CN107718426A - Center, center manufacture method and electronic equipment - Google Patents
Center, center manufacture method and electronic equipment Download PDFInfo
- Publication number
- CN107718426A CN107718426A CN201710892906.2A CN201710892906A CN107718426A CN 107718426 A CN107718426 A CN 107718426A CN 201710892906 A CN201710892906 A CN 201710892906A CN 107718426 A CN107718426 A CN 107718426A
- Authority
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- China
- Prior art keywords
- substrate
- side frame
- center
- noumenon
- connector
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/18—Construction of rack or frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The embodiment of the present application provides a kind of center, center manufacture method and electronic equipment.Wherein, center includes first substrate and second substrate；First substrate connects with second substrate；First substrate includes the first noumenon and side frame, and the first noumenon connects with side frame；Formed with the first breach between the first noumenon and side frame；Second substrate is arranged on the first indentation, there, and second substrate is at close side frame formed with the second breach.Due to second substrate at the side frame close to first substrate formed with the second breach, when can mitigate injection molding second substrate to caused by the first noumenon and side frame briquetting pressure, and then prevent side frame from deforming, so as to improve the yields of center.
Description
Technical field
The application is related to electronic technology field, more particularly to a kind of center, center manufacture method and electronic equipment.
Background technology
With the development of electronic technology, the electronic equipment such as mobile phone, tablet personal computer and wearable device is widely made
With.Wherein, the part such as printed circuit board of electronic equipment generally requires is installed on the center of electronic equipment by screw, corresponding
, set nut to be realized with screw on center and be spirally connected.
However, in the prior art, when injection forms center, because injection molding pressure is larger, easily make center certain
A little narrower part deformations, cause the yields of center low.
The content of the invention
The embodiment of the present application provides a kind of center, center manufacture method and electronic equipment, can improve the yield rate of center.
In a first aspect, the embodiment of the present application provides a kind of center, including first substrate and second substrate；The first substrate
Connected with the second substrate；The first substrate includes the first noumenon and side frame, and the first noumenon connects with the side frame；
Formed with the first breach between the first noumenon and the side frame；The second substrate is arranged on first indentation, there, institute
Second substrate is stated at the close side frame formed with the second breach.
Second aspect, the embodiment of the present application also provide a kind of center manufacture method, including step：
First substrate is provided, wherein the first substrate includes the first noumenon and side frame, the first noumenon and the side
Frame connects, formed with the first breach between the first noumenon and the side frame；
Injection mold is provided, and the first substrate is put into the injection mold, wherein the injection mold by
Barrier bodies are provided with the nearly side frame, the barrier bodies are arranged in first breach；
Plastic cement is injected in the injection mold, is molded to form second substrate in first breach, wherein described second
Substrate forms the second breach at the barrier bodies, to reduce to the side frame when injection forms the second substrate
Briquetting pressure.
The third aspect, the embodiment of the present application also provide a kind of electronic equipment, including center, and the center is as described above
Center.
Fourth aspect, the embodiment of the present application also provide a kind of electronic equipment, including center, and the center is using as described above
Center manufacture method be made.
The center that the embodiment of the present application is provided, including first substrate and second substrate；First substrate and second substrate connect
Connect；First substrate includes the first noumenon and side frame, and the first noumenon connects with side frame；Formed with first between the first noumenon and side frame
Breach；Second substrate is arranged on the first indentation, there, and second substrate is at close side frame formed with the second breach.Due to second substrate
Formed with the second breach at the side frame close to first substrate, when can mitigate injection molding second substrate to caused by side frame into
Type pressure, and then prevent side frame from deforming, so as to improve the yields of center.
Brief description of the drawings
In order to illustrate more clearly of the technical scheme in the embodiment of the present application, make required in being described below to embodiment
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present application, for
For those skilled in the art, on the premise of not paying creative work, it can also be obtained according to these accompanying drawings other attached
Figure.
The structural representation for the electronic equipment that Fig. 1 is provided by the embodiment of the present application.
Another structural representation for the electronic equipment that Fig. 2 is provided by the embodiment of the present application.
The structural representation for the center that Fig. 3 is provided by the embodiment of the present application.
The partial structural diagram for the center that Fig. 4 is provided by the embodiment of the present application.
The partial cutaway schematic for the center that Fig. 5 is provided by the embodiment of the present application.
Another partial cutaway schematic for the center that Fig. 6 is provided by the embodiment of the present application.
The another partial cutaway schematic for the center that Fig. 7 is provided by the embodiment of the present application.
The another partial cutaway schematic for the center that Fig. 8 is provided by the embodiment of the present application.
The structural representation for the second breach that Fig. 9 is provided by the embodiment of the present application.
The schematic flow sheet for the center manufacture method that Figure 10 is provided by the embodiment of the present application.
The schematic flow sheet for forming second substrate that Figure 11 is provided by the embodiment of the present application.
Another schematic flow sheet for forming second substrate that Figure 12 is provided by the embodiment of the present application.
The another schematic flow sheet for forming second substrate that Figure 13 is provided by the embodiment of the present application.
Description of reference numerals：1 is electronic equipment, and 10 be housing, and 11 be fore shell, and 12 be center, and 12a is first substrate, 121
It is side frame for the first noumenon, 122,123 be the first breach, and 12b is second substrate, and 124 be the second body, and 125 be the second breach,
125a is connector, and 125b is the first side wall, and 125c is second sidewall, and 125d is protuberance, and 13 be rear shell, and 20 be display screen,
21 be viewing area, and 22 be non-display area, and 30 be printed circuit board, and 40 be battery.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present application, the technical scheme in the embodiment of the present application is carried out clear, complete
Site preparation describes.Obviously, described embodiment is only some embodiments of the present application, rather than whole embodiments.It is based on
Embodiment in the application, the every other implementation that those skilled in the art are obtained under the premise of creative work is not made
Example, belong to the scope of the application protection.
In the description of the present application, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer ", " up time
The orientation or position relationship of the instruction such as pin ", " counterclockwise " are based on orientation shown in the drawings or position relationship, are for only for ease of
Describe the application and simplify to describe, rather than indicate or imply that signified device or element must have specific orientation, Yi Te
Fixed azimuth configuration and operation, therefore it is not intended that limitation to the application.In addition, term " first ", " second " are only used for
Purpose is described, and it is not intended that instruction or hint relative importance or the implicit quantity for indicating indicated technical characteristic.
Thus, " first " is defined, the feature of " second " can be expressed or implicitly includes one or more feature.
In the description of the present application, " multiple " are meant that two or more, unless otherwise specifically defined.
, it is necessary to illustrate in the description of the present application, unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or be integrally connected；Can
To be mechanical connection or electrical connection or can mutually communicate；Can be joined directly together, can also be by between intermediary
Connect connected, can be connection or the interaction relationship of two elements of two element internals.For the ordinary skill of this area
For personnel, the concrete meaning of above-mentioned term in this application can be understood as the case may be.
In this application, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it " under "
Can directly it be contacted including the first and second features, it is not directly to contact but pass through it that can also include the first and second features
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " to include first special
Sign is directly over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " fisrt feature that includes are immediately below second feature and obliquely downward, or be merely representative of
Fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the application.In order to
Simplify disclosure herein, hereinafter the part and setting of specific examples are described.Certainly, they are only example, and
And purpose does not lie in limitation the application.In addition, the application can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, between itself not indicating discussed various embodiments and/or setting
Relation.In addition, this application provides various specific techniques and material examples, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
The embodiment of the present application provides a kind of center, center manufacture method and electronic equipment.It will carry out respectively specifically below
It is bright.
In the present embodiment, will be described from the angle of center, the center can specifically set in the electronic device, than
Such as mobile phone, tablet personal computer, palm PC, intelligent watch or Intelligent bracelet.
Referring to Fig. 1, Fig. 1 is the structural representation for the electronic equipment that the embodiment of the present application provides.The electronic equipment 1 includes
Housing 10, display screen 20, printed circuit board 30 and battery 40.
Wherein, the housing 10 can include fore shell 11, center 12 and rear shell 13.Fore shell 11, center 12 and rear shell 13 combine
Form the housing 10.The housing 10 has the confined space formed by fore shell 11, center 12 and rear shell 13, to accommodate display screen
20th, the device such as printed circuit board 30 and battery 40.
In certain embodiments, the lid of fore shell 11 is set on center 12, and the lid of rear shell 13 is set on center 12.Fore shell 11 and rear shell
13 are oppositely arranged, and fore shell 11 and rear shell 13 is located at the opposite face of center 12, the confined space of housing 10 is located at fore shell 11 with after
Between shell 13.
In certain embodiments, housing 10 can be metal shell.It should be noted that the embodiment of the present application is to housing 10
Material be not restricted, the material of housing 10 can also include：Such as plastic cement；For another example, plastic cement and metal.
In certain embodiments, fore shell 11 can be clear glass fore shell.For example, fore shell can be with sapphire etc.
Glass fore shell made of material.
It should be noted that the structure of the housing 10 of the embodiment of the present application is not limited to this, such as：Rear shell 13 and center 12
It can be integrally formed.
In the embodiment of the present application, display screen 20 may be mounted in housing 10, meanwhile, the display screen 20 can electrically connect
To printed circuit board 30, to form the display surface of electronic equipment 1.The display screen 20 can include viewing area 21 and non-display
Region 22.The viewing area 21 is displayed for the picture of electronic equipment 1 or carries out touching manipulation etc. for user.This is non-aobvious
The perforate for sound and/or light conduction can be opened up by showing the top area in region 22.The bottom section of the non-display area 22
The function elements such as fingerprint module and/or touch controlled key can be set.Wherein fore shell 11 can be installed on display screen, aobvious to cover
Display screen 20, formation and the identical viewing area of display screen 20 and non-display area, it can specifically refer to the viewing area of display screen 20
Domain and non-display area.
It should be noted that the structure of display screen 20 is not limited to this.Such as in some embodiments, display screen 20
Can be comprehensive screen or opposite sex screen.Specifically, referring to Fig. 2, Fig. 2 is another knot for the electronic equipment that the embodiment of the present application provides
Structure schematic diagram.The difference of the electronic equipment in electronic equipment and Fig. 1 in Fig. 2 is：The non-display area 22 is formed directly into
On display screen 20, for example in the non-display area 22 of display screen 20 transparent configuration is arranged on, so that optical signal passes through, or directly
Open up in the non-display area 22 of display screen 20 and tied for the perforate of light conduction or product etc., can by front camera and/or
Photoelectric sensor etc. is arranged at non-display area position, so that front camera is taken pictures and/or so that photoelectric sensor detects.
In the embodiment of the present application, printed circuit board 30 may be mounted in housing 10.The printed circuit board 30 can be
The mainboard or subplate of electronic equipment 1.Motor, microphone, receiver or processor etc. can be integrated with printed circuit board 30
Function element.
In certain embodiments, printed circuit board 30 can be fixed in housing 10.Specifically, the printed circuit board 30 can
To be screwed to by screw on center, can also be fitted on using card by the way of buckle on center 12.It should be noted that the application
The mode that the printed circuit board 30 of embodiment is fixed to center is not limited to this, can also use other manner, for example pass through card
The mode such as button and the common fixation of screw.It is provided with distributing point on printed circuit board 30, the antenna part (not shown) of center 12 can be with
It is electrically connected to the distributing point.
In the embodiment of the present application, battery 40 may be mounted in housing 10, and battery 40 and printed circuit board 30 carry out electricity
Connection, to provide power supply to electronic equipment 1.Housing 10 can be used as battery cover.Housing 10 covers battery 40 to protect battery 40,
Specifically, battery 40 can be covered by rear shell 13 to protect battery 40, prevent due to when electronic equipment is collided or falls
Battery is caused damage.
It is described below from the angle of center.
Fig. 3 to Fig. 8 is referred to, Fig. 3 is the structural representation for the center that the embodiment of the present application provides, and Fig. 4 is that the application is real
The partial structural diagram of the center of example offer is applied, Fig. 5 is the partial cutaway schematic for the center that the embodiment of the present application provides.Its
In, Fig. 4 is the enlarged diagram of the part B in Fig. 3, and Fig. 5 to Fig. 8 is the partial cutaway schematic in Fig. 3.
The center 12 includes first substrate 12a and second substrate 12b.Wherein, first substrate 12a includes the first noumenon
121 and side frame 122.The first noumenon 121 and side frame 122 connect.Formed with the first breach between the first noumenon 121 and side frame 122
123.Second substrate 12b is arranged at the first breach 123, and second substrate 12b is arranged at the first breach 123, second substrate 12b
Formed with the second breach 125 at close side frame 122.
Due to second substrate 12b at the side frame 122 formed with the second breach 125, so as in shaping second substrate 12b
When, impact of the briquetting pressure to first substrate 12a side frame 122 can be mitigated, so as to prevent first substrate 12a side frame 122
Deformation.
In some embodiments, the first noumenon 121 and side frame 122 can be integrally formed.For example, using magnesium alloy material
Material, the first noumenon 121 and side frame 122 are integrally formed using extrusion process.
In some embodiments, as shown in figure 5, second substrate 12b includes the second body 124 and connector 125a, its
Middle connector 125a connects the first noumenon 121 and side frame 122 respectively.Second body 124 is formed at the first breach 123.Connection
Body 125a forms the second breach 125 on the second body 124.
Specifically, the thickness of connector can be caused to be less than the thickness of side frame, so as to which connector is formed on the second body
Second breach, the first noumenon and second substrate can be caused to exist in the binding face and side frame and second substrate of the first notch side
The binding face of first notch side is smaller.Wherein, the thickness of connector and the thickness of side frame each mean the side for being approximately perpendicular to center
To thickness.
In some embodiments, second substrate 12b can pass through injection molding.
Because side frame bandpass is smaller, if the briquetting pressure that side frame is acted on during injection molding second substrate is too big,
Easily side frame is caused to deform.In the application embodiment, because connector forms the second breach on the second body so that the
One body and second substrate the first notch side binding face and side frame and second substrate the first notch side binding face compared with
It is small, so that reducing the briquetting pressure for acting on side frame and the first noumenon in injection molding second substrate, to avoid
Side frame and the first noumenon deformation, improve the yield rate of center.
In some embodiments, as shown in fig. 6, second substrate 12b include the second body 124, the first side wall 125b and
Connector 125a, wherein the first side wall 125b connections the first noumenon 121, connector 125a connects the first side wall 125b and side respectively
Frame 122.Second body 124 is formed at the first breach 123.The first side wall 125b and connector 125a is on the second body 124
Form the second breach 125.
Specifically, the thickness of connector can be caused to be less than the thickness of side frame, the thickness of the first side wall can be less than or equal to
The thickness of the first noumenon, so as to which connector and the first side wall form the second breach on the second body, side frame and the can make it that
Two substrates are smaller in the binding face of the first notch side.Wherein, the thickness of connector and the thickness of the first noumenon each mean and substantially hung down
Directly in the thickness in the direction of center.
Because side frame bandpass is smaller, the first noumenon bandpass is larger, if being acted on during injection molding second substrate
The briquetting pressure of side frame is too big, then easily causes side frame to deform.In the application embodiment, due to connector and the first side wall
The second breach is formed on the second body so that side frame and second substrate are smaller in the binding face of the first notch side, so as to
Act on the briquetting pressure of side frame so that reducing in injection molding second substrate, to avoid side frame from deforming, improve center into
Product rate.
It is possible to further which the first side wall is arranged into thin-walled, so that subtracting in injection molding second substrate
The small briquetting pressure for acting on the first noumenon, to avoid the first noumenon from deforming.
In some embodiments, as shown in fig. 7, second substrate 12b includes the second body 124, the first side wall 125b, connected
Junctor 125a and second sidewall 125c, wherein the first side wall 125b connections the first noumenon 121, second sidewall 125c connection side frames
122, connector 125a connects the first side wall 125b and second sidewall 125c respectively.Second body 124 is formed in the first breach 123
Place, the first side wall 125b, connector 125a and second sidewall 125c form the second breach 125 on the second body 124.
Specifically, the thickness of connector can be caused to be less than the thickness of side frame, the thickness and/or second sidewall of the first side wall
Thickness can be less than or equal to the thickness of the first noumenon, so as to connector and the first side wall, to form second on the second body scarce
Mouthful, it can make it that side frame and second substrate are smaller in the binding face of the first notch side.Wherein, the thickness and the first noumenon of connector
Thickness each mean the thickness in the direction for being approximately perpendicular to center.It should be noted that the width of second sidewall could be arranged to
The width of lesser width, wherein second sidewall refers to the width in the direction of plane where being roughly parallel to center.
Because side frame bandpass is smaller, if the briquetting pressure that side frame is acted on during injection molding second substrate is too big,
Easily side frame is caused to deform.In the application embodiment, because connector, the first side wall and second sidewall are on the second body
The second breach is formed, because the first side wall and second sidewall are relatively thin, can make it that reduction acts in injection molding second substrate
In the briquetting pressure of the first noumenon and side frame, to avoid the first noumenon and side frame from deforming, the yield rate of center is improved.
In some embodiments, as shown in figure 8, connector 125a is provided with least one protuberance 125d.Protuberance
125d is between the first noumenon 121 and side frame 122.
In some embodiments, as shown in Figure 8 and Figure 9, the surface of protuberance can be with curved, such as protuberance can be with
It is semi-cylindrical or hemispherical etc..It should be noted that the structure of the protuberance of the embodiment of the present application is not limited to this, it is prominent
Portion can be any raised structure.For example protuberance can include at least one hill.The quantity of hill can be one,
Two or more.
In some embodiments, the thickness of protuberance is more than the thickness of connector.
In the application embodiment, due to protuberance connector protrude, can cause in injection molding second substrate
When plastic cement be initially formed protuberance, connector and the second body are re-formed, so that subtracting in injection molding second substrate
The small briquetting pressure for acting on the first noumenon and side frame, to avoid the first noumenon and side frame from deforming, improve the yield rate of center.
In some embodiments, side frame is smaller in the screw hole wall wide degree of the first notch side formed with screw hole, and second
Second breach of substrate can be made only in close to the screw hole wall side, shaping pressure during preventing injection molding second substrate
Power causes screw bore deformation.
It should be noted that the structure of second breach of the embodiment of the present application is not limited to above-mentioned several ways, it is only necessary to
So that plastic cement during injection molding second substrate at side frame is less or without plastic cement.
In some embodiments, first substrate 12a side frame 122 can be antenna radiator.Antenna radiator is used for
Transmitting and reception signal.For example, antenna radiator can be used for the transmitting and reception of mobile network signals, it can be used for Wi-Fi
The transmitting and reception of signal, can be used for the transmitting and reception of Bluetooth signal, or can be used for the transmitting of radiofrequency signal and connect
Receive.As shown in figure 4, antenna radiator is in suspension beam structure, and the narrower width of side frame, it is yielding.However, the embodiment of the present application is led to
Cross second substrate 12b set the second breach, so as to reduce acted on during injection molding second substrate 12b antenna radiator into
Type pressure, influence during avoiding injection molding second substrate 12b to antenna radiator, prevents antenna radiator from deforming.
The center that the embodiment of the present application is provided, including first substrate and second substrate；First substrate and second substrate connect
Connect；First substrate includes the first noumenon and side frame, and the first noumenon connects with side frame；Formed with first between the first noumenon and side frame
Breach；Second substrate is arranged on the first indentation, there, and second substrate is at close side frame formed with the second breach.Due to second substrate
Formed with the second breach at the side frame close to first substrate, when can reduce injection molding second substrate to caused by side frame into
Type pressure, and then prevent side frame from deforming, so as to improve the yields of center.
In order to preferably describe the middle frame structure of the embodiment of the present application, will be retouched below from the direction of center manufacture method
State.
Fig. 5 and Figure 10 are referred to, Figure 10 is the schematic flow sheet for the center manufacture method that the embodiment of the present application provides.In this
Frame manufacture method comprises the following steps：
Step 101, there is provided first substrate 12a, wherein first substrate 12a include the first noumenon 121 and side frame 122, the
One body 121 and side frame 122 connect, formed with the first breach 123 between the first noumenon 121 and side frame 122.
Step 102, there is provided injection mold, and first substrate 12a is put into injection mold, wherein injection mold is close
Barrier bodies are provided with side frame 122, barrier bodies are arranged in first breach 123.
Step 103, plastic cement is injected in injection mold, second substrate 12b is formed in the injection of the first breach 123, wherein the
Two substrate 12b form the second breach 125 at barrier bodies, to reduce to side frame 122 when injection forms second substrate 12b
Briquetting pressure.
In the embodiment of the present application, because injection mold is being provided with barrier bodies at side frame, so as in injection molding
During second substrate, barrier bodies can stop the briquetting pressure of the plastic cement percussion to caused by side frame, to prevent side frame from deforming, carry
The yield rate of high center.
In some embodiments, as shown in Fig. 6 and Figure 11, second substrate 12b step is formed in the injection of the first breach 123
Suddenly can include：
Step 201, when plastic cement is injected in injection mold, plastic cement first forms connector at the barrier bodies of injection mold
125a, wherein connector 125a connect the first noumenon 121 and side frame 122 respectively.
Step 202, plastic cement continuously forms the second body 124 being connected with connector 125a；Wherein connector 125a is
The second breach 125 is formed on two bodies 124.
Due to connector is first formed at the barrier bodies in injection mold in injection molding second substrate so that connector
Thickness is less than the thickness of side frame, and connector forms the second breach on the second body, can cause the first noumenon and second substrate
It is smaller in the binding face of the first notch side in the binding face and side frame and second substrate of the first notch side, so that
Reduce the briquetting pressure for acting on side frame and the first noumenon in injection molding second substrate, to avoid side frame and the first noumenon from becoming
Shape, improve the yield rate of center.
In some embodiments, formed with the first gap between barrier bodies and the first noumenon 121, and then, such as Fig. 7 and figure
Shown in 12, it can include in the step of 123 injection molding second substrate 12b of the first breach：
Step 301, when plastic cement is injected in injection mold, plastic cement first forms the first side wall 125b in the first gap, wherein
The first side wall 125b connections the first noumenon 121；
Step 302, plastic cement continues to form connector 125a at the barrier bodies of injection mold, wherein connector 125a points
Lian Jie not the first side wall 125b and side frame 122；
Step 303, plastic cement continuously forms the second body 124 being connected with connector 125a；Wherein the first side wall 125b and
Connector 125a forms the second breach 125 on the second body 124.
In the embodiment of the present application, in injection molding second substrate, first is first formed between the first noumenon and barrier bodies
Side wall, then connector is formed at the barrier bodies of injection mold so that connector and the first side wall form the on the second body
Two breach.During due to injection molding second substrate, the binding face of plastic cement and side frame is smaller, only a small amount of plastic cement contact side frame,
It can to reduce the briquetting pressure for acting on side frame in injection molding second substrate, to avoid side frame from deforming, improve center
Yield rate.
Smaller it is possible to further which the first gap setting is obtained, i.e. the first side wall of injection molding is relatively thin, so as to so that
The briquetting pressure for reducing in injection molding second substrate and acting on the first noumenon is obtained, to avoid the first noumenon from deforming.
In some embodiments, formed with the first gap, barrier bodies and side frame between barrier bodies and the first noumenon 121
Formed with the second gap between 122, and then, as shown in figure 8 and 13, the injection molding second substrate 12b's of the first breach 123
Step can include：
Step 401, by plastic cement inject injection mold in when, plastic cement first the first gap formed the first side wall 125b and
Second gap forms second sidewall 125c, wherein the first side wall 125b connections the first noumenon 121, second sidewall 125c connection side frames
122；
Step 402, plastic cement continues to form connector 125a at the barrier bodies of injection mold, wherein connector 125a points
Lian Jie not the first side wall 125b and second sidewall 125c；
Step 403, plastic cement continuously forms the second body 124 being connected with connector 125a；Wherein the first side wall 125b, connect
Junctor 125a and second sidewall 125c forms the second breach 125 on the second body 124.
In the embodiment of the present application, in injection molding second substrate, first is first formed between the first noumenon and barrier bodies
Second sidewall is formed between side wall and side frame and barrier bodies, then connector is formed at the barrier bodies of injection mold so that even
Junctor, the first side wall and second sidewall form the second breach on the second body.Second gap setting can be obtained smaller, that is, noted
It is moulded into that the second sidewall of type is relatively thin, so that reducing the shaping pressure for acting on side frame in injection molding second substrate
Power, to avoid side frame from deforming, improve the yield rate of center.Because the width of the first noumenon is more than the width of side frame, therefore can be with
Require nothing more than the second gap setting is obtained it is smaller.It is understood, however, that the first gap and the second gap can be all provided with simultaneously
It is smalllyer standby, to avoid the first noumenon and side frame from deforming.
In some embodiments, barrier bodies are provided with depressed part, the depressed area in the first noumenon 121 and side frame 122 it
Between.And then it can also include in the step of 123 injection molding second substrate 12b of the first breach：
When plastic cement is injected in injection mold, plastic cement forms protuberance 125d in the depressed part of injection mold at first.
Plastic cement is at first after the depressed part of injection mold forms protuberance 125d, then perform step 201 to step 202, step
Rapid 301 to step 303 or step 401 to step 403.
In some embodiments, the surface of protuberance can be with curved, such as protuberance can be semi-cylindrical or half
It is spherical etc..It should be noted that the structure of the protuberance of the embodiment of the present application is not limited to this, protuberance can be any convex
The structure risen.For example protuberance can include at least one hill.The quantity of hill can be one, two or two with
On.
In some embodiments, the thickness of protuberance is more than the thickness of connector.
In the application embodiment, due to protuberance connector protrude, can cause in injection molding second substrate
When plastic cement be initially formed protuberance, connector and the second body are re-formed, so that subtracting in injection molding second substrate
The small briquetting pressure for acting on the first noumenon and side frame, to avoid the first noumenon and side frame from deforming, improve the yield rate of center.
In some embodiments, after the injection of the first breach 123 forms second substrate 12b, first substrate 12a and second
Substrate 12b is integrally formed, so as to improve the intensity of center.
In some embodiments, side frame is smaller in the screw hole wall wide degree of the first notch side formed with screw hole, and second
Second breach of substrate can be made only in close to the screw hole wall side, shaping pressure during preventing injection molding second substrate
Power causes screw bore deformation.
In some embodiments, the step of forming first substrate 12a, can specifically include：
Form the first noumenon 121 and side frame 122 using magnesium alloy materials so that the first noumenon 121 and the one of side frame 122 into
Type first substrate 12a.
It should be noted that the material that the embodiment of the present application forms first substrate 12a is not limited to magnesium alloy materials.Formed
First substrate 12a material can also be mixing material of other metal materials or metal and plastics etc..
In addition, it is necessary to explanation, the embodiment of the present application, which forms first substrate 12a, can use die casting, injection or milling pin
Etc. technique.
The center manufacture method that the embodiment of the present application provides, it can avoid in the fabrication process to some positions of center,
Such as the first noumenon 121 and side frame 122 cause excessive briquetting pressure and cause to deform, and improve the intensity of center, also improve
The yield rate of center.
It should be noted that above center 12 is arranged in electronic equipment, it is only illustrating for the embodiment of the present application
Bright, the center 12 is not limited to electronic equipment 1, and the concrete structure of the center 12 is also not limited to this.
It will be understood by those skilled in the art that the structure of the electronic equipment 1 shown in Fig. 1 and Fig. 2 not structure paired electrons
The restriction of equipment 1.Electronic equipment 1 can be included than illustrating more or less parts, either combine some parts or difference
Part arrangement.Electronic equipment 1 can also include processor, memory and bluetooth module etc., will not be repeated here.
Although the application, those skilled in the art have shown and described relative to one or more implementations
Based on the reading to the specification and drawings and understand it will be appreciated that equivalent variations and modification.The application includes all such repair
Change and modification, and be limited only by the scope of the following claims.In particular, to the various functions performed by said modules, use
Being intended to correspond to the specified function of performing the component in the term of component as description, (such as it is functionally of equal value
) random component (unless otherwise instructed), with performing the exemplary realization of this specification shown in this article in structure
The open structure of function in mode is not equivalent.In addition, although the special characteristic of this specification is relative to some realization sides
Only one in formula is disclosed, but this feature can with as can be it is expected and favorably for given or application-specific
Other one or more combinations of features of other implementations.Moreover, with regard to term " comprising ", " having ", " containing " or its deformation
For being used in embodiment or claim, such term is intended to the bag in a manner of similar to term "comprising"
Include.
Center, center manufacture method and the electronic equipment provided above the embodiment of the present application is described in detail, this
Apply specific case in text to be set forth the principle and embodiment of the application, the explanation of above example is only intended to
Help understands the application.Meanwhile for those skilled in the art, according to the thought of the application, in embodiment and answer
With there will be changes in scope, in summary, this specification content should not be construed as the limitation to the application.
Claims (19)
1. a kind of center, it is characterised in that including first substrate and second substrate；The first substrate and the second substrate connect
Connect；The first substrate includes the first noumenon and side frame, and the first noumenon connects with the side frame；The first noumenon and institute
State between side frame formed with the first breach；The second substrate is arranged on first indentation, there, and the second substrate is close
Formed with the second breach at the side frame.
2. center according to claim 1, it is characterised in that the second substrate includes the second body and connector, institute
State the formation of the second body and second breach is formed on second body in first indentation, there, the connector, its
Described in connector connect the first noumenon and the side frame respectively.
3. center according to claim 1, it is characterised in that the second substrate include the second body, the first side wall and
Connector, second body are formed in first indentation, there, the first side wall and the connector at described second
Second breach is formed on body, wherein the first side wall connects the first noumenon, the connector connects described respectively
The first side wall and the side frame.
4. center according to claim 1, it is characterised in that the second substrate includes the second body, the first side wall, company
Junctor and second sidewall, second body are formed in first indentation, there, the first side wall, the connector and described
Second sidewall forms second breach on second body, wherein the first side wall connects the first noumenon, institute
State second sidewall and connect the side frame, the connector connects the first side wall and the second sidewall respectively.
5. according to the center described in any one of claim 2 to 4, it is characterised in that the connector is provided with least one prominent
Go out portion, the protruding parts are between the first noumenon and the side frame.
6. center according to claim 1, it is characterised in that the first substrate and the second substrate are integrally formed.
7. center according to claim 1, it is characterised in that the first noumenon and the side frame are integrally formed.
8. center according to claim 1, it is characterised in that the first substrate is made of magnesium alloy.
9. center according to claim 1, it is characterised in that the second substrate passes through injection molding.
10. center according to claim 1, it is characterised in that the side frame is antenna radiator.
11. a kind of center manufacture method, it is characterised in that including step：
First substrate is provided, wherein the first substrate includes the first noumenon and side frame, the first noumenon and the side frame connect
Connect, formed with the first breach between the first noumenon and the side frame；
Injection mold is provided, and the first substrate is put into the injection mold, wherein the injection mold is close to institute
State and barrier bodies are provided with side frame, the barrier bodies are arranged in first breach；
Plastic cement is injected in the injection mold, is molded to form second substrate in first breach, wherein the second substrate
The second breach is formed at the barrier bodies, to reduce the shaping to the side frame when injection forms the second substrate
Pressure.
12. center manufacture method according to claim 11, it is characterised in that described to be molded to be formed in first breach
The step of second substrate, includes：
When plastic cement is injected in the injection mold, the plastic cement first forms connector at the barrier bodies of the injection mold,
Wherein described connector connects the first noumenon and the side frame respectively；
Then the plastic cement forms the second body being connected with the connector；Wherein described connector is on second body
Form second breach.
13. center manufacture method according to claim 11, it is characterised in that the barrier bodies and the first noumenon it
Between formed with the first gap, it is described to be molded the step of forming second substrate in first breach and include：
When plastic cement is injected in the injection mold, the plastic cement first forms the first side wall in first gap, wherein described
The first side wall connects the first noumenon；
Then the plastic cement forms connector at the barrier bodies of the injection mold, wherein the connector connect respectively it is described
The first side wall and the side frame；
Then the plastic cement forms the second body being connected with the connector；Wherein described the first side wall and the connector exist
Second breach is formed on second body.
14. center manufacture method according to claim 11, it is characterised in that the barrier bodies and the first noumenon it
Between formed with the first gap, it is described to be noted in first breach formed with the second gap between the barrier bodies and the side frame
It is moulding to include into the step of second substrate：
When plastic cement is injected in the injection mold, the plastic cement first forms the first side wall in first gap and described
Second gap forms second sidewall, wherein the first side wall connects the first noumenon, the second sidewall connects the side
Frame；
Then the plastic cement forms connector at the barrier bodies of the injection mold, wherein the connector connect respectively it is described
The first side wall and the second sidewall；
Then the plastic cement forms the second body being connected with the connector；Wherein described the first side wall, the connector and
The second sidewall forms second breach on second body.
15. the center manufacture method according to any one of claim 12 to 14, it is characterised in that the barrier bodies are provided with recessed
The portion of falling into, the depressed area are described to be molded to form second in first breach between the first noumenon and the side frame
The step of substrate, also includes：
When plastic cement is injected in the injection mold, the plastic cement forms protuberance in the depressed part of the injection mold at first.
16. center manufacture method according to claim 11, it is characterised in that be molded to form second in first breach
After substrate, the first substrate and the second substrate are integrally formed.
17. center manufacture method according to claim 11, it is characterised in that described the step of providing first substrate wraps
Include：
Form the first noumenon and the side frame using magnesium alloy materials so that the first noumenon and the side frame one into
First substrate described in type.
18. a kind of electronic equipment, it is characterised in that including center, the center is as described in any one of claim 1 to 10
Center.
19. a kind of electronic equipment, it is characterised in that including center, the center is as described in any one of claim 11 to 17
Manufacture method manufacture center.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710892906.2A CN107718426B (en) | 2017-09-27 | 2017-09-27 | Middle frame, middle frame manufacturing method and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710892906.2A CN107718426B (en) | 2017-09-27 | 2017-09-27 | Middle frame, middle frame manufacturing method and electronic equipment |
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| CN107718426A true CN107718426A (en) | 2018-02-23 |
| CN107718426B CN107718426B (en) | 2023-09-05 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108901154A (en) * | 2018-06-29 | 2018-11-27 | Oppo广东移动通信有限公司 | Center production method, center and electronic device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102562939A (en) * | 2010-12-09 | 2012-07-11 | 东洋橡胶工业株式会社 | Vibration isolation apparatus |
| CN202524441U (en) * | 2012-04-17 | 2012-11-07 | 广东欧珀移动通信有限公司 | Shell structure of all-metal middle frame mobile phone |
| CN203827390U (en) * | 2014-03-12 | 2014-09-10 | 福建省石狮市通达电器有限公司 | Novel integrated mobile phone intermediate frame |
| CN203942555U (en) * | 2014-06-30 | 2014-11-12 | 深圳市渴望通信有限公司 | A kind of Novel mobile phone construction |
| CN207252109U (en) * | 2017-09-27 | 2018-04-17 | 广东欧珀移动通信有限公司 | Center and electronic equipment |
-
2017
- 2017-09-27 CN CN201710892906.2A patent/CN107718426B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102562939A (en) * | 2010-12-09 | 2012-07-11 | 东洋橡胶工业株式会社 | Vibration isolation apparatus |
| CN202524441U (en) * | 2012-04-17 | 2012-11-07 | 广东欧珀移动通信有限公司 | Shell structure of all-metal middle frame mobile phone |
| CN203827390U (en) * | 2014-03-12 | 2014-09-10 | 福建省石狮市通达电器有限公司 | Novel integrated mobile phone intermediate frame |
| CN203942555U (en) * | 2014-06-30 | 2014-11-12 | 深圳市渴望通信有限公司 | A kind of Novel mobile phone construction |
| CN207252109U (en) * | 2017-09-27 | 2018-04-17 | 广东欧珀移动通信有限公司 | Center and electronic equipment |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108901154A (en) * | 2018-06-29 | 2018-11-27 | Oppo广东移动通信有限公司 | Center production method, center and electronic device |
| CN108901154B (en) * | 2018-06-29 | 2020-06-30 | Oppo广东移动通信有限公司 | Middle frame manufacturing method, middle frame and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107718426B (en) | 2023-09-05 |
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