CN107664548A - A kind of EFPI fibre optic compression sensors and preparation method thereof - Google Patents
A kind of EFPI fibre optic compression sensors and preparation method thereof Download PDFInfo
- Publication number
- CN107664548A CN107664548A CN201711072698.8A CN201711072698A CN107664548A CN 107664548 A CN107664548 A CN 107664548A CN 201711072698 A CN201711072698 A CN 201711072698A CN 107664548 A CN107664548 A CN 107664548A
- Authority
- CN
- China
- Prior art keywords
- presser sensor
- monocrystalline silicon
- fibre optic
- efpi
- cylindrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000835 fiber Substances 0.000 title claims abstract description 43
- 230000006835 compression Effects 0.000 title claims abstract description 29
- 238000007906 compression Methods 0.000 title claims abstract description 29
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 239000011521 glass Substances 0.000 claims abstract description 39
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims abstract description 37
- 239000013078 crystal Substances 0.000 claims abstract description 31
- 239000000463 material Substances 0.000 claims abstract 4
- 238000000034 method Methods 0.000 claims description 42
- 230000005540 biological transmission Effects 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 10
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- 239000003822 epoxy resin Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000010276 construction Methods 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 8
- 239000013307 optical fiber Substances 0.000 claims description 7
- 238000012545 processing Methods 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 5
- 230000000694 effects Effects 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- 210000003746 feather Anatomy 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 2
- 238000002310 reflectometry Methods 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052710 silicon Inorganic materials 0.000 abstract description 6
- 239000010703 silicon Substances 0.000 abstract description 6
- 239000002775 capsule Substances 0.000 abstract description 2
- 238000005259 measurement Methods 0.000 abstract description 2
- 230000003595 spectral effect Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 47
- 238000005498 polishing Methods 0.000 description 7
- 239000010453 quartz Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000001228 spectrum Methods 0.000 description 6
- 238000013475 authorization Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000001413 cellular effect Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/24—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet
- G01L1/242—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet the material being an optical fibre
- G01L1/246—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet the material being an optical fibre using integrated gratings, e.g. Bragg gratings
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The present invention relates to a kind of EFPI fibre optic compression sensors and preparation method thereof, and in particular to a kind of silicon glass basis EFPI fibre optic compression sensors made using MEMS technology and preparation method thereof, belongs to fibre optic compression sensor technical field.Presser sensor structure is double-layer structure, respectively presser sensor structure top unit and presser sensor structure bottom unit；The presser sensor structure top unit uses monocrystalline silicon wafer crystal sheet material；The presser sensor structure bottom unit uses glass wafer sheet material.The present invention is while MEMS technology complexity is simplified, the depth of parallelism that can ensure two reflectings surface of mechanics amber microcavity is good, roughness grade number is high, interference signal spectral quality is improved, improves the reliability of the fibre optic compression sensor based on MEMS technology technology and the measurement accuracy of whole pressure capsule system.
Description
Technical field
The present invention relates to a kind of EFPI fibre optic compression sensors and preparation method thereof, and in particular to one kind uses MEMS technology
Silicon glass basis EFPI fibre optic compression sensors of making and preparation method thereof, belong to fibre optic compression sensor technical field.
Technical background
Extrinsic type method Fabry-Parot interferent (extrinsic Fabry-Perot interferometer, EFPI) fibre optical sensor
Because of its high sensitivity, small volume, simple in construction and flexible design, and it is developed to various sensors and is led with adapting to different applications
Domain.Typical EFPI sensor constructions are made up of a chamber, i.e., are made up of an incident optical and a output optical fiber, certain shape
Two reflectings surface into F-P cavity can be the surface of any optical element, therefore, in order to meet pressure measxurement demand, based on thin
The EFPI fibre optic compression sensors of membrane structure are more suitable for.EFPI fibre optic compression sensor manufacture crafts have polytype, wherein
MEMS (MEMS) device is adapted to large scale integration production, can substantially reduce the production cost of sensor, therefore, domestic
The outer research for having carried out much EFPI fibre optic compression sensors based on MEMS technology technology.
Authorization Notice No. CN102721492B, Authorization Notice No. CN102384809B patent provide a kind of sensor knot
Structure is that the glass wafer piece of a piece of twin polishing with through hole is bonded together to form with two panels monocrystalline silicon respectively by bonding technology twice
Method amber micro-cavity structure；Authorization Notice No. CN102721492B, the number of applying for a patent 201510401629.1, Authorization Notice No.
It is that corrosion forms circle on the glass wafer piece by twin polishing that CN102607761B patent, which provides a kind of sensor construction,
Shallow hole, method amber micro-cavity structure is then bonded together to form with monocrystalline silicon.
In summary, according to EFPI Fibre Optical Sensor principles, form two reflectings surface of its method amber microcavity the depth of parallelism and
Roughness is to influence the key parameter of sensor performance.The monocrystalline silicon piece of two panels twin polishing and a piece of glass wafer with through hole
Method of the piece by bonding together to form method amber micro-cavity structure twice, two reflectings surface of its micro-cavity structure are the list by polishing
Crystal silicon chip surface, although the depth of parallelism and roughness of two reflectings surface ensured, bonding twice adds manufacturing process
Difficulty and complexity；Monocrystalline silicon piece is with forming the glass wafer piece of blind hole with corrosion by once bonding together to form method amber micro-cavity structure
Method, two reflectings surface of its micro-cavity structure are the monocrystalline silicon sheet surface by polishing and the bottom surface of blind hole, although one
Secondary bonding technology is simple, but the blind via bottom for corroding formation on glass wafer piece is bowl-shape, can not be ensured and another reflecting surface
The depth of parallelism, while the surface roughness for corroding formation is poor, so as to have influence on the quality of sensing optical signal.
The content of the invention
It is an object of the invention to provide a kind of silicon glass basis EFPI fibre optic compression sensors and preparation method thereof, this method exists
In fibre optic compression sensor manufacturing process based on MEMS technology, simplify MEMS technology complexity；And the biography that this method is prepared
Sensor can ensure that the depth of parallelism of two reflectings surface of mechanics amber microcavity is good, roughness grade number is high.
The purpose of the present invention is achieved through the following technical solutions：
A kind of EFPI fibre optic compression sensors, including：Presser sensor structure, cylindrical, hollow pipe and Transmission Fibers；Pressure
Sensitive structure bottom is coaxially connected with cylindrical, hollow pipe, and Transmission Fibers penetrate cylindrical, hollow pipe to presser sensor structure bottom
Portion, and be connected with the encapsulation of cylindrical, hollow pipe, described presser sensor structure is double-layer structure, including：In presser sensor structure
Layer unit and presser sensor structure bottom unit；
Presser sensor structure top unit is processed using monocrystalline silicon wafer crystal piece, monocrystalline silicon wafer crystal piece twin polishing, under it
Surface Machining blind hole, blind hole and monocrystalline silicon wafer crystal piece are concentric, and the blind hole is method amber microcavity, and the depth of blind hole is method amber microcavity
Chamber length, the lower surface of blind hole is second reflecting surface of method amber microcavity；
Presser sensor structure bottom unit is processed using glass wafer piece, glass wafer piece twin polishing, glass wafer piece
Upper surface be method amber microcavity first reflecting surface.
A kind of EFPI fibre optic compression sensors shown in the present invention, reflection can also be plated in the lower surface of monocrystalline silicon wafer crystal piece
Rate is 4% glass reflective coating, improves the contrast that sensor returns to interference signal, is easy to demodulate instrument signal demodulation.
A kind of EFPI fibre optic compression sensors preparation method shown in the present invention,：This method comprises the following steps：
1) presser sensor structure is made
A) double the throwing glass wafer pieces and monocrystalline silicon wafer crystal piece that original surface flatness meets principle of optical interference requirement are chosen,
And carry out standard cleaning；
B) in monocrystalline silicon wafer crystal piece lower surface processing blind hole array, blind via bottom to monocrystalline silicon wafer crystal piece surface structure
Effect is pressure-sensitive flexible sheet, and the blind hole is method amber microcavity, and the depth of blind hole is the chamber length of method amber microcavity, the bottom of blind hole
Surface is second reflecting surface of method amber microcavity；
C) lower surface of monocrystalline silicon wafer crystal piece and glass wafer piece upper surface are bonded to together using anode linkage, extremely
This, completes the making of method amber microcavity：Glass wafer piece upper surface be method amber microcavity first reflecting surface, monocrystalline silicon wafer crystal piece
Upper blind via bottom surface is second reflecting surface of method amber microcavity, and the depth of blind hole is grown for the chamber of method amber microcavity；
D) upper surface of monocrystalline silicon wafer crystal piece is thinned, and doing feather plucking processing makes the surface have diffusing reflection effect,
The thickness on the surface to blind via bottom surface is the thickness of pressure-sensitive flexible sheet.So far, it is brilliant to complete presser sensor array of structures
Disk；
E) presser sensor array of structures wafer is carried out by scribing using scribing machine, obtains single presser sensor structure list
Member.
2) cylindrical, hollow pipe front end applies epoxide-resin glue, before presser sensor structural glass bottom and cylindrical, hollow pipe
End is in close contact, and ensures that epoxide-resin glue will not enter hollow tube cavity, realizes presser sensor structure and cylindrical, hollow
The coaxial of pipe is connected.
3) Transmission Fibers are penetrated into tube cavity from the tail end of cylindrical, hollow pipe, until fiber end face and presser sensor structure
Glass base is in close contact, and is connected in the tail end of cylindrical, hollow pipe with epoxide-resin glue and Transmission Fibers, completes EFPI optical fiber
Pressure sensor makes.
A kind of EFPI fibre optic compression sensors preparation method shown in the present invention, sun is carried out under local atmospheric pressure environments
Pole is bonded, and realizes that gauge pressure sensor makes；Anode linkage can also be carried out under vacuum conditions, realize absolute pressure transducer
Make.
Beneficial effect
1st, a kind of silicon glass basis EFPI fibre optic compression sensors of the invention, two reflectings surface of mechanics amber micro-cavity structure
The depth of parallelism is good, roughness grade number is high can be while manufacturing process complexity be reduced, hence it is evident that is improved optical sensor signal quality, is carried
The measurement accuracy of high whole pressure capsule system；
2nd, the preparation method of a kind of silicon glass basis EFPI fibre optic compression sensors of the invention, MEMS technology complexity is reduced
Property, be advantageous to improve fibre optic compression sensor sensitive structure stability, so as to improve the reliability of fibre optic compression sensor.
Brief description of the drawings
Fig. 1 is sensor of the invention structural representation；
Fig. 2 is the sensor construction schematic diagram of the embodiment of the present invention 1；
Fig. 3 is the presser sensor structural representation of the embodiment of the present invention 1；
Fig. 4 is the presser sensor structure top cellular construction schematic diagram of the embodiment of the present invention 1；
Fig. 5 is the presser sensor structure bottom cellular construction schematic diagram of the embodiment of the present invention 1；
Fig. 6 is the spectrum test figure of the sensor of embodiment 1；
Fig. 7 is the presser sensor structural representation of the embodiment of the present invention 3；
Fig. 8 is the spectrum test figure of the sensor of embodiment 3.
Wherein, 1- methods amber microcavity, 2- presser sensor structure top units, 3- presser sensor structure bottom units, 4- epoxies
Resin glue, 5- cylindrical, hollow pipes, 6- Transmission Fibers, 7- quartz hollow tubes, 8- single-mode quartz optical fibers, in 9- presser sensor structures
Layer unit and lower unit anode linkage face, 10- monocrystalline silicon wafer crystal pieces upper surface, 11- blind via bottoms surface, 12- monocrystalline silicon wafers
Disk, 13- monocrystalline silicon wafer crystal pieces lower surface, 14- glass wafer pieces upper surface, 15- glass wafer pieces, under 16- glass wafer pieces
Surface, 17- glass reflective coatings.
Embodiment
The present invention is described in further details with reference to the accompanying drawings and examples.
Embodiment 1
A kind of EFPI fibre optic compression sensors, as shown in Figure 1 and Figure 2, from single-mode quartz optical fibers as Transmission Fibers, choosing
By the use of external diameter 2mm, 130 μm of internal diameter quartzy hollow tube as cylindrical, hollow pipe, be that 200 μ m diameters are 4 inches from thickness
Double throwing monocrystalline silicon wafer crystal pieces, are the BF33 sheet glass that 500 μ m diameters are 4 inches from thickness.As shown in Fig. 3, Fig. 4, Fig. 5, pressure
Power sensitive structure is made up of double-layer structure, presser sensor structure top unit 2 and presser sensor structure bottom unit 3.
A kind of preparation method of EFPI fibre optic compression sensors：Rower is entered to monocrystalline silicon wafer crystal piece 12 and glass wafer piece 15
Quasi- cleaning；In the processing blind hole array of monocrystalline silicon wafer crystal piece lower surface 13, by blind via bottom surface 11 and monocrystalline silicon wafer crystal piece upper table
It is pressure-sensitive flexible sheet that face 10, which forms diaphragm, and the blind hole is method amber microcavity 1, and the depth of blind hole is the chamber of method amber microcavity 1
Long, the lower surface 11 of blind hole is second reflecting surface of method amber microcavity 1；Anode linkage is carried out under vacuum conditions by monocrystalline silicon
The lower surface 13 and glass wafer piece upper surface 14 of wafer are bonded to together, so far, complete the making of method amber microcavity 1；Glass
Glass wafer upper surface 14 is first reflecting surface of method amber microcavity 1, and blind via bottom surface 11 is method on monocrystalline silicon wafer crystal piece 12
Second reflecting surface of amber microcavity 1, the depth of blind hole are grown for the chamber of method amber microcavity 1；The upper surface 10 of monocrystalline silicon wafer crystal piece is entered
Row is thinned, and the distance on upper surface 10 to the blind via bottom surface 11 of monocrystalline silicon wafer crystal piece is the thickness of compression elasticity diaphragm, to subtracting
The upper surface 10 of monocrystalline silicon wafer crystal piece after thin, which carries out feather plucking processing, makes the surface have diffusing reflection effect.So far, pressure is completed
Sensitive structure array wafer；Presser sensor array of structures wafer is carried out by scribing using scribing machine, it is quick to obtain single pressure
Feel construction unit.
The quartzy front end of hollow tube 7 applies epoxide-resin glue 4, and glass wafer piece lower surface 16 and the quartzy front end of hollow tube 7 is tight
Contiguity is touched, and ensures that epoxide-resin glue 4 will not enter the quartzy inner chamber of hollow tube 7, realizes that presser sensor structure and quartz are hollow
The coaxial of pipe 7 is connected.The tail end of single-mode quartz optical fibers 8 from quartzy hollow tube 7 is penetrated into tube cavity, until fiber end face and glass
Wafer lower surface 16 is in close contact, and is connected in the tail end of quartzy hollow tube 7 with epoxide-resin glue 4 and single-mode quartz optical fibers 8, complete
Made into EFPI fibre optic compression sensors.
The sensor spectrum test comparison that the sensor of embodiment 1 is produced on blind hole on glass wafer piece is as shown in Figure 6.It is real
The sensor spectrum of example 1 is applied to significantly improve on energy and contrast.
Embodiment 2
Anode linkage technique will be carried out during the presser sensor structure fabrication of embodiment 1 under vacuum conditions to be changed to
Anode linkage is carried out under local atmospheric pressure environments, realizes that gauge pressure sensor sensitive structure makes.
Embodiment 3
As shown in fig. 7, increase blind hole on monocrystalline silicon wafer crystal piece 12 during the presser sensor structure fabrication of embodiment 1
Lower surface 11 plate the glass reflective coating 17 that reflectivity is 4%, carrying out anode linkage under vacuum conditions, to complete method amber micro-
The making of chamber 1：Glass wafer piece upper surface 14 is first reflecting surface of method amber microcavity 1, and glass reflective coating 17 is method amber microcavity 1
Second reflecting surface, the depth of blind hole grows for the chamber of method amber microcavity 1.So as to improve the contrast that sensor returns to interference signal
Degree, it is easy to demodulate instrument signal demodulation.
The sensor of embodiment 3 and the uncoated sensor spectrum test comparison of diaphragm reflecting surface are as shown in Figure 8.Embodiment 3
Sensor spectrum increases in contrast.
The embodiment of the present invention is described above in association with accompanying drawing, but these explanations can not be understood to limit
The scope of the present invention, protection scope of the present invention are limited by appended claims, any in the claims in the present invention base
Change on plinth is all protection scope of the present invention.
Claims (3)
1. a kind of EFPI fibre optic compression sensors, including：Presser sensor structure, cylindrical, hollow pipe and Transmission Fibers；Pressure is quick
Sense structural base is coaxially connected with cylindrical, hollow pipe, and Transmission Fibers penetrate cylindrical, hollow pipe to presser sensor structural base,
And it is connected with the encapsulation of cylindrical, hollow pipe, it is characterised in that：Described presser sensor structure is double-layer structure, and respectively pressure is quick
Feel structure top unit and presser sensor structure bottom unit；The presser sensor structure top unit uses monocrystalline silicon wafer crystal piece
Material；The presser sensor structure bottom unit uses glass wafer sheet material.
A kind of 2. EFPI fibre optic compression sensors preparation method, it is characterised in that：Comprise the following steps：
1) presser sensor structure is made
A) double the throwing glass wafer pieces and monocrystalline silicon wafer crystal piece that original surface flatness meets principle of optical interference requirement are chosen, are gone forward side by side
Row standard cleaning；
B) in monocrystalline silicon wafer crystal piece lower surface processing blind hole array, the effect of blind via bottom to monocrystalline silicon wafer crystal piece surface structure
It is pressure-sensitive flexible sheet, the blind hole is method amber microcavity, and the depth of blind hole is the chamber length of method amber microcavity, the lower surface of blind hole
For second reflecting surface of method amber microcavity；
C) lower surface of monocrystalline silicon wafer crystal piece and glass wafer piece upper surface are bonded to together using anode linkage, it is so far, complete
Into the making of method amber microcavity：Glass wafer piece upper surface is first reflecting surface of method amber microcavity, blind on monocrystalline silicon wafer crystal piece
Hole lower surface is second reflecting surface of method amber microcavity, and the depth of blind hole is grown for the chamber of method amber microcavity；
D) upper surface of monocrystalline silicon wafer crystal piece is thinned, and doing feather plucking processing makes the surface have diffusing reflection effect, the table
The thickness on face to blind via bottom surface is the thickness of pressure-sensitive flexible sheet；So far, presser sensor array of structures wafer is completed；
E) presser sensor array of structures wafer is carried out by scribing using scribing machine, obtains single presser sensor construction unit；
2) cylindrical, hollow pipe front end applies epoxide-resin glue, and presser sensor structural glass bottom and cylindrical, hollow pipe front end is tight
Contiguity is touched, and ensures that epoxide-resin glue will not enter hollow tube cavity, realizes presser sensor structure and cylindrical, hollow pipe
It is coaxial to be connected；
3) Transmission Fibers are penetrated into tube cavity from the tail end of cylindrical, hollow pipe, until fiber end face and presser sensor structural glass
Bottom is in close contact, and is connected in the tail end of cylindrical, hollow pipe with epoxide-resin glue and Transmission Fibers, completes EFPI optical fiber pressures
Sensor production.
A kind of 3. EFPI fibre optic compression sensors as claimed in claim 1, it is characterised in that：In the monocrystalline silicon wafer crystal piece
The glass reflective coating that lower surface plating reflectivity is 4%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711072698.8A CN107664548A (en) | 2017-11-03 | 2017-11-03 | A kind of EFPI fibre optic compression sensors and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711072698.8A CN107664548A (en) | 2017-11-03 | 2017-11-03 | A kind of EFPI fibre optic compression sensors and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107664548A true CN107664548A (en) | 2018-02-06 |
Family
ID=61143995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711072698.8A Pending CN107664548A (en) | 2017-11-03 | 2017-11-03 | A kind of EFPI fibre optic compression sensors and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107664548A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108760148A (en) * | 2018-07-20 | 2018-11-06 | 北京航空航天大学 | A kind of absolute pressure formula Fabry-perot optical fiber silicon carbide high temperature resistant aviation pressure sensor |
| CN109580546A (en) * | 2018-12-19 | 2019-04-05 | 天津大学 | A kind of Fabry-perot optical fiber gas refracting index and temperature sensor and system, measurement method |
| CN110618302A (en) * | 2019-10-31 | 2019-12-27 | 国网上海市电力公司 | Manufacturing method of Fabry-Perot cavity probe of partial discharge EFPI optical fiber sensor |
| CN110849442A (en) * | 2019-11-06 | 2020-02-28 | 天津大学 | MEMS optical fiber Fabry-Perot low-temperature liquid level sensor based on differential pressure and measuring system thereof |
| CN112629720A (en) * | 2020-11-30 | 2021-04-09 | 中国航空工业集团公司北京长城计量测试技术研究所 | Low-loss optical fiber pressure sensor and manufacturing method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1614371A (en) * | 2004-10-11 | 2005-05-11 | 南京师范大学 | Pressure sensor of optical fiber micro-electromechanic system |
| US20090226128A1 (en) * | 2005-08-12 | 2009-09-10 | Denis Donlagic | Single piece fabry-perot optical sensor and method of manufacturing the same |
| CN102721492A (en) * | 2012-05-31 | 2012-10-10 | 天津大学 | Optical fiber Fabry-Perot pressure sensor with fiber bragg grating temperature compensation and making method thereof |
| CN104502005A (en) * | 2014-12-04 | 2015-04-08 | 刘玉珏 | F-P pressure sensor based on MEMS technology and formation method thereof |
| CN104515621A (en) * | 2014-12-24 | 2015-04-15 | 天津大学 | Fiber optic temperature sensor based on sealed micro cavity gas thermal effect and manufacturing method of fiber optic temperature sensor |
| CN104596685A (en) * | 2014-12-04 | 2015-05-06 | 刘玉珏 | MEMS process based miniature packaged F-P pressure sensor and forming method |
-
2017
- 2017-11-03 CN CN201711072698.8A patent/CN107664548A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1614371A (en) * | 2004-10-11 | 2005-05-11 | 南京师范大学 | Pressure sensor of optical fiber micro-electromechanic system |
| US20090226128A1 (en) * | 2005-08-12 | 2009-09-10 | Denis Donlagic | Single piece fabry-perot optical sensor and method of manufacturing the same |
| CN102721492A (en) * | 2012-05-31 | 2012-10-10 | 天津大学 | Optical fiber Fabry-Perot pressure sensor with fiber bragg grating temperature compensation and making method thereof |
| CN104502005A (en) * | 2014-12-04 | 2015-04-08 | 刘玉珏 | F-P pressure sensor based on MEMS technology and formation method thereof |
| CN104596685A (en) * | 2014-12-04 | 2015-05-06 | 刘玉珏 | MEMS process based miniature packaged F-P pressure sensor and forming method |
| CN104515621A (en) * | 2014-12-24 | 2015-04-15 | 天津大学 | Fiber optic temperature sensor based on sealed micro cavity gas thermal effect and manufacturing method of fiber optic temperature sensor |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108760148A (en) * | 2018-07-20 | 2018-11-06 | 北京航空航天大学 | A kind of absolute pressure formula Fabry-perot optical fiber silicon carbide high temperature resistant aviation pressure sensor |
| CN108760148B (en) * | 2018-07-20 | 2020-04-10 | 北京航空航天大学 | Absolute pressure type optical fiber Fabry-Perot silicon carbide high-temperature resistant aviation pressure sensor |
| CN109580546A (en) * | 2018-12-19 | 2019-04-05 | 天津大学 | A kind of Fabry-perot optical fiber gas refracting index and temperature sensor and system, measurement method |
| CN109580546B (en) * | 2018-12-19 | 2021-07-20 | 天津大学 | Measuring method realized by using optical fiber Fabry-Perot gas refractive index and temperature sensing system |
| CN110618302A (en) * | 2019-10-31 | 2019-12-27 | 国网上海市电力公司 | Manufacturing method of Fabry-Perot cavity probe of partial discharge EFPI optical fiber sensor |
| CN110849442A (en) * | 2019-11-06 | 2020-02-28 | 天津大学 | MEMS optical fiber Fabry-Perot low-temperature liquid level sensor based on differential pressure and measuring system thereof |
| CN112629720A (en) * | 2020-11-30 | 2021-04-09 | 中国航空工业集团公司北京长城计量测试技术研究所 | Low-loss optical fiber pressure sensor and manufacturing method thereof |
| CN112629720B (en) * | 2020-11-30 | 2022-08-09 | 中国航空工业集团公司北京长城计量测试技术研究所 | Low-loss optical fiber pressure sensor and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107664548A (en) | A kind of EFPI fibre optic compression sensors and preparation method thereof | |
| US9074957B2 (en) | High stable fiber fabry-perot pressure sensor with glue-free packing and its fabrication method | |
| CN103234673B (en) | Pressure sensor micro-nano structure with high stability under high-temperature environment | |
| CN101832832B (en) | Optical fiber Fabry-Perot pressure sensor and production method thereof | |
| CN111998932B (en) | Graphene corrugated film optical fiber F-P sound pressure sensor and manufacturing method thereof | |
| CN107063554B (en) | A kind of integrated fiber big pressure sensor and preparation method thereof | |
| CN103528665A (en) | Novel Fabry-Perot interference MEMS (Micro Electro Mechanical System) sound wave sensor | |
| CN103344381B (en) | Wide region vacuum optical fiber sensor with multiple stage rank and preparation method thereof | |
| CN103308717B (en) | Optical fiber Fabry-Perot acceleration sensor and manufacturing method thereof | |
| CN109374109B (en) | Miniature optical fiber extrinsic type Michelson sound pressure sensor with common optical path structure | |
| CN203551100U (en) | Novel Fabry-Perot interference-type MEMS sound wave sensor | |
| CN101034028A (en) | Fabry-Perotw fiber-optic pressure sensor and manufacture method therefor | |
| CN111256808A (en) | Optical fiber micro-opto-electro-mechanical system ultrasonic sensor with composite membrane structure and manufacturing method thereof | |
| CN205037998U (en) | Optic fibre F -P chamber stress release pressure sensor | |
| CN106017756A (en) | Submicron ultra-smooth metal film based highly sensitive FP pressure sensor | |
| CN112629720B (en) | Low-loss optical fiber pressure sensor and manufacturing method thereof | |
| CN106197782A (en) | Miniature extrinsic Fabry-perot optical fiber pressure transducer | |
| CN114486019B (en) | Optical fiber Fabry-Perot pressure sensor for eliminating interference of third cavity and MEMS manufacturing method | |
| CN110631616B (en) | Ultra-temperature miniature optical fiber EFPI strain sensor | |
| CN116425110B (en) | Wafer-level manufacturing method of high-temperature photoelectric pressure sensing chip with differential structure | |
| CN110618302A (en) | Manufacturing method of Fabry-Perot cavity probe of partial discharge EFPI optical fiber sensor | |
| CN113970348B (en) | Multi-parameter optical fiber sensor based on cascade F-P interferometer | |
| CN110332981A (en) | A kind of MEMS fibre optic hydrophone and preparation method thereof | |
| CN1614371A (en) | Pressure sensor of optical fiber micro-electromechanic system | |
| CN114279551B (en) | Optical fiber sound pressure sensor based on MEMS technology and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180206 |