CN107662401A - A kind of equipment and technique for printing dereliction grid cell piece front electrode - Google Patents
A kind of equipment and technique for printing dereliction grid cell piece front electrode Download PDFInfo
- Publication number
- CN107662401A CN107662401A CN201610625405.3A CN201610625405A CN107662401A CN 107662401 A CN107662401 A CN 107662401A CN 201610625405 A CN201610625405 A CN 201610625405A CN 107662401 A CN107662401 A CN 107662401A
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- cell piece
- extruding
- conductive silver
- silver paste
- printing
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- 238000007639 printing Methods 0.000 title claims abstract description 45
- 238000000034 method Methods 0.000 title claims abstract description 16
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 50
- 238000001746 injection moulding Methods 0.000 claims abstract description 29
- 230000000694 effects Effects 0.000 claims abstract description 22
- 230000001680 brushing effect Effects 0.000 claims abstract description 19
- 238000003860 storage Methods 0.000 claims abstract description 4
- 230000032258 transport Effects 0.000 claims abstract 4
- 230000002708 enhancing effect Effects 0.000 claims description 45
- 229910052710 silicon Inorganic materials 0.000 claims description 30
- 239000010703 silicon Substances 0.000 claims description 30
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 29
- 238000003466 welding Methods 0.000 claims description 26
- 229910021419 crystalline silicon Inorganic materials 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 15
- 239000007921 spray Substances 0.000 claims description 6
- 210000002268 wool Anatomy 0.000 claims description 6
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 229910052796 boron Inorganic materials 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 3
- 230000007547 defect Effects 0.000 claims description 3
- 235000008216 herbs Nutrition 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 239000011574 phosphorus Substances 0.000 claims description 3
- 238000002310 reflectometry Methods 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 2
- 239000007924 injection Substances 0.000 claims description 2
- 235000013399 edible fruits Nutrition 0.000 claims 1
- 230000001737 promoting effect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 230000005611 electricity Effects 0.000 description 5
- 239000013078 crystal Substances 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 1
- 210000004209 hair Anatomy 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
- B41F15/0804—Machines for printing sheets
- B41F15/0813—Machines for printing sheets with flat screens
- B41F15/0818—Machines for printing sheets with flat screens with a stationary screen and a moving squeegee
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/40—Inking units
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022433—Particular geometry of the grid contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
- B41P2215/00—Screen printing machines
- B41P2215/10—Screen printing machines characterised by their constructional features
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
- B41P2231/00—Inking devices; Recovering printing ink
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Printing Plates And Materials Therefor (AREA)
Abstract
It is an object of the invention to provide a kind of equipment and technique for printing dereliction grid cell piece front electrode.Workbench is provided with cell piece and transports platform, and pending cell piece is placed on cell piece and transported on platform, and thin grid line half tone is arranged on cell piece and transports platform top, and scraper and conductive paste outlet are arranged on the top of thin grid line half tone;Also include extruding injection moulding apparatus, it includes that 2 devices are adjacent to be independently arranged, and a device includes erecting bed, and conductive silver paste storage device is provided with the upside of erecting bed, its downside is provided with extruding conductive silver paste pipette tips, and brushing pattern mold is provided with extruding conductive silver paste pipette tips;Another device is provided with extruding pipette tips on the downside of conductive silver paste loading attachment, and extruding pipette tips are provided with brushing mould.For the present invention to provide the typography of front electrode without the design of main gate line solar battery sheet, it has very big application space, has the effect for promoting solar photovoltaic industry progress.
Description
Technical field
The invention belongs to technical field of solar, more particularly to a kind of production equipment and process of solar battery sheet, tool
Saying for body is a kind of equipment and technique for printing dereliction grid cell piece front electrode.
Background technology
Global fossil energy crisis has promoted the fast development of photovoltaic industry with environmental pollution.A few days ago, with crystal silicon electricity
Component based on the piece of pond occupies more than the 80% of global photovoltaic module market;Crystal-silicon battery slice is developed so far, its cost of manufacture
And generated energy turns into the main restricting factor of its development.In terms of cost of manufacture, material of the silicon materials in occupation of about 60-70%
Cost, the material cost of the dosage of silver paste in occupation of about 20-30%.The bold proposition of forefathers is to drop without main gate line technology
The most eager serious hope of this inexpensive target, and this technology also contributes to increase the effective illuminating area of cell piece, improves hair
Electricity.But some of which technological difficulties have contained the development without main grid, such as 1. Chinese patent《Silion cell without main gate line
Piece》[the patent No.:CN201820762U] in there is situations such as welding difficulty is big, welding is easy to fall off;2. Germany Schmid without
Main grid line technology butt welding machine requires too harsh, so as to improve equipment cost;3. Lin Jianwei《Connect without main grid, the high efficiency back of the body
Touch solar energy module, component and preparation technology》[the patent No.:CN 104282788A] there is whole battery sheet material and group
The technological innovation of part material, and technique and quality standard are very immature.
In cell piece printing screen plate this aspect, domestic and international many patents have some of oneself to illustrate viewpoint, but substantially
On all discuss conventional there is main gate line cell piece concentrating.For example, 1. Chinese patent《Photovoltaic cell printing module》[patent
Number:CN202669148U] main gate line that prints out and the junction of secondary grid line it is rounded, therefore contact area between the two increases
Greatly, contact resistance reduces, it is possible to increase photoelectric transformation efficiency.2. Chinese patent《Improved photovoltaic cell printing module》[specially
Profit number:CN202742802U] by aiding in grid line so that when a main gate line breaks down, connect the pair of the failure main gate line
Grid line can be by aiding in grid line to be connected in another main gate line.3. Chinese patent《A kind of enhanced crystal silicon solar electricity
The cell piece of the main gate line of pond four》[the patent No.:CN204792810U] when cell piece prints secondary grid line and broken, still
The collection of electric current can be effectively carried out, greatly reduces the bad ratios of cell piece EL.
The patent of many cell piece printing screen plates has all related to main gate line cell piece, without dereliction grid line cell piece
Half tone occur.Therefore the production equipment for the dereliction grid line cell piece that forms a complete production network also is badly in need of researching and developing.
The content of the invention
It is an object of the invention to provide a kind of printing low production cost, the front electricity of the dereliction grid cell piece of high generated energy
The equipment and technique of pole.
One kind printing dereliction grid cell piece front electrode equipment, including workbench, scraper, thin grid line half tone, pending electricity
Pond piece and conductive silver paste outlet, workbench are provided with cell piece and transport platform, and pending cell piece is placed on cell piece transport
On platform, thin grid line half tone is arranged on cell piece and transported above platform, and scraper and conductive silver paste outlet are arranged on thin grid line net
The top of version;Also including extruding injection moulding apparatus, the extruding injection moulding apparatus is arranged on next station of thin grid line half tone, its
Including main grid end and welding enhancing point extruding injection moulding apparatus and enhancing electrical connection effect portion's extruding injection moulding apparatus, 2 devices
Adjacent to be independently arranged, main grid end and welding enhancing point pressurization injection moulding apparatus include erecting bed, are provided with the upside of erecting bed
Conductive silver paste material storage device, its downside are provided with extruding conductive silver paste spray gun head, on extruding conductive silver paste spray gun head
Provided with brushing pattern mold;Enhancing electrical connection effect portion's extruding injection moulding apparatus includes conductive silver paste material loading attachment, in conduction
Extruding pipette tips are provided with the downside of silver paste material loading attachment, extruding pipette tips are provided with brushing mould.
Its both ends of dereliction grid cell piece that the present invention is directed to are provided with termination, and non-fully change existing production technology, only
The main gate line of center section is removed, the printing of main gate line is reduced, simultaneously because main gate line requires very high in itself, does not print main grid
Line can substantially reduce work quality requirement, while reduce the requirement of half tone production, and then reduce production cost.
It is removable up and down to extrude injection moulding apparatus.
It is 1-2mm that injection moulding apparatus, which is extruded, in distance of its bottom of working condition away from pending cell piece.
Welding enhancing point is arranged between the printing of main grid end;Enhancing electrical connection effect portion is arranged on a pair of main gate lines
Termination printing between line on or line side.
The thin grid line quantity of thin grid line half tone is 50-110 roots, and thin grid line width is 60-120 microns.
Main grid end printing length best results are 2-20mm, and optimal printing width best results are 0.2-1.2mm.
The length of welding enhancing point is 2-10 millimeters, and width is 0.2-1.2 millimeters, and its shape includes rectangle, circle, ellipse
Shape and triangle.
The width in enhancing electrical connection effect portion be 60-120 microns, is highly 10-40 microns, its shape including linear,
Rhombus, fold-line-shaped or rounding off are linear.
A kind of technique that dereliction grid cell piece is produced using the said equipment, is comprised the following steps:
A crystalline silicon substrates select
Preferential quality meets the crystalline silicon substrate of quality standard;Crystalline silicon substrate without open defect for example:Sliver, unfilled corner etc.;It is few
Number carrier lifetime is more than 20 microseconds.
B crystalline silicon substrate surface wool manufacturings
Silicon chip surface making herbs into wool:Corrosion is carried out in silicon chip surface and forms scraggly shape, to increase silicon chip to sunshine
Capture rate;
C diffuses to form PN junction
Diffuse to form PN junction:Phosphorus or boron doping are carried out to silicon chip so that cell piece both sides form P-type silicon and N-type silicon respectively;
D surfaces coated with antireflection coatings
Silicon chip surface coated with antireflection film:One layer of silicon nitride film is deposited in silicon chip surface, to reduce the reflectivity of sunshine;
Print electrode
F prints electrode:Including printing aluminium back surface field, backplate, thin grid line and main grid line end respectively to silicon chip both sides
Head, welding enhancing point and enhancing electrical connection effect portion.
When printing the thin grid line of front electrode, the cell piece by a-d processing is put into cell piece first and transported on platform,
Such as shown in accompanying drawing, conductive silver paste is in the left side of scraper, and as scraper moves to left movement.When scraper pushes
Wait, conductive silver paste leaks through silk screen and is attached in crystalline silicon substrate, and the then motion of scraper blows Excess conductive silver paste off, so
Transport platform by cell piece afterwards to transport, thin grid line finishes printing, into next process;
Main grid end and welding enhancing point pressurization injection moulding apparatus are adjusted apart from pending cell piece 1-2mm, first thin
The vertical one end extruding conductive silver paste of grid line forms 2-6 to main grid end;Then mobile extruding conductive silver paste pipette tips, are adjusted
Whole brushing pattern mold size, in thin grid line centre position, extruding conductive silver paste forms welding enhancing point;So far main grid is completed
The brushing of end and welding enhancing point, pending cell piece enter next process;
Adjustment enhancing electrical connection effect portion's extruding injection moulding apparatus is apart from pending cell piece 1-2mm, mobile extruding conductive silver
Slurry pipette tips, brushing pattern mold size is adjusted, optional position extruding conductive silver paste forms enhancing between main grid end
Electrically connect effect portion.
The present invention, which solves the typography of current battery piece front electrode and screen mesh printing plate, can not meet us without main grid
The production of line cell piece, it is therefore desirable to propose the printing screen plate of special dereliction grid line cell piece.
In addition, the main gate line of conventional batteries piece front electrode and thin grid line require higher to printing quality, therefore to silk
Net requires higher;But in our dereliction grid line cell piece, because without main gate line, only to the printing quality of thin grid line
It is required that it is somewhat higher, it is less demanding to some other printing positions, so silk screen manufacture difficulty is reduced, so as to reduce
The cost of manufacture of screen mesh printing plate.
The present invention is to be designed without main gate line solar battery sheet, and it has very big application space, has and promotes solar energy
The effect of photovoltaic industry progress.
Brief description of the drawings
Fig. 1 present device entirety major part structural representations;
Fig. 2 dereliction grid cell chip architecture schematic diagrames of the present invention;
Fig. 3 dereliction grid cell chip architecture schematic diagrames of the present invention;
Fig. 4 dereliction grid cell chip architecture schematic diagrames of the present invention;
Fig. 5 dereliction grid cell chip architecture schematic diagrames of the present invention;
Fig. 6 dereliction grid cell chip architecture schematic diagrames of the present invention;
Fig. 7 dereliction grid cell chip architecture schematic diagrames of the present invention;
The thin grid line screen structure schematic diagram of Fig. 8 present invention.
In figure:1 workbench;2 pending cell pieces;3 thin grid line half tones;4 scrapers;5 brushing pattern molds;6 extruding are conductive
Silver paste spray gun head;7 erecting beds;8 dereliction grid cell pieces;9 brushing moulds;10 extruding pipette tips;11 conductive silver paste loading attachments.
Embodiment
The invention will be further described with reference to the accompanying drawings and examples
One kind printing dereliction grid cell piece front electrode equipment, including it is workbench 1, scraper 4, thin grid line half tone 3, pending
Cell piece 2 and conductive silver paste outlet, workbench 1 are provided with cell piece and transport platform, and pending cell piece 2 is placed on cell piece
Transport on platform, thin grid line half tone 3 is arranged on cell piece and transported above platform, and scraper 6 and conductive silver paste outlet are arranged on carefully
The top of grid line half tone 3;Also include extruding injection moulding apparatus, the extruding injection moulding apparatus is arranged on the next of thin grid line half tone 3
On station, it includes main grid end and welding enhancing point extruding injection moulding apparatus and enhancing electrical connection effect portion extruding injection dress
Put, 2 devices are adjacent to be independently arranged, and main grid end and welding enhancing point pressurization injection moulding apparatus include erecting bed 7, in erecting bed
7 upside is provided with conductive silver paste material storage device, and its downside is provided with extruding conductive silver paste spray gun first 6, in extruding conductive silver
Slurry spray gun first 6 is provided with brushing pattern mold 5;Enhancing electrical connection effect portion extruding injection moulding apparatus fills including conductive silver paste material
Carry and put 11, extruding pipette tips 10 are provided with the downside of conductive silver paste material loading attachment 11, extruding pipette tips 10 are provided with brushing mould
9。
It is removable up and down to extrude injection moulding apparatus.
It is 1-2mm that injection moulding apparatus, which is extruded, in distance of its bottom of working condition away from pending cell piece 2.
Welding enhancing point is arranged between the printing of main grid end;Enhancing electrical connection effect portion is arranged on a pair of main gate lines
Termination printing between line on or line side.
The thin grid line quantity of thin grid line half tone 3 is 50-110 roots, and thin grid line width is 60-120 microns.
Main grid end printing length best results are 2-20mm, and optimal printing width best results are 0.2-1.2mm.
The length of welding enhancing point is 2-10 millimeters, and width is 0.2-1.2 millimeters, and its shape includes rectangle, circle, ellipse
Shape and triangle.
The width in enhancing electrical connection effect portion be 60-120 microns, is highly 10-40 microns, its shape including linear,
Rhombus, fold-line-shaped or rounding off are linear.
A kind of technique that dereliction grid cell piece is produced using the said equipment, is comprised the following steps:
A crystalline silicon substrates select
Preferential quality meets the crystalline silicon substrate of quality standard;Crystalline silicon substrate without open defect for example:Sliver, unfilled corner etc.;It is few
Number carrier lifetime is more than 20 microseconds.
B crystalline silicon substrate surface wool manufacturings
Silicon chip surface making herbs into wool:Corrosion is carried out in silicon chip surface and forms scraggly shape, to increase silicon chip to sunshine
Capture rate;
C diffuses to form PN junction
Diffuse to form PN junction:Phosphorus or boron doping are carried out to silicon chip so that cell piece both sides form P-type silicon and N-type silicon respectively;
D surfaces coated with antireflection coatings
Silicon chip surface coated with antireflection film:One layer of silicon nitride film is deposited in silicon chip surface, to reduce the reflectivity of sunshine;
F prints electrode
Print electrode:Including printing aluminium back surface field, backplate, thin grid line and main grid line end respectively to silicon chip both sides
Head, welding enhancing point and enhancing electrical connection effect portion.
When printing the thin grid line of front electrode, the cell piece by a-d processing is put into cell piece first and transported on platform,
Such as shown in accompanying drawing, conductive silver paste is in the left side of scraper, and as scraper moves to left movement.When scraper pushes
Wait, conductive silver paste leaks through silk screen and is attached in crystalline silicon substrate, and the then motion of scraper blows Excess conductive silver paste off, so
Transport platform by cell piece afterwards to transport, thin grid line finishes printing, into next process;
Main grid end and welding enhancing point pressurization injection moulding apparatus are adjusted apart from pending cell piece 1-2mm, first thin
The vertical one end extruding conductive silver paste of grid line forms 2-6 to main grid end;Then mobile extruding conductive silver paste pipette tips, are adjusted
Whole brushing pattern mold size, in thin grid line centre position, extruding conductive silver paste forms welding enhancing point;So far main grid is completed
The brushing of end and welding enhancing point, pending cell piece enter next process;
Adjustment enhancing electrical connection effect portion's extruding injection moulding apparatus is apart from pending cell piece 1-2mm, mobile extruding conductive silver
Slurry pipette tips, brushing pattern mold size is adjusted, optional position extruding conductive silver paste forms enhancing between main grid end
Electrically connect effect portion.
Claims (9)
1. it is a kind of print dereliction grid cell piece front electrode equipment, including workbench (1), scraper (4), thin grid line half tone (3),
Pending cell piece (2) and conductive paste outlet, workbench (7) are provided with cell piece and transport platform, and pending cell piece (2) is placed
Transported in cell piece on platform, thin grid line half tone (3) is arranged on cell piece and transported above platform, scraper (6) and conductive paste outlet
It is arranged on the top of thin grid line half tone (3), it is characterised in that:Also include extruding injection moulding apparatus, the extruding injection moulding apparatus is set
On next station of thin grid line half tone (3), it includes main grid end and welding enhancing point extruding injection moulding apparatus and enhancing
Effect portion extruding injection moulding apparatus is electrically connected, 2 devices are adjacent to be independently arranged, main grid end and welding enhancing point pressurization injection dress
Put including erecting bed (7), conductive silver paste storage device is provided with the upside of erecting bed (7), its downside is provided with extruding conductive silver
Slurry pipette tips (6), brushing pattern mold (5) is provided with extruding conductive silver paste pipette tips (6);The portion's extruding of enhancing electrical connection effect
Injection moulding apparatus includes conductive silver paste loading attachment (11), and extruding pipette tips are provided with the downside of conductive silver paste loading attachment (11)
(10) pipette tips (10), are extruded and are provided with brushing mould (9).
2. printing dereliction grid cell piece front electrode equipment according to claim 1, it is characterised in that:Extrude injection moulding apparatus
It is removable up and down.
3. printing dereliction grid cell piece front electrode equipment according to claim 1, it is characterised in that:Extrude injection moulding apparatus
In its bottom of working condition, the distance away from pending cell piece (2) is 1-2mm.
4. printing dereliction grid cell piece front electrode equipment according to claim 1, it is characterised in that:Welding enhancing point is set
Put between the printing of main grid end;Enhancing electrical connection effect portion is arranged on the line between a pair of main grid end printings
Upper or line side.
5. printing dereliction grid cell piece front electrode equipment according to claim 1, it is characterised in that:Thin grid line half tone
(3) thin grid line quantity is 50-110 roots, and thin grid line width is 60-120 microns.
6. printing dereliction grid cell piece front electrode equipment according to claim 1, it is characterised in that:Main grid end prints
Brush length best results are 2-20mm, and optimal printing width best results are 0.2-1.2mm.
7. printing dereliction grid cell piece front electrode equipment according to claim 2, it is characterised in that:Welding enhancing point
Length is 2-10 millimeters, and width is 0.2-1.2 millimeters, and its shape includes rectangle, circle, ellipse and triangle.
8. printing dereliction grid cell piece front electrode equipment according to claim 3, it is characterised in that:Enhancing electrical connection effect
The width in fruit portion is 60-120 microns, is highly 10-40 microns, and its shape includes linear, rhombus, fold-line-shaped or round and smooth mistake
Branch-cut bridge shape.
A kind of 9. technique that dereliction grid cell piece is produced using the said equipment, it is characterised in that:Comprise the following steps:
A) crystalline silicon substrate selects
Preferential quality meets the crystalline silicon substrate of quality standard;Crystalline silicon substrate is without open defect;Minority carrier lifetime is in 20 microseconds
More than.
B) crystalline silicon substrate surface wool manufacturing
Silicon chip surface making herbs into wool:Corrosion is carried out in silicon chip surface and forms scraggly shape, and sunshine is caught with increasing silicon chip
Obtain rate;
C) PN junction is diffuseed to form
Diffuse to form PN junction:Phosphorus or boron doping are carried out to silicon chip so that cell piece both sides form P-type silicon and N-type silicon respectively;
D) surface coated with antireflection coatings
Silicon chip surface coated with antireflection film:One layer of silicon nitride film is deposited in silicon chip surface, to reduce the reflectivity of sunshine;
E) print electrode
Print electrode:Including printing aluminium back surface field, backplate, thin grid line and main grid end, weldering respectively to silicon chip both sides
Connect enhancing point and enhancing electrical connection effect portion.
When printing the thin grid line of front electrode, the cell piece by a-d processing is put into cell piece first and transported on platform, it is conductive
Silver paste is in the left side of scraper (7), and as scraper moves to left movement.When scraper pushes, conductive silver paste leakage
Cross silk screen and be attached in crystalline silicon substrate, the then motion of scraper blows Excess conductive silver paste off, is then transported by cell piece
Platform transports, and thin grid line finishes printing, into next process;
Main grid end and welding enhancing point pressurization injection moulding apparatus are adjusted apart from pending cell piece (2) 1-2mm, first in thin grid
The vertical one end extruding conductive silver paste of line forms 2-6 to main grid end;Then mobile extruding conductive silver paste pipette tips (6),
Brushing pattern mold (5) size is adjusted, extruding conductive silver paste forms welding enhancing point in thin grid line centre position;So far complete
The brushing of main grid end and welding enhancing point, pending cell piece (2) enter next process;
Adjustment enhancing electrical connection effect portion's extruding injection moulding apparatus is apart from pending cell piece (2) 1-2mm, mobile extruding conductive silver paste
Spray gun head (10), brushing pattern mold (9) size is adjusted, optional position extruding conductive silver paste is formed between main grid end
Enhancing electrical connection effect portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610625405.3A CN107662401A (en) | 2016-07-31 | 2016-07-31 | A kind of equipment and technique for printing dereliction grid cell piece front electrode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610625405.3A CN107662401A (en) | 2016-07-31 | 2016-07-31 | A kind of equipment and technique for printing dereliction grid cell piece front electrode |
Publications (1)
Publication Number | Publication Date |
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CN107662401A true CN107662401A (en) | 2018-02-06 |
Family
ID=61122077
Family Applications (1)
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CN112937082A (en) * | 2021-01-22 | 2021-06-11 | 徐州中辉光伏科技有限公司 | Step-by-step printing device for photovoltaic crystal silicon battery |
CN114407507A (en) * | 2020-10-28 | 2022-04-29 | 江苏载驰科技股份有限公司 | Method and device for manufacturing thin grid of solar cell |
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