CN107644831B - Electrostatic clamp - Google Patents
Electrostatic clamp Download PDFInfo
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- CN107644831B CN107644831B CN201710595406.2A CN201710595406A CN107644831B CN 107644831 B CN107644831 B CN 107644831B CN 201710595406 A CN201710595406 A CN 201710595406A CN 107644831 B CN107644831 B CN 107644831B
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- electrostatic chuck
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
Abstract
The invention discloses an electrostatic clamp. An electrostatic chuck according to an embodiment of the present invention includes a support portion, a first insulating plate, a first electrode, a second electrode, and a second insulating plate. The first insulating plate is located on the support portion and has a plurality of first through holes. The first electrode and the second electrode are arranged on the first insulating plate, extend in the first direction, and are arranged in parallel to each other. The second insulating plate is disposed on the first insulating plate to cover the first electrode and the second electrode, and has a plurality of second through holes overlapping the plurality of first through holes. The plurality of first through holes include a plurality of first column through holes and a plurality of second column through holes. The first electrode includes a plurality of first electrode through holes, each of the plurality of first electrode through holes overlapping each of the plurality of first column through holes. The second electrode includes a plurality of second electrode through holes, each of the plurality of second electrode through holes overlapping each of the plurality of second column through holes.
Description
Technical Field
The present invention relates to an electrostatic chuck.
Background
In addition to the manufacture of various semiconductor chips such as processors, memories, and the like, the manufacture of Display devices or panels for Flat Panel displays (Flat Panel displays) such as Liquid Crystal displays (Liquid Crystal displays), plasma displays (Plasma displays), organic Light Emitting displays (Organic Light Emitting Diode displays) and the like, which have been widely spread in recent years, is also performed in various process apparatuses or chambers (chambers).
In order to manufacture such a semiconductor chip or a display device, manufacturing processes of photolithography (photolithography), etching, diffusion, ion implantation, metal deposition, chemical vapor deposition, and bonding of upper and lower glass substrates are generally repeatedly performed on a surface of a semiconductor wafer or a glass substrate, and the respective substrates are carried on a carrier and moved between respective process apparatuses. The substrate under process is transferred to a desired working position in the process according to the commands of a transfer robot or a worker provided on each process equipment.
In order to fix the substrate transferred to the working position of the corresponding process equipment or attach a cover of a window or the like to the completed display panel, a mechanical means using vacuum pressure, an electrical means using electrical characteristics, and the like are used, and one example of the electrical means is an electrostatic Chuck (Electro-Static Chuck).
Electrostatic clamps (Electro-Static Chuck) can be broadly classified into Unipolar (Unipolar) and Bipolar (Bipolar) types. In particular, a Bipolar Electro-Static Chuck (Bipolar Electro-Static Chuck) has two electrodes insulated from each other by an insulator, and clamping (chucking) is achieved by supplying an anode voltage or a cathode voltage to each electrode.
However, before attaching the window to the display panel using the bipolar electrostatic chuck, the protective film attached on the display panel needs to be removed, and at this time, a case where the display panel moves during the peeling of the protective film occurs because the display panel is not firmly fixed on the electrostatic chuck.
Disclosure of Invention
In view of the above-described technical background, the present invention is directed to an electrostatic chuck capable of firmly fixing an object fixed to the electrostatic chuck.
An electrostatic chuck according to an embodiment of the present invention includes a support portion, a first insulating plate, a first electrode, a second electrode, and a second insulating plate. The first insulating plate is located on the support portion and has a plurality of first through holes. The first electrode and the second electrode are arranged on the first insulating plate, and extend in the first direction and are arranged parallel to each other. The second insulating plate is disposed on the first insulating plate to cover the first electrode and the second electrode, and has a plurality of second through holes overlapping the plurality of first through holes. The plurality of first through holes include a plurality of first column through holes and a plurality of second column through holes. The plurality of first row through holes are arranged along a first row parallel to the first direction. The plurality of second columns of through-holes are arranged in parallel with the first columns of through-holes and are arranged along second columns parallel with the first direction. The first electrode includes a plurality of first electrode through holes, each of which overlaps with each of the plurality of first column through holes. The second electrode includes a plurality of second electrode through holes, each of which overlaps with each of the plurality of second column through holes.
The first electrode and the second electrode may be arranged in plurality along a second direction intersecting the first direction. The first electrodes and the second electrodes may be alternately arranged along the second direction.
A pair of first electrodes adjacent to each other among the plurality of first electrodes may be connected to each other, and a pair of second electrodes adjacent to each other among the plurality of second electrodes may be connected to each other. Each of the first electrode and the second electrode may have a shape bent at least twice.
The support portion may include a body and a plurality of third through holes, wherein the body has a space formed therein, the plurality of third through holes are disposed on an upper surface of the body and connected to the space, and the plurality of third through holes overlap the plurality of first through holes. The plurality of first through holes, the plurality of second through holes, the plurality of third through holes, the plurality of first electrode through holes, and the plurality of second electrode through holes may communicate with each other.
The support portion may include a connection port located at one side of the body and connected with the space. The electrostatic chuck may further comprise a vacuum pump connected to the connection port.
The electrostatic chuck may further include a connection plate located between the support portion and the first insulating plate and having a plurality of fourth through-holes overlapping the plurality of first through-holes. The plurality of fourth column through holes may include a plurality of third column through holes each overlapping with each of the plurality of first column through holes and a plurality of fourth column through holes each overlapping with each of the plurality of second column through holes.
The support portion may include a first groove extending in the first direction and communicating with the plurality of third-row through-holes, and a second groove parallel to the first groove and communicating with the plurality of fourth-row through-holes. The first electrode and the second electrode may have different polarities from each other.
The first insulating plate may include a through hole region adjacent to at least one corner of the first insulating plate and in which only the first through hole is positioned. Each of the plurality of first electrode through holes and each of the plurality of second electrode through holes may have a diameter larger than a diameter of each of the plurality of first through holes.
An electrostatic chuck according to an embodiment of the present invention includes a support portion, a first insulating plate, a first electrode, a second electrode, and a second insulating plate. The first insulating plate is located on the support portion and has a plurality of first through holes. The first electrode and the second electrode are located on the first insulating plate, and extend in the first direction such that both side ends are arranged adjacent to an edge position of the first insulating plate. The second insulating plate is disposed on the first insulating plate to cover the first electrode and the second electrode, and has a plurality of second through holes overlapping the plurality of first through holes. The plurality of first through holes include a plurality of first column through holes and a plurality of second column through holes. The plurality of first row through holes are arranged along a first row parallel to the first direction. The plurality of second column through holes are arranged in parallel with the plurality of first column through holes and are aligned along a second column parallel to the first direction. The first electrode and the second electrode are arranged in parallel with the first row of through holes and the second row of through holes.
A first electrode or a second electrode may be disposed between the first column of through holes and the second column of through holes. The first electrodes and the second electrodes may be alternately arranged along a second direction crossing the first direction.
A first electrode and a second electrode may be disposed between the first column of through-holes and the second column of through-holes. The first electrode and the second electrode may be arranged in plurality along a second direction intersecting the first direction.
A pair of the first electrodes adjacent to each other among the plurality of first electrodes may be connected to each other, and a pair of the second electrodes adjacent to each other among the plurality of second electrodes may be connected to each other.
An electrostatic chuck according to an embodiment of the present invention includes a support portion, a first insulating plate, a first electrode, a second electrode, and a second insulating plate. The first insulating plate is located on the support portion and has a plurality of first through holes. The first electrode and the second electrode are arranged on the first insulating plate and arranged to extend in the first direction. The second insulating plate is disposed on the first insulating plate to cover the first electrode and the second electrode, and has a plurality of second through holes overlapping the plurality of first through holes. The plurality of first through holes comprise a plurality of first column through holes and a plurality of second column through holes. The plurality of first row through holes are arranged along a first row parallel to the first direction. The plurality of second column through holes are arranged in parallel with the plurality of first column through holes and are aligned along a second column parallel to the first direction. The first electrode passes through a pair of adjacent first row through holes in the plurality of first row through holes.
The second electrode may be arranged in parallel with the first electrode. The first electrode and the second electrode may continuously pass between the pair of first column through holes and between an adjacent pair of second column through holes of the plurality of second through holes. The second electrode may pass between an adjacent pair of the second row of through-holes among the plurality of second row of through-holes.
According to the electrostatic chuck as described above, the object fixed to the electrostatic chuck in operation can be firmly fixed without moving.
Drawings
Fig. 1 is a schematic exploded perspective view of an electrostatic chuck according to a first embodiment of the present invention.
Fig. 2 is a plan view illustrating a first insulating plate, a first electrode, and a second electrode of an electrostatic chuck according to a first embodiment of the present invention.
Fig. 3 isbase:Sub>A sectional view taken alongbase:Sub>A-base:Sub>A' of fig. 2.
Fig. 4 to 7 are modified examples of the first electrode and the second electrode in the first embodiment.
Fig. 8 is a sectional view showing a structure in which a third electrode is disposed on a second insulating plate.
Fig. 9 is a view for explaining a process of peeling a film from a device by the electrostatic chuck of the present embodiment.
Fig. 10 is a plan view schematically showing an electrostatic chuck according to a second embodiment of the present invention.
Fig. 11 is a sectional view taken along B-B' of fig. 10.
Fig. 12 is a view showing a state in which first and second electrodes are arranged on the first insulating plate of fig. 10.
Fig. 13 to 24 are modified examples of the first electrode and the second electrode according to the second embodiment.
Fig. 25 is a schematic exploded perspective view of an electrostatic chuck according to a third embodiment of the present invention.
Fig. 26 is a sectional view of an electrostatic chuck according to a third embodiment of the present invention.
Fig. 27 is a schematic perspective view of the support portion of the third embodiment.
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art to which the present invention pertains can easily carry out the present invention. The present invention may be embodied in various forms and is not limited to the embodiments described herein. In the drawings, in order to clearly explain the present invention, portions that are not related to the description are omitted, and the same reference numerals are given to the same or similar constituent elements throughout the specification.
Further, in the drawings, the size and thickness of each structure are arbitrarily shown for convenience of explanation, and thus the present invention is not necessarily limited to those shown in the drawings.
In the drawings, the thickness is shown exaggerated to clearly indicate the respective layers and regions. In addition, in the drawings, the thickness of portions of layers and regions is exaggerated for convenience of explanation. When a layer, film, region, plate, or the like is referred to as being "on" or "over" other portions, it includes not only the case of being "directly on" the other portions, but also the case where another portion exists therebetween.
Further, throughout the specification, when some portion is referred to as "including" some constituent elements, it means that other constituent elements may be included, not excluding other constituent elements, unless there is explicit contrary description. In the entire specification, the phrase "on … …" means that the target portion is located above or below, and does not mean that the target portion must be located above with reference to the direction of gravity.
Next, an electrostatic chuck according to a first embodiment of the present invention will be described with reference to fig. 1 to 4.
Fig. 1 isbase:Sub>A schematic exploded perspective view of an electrostatic chuck according tobase:Sub>A first embodiment of the present invention, fig. 2 isbase:Sub>A plan view illustratingbase:Sub>A first insulating plate,base:Sub>A first electrode, andbase:Sub>A second electrode of the electrostatic chuck according to the first embodiment of the present invention, and fig. 3 isbase:Sub>A sectional view taken alongbase:Sub>A-base:Sub>A' of fig. 2.
Referring to fig. 1 to 3, the electrostatic chuck 10 of the present embodiment may include a support 100, a first insulating plate 300, a second insulating plate 700, a first electrode 510, and a second electrode 530. The electrostatic Chuck 10 of the present embodiment is a Bipolar Electro-Static Chuck (Bipolar Electro-Static Chuck) that generates an electrostatic force by using two electrodes, and generates a vacuum suction force by a plurality of through holes between the electrodes. The substrate or the display panel placed on the electrostatic chuck may be firmly adsorbed and fixed by generating an electrostatic force and a vacuum suction force by the two electrodes and the plurality of through holes.
The support portion 100 may be located at the lowermost portion of the electrostatic chuck 10 and support the first insulating plate 300, the second insulating plate 700, the first electrode 510, and the second electrode 530, etc. In this case, the support part 100 may include a body 130, a space 150, a plurality of third through holes 110, and connection ports 170.
The body 130, as a structure configured in a substantially hexahedral shape, may be composed of a relatively hard material to firmly support the first insulating plate 300, the second insulating plate 700, the first electrode 510, and the second electrode 530, etc. located on the body 130. For example, the body 130 may be one selected from the group consisting of Stainless Steel (SUS), invar (Invar), nickel, cobalt, aluminum, titanium, their alloys, acrylic, and wood.
The body 130 may have a space 150 formed therein. The space 150 may communicate with a plurality of third through holes 110 formed above the body 130. Further, a connection port 170 may be formed at one side of the body 130 such that the connection port 170, the space 150, and the plurality of third through holes 110 communicate with each other. Thereby, the vacuum suction force generated by the vacuum pump (not shown) coupled to the connection port 170 may be sequentially transmitted through the connection port 170, the space 150, and the plurality of third through holes 110.
In addition, a plurality of third through holes 110 may be formed above the body 130. A plurality of third through holes 110 may be formed to penetrate the upper surface of the body 130.
Each of the plurality of third through holes 110 may have a circular sectional shape. However, the cross-sectional shape of the third through-holes 110 may be a variety of polygonal shapes such as a triangle, a quadrangle, and a pentagon.
At this time, the plurality of third through holes 110 may be arranged in a plurality of rows parallel to the first direction (Y-axis direction in the drawing). Each of the plurality of columns may be arranged to be spaced apart from each other in a second direction (X-axis direction in the drawing) intersecting the first direction. In the following drawings, an X-axis representing coordinates indicates a second direction, a Y-axis indicates a first direction, and a Z-axis indicates a third direction.
In the present embodiment, the plurality of third through holes 110 may be formed in a pattern corresponding to a plurality of first through holes 310 of the first insulating plate 300, which will be described later. Here, the pattern (pattern) represents a pattern or texture in which the plurality of first through holes 310 and the plurality of third through holes 110 are arranged.
Each of the plurality of third through holes 110 and each of the plurality of first through holes 310 may be arranged to overlap each other in a direction parallel to the Z axis. Thereby, each of the plurality of first through holes 310 of the first insulating plate 300 and each of the plurality of third through holes 110 of the body 130 may communicate with each other. Accordingly, the vacuum suction force generated by the vacuum pump (not shown) may be transmitted to the plurality of first through holes 310 via the plurality of third through holes 110.
A vacuum pump (not shown) may be coupled to the connection port 170 of the body 130 to suck gas inside the space 150. Thereby, the vacuum pump (not shown) may increase the degree of vacuum inside the space 150 of the body 130.
In the present embodiment, the first insulating plate 300 may be disposed on the support portion 100. The first insulating plate 300 may electrically insulate the first and second electrodes 510 and 530 disposed on the first insulating plate 300 and the supporting part 100 from each other.
The first insulating plate 300 may be configured as a flat plate of a quadrangular shape. The first insulating plate 300 may be made of an insulating material, and for example, may include any one selected from the group consisting of Polyimide (PI), polyether sulfone (PES), polyether sulfone (PAR), polyether imide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallylate (polycarbonate), polycarbonate (PC), cellulose triacetate (cellulose triacetate), cellulose Acetate Propionate (CAP), polyether sulfone (aryl ether sulfone), and a combination thereof.
The first insulating plate 300 may have a plurality of first through holes 310 formed therein. As described above, the plurality of first through holes 310 may be formed in a pattern corresponding to the plurality of third through holes 110 of the support part 100.
The plurality of first through holes 310 may be arranged in a plurality of columns parallel to the Y-axis. Each of the plurality of columns may be arranged to be spaced apart from each other on the X-axis.
More specifically, as shown in fig. 2 and 3, the plurality of first through holes 310 may include a plurality of first column through holes 311 and a plurality of second column through holes 313. The plurality of first column through holes 311 may be arranged along the first column A1 parallel to the Y axis. In addition, a plurality of second column through holes 313 may be arranged along the second column A2. Here, the second column A2 may be parallel to the first column A1, and may be disposed to be spaced apart from the first column A1 on the X-axis.
The plurality of first column through holes 311 may be arranged to be spaced apart from each other at intervals along the Y axis. That is, the intervals between a pair of first column through-holes 311 adjacent to each other in the Y-axis direction among the plurality of first column through-holes 311 may be the same as each other. Similarly to the plurality of first column penetration holes 311, the plurality of second column penetration holes 313 may also be arranged to be spaced apart from each other at intervals along the Y axis. Intervals between a pair of second-row through holes 313 adjacent to each other in the Y-axis direction among the plurality of second-row through holes 313 may be the same as each other.
The plurality of first column through holes 311 and the plurality of second column through holes 313 may be arranged to be spaced apart by a predetermined distance on the X axis. In the present embodiment, the plurality of first row through holes 311 and the plurality of second row through holes 313 may be arranged in the order of the first row through holes 311, the second row through holes 313, the first row through holes 311, and the second row through holes 313 along the X axis.
Each of the plurality of first column through holes 311 and the plurality of second column through holes 313 may have a circular sectional shape. However, the cross-sectional shapes of the plurality of first row through holes 311 and the plurality of second row through holes 313 may be various polygonal shapes such as a triangle, a quadrangle, and a pentagon.
In the present embodiment, the first electrode 510 and the second electrode 530 may be disposed on the first insulating plate 300. The first electrode 510 and the second electrode 530 may have different polarities from each other, for example, the first electrode 510 may have (+) polarity and the second electrode 530 may have (-) polarity. Conversely, it is also possible that the first electrode 510 has (-) polarity and the second electrode 530 has (+) polarity. Such first and second electrodes 510 and 530 having different polarities from each other may generate an electrostatic force.
The first electrode 510 and the second electrode 530 may be arranged to extend along the Y-axis. At this time, the first electrode 510 and the second electrode 530 may be arranged in a linear state. In addition, the first electrode 510 and the second electrode 530 may be arranged in parallel with each other.
The first electrode 510 and the second electrode 530 may be arranged in plurality on the first insulating plate 300. At this time, each of the plurality of first electrodes 510 may be arranged on the first insulating plate 300 to be spaced apart from each other in the X-axis. In addition, each of the plurality of second electrodes 530 may also be arranged on the first insulating plate 300 to be spaced apart from each other along the X-axis.
At this time, the plurality of first electrodes 510 disposed to be spaced apart from each other on the X-axis may be electrically connected to each other. In addition, the plurality of second electrodes 530 may also be electrically connected to each other. However, the first electrode 510 and the second electrode 530 may be insulated from each other.
The first electrode 510 and the second electrode 530 may be formed by attaching a metal thin film in a linear form on the first insulating plate 300, or may be formed by patterning in a linear form after depositing a metal substance on the first insulating plate 300.
In the present embodiment, the pair of the first and second electrodes 510 and 530 may be arranged in parallel with each other, and such pair of the first and second electrodes 510 and 530 may be configured in plurality and arranged to be spaced apart from each other on the X-axis.
In addition, the first electrode 510 and the second electrode 530 are not disposed in a region adjacent to at least one corner of the first insulating plate 300. As shown in fig. 2, a through hole region H1 in which only the first through hole 310 is disposed may be formed in a region adjacent to one corner of the first insulating plate 300. Since only the plurality of first through holes 310 are arranged in the through hole region H1, the density of the first through holes 310 in the through hole region H1 is higher than that in other positions of the first insulating plate 300. Here, the density represents the number of the first through holes 310 arranged per unit area.
In addition, the support portion 100 and the second insulating plate 700 may be formed with regions in which only the plurality of third through holes 110 and the plurality of second through holes 710 are arranged, respectively, corresponding to the through hole region H1 of the first insulating plate 300.
As described above, only the plurality of first through holes 310, the plurality of second through holes 710, and the plurality of third through holes 110 are arranged in the through hole region H1, and the first electrode 510 and the second electrode 530 are not arranged. Therefore, when the target object (P1, see fig. 9) is fixed to the electrostatic chuck 10, the target object (P1, see fig. 9) can be fixed only by the vacuum suction force.
In the electrostatic chuck 10 of the present embodiment, a plurality of first electrode through holes 513 may be formed in the first electrode 510, and a plurality of second electrode through holes 533 may be formed in the second electrode 530. The first electrode 510 may have a plurality of first electrode through holes 513 penetrating the first electrode 510 formed therein, and the second electrode 530 may have a plurality of second electrode through holes 533 penetrating the second electrode 530 formed therein.
At this time, each of the plurality of first electrode through holes 513 and each of the plurality of first column through holes 311 formed in the first electrode 510 may be arranged to overlap each other in a direction parallel to the Z axis. Thereby, each of the plurality of first column through holes 311 and each of the plurality of first electrode through holes 513 of the first insulating plate 300 may communicate with each other.
In addition, the second electrode 530 may be adjacent to the first electrode 510 and extend parallel to the first electrode 510 along the Y-axis. At this time, each of the plurality of second electrode through holes 533 formed in the second electrode 530 and each of the plurality of second column through holes 313 may be arranged to overlap each other in a direction parallel to the Z axis. Thereby, each of the plurality of second column through holes 313 of the first insulating plate 300 and each of the plurality of second electrode through holes 533 can communicate with each other.
Accordingly, the vacuum suction force generated by the vacuum pump (not shown) may be transmitted in the order of the connection port 170, the space 150, and the plurality of third through-holes 110, the first through-hole 310, the first electrode through-hole 513/the second electrode through-hole 533.
At this time, the diameters of the first electrode through hole 513 and the second electrode through hole 533 may be formed to be larger than the diameter of the first through hole 310.
According to the present embodiment, the first electrode through hole 513 and the first column through hole 311 may be arranged to overlap each other, and the second electrode through hole 533 and the second column through hole 313 may be arranged to overlap each other, and thus many through holes can be arranged within a certain area. In addition, a plurality of electrodes can be arranged in a certain area. Therefore, as the number of through-holes and electrodes arranged in a certain area increases, the electrostatic force and the vacuum suction force can be enhanced.
Referring to fig. 4 to 7, various modifications of the first electrode 510, the second electrode 530, and the plurality of first through holes 310 are shown.
Referring to fig. 4, one pair of the first and second electrodes 510 and 530 extending along the Y-axis may be connected to each other with another pair of the first and second electrodes 510 and 530 adjacent thereto. That is, a pair of first electrodes 510 adjacent to each other among the plurality of first electrodes 510 may be connected to each other, and a pair of second electrodes 530 adjacent to each other among the plurality of second electrodes 530 may be connected to each other.
Specifically, the pair of first and second electrodes 510 and 530 may extend and be bent along the Y-axis and then extend in opposite directions along the Y-axis. A pair of the first electrode 510 and the second electrode 530 may repeat this form and be disposed on the first insulating plate 300. That is, the pair of the first electrode 510 and the second electrode 530 shown in fig. 4 may be in a form in which one first electrode 510 and one second electrode 530 are extended.
Referring to fig. 5, each of the first electrodes 510 may be configured in a shape that first extends in a direction of approximately 9 dots, then extends in a direction of approximately 12 dots, and then extends in a direction of approximately 3 dots, and then extends in a direction of 12 dots again. Referring to fig. 6, the second electrode 530 may be configured to have a shape that first extends obliquely in a direction of approximately 1 point and then extends obliquely in a direction of approximately 11 points.
As shown in fig. 7, the second electrode 530 may be configured in a shape that first extends obliquely in a direction of approximately 1 point, then extends in a direction of approximately 12 points, then extends obliquely in a direction of 11 points, and again extends in a direction of approximately 12 points.
In these modifications, the first electrode 510 and the second electrode 530 may also have the first electrode through-hole 513 and the second electrode through-hole 533 formed thereon, respectively, and the first electrode through-hole 513/the second electrode through-hole 533 may also be arranged to overlap each of the plurality of first through-holes 310. In addition, the first electrode 510 and the second electrode 530 may be symmetrically arranged with respect to each other with the Y-axis as a central axis.
Referring again to fig. 1 to 3, a second insulation plate 700 may be positioned on the first insulation plate 300. The second insulating plate 700 may cover the first electrode 510 and the second electrode 530 on the first insulating plate 300.
In the present embodiment, the target object to be fixed to the electrostatic chuck 10 may be placed on the second insulating plate 700 (P1, see fig. 9). At this time, the second insulating plate 700 may insulate the target object (P1, refer to fig. 9) and the first and second electrodes 510 and 530 from each other.
The second insulating plate 700 may be composed of an insulating substance, similarly to the first insulating plate 300. For example, any one selected from the group consisting of Polyimide (PI), polyethersulfone (PES), polyethylenesulfonate (PAR), polyetherimide (PEI), polyethylenenaphthalate (PEN), polyethyleneterephthalate (PET), polyphenylenesulfide (PPS), polyallylate (polyallylate), polycarbonate (PC), cellulose triacetate (cellulose triacetate), cellulose Acetate Propionate (CAP), polyarylethersulfone (aryl ether sulfone), and combinations thereof may be included.
At this time, the second insulating plate 700 may be configured as a flat plate of a quadrangular shape to completely cover the first and second electrodes 510 and 530 disposed on the first insulating plate 300.
In addition, a plurality of second through holes 710 may be formed in the second insulating plate 700. The plurality of second through holes 710 may be formed through the second insulating plate 700, and may be formed in a pattern corresponding to the plurality of first through holes 310 of the first insulating plate 300.
Each of the plurality of second through holes 710, each of the plurality of first through holes 310, each of the plurality of first electrode through holes 513, and each of the second electrode through holes 533 may be arranged to overlap each other in a direction parallel to the Z axis. Accordingly, the vacuum suction force generated by the vacuum pump (not shown) may be transmitted in the order of the connection port 170, the space 150, the plurality of third through-holes 110, the first through-hole 310, the plurality of first electrode through-holes 513/second electrode through-holes 533, and the second through-hole 710.
According to the present embodiment, the object (P1, see fig. 9) fixed on the electrostatic chuck 10 may be fixed not only by the electrostatic force according to the first and second electrodes 510 and 530, but also by the vacuum suction according to the first, second, and third through holes 310, 710, and 110 and the plurality of first and second electrode through holes 513 and 533.
Therefore, according to the electrostatic chuck 10 of the present embodiment, when the protective film (P2, see fig. 9) is peeled off from the target object (P1, see fig. 9) in the vacuum chamber (not shown), the target object (P1, see fig. 9) can be firmly fixed to the electrostatic chuck 10. In addition, the electrostatic chuck 10 of the present embodiment may also be used in a process of fixing a substrate (not shown) in a vacuum chamber and depositing a deposition substance onto the substrate.
In the present embodiment, the first electrode 510 and the second electrode 530 generating the electrostatic force are positioned on the first insulating plate 300. That is, the first electrode 510 and the second electrode 530 having different polarities from each other may be disposed on the same layer as each other.
However, it is not limited thereto, and the electrodes having polarities different from each other may be arranged on layers different from each other. For example, it may be arranged that the insulating plate is located between electrodes having different polarities from each other.
Referring to fig. 8, a third electrode 600 may be disposed on a second insulating plate 700 covering the first electrode 510 and the second electrode 530. Further, a third insulating plate 800 covering the third electrode 600 may be positioned on the second insulating plate 700.
Unlike the above-described structure, the first electrode 510 and the second electrode 530 may be configured to have the same polarity as each other. For example, the first and second electrodes 510 and 530 may have (+) polarity, and the third electrode 600 may have (-) polarity. Conversely, it is also possible that the third electrode 600 has (+) polarity and the first and second electrodes 510 and 530 have (-) polarity.
Hereinafter, a process of removing the protective film P2 from the target object P1 and covering the protective cover P3 thereon with the electrostatic chuck 10 of the present embodiment will be described with reference to fig. 9.
The target object P1 placed on the electrostatic chuck 10 of the present embodiment may be a light-emitting display panel. At this time, the light emitting display panel may include the remaining structure except for the protective cover P3 of the window or the like. In addition, a protective film P2 for protecting the target object P1 may be attached above the target object P1.
Referring to fig. 9 (a), the target object P1 with the protective film P2 attached thereon is positioned on the electrostatic chuck 10. At this time, an electrostatic force may be generated by applying electric power to the first and second electrodes 510 and 530. Further, at the same time, the vacuum suction force may be generated through the first through hole 310, the second through hole 710, and the third through hole 110 by operating a vacuum pump (not shown). Thereby, the target object P1 can be firmly fixed on the electrostatic chuck 10 by the electrostatic force and the vacuum suction force.
Next, as shown in (B) of fig. 9, the protective film P2 attached on the target object P1 is peeled off. At this time, since the target object P1 is fixed to the electrostatic chuck 10 by the electrostatic force and the vacuum suction force, the target object P1 can be prevented from being separated from the electrostatic chuck 10 or the target object P1 can be prevented from being positionally changed on the electrostatic chuck 10.
When the protective film P2 is completely peeled off from the target object P1, as shown in (C) of fig. 9, the protective cover P3 may be attached to the target object P1. During the attachment of the protective cover P3, the operation of the vacuum pump (not shown) may be suspended, and the target object P1 is fixed on the electrostatic chuck 10 only by electrostatic force. However, during the attachment of the protective cover P3, a vacuum pump (not shown) may also be operated, and the target object P1 is fixed by electrostatic force and vacuum suction.
Hereinafter, an electrostatic chuck according to a second embodiment of the present invention will be described with reference to fig. 10 to 12. In describing the second embodiment, detailed description of the same structure as that of the aforementioned first embodiment will be omitted.
Fig. 10 is a plan view schematically showing an electrostatic chuck according to a second embodiment of the present invention, fig. 11 is a sectional view taken along B-B' of fig. 10, and fig. 12 is a view showing a state in which first and second electrodes are arranged on the first insulating plate of fig. 10.
Unlike the foregoing first embodiment, in the electrostatic chuck 10 of the present embodiment, the plurality of first electrode through holes 513 and second electrode through holes 533 may not be formed in the first electrode 510 and the second electrode 530, and the first electrode 510 and the second electrode 530 may be disposed so as not to overlap the plurality of first through holes 310.
Referring to fig. 10 to 12, the first and second electrodes 510 and 530 may be arranged in parallel with the first and second columns of through holes 311 and 313. That is, the first electrode 510 and the second electrode 530 may be arranged to extend along the Y-axis. At this time, the first electrode 510 and the second electrode 530 may be arranged in a linear state.
In addition, the first electrode 510 and the second electrode 530 may be disposed between the first column of through vias 311 and the second column of through vias 313. More specifically, a pair of the first electrode 510 and the second electrode 530 may be disposed between the first column of through holes 311 and the second column of through holes 313. The pair of first and second electrodes 510 and 530 may be arranged in parallel with each other and may be arranged between the first and second columns of through- holes 311 and 313.
The first electrode 510 and the second electrode 530 may be arranged in plurality on the first insulating plate 300. At this time, each of the plurality of first electrodes 510 may be arranged on the first insulating plate 300 to be spaced apart from each other in the X-axis. In addition, each of the plurality of second electrodes 530 may also be arranged on the first insulating plate 300 to be spaced apart from each other in the X-axis. At this time, the first electrode 510 and the second electrode 530 may be paired and may be disposed between the first column of through holes 311 and the second column of through holes 313.
At this time, the plurality of first electrodes 510 disposed to be spaced apart from each other on the X-axis may be electrically connected to each other. In addition, the plurality of second electrodes 530 may also be electrically connected to each other. However, the first electrode 510 and the second electrode 530 may be insulated from each other.
In the present embodiment, the pairs of the first and second electrodes 510 and 530 may be aligned parallel to each other, and such pairs of the first and second electrodes 510 and 530 may be configured in plurality and arranged to be spaced apart from each other on the X-axis. In addition, a plurality of first through holes 310 may be disposed between one pair of the first and second electrodes 510 and 530 and another adjacent pair of the first and second electrodes 510 and 530. That is, a first column of through holes 311 or a second column of through holes 313 may be disposed between one pair of the first and second electrodes 510 and 530 and another adjacent pair of the first and second electrodes 510 and 530.
However, the arrangement structure of the first electrode 510, the second electrode 530, and the plurality of first through holes 310 is not limited to the structure shown in fig. 12, but may be arranged in various forms. Hereinafter, various modifications of the first electrode 510, the second electrode 530, and the plurality of first through holes 310 will be described with reference to fig. 13 to 24, and in describing the various modifications, detailed description of the same structure as the foregoing will be omitted.
Fig. 13 to 24 are modified examples of the first electrode and the second electrode according to the second embodiment.
Referring to fig. 13, a pair of first and second electrodes 510 and 530 may be disposed between the first and second columns of through holes 311 and 313. However, unlike the structure of fig. 12, one pair of the first and second electrodes 510 and 530 extending along the Y-axis may be connected to each other with another pair of the first and second electrodes 510 and 530 adjacent thereto. That is, a pair of first electrodes 510 adjacent to each other among the plurality of first electrodes 510 may be connected to each other, and a pair of second electrodes 530 adjacent to each other among the plurality of second electrodes 530 may be connected to each other.
Specifically, the pair of first and second electrodes 510 and 530 may extend and be bent along the Y-axis and then extend in opposite directions along the Y-axis. A pair of the first electrode 510 and the second electrode 530 may repeat this form and be disposed on the first insulating plate 300. That is, the pair of the first electrode 510 and the second electrode 530 shown in fig. 13 may be in a form in which one first electrode 510 and one second electrode 530 extend.
Referring to fig. 14, a first column of through-holes 311 may be disposed between a pair of first electrodes 510 and a second electrode 530. At this time, a portion of the first electrode 510 and the second electrode 530 may extend a portion along the X axis and surround each of the first column of through holes 311.
The first electrode extension 511 may extend from the first electrode 510 along the X-axis, and the second electrode extension 531 may extend from the second electrode 530 along the X-axis. At this time, the first electrode extension 511 and the second electrode extension 531 may extend in different directions from each other along the X-axis. The first electrode extension 511 and the second electrode extension 531 may be arranged to surround one first column through hole 311.
In addition, a second column of through holes 313 may be disposed between the pair of first electrodes 510 and the second electrode 530. At this time, a portion of the first electrode 510 and the second electrode 530 may extend a portion along the X axis and surround each of the second column of through holes 313.
Referring to fig. 15 to 17, a pair of first and second electrodes 510 and 530 may continuously pass between a pair of adjacent first column through holes 311. The pair of first and second electrodes 510 and 530 may extend along the Y axis and continuously pass between the adjacent pair of first column through holes 311. Thus, the pair of the first electrode 510 and the second electrode 530 may be configured in a zigzag shape.
At this time, in fig. 15 to 17, there is a difference in shape of the bent section of the first electrode 510 and the second electrode 530 passing through the pair of first row through holes 311. For example, as shown in fig. 15, the pair of the first electrode 510 and the second electrode 530 may be configured in a shape that first extends obliquely in a direction of approximately 1 point, and then extends obliquely in a direction of approximately 11 points.
As shown in fig. 16, the first electrode 510 and the second electrode 530 may be configured in a shape that first extends obliquely in the approximately 1-point direction, then extends in the approximately 12-point direction, then extends obliquely in the approximately 11-point direction, and again extends in the approximately 12-point direction.
As shown in fig. 17, the first electrode 510 and the second electrode 530 may be configured in a shape that first extends in a direction of approximately 9 points, then extends in a direction of approximately 12 points, and then extends in a direction of approximately 3 points, and then extends in a direction of 12 points again.
In addition, the pair of first electrodes 510 and the second electrodes 530 may continuously pass through the pair of adjacent second-row through holes 313. Similarly to the first column of through holes 311, a pair of the first electrode 510 and the second electrode 530 may extend along the Y axis and continuously pass between an adjacent pair of the second column of through holes 313. Thus, the pair of the first electrode 510 and the second electrode 530 may be configured in a zigzag shape.
Referring to fig. 18, a pair of the first electrode 510 and the second electrode 530 may continuously pass through between the first column of through holes 311 and between the second column of through holes 313 at the same time. In fig. 15 to 17, a pair of the first electrode 510 and the second electrode 530 is arranged to pass only between the neighboring first column of through-holes 311 or pass between the neighboring second column of through-holes 313. However, in fig. 18, the pair of the first electrode 510 and the second electrode 530 may pass through between the second column of through holes 313 after passing through between the first column of through holes 311.
Referring to fig. 19, one of the first electrode 510 and the second electrode 530 may be disposed between the first column of through holes 311 and the second column of through holes 313. For example, the first electrode 510 may be disposed between the first column of through vias 311 and the second column of through vias 313, or the second electrode 530 may be disposed between the first column of through vias 311 and the second column of through vias 313.
At this time, the first and second electrodes 510 and 530 may be alternately arranged with each other along the X-axis. For example, the first electrode 510 and the second electrode 530 may be arranged in the order of the first electrode 510, the second electrode 530, the first electrode 510, and the second electrode 530 along the X-axis.
The plurality of first electrodes 510 arranged spaced apart from each other along the X-axis may be electrically connected to each other. In addition, the plurality of second electrodes 530 may also be electrically connected to each other. However, the first electrode 510 and the second electrode 530 may be insulated from each other.
Referring to fig. 20 to 22, the first electrode 510 may continuously pass between a pair of adjacent first column through holes 311. The first electrode 510 may extend along the Y axis and continuously pass between an adjacent pair of the first column through holes 311. Thus, the first electrode 510 may be configured in a zigzag shape.
In addition, the second electrode 530 may continuously pass between the adjacent pair of second row through holes 313. The second electrode 530 may extend along the Y axis and continuously pass between an adjacent pair of second column through holes 313. Thus, the second electrode 530 may be configured in a zigzag shape. At this time, the first and second electrodes 510 and 530 may be arranged symmetrically to each other with the Y-axis as a central axis.
At this time, in fig. 20 to 22, there may be a difference in shape of a bent section of the first electrode 510 and the second electrode 530 passing between the pair of first column through holes 311 or the pair of second column through holes 313. For example, as shown in fig. 20, the first electrode 510 may be configured in a shape that first extends obliquely in a direction of approximately 1 point, and then extends obliquely in a direction of approximately 11 points.
As shown in fig. 21, the first electrode 510 may be configured in a shape that first extends obliquely in a direction of approximately 1 point, then extends in a direction of approximately 12 points, then extends obliquely in a direction of approximately 11 points, and again extends in a direction of approximately 12 points.
As shown in fig. 22, the second electrode 530 may be configured in a shape that extends first in a direction of approximately 9 dots, then extends in a direction of approximately 12 dots, then extends in a direction of approximately 3 dots, and then extends in a direction of 12 dots again.
Referring to fig. 23, the first electrodes 510 may continuously pass through between the first column of through holes 311 and between the second column of through holes 313 at the same time, and the second electrodes 530 may also continuously pass through between the first column of through holes 311 and between the second column of through holes 313 at the same time. However, unlike fig. 18, the first electrode 510 and the second electrode 530 do not continuously pass through between the first column of through holes 311 and between the second column of through holes 313 together at the same time. Only one of the first electrode 510 and the second electrode 530 may be simultaneously passed between the first column of through holes 311 and between the second column of through holes 313.
Referring to fig. 24, through-hole regions H1, H2, H3, H4 in which a plurality of first through-holes 310 can be arranged may be formed at respective corners of the first insulating plate 300. Only the plurality of first through holes 310 are disposed in the through hole regions H1, H2, H3, H4, and the first and second electrodes 510 and 530 are not disposed.
The first electrode 510 and the second electrode 530 may be disposed only within the electrode regions X1, X2, X3, X4, X5. At this time, the plurality of first through holes 310 are not formed in the electrode regions X1, X2, X3, X4, and X5.
The electrode regions X1, X2, X3, X4, X5 may be arranged on the first insulating plate 300 in any region except for the respective corners where the through-hole regions H1, H2, H3, H4 are arranged. A plurality of first through holes 310 may be disposed between the electrode regions X1, X2, X3, X4, X5.
Hereinafter, an electrostatic chuck according to a third embodiment of the present invention will be described with reference to fig. 25 to 27. In describing the third embodiment, detailed description of the same structure as that of the foregoing first and second embodiments will be omitted.
Fig. 25 is a schematic exploded perspective view of an electrostatic chuck according to a third embodiment of the present invention, fig. 26 is a cross-sectional view of the electrostatic chuck according to the third embodiment of the present invention, and fig. 27 is a schematic perspective view of a support portion of the third embodiment.
Referring to fig. 25 to 27, the electrostatic chuck 10 of the present embodiment may include a connection plate 400 between the support 100 and the first insulating plate 300. In addition, a plurality of grooves 190 may be formed in the support portion 100 instead of the plurality of third through holes 110 of the first embodiment.
The connection plate 400 may be configured as a flat plate of a quadrangular shape. A plurality of fourth through holes 410 may be formed in the connection plate 400. The plurality of fourth through holes 410 may be formed in a pattern corresponding to the plurality of first through holes 310 described above.
Referring to fig. 26, the plurality of fourth through holes 410 may include a plurality of third and fourth column through holes 411 and 413. The plurality of third column through holes 411 may be formed in a pattern corresponding to the plurality of first column through holes 311. That is, each of the plurality of third column through holes 411 and each of the plurality of first column through holes 311 may be arranged to overlap each other in a direction parallel to the Z axis. Thereby, each of the plurality of third column through holes 411 of the connection plate 400 and each of the first column through holes 311 of the first insulation plate 300 may communicate with each other.
Further, the plurality of fourth column penetration holes 413 may be formed in a pattern corresponding to the plurality of second column penetration holes 313. That is, each of the plurality of fourth column penetration holes 413 and each of the plurality of second column penetration holes 313 may be arranged to overlap each other in a direction parallel to the Z axis. Thereby, each of the plurality of fourth column through holes 413 of the connection plate 400 and each of the second column through holes 313 of the first insulation plate 300 may communicate with each other.
At this time, each of the plurality of third column penetration holes 411 and each of the plurality of fourth column penetration holes 413 may have a diameter of about 0.3mm to 1.0mm.
Referring to fig. 27, in the present embodiment, a plurality of grooves 190 may be formed above the support portion 100. The plurality of grooves 190 may include a first groove 191 and a second groove 193.
The first groove 191 may be a groove (groove) shape formed to extend along the Y axis. At this time, the first groove 191 may be formed through an etching (etching) process. For example, the upper surface of the support 100 made of nickel, cobalt, aluminum, titanium, or the like is formed by etching the upper surface into a groove shape with an etching solution (etchant).
At this time, the first grooves 191 may be formed to correspond to the plurality of third-row through holes 411 of the connection plate 400. Specifically, all of the plurality of third column through holes 411 may overlap the first groove 191 in the Z-axis direction. Thereby, one first groove 191 can communicate with all of the plurality of third row through holes 411.
At this time, the width of the first groove 191 may be formed to be larger than the diameter of each of the plurality of third-row through holes 411. Here, the width of the first groove 191 denotes a width measured in parallel with the X axis.
The second groove 193 may also have a groove (groovee) shape extending along the Y axis, similarly to the first groove 191. At this time, the second grooves 193 may be formed to correspond to the plurality of fourth row through holes 413 of the connection plate 400. Specifically, all of the plurality of fourth column through holes 413 may overlap the second groove 193 in the Z-axis direction. Thereby, one second groove 193 can communicate with all of the plurality of fourth row through holes 413.
In the present embodiment, one of the plurality of grooves 190 formed in the support portion 100 and the plurality of third row through holes 411 or the plurality of fourth row through holes 413 of the connection plate 400 may communicate with each other.
In addition, each of the first and second grooves 191 and 193 of the support 100 may be connected with a vacuum pump (not shown). A vacuum pump (not shown) may suck gas inside the first or second grooves 191 or 193, thereby increasing the vacuum degree inside the first or second grooves 191 or 193.
In the present embodiment, the supporting portion 100 is not formed with through holes corresponding to the plurality of first through holes 310, but is formed with grooves (grooves) having a size slightly larger than the through holes, so that the supporting portion 100 can be easily manufactured.
As described above, although the present invention has been described by the limited embodiments and the accompanying drawings, the present invention is not limited thereto, and those skilled in the art to which the present invention pertains can make modifications and variations of the present invention within the technical spirit of the present invention and the equivalent scope of the appended claims.
Claims (24)
1. An electrostatic chuck, comprising:
a support portion;
a first insulating plate which is located on the support portion and has a plurality of first through holes;
a first electrode and a second electrode arranged on the first insulating plate, and extending in a first direction and arranged parallel to each other; and
a second insulating plate disposed on the first insulating plate to cover the first electrode and the second electrode, and having a plurality of second through holes overlapping the plurality of first through holes,
wherein the plurality of first through holes include:
a plurality of first row through holes arranged along a first row parallel to the first direction; and
a plurality of second columns of through-holes arranged in parallel with the first columns of through-holes and arranged along second columns parallel with the first direction,
wherein the first electrode includes a plurality of first electrode through holes, each of the plurality of first electrode through holes overlapping each of the plurality of first column through holes, an
Wherein the second electrode includes a plurality of second electrode through holes, each of the plurality of second electrode through holes overlapping each of the plurality of second column through holes.
2. The electrostatic chuck of claim 1, wherein the first electrode and the second electrode are arranged in plurality along a second direction intersecting the first direction.
3. The electrostatic chuck of claim 2, wherein the first and second electrodes are alternately arranged along the second direction.
4. The electrostatic chuck of claim 2, wherein a pair of the plurality of first electrodes adjacent to each other are connected to each other, and a pair of the plurality of second electrodes adjacent to each other are connected to each other.
5. The electrostatic chuck of claim 1, wherein each of the first and second electrodes has a shape that is bent at least twice.
6. The electrostatic chuck of claim 1, wherein the support comprises:
a body having a space formed therein; and
a plurality of third through holes disposed on an upper surface of the body and connected with the space, and the plurality of third through holes overlap the plurality of first through holes.
7. The electrostatic chuck of claim 6, wherein the first, second, third, first, and second plurality of through-holes communicate with each other.
8. The electrostatic chuck of claim 6, wherein the support comprises:
a connection port located at one side of the body and connected with the space.
9. The electrostatic chuck of claim 8, further comprising:
and the vacuum pump is connected with the connecting port.
10. The electrostatic chuck of claim 1, further comprising:
a connecting plate which is positioned between the support portion and the first insulating plate and has a plurality of fourth through holes overlapping the plurality of first through holes,
wherein the plurality of fourth through holes include:
a plurality of third column through holes, each of the plurality of third column through holes overlapping with each of the plurality of first column through holes; and
a plurality of fourth column of through vias, each of the plurality of fourth column of through vias overlapping each of the plurality of second column of through vias.
11. The electrostatic chuck of claim 10, wherein the support comprises:
a first groove extending in the first direction and communicating with the plurality of third-row through holes; and
and a second groove parallel to the first groove and communicating with the plurality of fourth row through holes.
12. The electrostatic chuck of claim 1, wherein the first electrode and the second electrode have different polarities from each other.
13. The electrostatic chuck of claim 1, wherein the first insulating plate comprises:
a through hole region adjacent to at least one corner of the first insulating plate, and only the first through hole is positioned in the through hole region.
14. The electrostatic chuck of claim 1, wherein a diameter of each of the plurality of first electrode through holes and each of the plurality of second electrode through holes is greater than a diameter of each of the plurality of first through holes.
15. An electrostatic chuck comprising:
a support portion;
a first insulating plate which is located on the support portion and has a plurality of first through holes;
first and second electrodes disposed on the first insulating plate and extending in a first direction such that both side ends of the first and second electrodes are disposed adjacent to an edge position of the first insulating plate; and
a second insulating plate disposed on the first insulating plate to cover the first electrode and the second electrode, and having a plurality of second through holes overlapping the plurality of first through holes, wherein the plurality of first through holes include:
a plurality of first-row through holes arranged in a first row parallel to the first direction; and
a plurality of second columns of through-holes arranged in parallel with the plurality of first columns of through-holes and arranged along second columns parallel with the first direction,
wherein the first electrode and the second electrode are arranged in parallel with the first column of through holes and the second column of through holes.
16. The electrostatic chuck of claim 15, wherein the first electrode or the second electrode is disposed between the first column of through vias and the second column of through vias.
17. The electrostatic chuck of claim 15, wherein the first and second electrodes are alternately arranged along a second direction that intersects the first direction.
18. The electrostatic chuck of claim 15, wherein the first and second electrodes are disposed between the first and second columns of through vias.
19. The electrostatic chuck of claim 18, wherein the first electrode and the second electrode are arranged in plurality along a second direction intersecting the first direction.
20. The electrostatic chuck of claim 19, wherein a pair of the plurality of first electrodes that are adjacent to each other are connected to each other, and a pair of the plurality of second electrodes that are adjacent to each other are connected to each other.
21. An electrostatic chuck, comprising:
a support portion;
a first insulating plate which is located on the support portion and has a plurality of first through holes;
a first electrode and a second electrode arranged on the first insulating plate and arranged to extend in a first direction; and
a second insulating plate disposed on the first insulating plate to cover the first electrode and the second electrode, and having a plurality of second through holes overlapping the plurality of first through holes, wherein the plurality of first through holes include:
a plurality of first-row through holes arranged in a first row parallel to the first direction; and
a plurality of second columns of through-holes arranged in parallel with the plurality of first columns of through-holes and arranged along second columns parallel with the first direction,
wherein the first electrode passes through between a pair of adjacent first-column through holes among the plurality of first-column through holes.
22. The electrostatic chuck of claim 21, wherein the second electrode is arranged parallel to the first electrode.
23. The electrostatic chuck of claim 22, wherein the first electrode and the second electrode pass continuously between the pair of first columns of through vias and between an adjacent pair of second columns of through vias of the plurality of second through vias.
24. The electrostatic chuck of claim 21, wherein the second electrode passes between an adjacent pair of the second column of through-holes of the plurality of second column of through-holes.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2016-0092120 | 2016-07-20 | ||
| KR1020160092120A KR102590964B1 (en) | 2016-07-20 | 2016-07-20 | Electro-static chuck |
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| CN107644831A CN107644831A (en) | 2018-01-30 |
| CN107644831B true CN107644831B (en) | 2023-03-17 |
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| CN201710595406.2A Active CN107644831B (en) | 2016-07-20 | 2017-07-20 | Electrostatic clamp |
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| KR102642160B1 (en) * | 2022-07-12 | 2024-03-04 | 주식회사 이에스티 | Substrate processing apparatus for manufacturing a large size display and driving methode thereof |
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| US5847918A (en) * | 1995-09-29 | 1998-12-08 | Lam Research Corporation | Electrostatic clamping method and apparatus for dielectric workpieces in vacuum processors |
| JP2002345273A (en) * | 2001-05-18 | 2002-11-29 | Toto Ltd | Electrostatic chuck |
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| CN1908781A (en) * | 2002-03-19 | 2007-02-07 | 富士通株式会社 | Apparatus for fabricating bonded substrate |
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| KR100769188B1 (en) * | 2002-03-20 | 2007-10-23 | 엘지.필립스 엘시디 주식회사 | Stage of bonding device |
| JP2008041993A (en) * | 2006-08-08 | 2008-02-21 | Shinko Electric Ind Co Ltd | Electrostatic chuck |
| KR101403328B1 (en) * | 2007-02-16 | 2014-06-05 | 엘아이지에이디피 주식회사 | Electro-Static Chuck Having Embossing Electrode Pattern and Method for Processing Substrate Using The Same |
| EP2317546A1 (en) * | 2009-10-30 | 2011-05-04 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Method of making a support structure |
| US8455349B2 (en) * | 2010-04-28 | 2013-06-04 | Headway Technologies, Inc. | Layered chip package and method of manufacturing same |
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2016
- 2016-07-20 KR KR1020160092120A patent/KR102590964B1/en active IP Right Grant
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| US5847918A (en) * | 1995-09-29 | 1998-12-08 | Lam Research Corporation | Electrostatic clamping method and apparatus for dielectric workpieces in vacuum processors |
| JP2002345273A (en) * | 2001-05-18 | 2002-11-29 | Toto Ltd | Electrostatic chuck |
| CN1908781A (en) * | 2002-03-19 | 2007-02-07 | 富士通株式会社 | Apparatus for fabricating bonded substrate |
| JP2004172202A (en) * | 2002-11-18 | 2004-06-17 | Anelva Corp | Electrostatic chuck device |
| CN201780955U (en) * | 2010-09-17 | 2011-03-30 | 汉泰科技股份有限公司 | Electrostatic clamp |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20180010376A (en) | 2018-01-31 |
| KR102590964B1 (en) | 2023-10-18 |
| CN107644831A (en) | 2018-01-30 |
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