CN107703663A - The changeable panels of 2D/3D and display device - Google Patents
The changeable panels of 2D/3D and display device Download PDFInfo
- Publication number
- CN107703663A CN107703663A CN201710884950.9A CN201710884950A CN107703663A CN 107703663 A CN107703663 A CN 107703663A CN 201710884950 A CN201710884950 A CN 201710884950A CN 107703663 A CN107703663 A CN 107703663A
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- China
- Prior art keywords
- electrically
- backing plate
- conductive backing
- bonding area
- encapsulation region
- Prior art date
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B30/00—Optical systems or apparatus for producing three-dimensional [3D] effects, e.g. stereoscopic images
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
- G02F1/134309—Electrodes characterised by their geometrical arrangement
Abstract
The invention provides a kind of changeable panels of 2D/3D and display device.The changeable panels of 2D/3D include the first electrically-conductive backing plate, the second electrically-conductive backing plate and electro-optical material layer.First electrically-conductive backing plate includes the first electrically-conductive backing plate, the first encapsulation region and the first bonding area and the first electrode layer being arranged on the first electrically-conductive backing plate；Second electrically-conductive backing plate includes the second electrically-conductive backing plate, the second encapsulation region and the second bonding area and the second electrode lay being arranged on the second electrically-conductive backing plate, first electrode layer are oppositely arranged with the second electrode lay；Electro-optical material layer is packaged between the first electrically-conductive backing plate and the second electrically-conductive backing plate；First encapsulation region and the second encapsulation region are oppositely arranged, the first bonding area and the second bonding area stagger setting, and the driving power of the first bonding area and the second bonding area respectively with outside electrically connects, to drive electro-optical material layer.The changeable panels of 2D/3D and there is good conduction comprising its display device that the application provides.
Description
Technical field
The present invention relates to 2D/3D field of liquid crystal display, is filled in particular to a kind of changeable panels of 2D/3D and display
Put.
Background technology
Principle changeable 2D/3D is exactly to realize 2D and 3D using post lens 3D display technology and the rotatory of liquid crystal
Conversion.It is to be subsequently filled liquid crystal with last layer lens pillar is added inside transparency electrode glass in two panels, pass through external voltage
The rotation of liquid crystal is controlled, so as to realize 2D and 3D conversion.
The conventional changeable panels of 2D/3D are the conductings that upper/lower electrode is realized by gold goal or silver paste, as illustrated in fig. 1 and 2,
It includes the first transparency electrode 101` in the radium-shine outer frame face of infrabasal plate, the second transparency electrode 102` inside the radium-shine frame of infrabasal plate,
3rd transparency electrode 103` of upper substrate, the non-conductive sealant 104` normally coated, the sealant 105` of gold goal is added, it is radium-shine
Frame 106` and drive system 107`.First transparency electrode 101` on the left of drive system 107` with the radium-shine outer frame face of infrabasal plate is led
It is logical, turned on the right side of drive system 107` with the second transparency electrode 102` inside the radium-shine frame of infrabasal plate, the second of infrabasal plate is transparent
Electrode 102` is turned on by the sealant 105` being crushed with the transparency electrode 103` of upper substrate, above and below in viewing area
The upset of electrical potential difference control liquid crystal between transparency electrode.
The bonding flexible printed circuit board on the step side of the first electrically-conductive backing plate, driven when being powered up to flexible printed circuit board
Afterwards, the cathode voltage of flexible printed circuit board is added on the first electrically-conductive backing plate, and the cathode voltage of flexible printed circuit board then passes through
Gold goal in radium-shine frame and the sealing frame glue'' is conducting on the second electrically-conductive backing plate, so that upper and lower base plate forms electrical potential difference.
But existing type of drive is to realize conducting between the first electrically-conductive backing plate and the second electrically-conductive backing plate with gold goal,
And the selection of gold goal is improper, upper and lower base plate poor flow will be made.
The content of the invention
It is a primary object of the present invention to provide a kind of changeable panels of 2D/3D and display device, to solve existing 2D/
The problem of conduction is bad in 3D switchable apparatus.
To achieve these goals, according to an aspect of the invention, there is provided a kind of changeable panels of 2D/3D, including：
First electrically-conductive backing plate, the first electrically-conductive backing plate include first substrate and the first electrode layer being arranged on first substrate；Second is conductive
Substrate, the second electrically-conductive backing plate include second substrate and the second electrode lay being arranged on second substrate, first electrode layer and second
Electrode layer is oppositely arranged；Electro-optical material layer, it is packaged between the first electrically-conductive backing plate and the second electrically-conductive backing plate；First electrically-conductive backing plate bag
Include the first encapsulation region and the first bonding area；Second electrically-conductive backing plate includes the second encapsulation region and the second bonding area；First encapsulation region and
Second encapsulation region is oppositely arranged, the first bonding area and the second bonding area stagger setting, the first bonding area and the second bonding area difference
Electrically connected with the driving power of outside, to drive electro-optical material layer.
Further, the first bonding area and the second bonding area are located at the homonymy of the changeable panels of 2D/3D.
Further, the first electrically-conductive backing plate includes the first breach, and the second electrically-conductive backing plate includes the second breach, the first breach with
Second bonding area is correspondingly arranged, and the second breach is correspondingly arranged with the first bonding area.
Further, projection of the first bonding area on the plane parallel to the second electrically-conductive backing plate overlaps with the second breach,
Projection of the second bonding area on the plane parallel to the first electrically-conductive backing plate overlaps with the first breach.
Further, the first bonding area and the second bonding area are located at the not homonymy of the changeable panels of 2D/3D.
Further, the first electrically-conductive backing plate and the second electrically-conductive backing plate are long and wide different rectangle.
Further, the first encapsulation region includes the first electrooptical material encapsulation region and positioned at the first electrooptical material encapsulation region periphery
The first frame glue encapsulation region；Second encapsulation region includes the second electrooptical material encapsulation region and positioned at the second electrooptical material encapsulation region periphery
The second frame glue encapsulation region.
Further, the changeable panels of 2D/3D also include the sealing frame glue'', the sealing frame glue'' be arranged on the first frame glue encapsulation region and
Between second frame glue encapsulation region, and the first electrically-conductive backing plate, the second electrically-conductive backing plate and the sealing frame glue'' are formed for encapsulating electrooptical material
The confined space of layer.
Further, electro-optical material layer is formed by electrooptical material or formed by electrooptical material and cylindrical lens array.
To achieve these goals, a kind of display device is provided according to another aspect of the present invention, and display device includes
The above-mentioned changeable panels of 2D/3D.
Apply the technical scheme of the present invention, in the changeable panel of 2D/3D provided herein, the first bonding area and second
Driving power of the bonding area respectively with outside electrically connects, and this causes in the changeable panels of 2D/3D without using conductive metallic material
It can make to form electric field between the first electrically-conductive backing plate and the second electrically-conductive backing plate, so as to be advantageous to improve the changeable panels of 2D/3D
Conduction.Simultaneously because in the existing changeable panels of 2D/3D, spacing between the first electrically-conductive backing plate and the second electrically-conductive backing plate compared with
It is small, by the second bonding area and the first bonding area stagger setting, not only contribute to realize and led respectively in the first electrically-conductive backing plate and second
First bonding area and the second bonding area are correspondingly set on electric substrate, also helps and avoids the first electrically-conductive backing plate and the second conductive base
Misleaded between plate.
Brief description of the drawings
The Figure of description for forming the part of the application is used for providing a further understanding of the present invention, and of the invention shows
Meaning property embodiment and its illustrate be used for explain the present invention, do not form inappropriate limitation of the present invention.In the accompanying drawings：
Fig. 1 shows a kind of side view for the changeable panels of 2D/3D that prior art provides；
Fig. 2 shows a kind of top view for the changeable panels of 2D/3D that prior art provides；
Fig. 3 a are shown according to first in the changeable panels of 2D/3D provided in the first preferred embodiment of the invention
The structural representation of electrically-conductive backing plate；
Fig. 3 b are shown according to second in the changeable panels of 2D/3D provided in the first preferred embodiment of the invention
The structural representation of electrically-conductive backing plate；
Fig. 3 c show that the structure of the changeable panels of 2D/3D provided according to the first preferred embodiment of the invention is shown
It is intended to；
Fig. 4 a are shown according to first in the changeable panels of 2D/3D provided in second of preferred embodiment of the invention
The structural representation of electrically-conductive backing plate；
Fig. 4 b are shown according to second in the changeable panels of 2D/3D provided in second of preferred embodiment of the invention
The structural representation of electrically-conductive backing plate；
Fig. 4 c show that the structure of the changeable panels of 2D/3D provided according to second of preferred embodiment of the present invention is shown
It is intended to；And
Fig. 5 shows that the structure of the changeable panels of 2D/3D provided according to the third preferred embodiment of the invention is shown
It is intended to.
Wherein, above-mentioned accompanying drawing marks including the following drawings：
10th, the first electrically-conductive backing plate；11st, the first encapsulation region；111st, the first electrooptical material encapsulation region；112nd, the first frame glue encapsulates
Area；12nd, the first bonding area；13rd, the first breach；20th, the second electrically-conductive backing plate；21st, the second encapsulation region；211st, the second electrooptical material seals
Fill area；212nd, the second frame glue encapsulation region；22nd, the second bonding area；23rd, the second breach；30th, driving power；31st, the first flexible printing
Circuit board；32nd, the second flexible printed circuit board；
101`, first transparency electrode；102`, second transparency electrode；103`, the 3rd transparency electrode；104`, non-conductive envelope frame
Glue；105`, sealant；106`, radium-shine frame；107`, drive system.
Embodiment
It should be noted that in the case where not conflicting, the feature in embodiment and embodiment in the application can phase
Mutually combination.The present invention is described in detail below in conjunction with embodiment.
As described by background technology, the problem of conduction is bad in existing 2D/3D switchable apparatus.In order to solve
Above-mentioned technical problem, this application provides a kind of changeable panels of 2D/3D, as shown in figure 3, including the first electrically-conductive backing plate 10,
Two electrically-conductive backing plates 20 and electro-optical material layer.Include the first electrically-conductive backing plate 10 on first electrically-conductive backing plate 10 and be arranged at the first conductive base
First electrode layer on plate 10, the second electrically-conductive backing plate 20 is included on the second electrically-conductive backing plate 20 and is arranged on the second electrically-conductive backing plate 20
The second electrode lay, first electrode layer is oppositely arranged with the second electrode lay, electro-optical material layer, is packaged in the He of the first electrically-conductive backing plate 10
Between second electrically-conductive backing plate 20.Wherein, the first electrically-conductive backing plate 10 includes the first encapsulation region 11 and the first bonding area 12；Second is conductive
Substrate 20 includes the second encapsulation region 21 and the second bonding area 22；First encapsulation region 11 and the second encapsulation region 21 are oppositely arranged, and first
The stagger setting of 12 and second bonding area of bonding area 22, the first bonding area 12 and the second bonding area 22 respectively with outside driving power
30 electrical connections, to drive above-mentioned electro-optical material layer.
The driving power 30 of first bonding area 12 and the second bonding area 22 respectively with outside electrically connects so that the first conductive base
Electric field can be formed between the electrically-conductive backing plate 20 of plate 10 and second, so as to drive above-mentioned electro-optical material layer to carry out in the presence of electric field
2D/3D switches.
Compared to the changeable panels of existing 2D/3D, in the changeable panel of 2D/3D provided herein, the first bonding
Bonding area 22 of area 12 and second respectively with outside driving power 30 electrically connect, this cause in the changeable panels of 2D/3D without using
Conductive metallic material gold goal etc. can also make to form electric field between the first electrically-conductive backing plate 10 and the second electrically-conductive backing plate 20, so as to favourable
In the conduction for improving the changeable panels of 2D/3D.Simultaneously because in the existing changeable panels of 2D/3D, the first electrically-conductive backing plate 10
And the second spacing between electrically-conductive backing plate 20 is smaller, by the second bonding area 22 and the stagger setting of the first bonding area 12, not only favorably
First bonding area 12 and the second bonding are correspondingly set on the first electrically-conductive backing plate 10 and the second electrically-conductive backing plate 20 respectively in realizing
Area 22, also help and avoid misleading between the first electrically-conductive backing plate 10 and the second electrically-conductive backing plate 20.
It should be noted that term used herein above is merely to describe embodiment, and be not intended to restricted root
According to the illustrative embodiments of the present invention.As used herein, unless the context clearly indicates otherwise, otherwise singulative
It is also intended to include plural form, additionally, it should be understood that, when in this manual using term "comprising" and/or " bag
Include " when, it indicates existing characteristics, step, operation, device, component and/or combinations thereof.
The changeable panels of 2D/3D that the application provides can not only improve the changeable panel conductions of 2D/3D, and can also
The phenomenon for suppressing to avoid misleading between the first electrically-conductive backing plate 10 and the second electrically-conductive backing plate 20 occurs.In a kind of preferable embodiment party
In formula, the first bonding area 12 and the second bonding area 22 are located at the homonymy of the changeable panels of 2D/3D, i.e., obtained 2D/3D is changeable
In the same side, it is changeable that this advantageously reduces driving power 30 and 2D/3D for the first bonding area 12 and the second bonding area 22 in panel
The length of electrical interconnection between panel, improve the regularity of the display device subsequently containing the changeable panels of 2D/3D.
Preferably, the first pad is provided with the first bonding area 12, the first pad is used to bind the first flexible print circuit
One end of plate 31, the other end of the first flexible printed circuit board 31 electrically connect with the driving power 30 of outside.
Preferably, the second pad is provided with the second bonding area 22, the second pad is used for the flexible print circuit of bonding second
One end of plate 32, the other end of the second flexible printed circuit board 32 electrically connect with the driving power 30 of outside.
The above-mentioned flexible printed circuit board 32 of first flexible printed circuit board 31 and second is flexible conducting material.Preferably,
By the first flexible printed circuit board 31 and/or the bonding of the second flexible printed circuit board 32 to correspondingly bonding by way of hot pressing
On the first pad and/or the second pad in area.
The word such as " first " used herein, " second " limits parts, it is only for is easy to corresponding zero
Part is distinguished, and does not have Stated otherwise such as, above-mentioned word does not have particular meaning, therefore it is not intended that protects model to the present invention
The limitation enclosed.
In a preferred embodiment, as shown in figure 3, the first electrically-conductive backing plate 10 includes the first breach 13, second leads
Electric substrate 20 includes the second breach 23, and the first breach 13 is correspondingly arranged with the second bonding area 22, the second breach 23 and the first bonding
Area 12 is correspondingly arranged.The shape of the changeable panels of 2D/3D with said structure is more regular, and this is advantageous to improve liquid crystal display
Relative area of the region in whole 2D/3D switchable apparatus.
In another preferred embodiment, as shown in figure 4, the first bonding area 12 is parallel to the second electrically-conductive backing plate 20
Projection in plane overlaps with the second breach 23, projection of the second bonding area 22 on the plane parallel to the first electrically-conductive backing plate 10
Overlapped with the first breach 13.This is advantageous to the planarization for improving the changeable panel surfaces of 2D/3D.
, as needed can also be by the first bonding area 12 and the second bonding in the changeable panels of 2D/3D that the application provides
Area 22 is located at the not homonymy of the changeable panels of 2D/3D, i.e., the first bonding area 12 and the second nation in the changeable panels of obtained 2D/3D
Area 22 is determined not in the same side.
The shape of the first electrically-conductive backing plate 10 and the second electrically-conductive backing plate 20 can be regular in the above-mentioned changeable panels of 2D/3D
Or irregular shape, as long as the second bonding area 22 and the stagger setting of the first bonding area 12 can be ensured.Preferably, first
The electrically-conductive backing plate 20 of electrically-conductive backing plate 10 and second is long and wide different rectangle.
In a kind of preferred embodiment, as shown in figure 5, the first electrically-conductive backing plate 10 is adjacent while first including first
The second side, the second electrically-conductive backing plate 20 includes the 3rd the 4th side adjacent while the 3rd, and first is parallel while with the 3rd,
Second is parallel while with the 4th, wherein, first while length be more than the 3rd while, second while length be less than the 4th while.With upper
The changeable panels of 2D/3D for stating structure can obtain the first required electrically-conductive backing plate in preparation process without carrying out complicated cutting
10 and second electrically-conductive backing plate 20, so as to be advantageous to shorten manufacturing cycle and the production cost of the changeable panels of 2D/3D.
Preferably, the first encapsulation region 11 includes the first electrooptical material encapsulation region 111 and positioned at the first electrooptical material encapsulation region
First frame glue encapsulation region 112 of 111 peripheries；Second encapsulation region 21 includes the second electrooptical material encapsulation region 211 and positioned at the second electricity
Second frame glue encapsulation region 212 of the periphery of luminescent material encapsulation region 211.
Preferably, the changeable panels of 2D/3D also include the sealing frame glue'', and the sealing frame glue'' is arranged on the first frame glue encapsulation region 112
And second between frame glue encapsulation region 212, and the first electrically-conductive backing plate 10, the second electrically-conductive backing plate 20 are formed for encapsulating with the sealing frame glue''
The confined space of electro-optical material layer.
Preferably, electro-optical material layer is formed by electrooptical material or formed by electrooptical material and cylindrical lens array.
In the changeable panels of 2D/3D that the application provides, the first electrically-conductive backing plate 10 and the second electrically-conductive backing plate 20 can use
Baseplate material commonly used in the art.Preferably, the first electrically-conductive backing plate 10 and the second electrically-conductive backing plate 20 are glass substrate, due to glass
The price of substrate is relatively low, thus using its advantageously reduce 2D/3D as the first electrically-conductive backing plate 10 and the second electrically-conductive backing plate 20 can
Switch the cost of manufacture of panel.
In the changeable panels of 2D/3D that the application provides, first electrode layer and the second electrode lay can be normal by this area
Conductive material is loaded on the first electrically-conductive backing plate 10 and the second electrically-conductive backing plate 20 and formed by process, such as chemical deposition,
Physical sputtering etc..Preferably, first electrode layer and the second electrode lay include but is not limited to ITO layer, IZO layers etc..
The another aspect of the application additionally provides a kind of display device, and the display device includes the changeable faces of above-mentioned 2D/3D
Plate.
The changeable panels of 2D/3D that the application provides not only have good conduction, and can also suppress to avoid first
The phenomenon to be misleaded between the electrically-conductive backing plate 20 of electrically-conductive backing plate 10 and second occurs.Thus containing the changeable panels of above-mentioned 2D/3D
Display device equally has good conductive conduction.
The application is described in further detail below in conjunction with specific embodiment, these embodiments are it is not intended that limit this
Apply for scope claimed.
Embodiment 1
As shown in figure 3, Fig. 3 a show the partitioning scenario of the first electrically-conductive backing plate 10, the first electrically-conductive backing plate 10 includes the first envelope
Area 11, the first bonding area 12 and the first breach 13 are filled, wherein the first encapsulation region 11 includes the (void of the first electrooptical material encapsulation region 111
Line region) and the first frame glue encapsulation region 112 on the outside of it.Fig. 3 b show the partitioning scenario of the second electrically-conductive backing plate 20, the
Two electrically-conductive backing plates 20 include the second electrooptical material encapsulation region 211, the second bonding area 22 and the second breach 23, wherein the second encapsulation region
21 include the second electrooptical material encapsulation region 211 (dashed region) and the second frame glue encapsulation region 212 on the outside of it.Fig. 3 c are shown
The changeable panels of 2D/3D that first electrically-conductive backing plate 10, second electrically-conductive backing plate 20, electro-optical material layer and the sealing frame glue'' are formed are bowed
View.By Fig. 3 it will be clear that：First breach 13 is correspondingly arranged with the second bonding area 22, the second breach 23 and the first nation
Determine area 12 to be correspondingly arranged, and the first bonding area 12 and the stagger setting of the second bonding area 22.First bonding area 12 and driving electricity simultaneously
Source 30 is electrically connected by the first flexible printed circuit board 31, and the second bonding area 22 passes through the second flexible printing electricity with driving power 30
Road plate 32 electrically connects.
Embodiment 2
As shown in figure 4, Fig. 4 a show the partitioning scenario of the first electrically-conductive backing plate 10, the first electrically-conductive backing plate 10 includes the first envelope
Area 11, the first bonding area 12 and the first breach 13 are filled, wherein the first encapsulation region 11 includes the first electrooptical material encapsulation region 111 and position
The first frame glue encapsulation region 112 on the outside of it.Fig. 4 b show the partitioning scenario of the second electrically-conductive backing plate 20, the second electrically-conductive backing plate 20
Including the second encapsulation region 21, the second bonding area 22 and the second breach 23, wherein the second encapsulation region 21 is sealed including the second electrooptical material
Fill area 211 and the second frame glue encapsulation region 212 on the outside of it.Fig. 4 c show the first electrically-conductive backing plate 10, the second electrically-conductive backing plate
20th, the top view for the changeable panels of 2D/3D that electro-optical material layer and the sealing frame glue'' are formed.By Fig. 4 it will be clear that：First
Breach 13 overlaps with the second bonding area 22, and the second breach 23 overlaps with the first bonding area 12, and the first bonding area 12 and the second nation
Determine the stagger setting of area 22.The first bonding area 12 and driving power 30 are electrically connected by the first flexible printed circuit board 31 simultaneously, the
Two bonding areas 22 are electrically connected with driving power 30 by the second flexible printed circuit board 32.
Embodiment 3
As Fig. 5 shows that the first electrically-conductive backing plate 10, the second electrically-conductive backing plate 20, electro-optical material layer and the sealing frame glue'' are formed
The top view of the changeable panels of 2D/3D.Wherein, the first electrically-conductive backing plate 10 includes the first encapsulation region 11 and the first bonding area 12, the
Two electrically-conductive backing plates 20 include the second encapsulation region 21 and the second bonding area 22；First encapsulation region 11 includes the first electrooptical material encapsulation region
111 and the first frame glue encapsulation region 112 on the outside of it, the second encapsulation region 21 include the second electrooptical material encapsulation region 211 and position
The second frame glue encapsulation region 212 on the outside of it.By Fig. 5 it will be clear that：First electrically-conductive backing plate 10 include the first side and with
First at adjacent second, and the second electrically-conductive backing plate 20 includes the 3rd the 4th side adjacent while the 3rd, and the first side with
3rd side is parallel, and second is parallel while with the 4th, wherein, first while length be more than the 3rd while, the length on the second side is less than the
Four sides, and the first bonding area 12 and the stagger setting of the second bonding area 22.The first bonding area 12 and driving power 30 pass through the simultaneously
One flexible printed circuit board 31 is electrically connected, and the second bonding area 22 is electrically connected with driving power 30 by the second flexible printed circuit board 32
Connect.
As can be seen from the above description, the above embodiments of the present invention realize following technique effect：
Compared to the changeable panels of existing 2D/3D, in the changeable panel of 2D/3D provided herein, the first bonding
The driving power 30 of area and the second bonding area respectively with outside electrically connects, and this causes in the changeable panels of 2D/3D without using conduction
Metal material can also make to form electric field between the first electrically-conductive backing plate and the second electrically-conductive backing plate, can so as to be advantageous to raising 2D/3D
Switch the conduction of panel.Simultaneously because in the existing changeable panels of 2D/3D, the first electrically-conductive backing plate and the second electrically-conductive backing plate it
Between spacing it is smaller, the second bonding area and the first bonding area stagger setting not only contribute to realize respectively in the first conductive base
First bonding area and the second bonding area are correspondingly set on plate and the second electrically-conductive backing plate, also help avoid the first electrically-conductive backing plate and
Misleaded between second electrically-conductive backing plate.
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention, for the skill of this area
For art personnel, the present invention can have various modifications and variations.Within the spirit and principles of the invention, that is made any repaiies
Change, equivalent substitution, improvement etc., should be included in the scope of the protection.
Claims (10)
1. a kind of changeable panels of 2D/3D, including：
First electrically-conductive backing plate (10), first electrically-conductive backing plate (10) include the first electrically-conductive backing plate (10) and are arranged at described first
First electrode layer on electrically-conductive backing plate (10)；
Second electrically-conductive backing plate (20), second electrically-conductive backing plate (20) include the second electrically-conductive backing plate (20) and are arranged at described second
The second electrode lay on electrically-conductive backing plate (20), the first electrode layer are oppositely arranged with the second electrode lay；
Electro-optical material layer, it is packaged between first electrically-conductive backing plate (10) and second electrically-conductive backing plate (20)；
Characterized in that,
First electrically-conductive backing plate (10) includes the first encapsulation region (11) and the first bonding area (12)；
Second electrically-conductive backing plate (20) includes the second encapsulation region (21) and the second bonding area (22)；
First encapsulation region (11) and second encapsulation region (21) are oppositely arranged, the first bonding area (12) and described
Two bonding area (22) stagger settings, the first bonding area (12) and the second bonding area (22) are electric with the driving of outside respectively
Source (30) electrically connects, to drive the electro-optical material layer.
2. the changeable panels of 2D/3D according to claim 1, it is characterised in that the first bonding area (12) and described
Second bonding area (22) is located at the homonymy of the changeable panels of the 2D/3D.
3. the changeable panels of 2D/3D according to claim 2, it is characterised in that first electrically-conductive backing plate (10) includes
First breach (13), second electrically-conductive backing plate (20) include the second breach (23), first breach (13) and described second
Bonding area (22) is correspondingly arranged, and second breach (23) is correspondingly arranged with the first bonding area (12).
4. the changeable panels of 2D/3D according to claim 3, it is characterised in that the first bonding area (12) is parallel
Overlapped in the projection in the plane of second electrically-conductive backing plate (20) with second breach (23), the second bonding area (22)
Projection on the plane parallel to first electrically-conductive backing plate (10) overlaps with first breach (13).
5. the changeable panels of 2D/3D according to claim 1, it is characterised in that the first bonding area (12) and described
Second bonding area (22) is located at the not homonymy of the changeable panels of the 2D/3D.
6. the changeable panels of 2D/3D according to claim 5, it is characterised in that first electrically-conductive backing plate (10) and institute
The second electrically-conductive backing plate (20) is stated as long and wide different rectangle.
7. the changeable panels of 2D/3D according to any one of claim 1 to 6, it is characterised in that first encapsulation region
(11) the first electrooptical material encapsulation region (111) and the first frame positioned at the first electrooptical material encapsulation region (111) periphery are included
Glue encapsulation region (112)；Second encapsulation region (21) includes the second electrooptical material encapsulation region (211) and positioned at the second electrooptical material
Second frame glue encapsulation region (212) of encapsulation region (211) periphery.
8. the changeable panels of 2D/3D according to claim 7, it is characterised in that the changeable panels of 2D/3D also include
The sealing frame glue'', the sealing frame glue'' be arranged on the first frame glue encapsulation region (112) and the second frame glue encapsulation region (212) it
Between, and first electrically-conductive backing plate (10), second electrically-conductive backing plate (20) and the sealing frame glue'' formed it is described for encapsulating
The confined space of electro-optical material layer.
9. the changeable panels of 2D/3D according to claim 8, it is characterised in that the electro-optical material layer is by electrooptical material
Formed or formed by electrooptical material and cylindrical lens array.
10. a kind of display device, it is characterised in that the display device includes 2D/3D any one of claim 1 to 9
Changeable panel.
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| CN201710884950.9A CN107703663A (en) | 2017-09-26 | 2017-09-26 | The changeable panels of 2D/3D and display device |
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| CN201710884950.9A CN107703663A (en) | 2017-09-26 | 2017-09-26 | The changeable panels of 2D/3D and display device |
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