CN107653437A - The compound mask plate of evaporation - Google Patents

The compound mask plate of evaporation Download PDF

Info

Publication number
CN107653437A
CN107653437A CN201711091790.9A CN201711091790A CN107653437A CN 107653437 A CN107653437 A CN 107653437A CN 201711091790 A CN201711091790 A CN 201711091790A CN 107653437 A CN107653437 A CN 107653437A
Authority
CN
China
Prior art keywords
rib
mask plate
mounting groove
base
evaporation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201711091790.9A
Other languages
Chinese (zh)
Other versions
CN107653437B (en
Inventor
范硕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to CN201711091790.9A priority Critical patent/CN107653437B/en
Priority to PCT/CN2017/110901 priority patent/WO2019090793A1/en
Publication of CN107653437A publication Critical patent/CN107653437A/en
Application granted granted Critical
Publication of CN107653437B publication Critical patent/CN107653437B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The invention discloses a kind of compound mask plate of evaporation, including base, lattice structure and mask plate, lattice structure is a plurality of orthogonal first rib and the second rib, the middle of the base offers evaporation hole, its top surface offers the mounting groove in connection evaporation hole, lattice structure is suspended from evaporation hole and surrounding is overlapped in mounting groove, and lattice structure upper surface is concordant with base top surface;Mask plate includes the pierced pattern region at multiple intervals and the white space adjacent with pierced pattern region, mask plate are overlapped on base, and the projection of the first rib and the second rib on mask plate is located in white space.Because netted lattice structure is suspended from evaporation hole and surrounding is overlapped and is fixed in mounting groove, the upper surface of lattice structure is concordant with base top surface, mask plate is overlapped on base, and hollow out evaporation passage is not blocked in projection of the lattice structure on mask plate, both being smoothed out for evaporation had been ensure that, the flatness of mask plate is in turn ensure that, is also convenient for the cleaning of mask plate.

Description

The compound mask plate of evaporation
Technical field
The present invention relates to organic light emitting display technical field, more particularly to a kind of compound mask plate of evaporation.
Background technology
At present, Organic Light Emitting Diode (OLED) display screen is widely used in smart mobile phone, tablet personal computer, computer and TV etc. End product.But higher and higher resolution requirement is proposed to display screen for these electronic terminal products, it is necessary to which screen parses (i.e. picture element density) is spent more than 400ppi.
With oled panel high resolution, high-precision metal mask plate (FMM, i.e. Fine metal Mask) thickness needs Become thinner, metal mask plate can not avoid sagging phenomenon when FMM thickness is thinning.Made using existing manufacture craft During OLED pixel, due to the thinning difficulty of processing of metal mask plate and it is sagging the problems such as, it is difficult to make high-resolution OLED faces Plate.
In existing metal mask plate manufacturing process, the carrier strip that transverse and longitudinal is interlocked generally is produced in framework, lower floor After carrier strip is welded to framework, the carrier strip on upper strata is vertically overlapped in the carrier strip of lower floor, and both ends are welded to framework again, though Right such a structure can play the carrying effect to the FMM on top to a certain extent, alleviate in large size panel in glass When R, G, B luminous organic material being deposited on substrate, glass substrate is with the phenomenon sagging FMM of its underpart, however, orthogonal Unavoidably the state that arches upward can be presented in intersection in two layers of carrier strip so that the flatness of metal mask plate is affected, and influences organic The evaporation uniformity of luminescent material, also, the position arched upward forms tiny gap, easily accumulates deposition material, to metal mask The cleaning in plate later stage brings inconvenience.
The content of the invention
In view of the shortcomings of the prior art, the invention provides a kind of compound mask plate of evaporation, it is ensured that covers Template will not be sagging, has good flatness, can also facilitate the cleaning of mask plate.
In order to realize above-mentioned purpose, present invention employs following technical scheme:
A kind of compound mask plate of evaporation, including base, lattice structure and mask plate, the lattice structure are a plurality of phase The network structure that mutually the first vertical rib and the second rib are formed, the base are the annular plate that middle part offers evaporation hole, The top surface of the base is further opened with connecting the mounting groove in the evaporation hole, and the lattice structure is suspended from the evaporation hole and four Week overlaps and is fixed in the mounting groove, and the upper surface of the lattice structure and the either flush;The mask plate bag The pierced pattern region and the white space adjacent with the pierced pattern region, the mask plate for including multiple intervals are overlapped on institute State on base, and the projection of first rib and second rib on the mask plate is located in the white space.
As one of which embodiment, the mounting groove includes first of two relative edges on the top surface of the base Mounting groove and on the top surface of the base another two relative edge the second mounting groove;First rib is overlapped in described second Above rib, first rib is embedded in first mounting groove, and second rib is embedded at second mounting groove It is interior, and the depth of second mounting groove is the thickness sum of first rib and second rib, first installation The depth of groove is identical with the thickness of first rib.
As one of which embodiment, the mask plate is placed parallel to first rib, adjacent two described Gap between one rib is less than the width of the mask plate, and the mask plate is overlapped on adjacent two first rib tables Face.
As one of which embodiment, it is recessed that the surface of second rib towards first rib offers first Groove, first rib are embedded and are fastened in first groove.
As one of which embodiment, it is recessed that the surface of first rib towards second rib offers second Groove, second rib are embedded and are fastened in second groove.
As one of which embodiment, the bottom surface of the base is further opened with connecting the secondary mounting groove in the evaporation hole, The secondary mounting groove is including the first secondary mounting groove of two relative edges on the bottom surface of the base and positioned at the bottom of the base The second secondary mounting groove of another two relative edge on face, the depth of the second secondary mounting groove is first rib and second muscle The thickness sum of bar, the depth of the first secondary mounting groove are identical with the thickness of first rib.
As one of which embodiment, the compound mask plate of described evaporation also includes shield, and the shield includes The frame portion of frame shape and the first projection on the relative side of the first couple of the frame portion and located at the frame portion The second projection on two pairs of relative sides, first projection, the protrusion direction of second projection are identical, and work as the frame Portion is selectively engaged with top surface or the bottom surface of the base, and first projection respectively correspondingly blocks with second projection Close in the mounting groove or the secondary mounting groove.
As one of which embodiment, first projection, the protrusion height of second projection are respectively with described The depth of one mounting groove, the depth of second mounting groove are identical.
As one of which embodiment, the compound mask plate of described evaporation also includes being respectively arranged on the base two Mask plate described in polylith is engaged togather by the locating rack at end, the locating rack, and is provided with alignment mark on the locating rack, It is correspondingly provided with the base for reference marker of the alignment mark as contraposition reference.
In the compound mask plate of the present invention, netted lattice structure is suspended from evaporation hole and surrounding overlaps and is fixed on installation In groove, and the upper surface of lattice structure and either flush, mask plate are overlapped on base, and the first rib and the second rib are being covered In white space of the projection without hollow out evaporation passage on mask plate on diaphragm plate, it can both ensure smoothly entering for evaporation OK, and can ensures that mask plate has good flatness, will not occur during evaporation sagging, is also convenient for the clear of mask plate Wash.
Brief description of the drawings
Fig. 1 is the structural representation of the compound mask plate of the embodiment of the present invention 1;
Fig. 2 is the internal structure schematic diagram of the compound mask plate of the embodiment of the present invention 1;
Fig. 3 is the cross section structure diagram of the base of the embodiment of the present invention 1;
Fig. 4 is a kind of fit system schematic diagram of the rib in the lattice structure of the embodiment of the present invention 1;
Fig. 5 is another fit system schematic diagram of the rib in the lattice structure of the embodiment of the present invention 1;
Fig. 6 is another fit system schematic diagram of the rib in the lattice structure of the embodiment of the present invention 1;
Fig. 7 is the cross section structure diagram of the base of the embodiment of the present invention 2;
Fig. 8 is the internal structure schematic diagram of the compound mask plate of the embodiment of the present invention 2;
Fig. 9 is the internal structure schematic diagram of the compound mask plate of the embodiment of the present invention 3;
Figure 10 is the structural representation of the shield of the embodiment of the present invention 3;
Figure 11 is Figure 10 A-A to sectional view.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples The present invention is further described.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and do not have to It is of the invention in limiting.
Embodiment 1
Refering to Fig. 1~3, the compound mask plate of the embodiment of the present invention is mainly used in that organic light emission material is deposited in oled panel The bed of material, the compound mask plate mainly include base 10, lattice structure 20 and polylith mask plate 30, and lattice structure 20 is a plurality of mutual The network structure that the first vertical rib 21 and the second rib 22 are formed, base 10 are the ring-type that middle part offers evaporation hole 100 Plate, the top surface of base 10 are further opened with the mounting groove 110 in connection evaporation hole 100, and lattice structure 20 is suspended from evaporation hole 100 and four Week overlaps and is fixed in mounting groove 110, and the upper surface of lattice structure 20 and either flush;Mask plate 30 includes multiple intervals Pierced pattern region 31 and the white space 32 adjacent with pierced pattern region 31, mask plate 30 be overlapped on base 10, and The projection of first rib 21 and the second rib 22 on mask plate 30 is located in white space 32, the pierced pattern area of mask plate 30 Domain 31 has the pattern consistent with pixel arrangement mode predetermined in OLED display panel.
With reference to shown in Fig. 1 and Fig. 2, the first rib 21 is overlapped in the top of the second rib 22, and mask plate 30 is parallel to the first muscle Bar 21 is placed, and the gap between adjacent two first ribs 21 is less than the width of mask plate 30, and mask plate 30 is overlapped on adjacent two The surface of the first rib of root 21, the first rib 21, the both ends of the second rib 22 can be fixed in base 10 by modes such as welding.When After mask plate 30 is placed on base 10, the both ends of mask plate 30 are overlapped on base 10, the center section overlap joint of mask plate 30 On the superposed surface of first rib 21, every two the first adjacent ribs 21 carry one piece of mask plate 30 thereon, can To ensure that mask plate 30 remains horizontal without sagging during evaporation, glass substrate can be placed on polylith mask plate On 30 surfaces formed, by the way that evaporation coating device is placed on below compound mask plate, the graininess evaporated in evaporation coating device has Machine material can sequentially pass through evaporation hole 100, the mesh of lattice structure 20, mask plate 30 pierced pattern region 31 after deposit to most The glass substrate lower surface of top, the pixel arrangement side consistent with the pattern in pierced pattern region 31 is formed on the glass substrate Formula.
Here, pierced pattern region 31 is located at directly over the mesh of lattice structure 20, and white space 32 is located at the first rib 21 surface, the second rib 22 are carried on the lower section of the first rib 21, can play the effect for preventing that the first rib 21 is sagging. And the first rib 21 also stops to the slit between the adjacent two piece mask plate 30 above it, evaporation process can be avoided Middle organic material enters the formation of the pattern of pixels for the glass substrate for influenceing the top in the slit.
As one of which embodiment, compound mask plate also has the locating rack 50 for being respectively arranged on the both ends of base 10, fixed Polylith mask plate 30 is engaged togather by position frame 50, and alignment mark 51 is provided with locating rack 50, corresponding on base 10 Provided with alignment mark 51 is supplied, in this, as the reference marker 11 of contraposition reference., only need to be by water when positioning each mask plate 30 Square alignment mark 51 thereon is set to be aligned with reference marker 11 to moving positioning frame 50, you can to make all mask plates 30 all It is moved to predetermined position, it is possible to achieve rapid-aligning, carry out follow-up evaporation processing procedure immediately.
As shown in figure 3, the mounting groove 110 of the present embodiment includes the first installation of two relative edges on the top surface of base 10 Groove 111 and on the top surface of base 10 another two relative edge the second mounting groove 112;First rib 21 is embedded at the first mounting groove In 111, the second rib 22 is embedded in the second mounting groove 112, and the depth of the second mounting groove 112 is the first rib 21 and second The thickness sum of rib 22, the depth of the first mounting groove 111 are identical with the thickness of the first rib 21.First rib 21 is overlapped in The top of two rib 22, the second rib 22 of lower section are completely embedded into the second deeper mounting groove 112, the first rib 21 of top It is completely embedded into the first shallower mounting groove 111, during compound mask plate is assembled, the first rib 21, the second rib 22 are respectively installed to the first mounting groove 111, in the second mounting groove 112, may then pass through the modes such as welding and are fixed.
In order to which the thickness of compound mask plate is thinned, when coordinating the first rib 21 and the second rib 22, Ke Yiyou A variety of fit systems.Such as Fig. 4~6, in Fig. 4, only the first groove is offered on the surface of the second rib 22 towards the first rib 21 220, after the first rib 21 is installed on base 10, the first rib 21 is embedded and is fastened in the first groove 220;In Fig. 5, only exist The surface of first rib 21 towards the second rib 22 offers the second groove 210, and the second rib 22 is embedded and to be fastened in second recessed In groove 210;In Fig. 6, the first groove 220 is offered on the surface of the second rib 22 towards the first rib 21, in the first rib 21 The second groove 210 is offered towards the surface of the second rib 22, can be further thinned relative to first two situation compound The thickness of mask plate.However, in the present embodiment it is preferred to it is using the collocation mode shown in Fig. 4, because during evaporation Granular organic material deposits on the glass substrate of the top of mask plate 30 from bottom to top, Fig. 5 and collocation mode shown in Fig. 6 by There is the second groove 210 directed downwardly in the first rib 21, understand deposited particles thing unavoidably in the second groove 210, cause composite mask There is certain difficulty in plate cleaning, and the collocation mode shown in Fig. 4 is not in such a defect.
Embodiment 2
Such as Fig. 7, on the basis of embodiment 1, the bottom surface of the base 10 of the present embodiment is further opened with connection evaporation hole 100 The secondary ' of mounting groove 110, mounting groove 110 and the secondary ' of mounting groove 110 are symmetrical above and below, and specifically, the secondary ' of mounting groove 110 includes being located at base On 10 bottom surface the first of two relative edges the secondary ' of mounting groove 111 and on the bottom surface of base 10 another two relative edge the second secondary peace Tankage 112 ', the first secondary ' of mounting groove 111 and the first mounting groove 111 position correspondence, the installations of the second secondary ' of mounting groove 112 and second The position correspondence of groove 112, the second secondary ' of mounting groove 112 depth for the first rib 21 and the second rib 22 thickness sum, first The secondary ' of mounting groove 111 depth is identical with the thickness of the first rib 21.
The understructure of such a mode causes the compound mask plate of the present embodiment to have longer service life, lattice structure 20 may be mounted in the mounting groove 110 at the top of base 10, can also be arranged on the ' of secondary mounting groove 110 of the bottom of base 10, i.e., The top structure of base is damaged or worn out, is distinguished after the first rib 21 and the second rib 22 of the top that need to only dismantle Compound mask plate is overturn to bottom court after in the first secondary secondary ' of mounting groove 112 of the ' of mounting groove 111 and second fixed to base bottom Upper (as shown in Figure 8), compound mask plate remain to be continuing with.
Embodiment 3
Such as Fig. 9~11, on the basis of embodiment 2, the compound mask plate of the present embodiment also has shield 40, and shield 40 wraps Include the frame portion 41 of frame shape and the first projection 42 on the relative side of the first couple of frame portion 41 and located at frame portion 41 The second projection 43 on second pair of relative side, the first projection 42, the protrusion direction of the second projection 43 are identical.
Shield 40 can be used for blocking untapped mounting groove 110 or secondary mounting groove 110 ', avoid the particle during evaporation The organic material of shape enters in corresponding mounting groove 110 or the ' of secondary mounting groove 110 cleaning for influenceing compound mask plate.Work as frame portion 41 selectively engage with top surface or the bottom surface of base 10, and the first projection 42 and the second projection 43 are respectively correspondingly fastened on peace In tankage 110 or the ' of secondary mounting groove 110.Specifically, when using the top of base 10, the first rib 21 and the second rib 22 It is separately mounted in the first mounting groove 111 and the second mounting groove 112, and by the first projection 42 and the second projection 43 respectively correspondingly It is fastened in the first secondary secondary ' of mounting groove 112 of the ' of mounting groove 111 and second of the bottom of base 10, prevents particulate matter from entering the first secondary peace The secondary ' of mounting groove 112 of the ' of tankage 111 and second;When using the bottom surface of base 10, the first rib 21 and the second rib 22 are distinguished In the first secondary secondary ' of mounting groove 112 of the ' of mounting groove 111 and second, the first projection 42 respectively correspondingly blocks with the second projection 43 Close in the first mounting groove 111 and the second mounting groove 112, prevent particulate matter from entering the first mounting groove 111 and the second mounting groove 112 It is interior.
Here, the first projection 42, the second projection 43 protrusion height respectively the depth with the first mounting groove 111, second peace The depth of tankage 112 is identical, further to avoid particulate matter from entering the first projection 42 and the secondary installation of the first mounting groove 111/ first The gap between gap and the second projection 43 and the 112/ second secondary ' of mounting groove 112 of the second mounting groove between the ' of groove 111.
In summary, in compound mask plate of the invention, netted lattice structure is suspended from evaporation hole and surrounding overlaps simultaneously It is fixed in mounting groove, and the upper surface of lattice structure and either flush, mask plate are overlapped on base, and the first rib and In white space of projection of two ribs on mask plate without hollow out evaporation passage on mask plate, it can both ensure to steam Plating is smoothed out, and and can ensures that mask plate has good flatness, will not occur during evaporation sagging, is also convenient for covering The cleaning of diaphragm plate.Also, the present invention is also further improved to compound mask plate, is improved its service life, is reduced dimension Cost is protected, and organic particle during being deposited can be avoided to enter in unnecessary gap well, it is easy to clean.
Described above is only the embodiment of the application, it is noted that for the ordinary skill people of the art For member, on the premise of the application principle is not departed from, some improvements and modifications can also be made, these improvements and modifications also should It is considered as the protection domain of the application.

Claims (9)

1. a kind of compound mask plate of evaporation, it is characterised in that including base (10), lattice structure (20) and mask plate (30) the netted knot that, the lattice structure (20) is a plurality of orthogonal first rib (21) and the second rib (22) is formed Structure, the base (10) are the annular plate that middle part offers evaporation hole (100), and the top surface of the base (10) is further opened with connecting The mounting groove (110) of evaporation hole (100), the lattice structure (20) is suspended from evaporation hole (100) and surrounding overlaps And be fixed in the mounting groove (110), and the upper surface of the lattice structure (20) and the either flush;The mask plate (30) the pierced pattern region (31) including multiple intervals and the white space (32) adjacent with the pierced pattern region (31), The mask plate (30) is overlapped on the base (10), and first rib (21) and second rib (22) are described Projection on mask plate (30) is located in the white space (32).
2. the compound mask plate of evaporation according to claim 1, it is characterised in that the mounting groove (110) includes position In the first mounting groove (111) of two relative edges on the top surface of the base (10) and another two on the top surface of the base (10) The second mounting groove (112) of relative edge;First rib (21) is overlapped in above second rib (22), first muscle Bar (21) is embedded in first mounting groove (111), and second rib (22) is embedded at second mounting groove (112) It is interior, and the depth of second mounting groove (112) is the thickness sum of first rib (21) and second rib (22), The depth of first mounting groove (111) is identical with the thickness of first rib (21).
3. the compound mask plate of evaporation according to claim 2, it is characterised in that the mask plate (30) is parallel to institute State the first rib (21) to place, the gap between adjacent two first ribs (21) is less than the width of the mask plate (30) Degree, the mask plate (30) are overlapped on adjacent two first rib (21) surfaces.
4. the compound mask plate of evaporation according to claim 2, it is characterised in that second rib (22) is towards institute The surface for stating the first rib (21) offers the first groove (220), and first rib (21) is embedded and is fastened in described first In groove (220).
5. the compound mask plate of evaporation according to claim 2, it is characterised in that first rib (21) is towards institute The surface for stating the second rib (22) offers the second groove (210), and second rib (22) is embedded and is fastened in described second In groove (210).
6. the compound mask plate of evaporation according to claim 2, it is characterised in that also open the bottom surface of the base (10) The secondary mounting groove (110 ') of evaporation hole (100) is communicated with, the secondary mounting groove (110 ') includes being located at the base (10) the first of two relative edges the secondary mounting groove (111 ') and another two relative edge on the bottom surface of the base (10) on bottom surface The second secondary mounting groove (112 '), the depth of the second secondary mounting groove (112 ') is first rib (21) and described second The thickness sum of rib (22), the depth of the first secondary mounting groove (111 ') are identical with the thickness of first rib (21).
7. the compound mask plate of evaporation according to claim 6, it is characterised in that also including shield (40), the screening Plate (40) includes the frame portion (41) of frame shape and the first projection on the relative side of the first couple of the frame portion (41) (42) and the second projection (43) on the relative side of the second couple of the frame portion (41), first projection (42), institute It is identical to state the protrusion direction of the second projection (43), and when the frame portion (41) is selectively engaged with the top of the base (10) When face or bottom surface, first projection (42) is respectively correspondingly fastened on the mounting groove (110) with second projection (43) Or in the secondary mounting groove (110 ').
8. the compound mask plate of evaporation according to claim 7, it is characterised in that first projection (42), described The protrusion height of second projection (43) depth with first mounting groove (111), the depth of second mounting groove (112) respectively Spend identical.
9. according to the compound mask plate of any described evaporations of claim 1-8, it is characterised in that also include being respectively arranged on institute The locating rack (50) at base (10) both ends is stated, mask plate described in polylith (30) is engaged togather by the locating rack (50), and institute State and alignment mark (51) is provided with locating rack (50), be correspondingly provided with the base (10) for the alignment mark (51) conduct The reference marker (11) of contraposition reference.
CN201711091790.9A 2017-11-08 2017-11-08 The compound mask plate of vapor deposition Active CN107653437B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201711091790.9A CN107653437B (en) 2017-11-08 2017-11-08 The compound mask plate of vapor deposition
PCT/CN2017/110901 WO2019090793A1 (en) 2017-11-08 2017-11-14 Composite mask plate for vapor deposition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711091790.9A CN107653437B (en) 2017-11-08 2017-11-08 The compound mask plate of vapor deposition

Publications (2)

Publication Number Publication Date
CN107653437A true CN107653437A (en) 2018-02-02
CN107653437B CN107653437B (en) 2019-10-25

Family

ID=61120652

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201711091790.9A Active CN107653437B (en) 2017-11-08 2017-11-08 The compound mask plate of vapor deposition

Country Status (2)

Country Link
CN (1) CN107653437B (en)
WO (1) WO2019090793A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108914055A (en) * 2018-07-05 2018-11-30 京东方科技集团股份有限公司 A kind of mask plate and evaporated device
CN109825802A (en) * 2019-04-10 2019-05-31 京东方科技集团股份有限公司 Mask plate and preparation method thereof
CN110055493A (en) * 2019-05-16 2019-07-26 武汉华星光电半导体显示技术有限公司 The precision metallic mask plate and its component of vapor deposition
CN111273515A (en) * 2020-02-14 2020-06-12 合肥鑫晟光电科技有限公司 Mask plate, manufacturing method, display panel and display device
WO2021136051A1 (en) * 2020-01-03 2021-07-08 京东方科技集团股份有限公司 Masking plate and manufacturing method therefor

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104561892A (en) * 2014-12-04 2015-04-29 深圳市华星光电技术有限公司 Mask sheet for OLED (organic light-emitting diode) material vacuum thermal evaporation
CN204738017U (en) * 2015-07-06 2015-11-04 信利(惠州)智能显示有限公司 Mask plate frame
CN105039907A (en) * 2015-09-22 2015-11-11 深圳市华星光电技术有限公司 Fixing assembly for mask plate
US20160260935A1 (en) * 2015-03-03 2016-09-08 Samsung Display Co., Ltd. Mask frame assembly, method of manufacturing the same and method of manufacturing display device by using the same
CN205662586U (en) * 2016-05-04 2016-10-26 合肥鑫晟光电科技有限公司 Mask frame

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101117645B1 (en) * 2009-02-05 2012-03-05 삼성모바일디스플레이주식회사 Mask Assembly and Deposition Apparatus using the same for Flat Panel Display
CN203960317U (en) * 2014-07-08 2014-11-26 上海天马有机发光显示技术有限公司 A kind of mask plate
CN105839051A (en) * 2016-05-09 2016-08-10 京东方科技集团股份有限公司 Masking plate, manufacturing method thereof, OLED display substrate and display device
CN106086782B (en) * 2016-06-28 2018-10-23 京东方科技集团股份有限公司 A kind of mask plate component and its installation method, evaporation coating device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104561892A (en) * 2014-12-04 2015-04-29 深圳市华星光电技术有限公司 Mask sheet for OLED (organic light-emitting diode) material vacuum thermal evaporation
US20160260935A1 (en) * 2015-03-03 2016-09-08 Samsung Display Co., Ltd. Mask frame assembly, method of manufacturing the same and method of manufacturing display device by using the same
CN204738017U (en) * 2015-07-06 2015-11-04 信利(惠州)智能显示有限公司 Mask plate frame
CN105039907A (en) * 2015-09-22 2015-11-11 深圳市华星光电技术有限公司 Fixing assembly for mask plate
CN205662586U (en) * 2016-05-04 2016-10-26 合肥鑫晟光电科技有限公司 Mask frame

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108914055A (en) * 2018-07-05 2018-11-30 京东方科技集团股份有限公司 A kind of mask plate and evaporated device
CN109825802A (en) * 2019-04-10 2019-05-31 京东方科技集团股份有限公司 Mask plate and preparation method thereof
CN109825802B (en) * 2019-04-10 2021-01-26 京东方科技集团股份有限公司 Mask plate and preparation method thereof
CN110055493A (en) * 2019-05-16 2019-07-26 武汉华星光电半导体显示技术有限公司 The precision metallic mask plate and its component of vapor deposition
CN110055493B (en) * 2019-05-16 2021-05-07 武汉华星光电半导体显示技术有限公司 Precision metal mask plate for evaporation and assembly thereof
WO2021136051A1 (en) * 2020-01-03 2021-07-08 京东方科技集团股份有限公司 Masking plate and manufacturing method therefor
CN111273515A (en) * 2020-02-14 2020-06-12 合肥鑫晟光电科技有限公司 Mask plate, manufacturing method, display panel and display device
CN111273515B (en) * 2020-02-14 2023-10-20 合肥鑫晟光电科技有限公司 Mask plate, manufacturing method, display panel and display device

Also Published As

Publication number Publication date
CN107653437B (en) 2019-10-25
WO2019090793A1 (en) 2019-05-16

Similar Documents

Publication Publication Date Title
CN107653437A (en) The compound mask plate of evaporation
US11018327B2 (en) Mask module, method for manufacturing a film layer, organic electromagnetic light-emitting display panel and method for manufacturing the same
US9909204B2 (en) Frame for mask plate and mask plate
US8617919B2 (en) Organic light emitting diode display and manufacturing method thereof
CN106601781A (en) Organic light-emitting display panel and display apparatus
KR102097706B1 (en) Mask structure for deposition
CN108321183A (en) A kind of organic light emitting display panel and display device
CN206279261U (en) A kind of mask integrated framework and evaporation coating device
CN107699852A (en) Mask plate and its manufacture method, evaporation coating method
CN108517490A (en) Mask plate and its manufacturing method
US20210336147A1 (en) Mask
CN207109079U (en) A kind of bilayer mask version component and evaporation coating device
CN109346505A (en) A kind of organic light emitting display panel, preparation method and display device
CN205893376U (en) Frame structure
CN109136833B (en) Display panel, mask plate, manufacturing method of display panel and display device
EP3187937B1 (en) Mask plate, mask plate assembly and use of mask plate assembly for pixel manufacturing
CN110850629A (en) Color film substrate, display panel and display device
US20150114287A1 (en) Mask frame assembly for thin film deposition and manufacturing method thereof
CN108193168B (en) Mask plate and preparation method thereof
CN107686964A (en) Mask plate support frame and mask plate
JP2019514152A (en) METHOD FOR MANUFACTURING DISPLAY SUBSTRATE, DISPLAY SUBSTRATE AND DISPLAY DEVICE
JP2019514152A5 (en)
CN105097882B (en) Pixel defining layer, organic electroluminescence device and preparation method thereof and display device
WO2024000893A1 (en) Mask, and mask manufacturing method
CN206902222U (en) Mask sheet and mask plate

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant