) having a reflection surface as an inner surface, and is formed of synthetic quartz or the like. That is, the 2 nd light guide 30 extends in parallel in the optical axis direction 70 of the light flux, and has a function of setting the size of the incident end surface 31 on which the light flux emitted from the 1 st light guide 20 is incident and the size of the incident end surface 32 on which the light flux is emitted to be equal or substantially equal, and uniformizing the luminance distribution of the light flux emitted from the 1 st light guide 20. The incident end surface 31 and the emission end surface 32 of the 2 nd light guide 30 are rectangular.
The optical member 40 is provided on the emission side of the 2 nd light guide 30. That is, the optical member 40 has the 1 st relay lens 50 and the 2 nd relay lens 60 configured by lenses of convex power, and has a function of irradiating the light flux emitted from the 2 nd light guide 30 to the exposure surface 80 while refracting it.
As described above, according to the present embodiment 1, the 1 st light guide 20 is provided adjacent to each other on the emission side of each of the plurality of LED modules 11, the 1 st light guide 20 is a tapered rod, the dimension of the 1 st light guide 20 is gradually enlarged in the optical axis direction 70 of the light flux emitted from the LED module 11, the dimension of the emission end surface 22 is set to be larger than the dimension of the incident end surface 21 of the light flux, and the dimension of the light flux emitted from the LED module 11 at the incident end surface 21 of the 1 st light guide 20 is set to be larger than the incident end surface 21 of the 1 st light guide 20. Therefore, while a light flux having a size equal to the size of the incident end surface 21 is incident from the incident end surface 21 of the 1 st light guide 20, as shown in fig. 3, the light flux emitted from the LED module 11 can be repeatedly reflected and gradually increased in size in the tapered 1 st light guide 20. As described above, as shown in fig. 4, even in the light source 10 having the plurality of LED modules 11 discretely arranged at predetermined intervals on the substrate 12, it is possible to prevent the light flux from being scattered at the emission end face 22 of the 1 st light guide 20, and to prevent the light flux from being emitted from one large surface light source, and the like, and to prevent the energy density from being reduced between the light fluxes emitted from the adjacent LED modules 11. In this way, it is possible to ensure uniformity of the luminance distribution of the light beam emitted from the light source 10 and sufficient illuminance, and perform stable substrate exposure.
Further, returning to fig. 3, in the tapered 1 st light guide 20, the light flux emitted from the LED module 11 is repeatedly reflected while reducing the reflection angle, so that light fluxes close in parallel can be easily generated, and as a result, the manufacturing efficiency of the substrate 81 can be improved.
That is, in the present invention, the angle θ of the light flux from the 2 nd relay lens 60 to the substrate 81 becomes small, and the Numerical Aperture (NA) becomes small. Therefore, "blur" on the exposure surface 80 can be appropriately prevented, and the gap between the substrate 81 and the mask 82 can be set relatively large, so that deterioration of the mask 82 can be appropriately prevented, and the frequency of replacement thereof can be reduced. Further, by maximizing the energy density projected on the exposure surface 80, it is also possible to appropriately prevent the exposure time of the substrate 81 from becoming long. This can improve the manufacturing efficiency of the substrate 81.
Further, since the plurality of 1 st light guides 20 are arranged adjacent to each other in parallel in the direction perpendicular to the optical axis direction 70 of the light flux with the end portions of the emission end surfaces 22 densely joined to each other, it is possible to further prevent the light flux from being dispersed at the emission end surfaces 22 of the 1 st light guides 20 and from being emitted from a single large surface light source, and it is possible to more reliably prevent the energy density from being reduced between the light fluxes emitted from the adjacent LED modules 11.
Further, the plurality of 1 st light guides 20 have parallel portions 23 parallel to the optical axis direction 70 on the light beam emission side, and the parallel portions 23 are densely bonded to each other, so that the adjacent 1 st light guides 20 can be surface-bonded to each other, and a stable bonded state can be ensured.
The 2 nd light guide 30 is provided on the emission side of the 1 st light guide 20, and the 2 nd light guide 30 is a rod, more specifically, a rod integrator extending in parallel to the optical axis direction 70, and has a function of equalizing the luminance distribution of the light flux emitted from the 1 st light guide 20 by setting the size of the incident end surface 31 on which the light flux emitted from the 1 st light guide 20 is incident and the size of the emission end surface 32 on which the incident light is emitted to be equal or substantially equal. Therefore, the light flux can be further prevented from being dispersed at the emission end surface of the light guide, and the light flux can be emitted from a large surface light source, and the luminance distribution of the light flux emitted from the 1 st light guide 20 can be more reliably uniformized. Incidentally, as described above, the 1 st light guide 20 has the parallel portion 23, and although there is a possibility that the parallel portion 23 causes a decrease in energy density, occurrence of such a decrease in energy density is reliably prevented by the incidence to the 2 nd light guide 30, so that the uniformization of the luminance distribution of the light flux can be achieved.
[ 2 nd embodiment ]
Next, embodiment 2 of the present invention will be described in detail with reference to fig. 5. In the description of embodiment 2, the same reference numerals are assigned to the same components as those in embodiment 1, and the description thereof will be omitted.
The exposure illumination device 2 according to embodiment 2 is shown as an example in which the position of the 2 nd light guide is changed. That is, in the present embodiment 2, the optical member 400 is provided between the 1 st light guide 20 and the 2 nd light guide 200, and the 2 nd light guide 200 refracts and converges the light flux emitted from the 1 st light guide 20 by the optical member 400 to make the light flux small and incident.
Like the above-described embodiment 1, the 2 nd light guide 200 is a rod. In more detail, the 2 nd light guide 200 is a rod integrator composed of a columnar light guide or a tubular light guide whose inner surface is a reflection surface, and is formed of synthetic quartz or the like. That is, the 2 nd light guide 200 extends in parallel in the optical axis direction 70 of the light flux, and has a function of equalizing the luminance distribution of the light flux emitted from the 1 st light guide 20 while setting the size of the incident end surface 201 on which the light flux emitted from the optical member 400 is incident and the size of the incident end surface 202 on which the incident light flux is emitted to be equal or substantially equal.
According to embodiment 2, with such a configuration, the size of the 2 nd light guide 200 can be set to a size corresponding to the size of the converged light flux, and the 2 nd light guide 200 can be made compact.
Further, since the light flux emitted from the 1 st light guide 20 is refracted and condensed by the optical member 400 to be incident on the 2 nd light guide 200, the luminance distribution of the light flux can be uniformized.
Also in embodiment 2, the optical member 400 is composed of a lens having convex power, and also includes a 1 st relay lens 401 and a 2 nd relay lens 402. Further, an optical member 500 is also provided on the light exit side of the 2 nd light guide 200, and the optical member 500 is composed of a lens having a convex power, and includes a 1 st relay lens 501 and a 2 nd relay lens 502. The light beam emitted from the 2 nd light guide 200 is refracted and irradiated to the exposure surface 80.
[ embodiment 3]
Next, embodiment 3 of the present invention will be described in detail with reference to fig. 6. In the description of embodiment 3, the same reference numerals are assigned to the components that are the same as those in embodiments 1 and 2, and the description thereof will be omitted as the same components.
An exposure illumination device 3 according to embodiment 3 is an example in which the configuration of the 2 nd light guide according to embodiment 2 is changed. That is, in embodiment 3, the 2 nd light guide 300 is a compound eye, and is formed of synthetic quartz or the like. More specifically, the 2 nd light guide 300 is a fly-eye integrator in which the 1 st fly eye 301a formed by a plurality of lenses 301b is provided on the incident end surface 301 side and the 2 nd fly eye 302a formed by a plurality of lenses 302b is provided on the emission end surface 302 side, and is configured to refract and converge the light flux emitted from the 1 st light guide 20 by the optical member 400, and to reduce the light flux and to enter the fly-eye integrator.
In the 2 nd light guide body 300 of the fly-eye integrator, a plurality of lenses 301b, 302b are in one-to-one correspondence on the fly- eyes 301a, 302a, for example, the lens 301b of the 1 st fly-eye 301a has a focal position on the corresponding lens 302b of the 2 nd fly-eye 302 a. Therefore, a light source image of the light flux incident on the 1 st fly eye 301a can be formed on each lens 302b of the 2 nd fly eye 302a, and uniform illumination can be performed. The 2 nd light guide 300 configured by the fly-eye integrator is set so that the size of the incident end surface 301 on which the light flux emitted from the optical member 400 is incident is equal to or substantially equal to the size of the incident end surface 302 on which the light flux is emitted, and has a function of uniformizing the luminance distribution of the light flux emitted from the 1 st light guide 20.
In the present embodiment 3, the optical member 400a is a relay lens 401a having convex power. Further, the 2 nd light guide 300 also has an optical member 500a on the light emission side, and the optical member 500a is also a single relay lens 501a having convex power. The light beam emitted from the 2 nd light guide 300 is refracted by the optical member 500a and irradiated to the exposure surface 80.
[ 4 th embodiment ]
Next, embodiment 4 of the present invention will be described in detail with reference to fig. 7. In the description of embodiment 4, the same reference numerals are assigned to the same components as those in embodiments 1 to 3, and the description thereof will be omitted.
An exposure illumination device 4 according to embodiment 4 is an example in which the configuration around the light source 10 in embodiments 1 to 3 is modified. That is, embodiment 4 shows a configuration in which the light source 10 and the 1 st light guide 20 are spaced outside. By providing the optical member 110 between each of the plurality of LED modules 11 provided in the light source 10 and the 1 st light guide 20 to re-image the light emitting surfaces of the LED modules 11, the size of the light flux emitted from the LED modules 110 at the incident end surface 21 of the 1 st light guide 20 is set to be larger than the incident end surface 21 of the 1 st light guide 20.
By configuring the embodiment 4 in this way, even when the size of the LED module 11 is smaller than the incident end surface 21 of the 1 st light guide 20, the size of the light flux emitted from the LED module 11 can be easily made larger than the size of the incident end surface 21 of the 1 st light guide 20, and the degree of freedom in selecting the size of the LED module 11 can be secured.
The optical member 110 is composed of a lens having convex power, has a 1 st relay lens 111 and a 2 nd relay lens 112, refracts and expands the light flux emitted from the LED module 11 and makes it incident on the 1 st light guide 20.
In embodiment 4, a position changing mechanism for changing the relative positions of the light source 10, the 1 st relay lens 111, the 2 nd relay lens 112, and the 1 st light guide 20 may be provided, and the size of the light flux incident on the 1 st light guide 20 may be appropriately adjusted.
Industrial applicability of the invention
The invention provides an exposure illumination device, which can ensure uniformity of brightness distribution of light beams emitted from a light source with a plurality of LED assemblies discretely arranged at a specified interval and sufficient illumination intensity, and can perform stable substrate exposure. Therefore, the manufacturing cost can be reduced, and a large contribution is made to the development of various manufacturing industries.
Claims (7)
1. An exposure illumination device for irradiating a light beam emitted from a light source having a plurality of LED elements discretely arranged at intervals to an exposure surface,
the exposure illumination device has a plurality of tapered 1 st light guide bodies adjacent to each other on an emission side of each of the plurality of LED modules, the plurality of tapered 1 st light guide bodies being gradually enlarged in size in an optical axis direction of a light beam emitted from the LED module, and an emission end face being set to be larger in size than an incident end face of the light beam,
the size of the light beam emitted from the LED module at the incident end surface of the 1 st light guide body is set to be larger than that of the incident end surface of the 1 st light guide body,
the LED assembly is arranged outside the incident end face of the 1 st light guide body,
the size of the LED component is set to be respectively larger than the height direction and the depth direction of the incident end face so as to cover the whole incident end face,
the size of the light beam emitted from the LED assembly at the incident end face of the 1 st light guide body in the direction perpendicular to the optical axis is set to be larger than the size of the incident end face of the 1 st light guide body,
the emission end surfaces of the plurality of tapered 1 st light guide members are rectangular, and the plurality of 1 st light guide members are arranged adjacent to each other in parallel in a direction perpendicular to the optical axis direction of the light flux by densely joining end portions of the emission end surfaces to each other.
2. The exposure illumination device according to claim 1, wherein the plurality of 1 st light guide bodies have parallel portions parallel to the optical axis direction on an emission side of the light beam, and the parallel portions are joined to each other.
3. The exposure illumination device according to claim 1 or 2, wherein the 1 st light guide is a tapered rod.
4. The exposure illumination device according to claim 1 or 2, comprising a 2 nd light guide body that uniformizes the light flux emitted from the 1 st light guide body, wherein the 2 nd light guide body is provided on an emission side of the 1 st light guide body and is set so that a size of an incident end surface on which the light flux emitted from the 1 st light guide body is incident is substantially equal to a size of an emission end surface from which the incident light flux is emitted, along an optical axis direction of the light flux.
5. The exposure illumination device according to claim 4, wherein the 2 nd light guide is: an end portion of the incident end surface of the 2 nd light guide is joined to an end portion of the emission end surface of the 1 st light guide.
6. The exposure illumination device according to claim 5, wherein an optical member is provided between the 1 st light guide and the 2 nd light guide, and the light flux emitted from the 1 st light guide is converged by the optical member and enters the 2 nd light guide.
7. The exposure illumination device according to claim 6, wherein the 2 nd light guide is a rod integrator or a fly-eye integrator.
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JP2016157450A JP6315720B2 (en) | 2016-08-10 | 2016-08-10 | Exposure illumination device |
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JP7277785B2 (en) | 2020-04-10 | 2023-05-19 | 日亜化学工業株式会社 | light emitting device |
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US20050088735A1 (en) * | 2003-10-22 | 2005-04-28 | Olszak Artur G. | Multi-axis imaging system with single-axis relay |
JP2003330109A (en) * | 2002-05-09 | 2003-11-19 | Seiko Epson Corp | Illuminator and projection type display device |
JP3991764B2 (en) * | 2002-05-10 | 2007-10-17 | セイコーエプソン株式会社 | Illumination device and projection display device |
JP2004335937A (en) * | 2002-11-25 | 2004-11-25 | Nikon Corp | Method for manufacturing aligner light source unit, aligner, exposure method and adjusting method for same |
US7245802B2 (en) * | 2003-08-04 | 2007-07-17 | Semiconductor Energy Laboratory Co., Ltd. | Beam homogenizer, laser irradiation apparatus and method for manufacturing semiconductor device |
JP4144532B2 (en) * | 2004-02-23 | 2008-09-03 | セイコーエプソン株式会社 | Illumination device and projection display device |
TW200625027A (en) * | 2005-01-14 | 2006-07-16 | Zeiss Carl Smt Ag | Illumination system for a microlithographic projection exposure apparatus |
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JP4678493B2 (en) * | 2005-05-23 | 2011-04-27 | 株式会社ニコン | Light source unit, illumination optical apparatus, exposure apparatus, and exposure method |
CN1924432B (en) * | 2005-08-31 | 2011-02-09 | 三洋电机株式会社 | Lighting device and projection type image display device |
CA2652240C (en) * | 2006-06-13 | 2016-04-26 | Wavien, Inc. | Illumination system and method for recycling light to increase the brightness of the light source |
US8330938B2 (en) * | 2009-02-27 | 2012-12-11 | Corning Incorporated | Solid-state array for lithography illumination |
US20100283978A1 (en) * | 2009-05-07 | 2010-11-11 | Ultratech,Inc. | LED-based UV illuminators and lithography systems using same |
JP2014003086A (en) * | 2012-06-15 | 2014-01-09 | Ushio Inc | Light irradiation device and exposure device |
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CN107728433A (en) | 2018-02-23 |
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