CN108193168B - Mask plate and preparation method thereof - Google Patents
Mask plate and preparation method thereof Download PDFInfo
- Publication number
- CN108193168B CN108193168B CN201810053569.2A CN201810053569A CN108193168B CN 108193168 B CN108193168 B CN 108193168B CN 201810053569 A CN201810053569 A CN 201810053569A CN 108193168 B CN108193168 B CN 108193168B
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- CN
- China
- Prior art keywords
- mask plate
- grid
- recessed portion
- open region
- strip structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
Abstract
The present invention proposes that a kind of mask plate, including integrally formed framework, the framework are additionally provided with a recessed portion, and patterned grid is equipped in the recessed portion.Recessed portion is formed by etching on an entire thin plate, recessed portion is an integral molding structure with the receptacle frame for being looped around recessed portion setting, and is carried out patterned process on recessed portion and formed grid, and accurate mask plate is finally laid on the grid.The grid of mask plate provided in this embodiment can be more docile on substrate, it is reduced the production cost relative to existing mask plate, the PPA stability for improving mask plate solves the problems, such as that the display such as colour mixture, variegation as caused by the bonding state of substrate and mask plate is bad is bad.
Description
Technical field
The present invention relates to a kind of field of display technology more particularly to a kind of mask plates and its production side for OLED vapor deposition
Method.
Background technique
In recent years, Organic Light Emitting Diode (Organic Light Emitting Diode, OLED) display with it is frivolous,
Actively shine, fast response time, many advantages, such as visual angle is wide, rich in color, brightness is high, low in energy consumption and high-low temperature resistant and by industry
Boundary is considered the novel display technology after liquid crystal display (Liquid Crystal Display, LCD), OLED display
It can be widely applied to the end products such as smart phone, tablet computer, TV.
It in the prior art, is that OLED is deposited under vacuum conditions, by the oled substrate court as process object
Its vapor deposition face is installed downwards, when the metal cover of vapor deposition configures between the vapor deposition face of oled substrate and evaporation source, will be steamed
Plating source is heated so that evaporation material evaporates, and so that it is attached to oled substrate surface via the opening portion of metal cover and steamed
Plating.For example, current OLED vapor deposition uses fine metal mask (Fine Metal Mask, FMM), it is contemplated that mode of throwing the net and
Be deposited processing procedure convenience, the metal frame (Frame) of fine metal mask is often hollow out, then on the metal frame of hollow out by
One welding of throwing the net forms the shielding portion (Cover) of horizontal direction, then vertically forms support bar in the top of shielding portion
(Howling), multiple metal strips (Mask Sheet) and in the side for being parallel to shielding portion is set up, is blocked by shielding portion
Gap between two adjacent metal strips, and using support bar to support these metal strips.
In evaporation process, there cannot be gap between metal cover and the substrate to be deposited, in order to avoid cause evaporation material
It is excessive and generate shadow effect.Therefore, magnet plate is set above substrate by metal cover because the attraction of magnetic force can be close
It is docile on substrate.At this point, metal cover is since its support bar and shielding portion are individually to be welded on metal frame, and magnet
Plate is non-uniformity, and support bar and shielding portion discontinuity deform the open region of metal cover, during vapor deposition
Easily causing evaporation material vapor deposition leads to colour mixture less than the specific region of design, influences product yield.
Summary of the invention
In view of this, the present invention is directed to propose a kind of mask plate and preparation method thereof, to solve mask plate in the prior art
Because its shielding portion and support bar are individually welded on metal frame, and the shielding portion of mask plate and the overlapping region of support bar is caused to exist
The magnetic force of magnet plate has subtle deformation under attracting, and it is specific less than design that evaporation material vapor deposition is easily caused during vapor deposition
Region leads to the problem of colour mixture.
The embodiment of the present invention provides a kind of mask plate, including integrally formed framework, which is additionally provided with a recessed portion, should
Patterned grid is equipped in recessed portion.
Further, which includes first part and second part, the first part include it is a plurality of in a first direction
The strip structure of parallelly distribute on, the second part include the strip structure of a plurality of parallelly distribute in a second direction, and this first
Point with the interlaced formation grid of the second part, the first direction and the second direction are perpendicular.
Further, it is limited by the first part with the second part and to form multiple be not attached to each other and array arrangement is opened
Mouth region.
Further, the width with the second part of the first part is of same size, the thickness of the first part with should
The thickness of second part is identical.
Further, which further includes the accurate mask plate being set on the grid, which includes more
A strip structure for being spaced apart from each other distribution is provided with area of the pattern on the strip structure.
Further, the parallel first part of multiple strip structures is arranged and covers the open region；Or, multiple strips
Parallelism structural is arranged and covers the open region in the second part, and the area of the pattern of the strip structure is corresponding with open region.
Based on the same inventive concept, the embodiment of the present invention also provides a kind of exposure mask board manufacturing method, which includes:
One thin plate is provided；
It is coated with photoresist on the thin plate, development is exposed to the photoresist, forms a recessed portion, and recessed at this
There is photoresist protection zone to be integrally formed a framework on concave portion periphery；
Patterned process is carried out to the recessed portion, forms grid.
Further, which includes first part and second part, the first part include it is a plurality of in a first direction
The strip structure of parallelly distribute on, the second part include the strip structure of a plurality of parallelly distribute in a second direction, first direction
It is mutually perpendicular to second direction, is limited by the first part and the second part and form multiple be not attached to each other and in array arrangement
Open region.
Further, the width with the second part of the first part is of same size, the thickness of the first part with should
The thickness of second part is identical.
Further, it carries out throwing the net on the grid and is laid with accurate mask plate, so that the strip structure of the precision mask plate
The first part is parallel to be arranged and cover the open region；Or multiple strip structures are parallel to the second part and are arranged and cover
The open region；The area of the pattern of the strip structure is corresponding with the open region.
Mask plate provided in an embodiment of the present invention and preparation method thereof forms recess by etching on an entire thin plate
Portion, recessed portion are an integral molding structure with the framework for being looped around recessed portion periphery, and patterned process shape is carried out on recessed portion
At grid, it is finally laid with accurate mask plate on the grid, can be avoided shielding portion in the prior art and independently formed with support bar
On metal frame, the overlapping region of the shielding portion and support bar that lead to mask plate stretches in the case where the magnetic force of magnet plate attracts and is generated
Creeping phenomenon causes open region to have the problem of subtle flow, and the grid of mask plate provided in this embodiment can be more docile in substrate
On, it is reduced the production cost relative to existing mask plate, improves PPA (aperture position precision) stability of mask plate, solved
Determined as the bonding state of substrate and mask plate it is bad caused by the bad problem of the display such as colour mixture, variegation.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the mask plate of the embodiment of the present invention.
Fig. 2 is the manufacturing process schematic diagram of the mask plate of the embodiment of the present invention.
Fig. 3 is the flow diagram of the production method of the mask plate of the embodiment of the present invention.
Fig. 4 is the structural schematic diagram of the mask plate of another embodiment of the present invention.
Specific embodiment
Further to illustrate that the present invention is to reach technical means and efficacy used by predetermined goal of the invention, below in conjunction with
Attached drawing and preferred embodiment, to a specific embodiment of the invention, structure, feature and its effect, detailed description is as follows.
[first embodiment]
Fig. 1 is the structural schematic diagram of the mask plate of the embodiment of the present invention.Fig. 2 is the production of the mask plate of the embodiment of the present invention
Process schematic.Incorporated by reference to Fig. 1 and Fig. 2, a kind of mask plate 100 includes a framework 101,101 middle part of framework recessed shape downwards
Cheng Youyi recessed portion 103, the framework 101 and the recessed portion 103 are integrally formed.The framework 101 is arranged around the recessed portion 103,
Patterned grid 105 is formed in the recessed portion 103.
Specifically, which includes first part 105a and second part 105b, and first part 105a includes a plurality of
The strip structure of parallelly distribute in a first direction, second part 105b include the item of a plurality of parallelly distribute in a second direction
Shape structure, first part 105a and interlaced the is formationed grid 105 of second part 105b, the first direction with this second
Direction is mutually perpendicular to.For example, first part 105a is horizontally extending, second part 105b is extended in the vertical direction,
Its extending direction is not limited thereto.It is limited to be formed by first part 105a and second part 105b and multiple be not attached to each other
And the open region 107 of array arrangement, the open region 107 are the mesh of the grid 105, pass through the mesh having to display panel
Source region is deposited to form target pattern.Preferably, the width of first part 105a and second part 105b's is of same size, should
The thickness of first part 105a is identical as the thickness of second part 105b.
In the present embodiment, which further includes the accurate mask plate 108 being set on the grid 105, which covers
Diaphragm plate 108 includes multiple strip structure 108a for being spaced apart from each other distribution, is provided with area of the pattern on strip structure 108a, is such as schemed
Shown in 1, the area of the pattern in the present embodiment on strip structure 108a is formed by multiple vacancy sections for rectangle.Wherein, the figure
Case region is the target pattern needed, which may be alternatively provided as non-rectangle such as round, polygon or other are not advised
Then shape.
Specifically, multiple strip structure 108a are parallel to first part 105a and are arranged and cover the open region 107, and
Area of the pattern on strip structure 108a is corresponding with the open region 107, so that evaporation material is by being attached on substrate.It answers
Form, various structures when the area of the pattern in explanation, strip structure 108a, attached drawing only depicts simply illustrative
Figure.
In addition, it is necessary to which explanation is that open region 107 can be completely covered in accurate mask plate 108, can also partially cover out
Mouth region 107.
Based on the same inventive concept, the present invention also provides a kind of exposure mask board manufacturing method, Fig. 3 is covering for the embodiment of the present invention
The flow diagram of diaphragm plate production method, referring to Fig. 3, which includes:
S1: a thin plate 10 is provided.When specific preparation, the thickness of thin plate 10 can be made to be reduced to certain journey by way of polishing
Degree, then carry out subsequent step.The thin plate 10 can be made of sheet metal or nonmetallic materials.
S2: being coated with photoresist on the thin plate 10, be exposed, develop to the photoresist, so that the photoresist
Patterning photoresist layer is formed, and forms a recessed portion 103 through overetch, it is noted that in this step not thin plate
It cuts through.Meanwhile on 103 periphery of recessed portion there is photoresist layer protection zone to form a framework 101.
S3: patterned process is carried out to the recessed portion 103, forms grid 105.It is specially the light of target pattern by shape
Cover is placed on 103 top of recessed portion, and is exposed, develops so that the photoresist layer on recessed portion 103 forms patterned photoresist
Layer is further etched will etch away without photoresist layer protection zone and then form grid 105.
Specifically, patterned grid 105 includes first part 105a and second part 105b, first part 105a packet
The strip structure of a plurality of parallelly distribute in a first direction is included, second part 105b includes a plurality of parallel point in a second direction
The strip structure of cloth.It is limited by first part 105a and second part 105a and forms multiple be not attached to each other and in array row
The open region 107 of column.Specifically, which is the mesh of grid 105.In the present embodiment, the width of first part 105a
Degree is of same size with second part 105b's, while the thickness of the thickness of first part 105a and second part 105b
It is identical.
Then, it throws the net on the grid 105 and is laid with accurate mask plate 108, in the present embodiment, accurate mask plate 108 includes
Multiple strip structure 108a, multiple strip structure 108a are parallel to first part 105a and are arranged and cover the open region 107.
Mask plate provided in an embodiment of the present invention and preparation method thereof forms recess by etching on an entire thin plate
Portion 103, recessed portion 103 is an integral molding structure with the framework 101 being arranged around recessed portion 103, and is carried out on recessed portion 103
Patterned process forms grid 105, is laid with accurate mask plate 108 on grid 105 finally with the open region of grid coverage 105
107, it is more docile on substrate since the first part 105a and second part 105b of grid 105 are an integral structure, thus
Avoid the shielding portion for because shielding portion and support bar are individually formed on metal frame, leading to mask plate in the prior art and support bar
Overlapping region is stretched in the case where the magnetic force of magnet plate attracts and leading to the problem of creeping phenomenon causes open region to have subtle flow.This reality
The grid 101 for applying the mask plate 100 of example more docile can be reduced the production cost on substrate relative to existing mask plate,
The PPA stability for improving mask plate, solve as the bonding state of substrate and mask plate it is bad caused by colour mixture, variegation etc.
Show bad problem.
[second embodiment]
The main distinction of second embodiment of the invention and above-mentioned first embodiment is: the precision mask plate 108 it is multiple
Area of the pattern on strip structure 108a is formed by multiple regularly arranged circular holes, and the area of the pattern of strip structure 108a is opened with this
Mouth region 107 is corresponding, and evaporation material is attached to substrate by the circular vapor deposition hole to form target pattern.It should in the present embodiment
Strip structure 108a is parallel to the second part 105b setting of the grid 105.
About the other structures of the present embodiment, above-mentioned first embodiment may refer to, details are not described herein.
Specific case is applied herein to be expounded mask plate of the invention and preparation method thereof and embodiment, it is above
The explanation of embodiment is merely used to help understand method and its core concept of the invention；Meanwhile for the general of this field
Technical staff, according to the thought of the present invention, there will be changes on specific embodiment and its application range, to sum up, this theory
Bright book content should not be construed as limiting the invention, and protection scope of the present invention should be subject to the attached claims.
Claims (8)
1. a kind of mask plate (100), which is characterized in that including integrally formed framework (101), which is additionally provided with one
Recessed portion (103), the recessed portion (103) is interior to be formed with patterned grid (105)；The grid (105) includes first part
(105a) and second part (105b), which includes the strip knot of a plurality of parallelly distribute in a first direction
Structure, the second part (105b) include the strip structure of a plurality of parallelly distribute in a second direction, the first part (105a) with
The interlaced formation grid (105) of the second part (105b), the first direction and the second direction are perpendicular；This first
(105a) is divided to be an integral structure with the second part (105b).
2. mask plate (100) as described in claim 1, which is characterized in that by the first part (105a) and the second part
(105b) restriction forms multiple be not attached to each other and the open region of array arrangement (107).
3. mask plate (100) as described in claim 1, which is characterized in that the width of the first part (105a) and this second
Partially (105b's) is of same size, and the thickness of the first part (105a) is identical as the thickness of the second part (105b).
4. mask plate (100) as claimed in claim 3, which is characterized in that the mask plate (100) further includes being set to the grid
(105) the accurate mask plate (108) on, the precision mask plate (108) include multiple strip structures for being spaced apart from each other distribution
(108a) is provided with area of the pattern on the strip structure (108a).
5. mask plate (100) as claimed in claim 4, which is characterized in that multiple strip structures (108a) be parallel to this
A part of (105a) is arranged and covers open region (107)；Or, multiple strip structures (108a) are parallel to the second part
(105b) is arranged and covers open region (107).
6. a kind of mask plate (100) production method, which is characterized in that the production method includes:
One thin plate (10) are provided；
It is coated with photoresist on the thin plate (10), development is exposed to the photoresist, is formed a recessed portion (103), and
On recessed portion (103) periphery there is photoresist protection zone to be integrally formed a framework (101)；
Patterned process is carried out to the recessed portion (103), is formed grid (105)；The grid (105) includes first part (105a)
With second part (105b), which includes the strip structure of a plurality of parallelly distribute in a first direction, this
Two parts (105b) include the strip structure of a plurality of parallelly distribute in a second direction, and the first direction and the second direction are mutual
Vertically, it is limited by the first part (105a) and the second part (105b) and forms multiple be not attached to each other and in array arrangement
Open region (107)；The first part (105a) is an integral structure with the second part (105b).
7. mask plate (100) production method as claimed in claim 6, which is characterized in that the width of the first part (105a)
With of same size, the thickness phase of the thickness of the first part (105a) and the second part (105b) of the second part (105b)
Together.
8. mask plate (100) production method as claimed in claim 6, which is characterized in that throw the net on the grid (105)
It is laid with accurate mask plate (108), so that the strip structure (108a) of the precision mask plate (108) is parallel to the first part
(105a) is arranged and covers the open region (107)；Or multiple strip structures (108a) are parallel to the second part (105b) and set
It sets and covers the open region (107)；The area of the pattern of the strip structure (108a) is corresponding with open region (107).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810053569.2A CN108193168B (en) | 2018-01-19 | 2018-01-19 | Mask plate and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810053569.2A CN108193168B (en) | 2018-01-19 | 2018-01-19 | Mask plate and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108193168A CN108193168A (en) | 2018-06-22 |
| CN108193168B true CN108193168B (en) | 2019-11-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810053569.2A Active CN108193168B (en) | 2018-01-19 | 2018-01-19 | Mask plate and preparation method thereof |
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| Country | Link |
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| CN (1) | CN108193168B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109023235B (en) * | 2018-08-13 | 2021-01-26 | 京东方科技集团股份有限公司 | Mask substrate, mask assembly, display panel and display device |
| CN110857461A (en) * | 2018-08-22 | 2020-03-03 | 鋆洤科技股份有限公司 | Method for manufacturing fine metal mask and manufacturing system thereof |
| CN109735802A (en) * | 2019-03-11 | 2019-05-10 | 南京高光半导体材料有限公司 | A kind of support metal mask version and mask plate component and photomask manufacturing method |
| CN109913805B (en) * | 2019-03-27 | 2021-01-26 | 京东方科技集团股份有限公司 | Mask plate |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5262226B2 (en) * | 2007-08-24 | 2013-08-14 | 大日本印刷株式会社 | Vapor deposition mask and method of manufacturing vapor deposition mask |
| JP2014194062A (en) * | 2013-03-29 | 2014-10-09 | Sony Corp | Mask frame unit, mask apparatus, and processing method |
| CN104532183B (en) * | 2015-01-26 | 2017-09-26 | 深圳市华星光电技术有限公司 | The preparation method of high-precision mask plate |
| CN205845955U (en) * | 2016-06-07 | 2016-12-28 | 鄂尔多斯市源盛光电有限责任公司 | A kind of mask plate, oled display substrate and display device |
| CN106480404B (en) * | 2016-12-28 | 2019-05-03 | 京东方科技集团股份有限公司 | A kind of exposure mask integrated framework and evaporation coating device |
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| CN108193168A (en) | 2018-06-22 |
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