CN107635717B - 基于铟-锡-银的无铅焊料 - Google Patents

基于铟-锡-银的无铅焊料 Download PDF

Info

Publication number
CN107635717B
CN107635717B CN201680028036.8A CN201680028036A CN107635717B CN 107635717 B CN107635717 B CN 107635717B CN 201680028036 A CN201680028036 A CN 201680028036A CN 107635717 B CN107635717 B CN 107635717B
Authority
CN
China
Prior art keywords
alloy
weight
silver
tin
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201680028036.8A
Other languages
English (en)
Chinese (zh)
Other versions
CN107635717A (zh
Inventor
J·佩雷拉
S·C·安塔拉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anbofu Technology Co ltd
Original Assignee
Delphi Technologies Inc
Antaya Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delphi Technologies Inc, Antaya Technologies Corp filed Critical Delphi Technologies Inc
Priority to CN202310564625.XA priority Critical patent/CN116393868A/zh
Priority to CN202211008509.1A priority patent/CN115139008B/zh
Priority to CN202110190195.0A priority patent/CN112958943B/zh
Publication of CN107635717A publication Critical patent/CN107635717A/zh
Application granted granted Critical
Publication of CN107635717B publication Critical patent/CN107635717B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Joining Of Glass To Other Materials (AREA)
CN201680028036.8A 2015-05-15 2016-05-12 基于铟-锡-银的无铅焊料 Active CN107635717B (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN202310564625.XA CN116393868A (zh) 2015-05-15 2016-05-12 基于铟-锡-银的无铅焊料
CN202211008509.1A CN115139008B (zh) 2015-05-15 2016-05-12 基于铟-锡-银的无铅焊料
CN202110190195.0A CN112958943B (zh) 2015-05-15 2016-05-12 基于铟-锡-银的无铅焊料

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562161966P 2015-05-15 2015-05-15
US62/161,966 2015-05-15
US201562168054P 2015-05-29 2015-05-29
US62/168,054 2015-05-29
PCT/US2016/032076 WO2016186954A1 (en) 2015-05-15 2016-05-12 Indium-tin-silver based lead free solder

Related Child Applications (3)

Application Number Title Priority Date Filing Date
CN202211008509.1A Division CN115139008B (zh) 2015-05-15 2016-05-12 基于铟-锡-银的无铅焊料
CN202110190195.0A Division CN112958943B (zh) 2015-05-15 2016-05-12 基于铟-锡-银的无铅焊料
CN202310564625.XA Division CN116393868A (zh) 2015-05-15 2016-05-12 基于铟-锡-银的无铅焊料

Publications (2)

Publication Number Publication Date
CN107635717A CN107635717A (zh) 2018-01-26
CN107635717B true CN107635717B (zh) 2021-02-05

Family

ID=57320312

Family Applications (4)

Application Number Title Priority Date Filing Date
CN202310564625.XA Pending CN116393868A (zh) 2015-05-15 2016-05-12 基于铟-锡-银的无铅焊料
CN201680028036.8A Active CN107635717B (zh) 2015-05-15 2016-05-12 基于铟-锡-银的无铅焊料
CN202211008509.1A Active CN115139008B (zh) 2015-05-15 2016-05-12 基于铟-锡-银的无铅焊料
CN202110190195.0A Active CN112958943B (zh) 2015-05-15 2016-05-12 基于铟-锡-银的无铅焊料

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN202310564625.XA Pending CN116393868A (zh) 2015-05-15 2016-05-12 基于铟-锡-银的无铅焊料

Family Applications After (2)

Application Number Title Priority Date Filing Date
CN202211008509.1A Active CN115139008B (zh) 2015-05-15 2016-05-12 基于铟-锡-银的无铅焊料
CN202110190195.0A Active CN112958943B (zh) 2015-05-15 2016-05-12 基于铟-锡-银的无铅焊料

Country Status (7)

Country Link
US (1) US9981347B2 (enExample)
EP (1) EP3294489A4 (enExample)
JP (2) JP6826995B2 (enExample)
KR (1) KR102272298B1 (enExample)
CN (4) CN116393868A (enExample)
TW (1) TWI652354B (enExample)
WO (1) WO2016186954A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX368692B (es) * 2015-05-05 2019-10-11 Saint Gobain Cristal con elemento de conexión eléctrica y elemento conector unido a éste.
GB201515010D0 (en) * 2015-08-24 2015-10-07 Pilkington Group Ltd Electrical connector
WO2019092947A1 (ja) 2017-11-07 2019-05-16 セントラル硝子株式会社 車両窓用ガラスアッセンブリー
WO2020050120A1 (ja) * 2018-09-07 2020-03-12 セントラル硝子株式会社 車両窓用ガラスアッセンブリー
CN109648222A (zh) * 2019-01-21 2019-04-19 上海莜玮汽车零部件有限公司 一种无铅焊料合金及其应用
CN109702372A (zh) * 2019-03-06 2019-05-03 上海莜玮汽车零部件有限公司 无铅焊料合金及其应用
CN109852843A (zh) * 2019-04-02 2019-06-07 史伟华 一种铟锡银铜合金及其制备方法和应用
US11383330B2 (en) * 2020-09-21 2022-07-12 Aptiv Technologies Limited Lead-free solder composition
CN113042842A (zh) * 2021-03-24 2021-06-29 河南东微电子材料有限公司 一种钌靶材与背板焊接的方法
JP2023091943A (ja) * 2021-12-21 2023-07-03 Ａｇｃ株式会社 積層部材
US12269127B2 (en) * 2022-04-22 2025-04-08 Magna Exteriors, Inc. Vehicular window assembly process with temperature control of the solder joint that attaches an electrical connector
CN115041863B (zh) * 2022-06-22 2023-04-25 浙江亚通新材料股份有限公司 一种汽车玻璃用复合钎料及其制备方法和应用

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0680881B2 (ja) * 1984-06-29 1994-10-12 富士通株式会社 半田溶融式高密度コネクタ
US5256370B1 (en) * 1992-05-04 1996-09-03 Indium Corp America Lead-free alloy containing tin silver and indium
US5328660A (en) * 1993-06-16 1994-07-12 International Business Machines Corporation Lead-free, high temperature, tin based multi-component solder
AU6279296A (en) * 1996-06-12 1998-01-07 International Business Machines Corporation Lead-free, high tin ternary solder alloy of tin, silver, and indium
JP2000141078A (ja) * 1998-09-08 2000-05-23 Nippon Sheet Glass Co Ltd 無鉛ハンダ
US6253988B1 (en) * 1999-03-29 2001-07-03 Antaya Technologies Corporation Low temperature solder
EP1231015B1 (en) * 2001-02-09 2007-01-03 Taiho Kogyo Co., Ltd. Lead-free solder and solder joint
US20050029666A1 (en) * 2001-08-31 2005-02-10 Yasutoshi Kurihara Semiconductor device structural body and electronic device
US7111771B2 (en) 2003-03-31 2006-09-26 Intel Corporation Solders with surfactant-refined grain sizes, solder bumps made thereof, and methods of making same
US20070037004A1 (en) * 2005-08-12 2007-02-15 Antaya Technologies Corporation Multilayer solder article
US20080175748A1 (en) * 2005-08-12 2008-07-24 John Pereira Solder Composition
JP2011240352A (ja) * 2010-05-17 2011-12-01 Central Glass Co Ltd 車両用無鉛はんだ組成物
JP2011243769A (ja) 2010-05-19 2011-12-01 Tokyo Electron Ltd 基板のエッチング方法、プログラム及びコンピュータ記憶媒体
JP5610202B2 (ja) 2010-06-23 2014-10-22 ミネベア株式会社 面状照明装置
JP2012091216A (ja) * 2010-10-28 2012-05-17 Asahi Glass Co Ltd 無鉛はんだ合金、およびこれを用いたガラス物品
KR20140032973A (ko) * 2011-01-14 2014-03-17 아사히 가라스 가부시키가이샤 차량용 창유리 및 그의 제조 방법
MX356849B (es) * 2011-02-04 2018-06-15 Antaya Tech Corp Composicion de soldadura sin plomo.
EP2704873B1 (en) * 2011-05-03 2022-02-09 Pilkington Group Limited Glazing with a soldered connector
JP5861559B2 (ja) * 2012-05-10 2016-02-16 住友金属鉱山株式会社 ＰｂフリーＩｎ系はんだ合金
CN104540636B (zh) * 2012-08-24 2017-09-08 法国圣戈班玻璃厂 具有电连接元件的玻璃板
EA029913B1 (ru) * 2012-11-21 2018-05-31 Сэн-Гобэн Гласс Франс Оконное стекло с электрическим присоединительным элементом и соединительной перемычкой
CN103341699A (zh) * 2013-07-04 2013-10-09 浙江亚通焊材有限公司 一种取代锡铅钎料的Sn-In-Ag无铅钎料
JP2016165751A (ja) * 2015-03-10 2016-09-15 住友金属鉱山株式会社 ＰｂフリーＩｎ系はんだ合金
CN104690442A (zh) * 2015-03-17 2015-06-10 湖南新瑞化工有限公司 一种低熔点无铅焊料合金及其制作方法

Also Published As

Publication number Publication date
KR102272298B1 (ko) 2021-07-05
KR20180006874A (ko) 2018-01-19
WO2016186954A1 (en) 2016-11-24
US9981347B2 (en) 2018-05-29
US20170368642A1 (en) 2017-12-28
JP2018520005A (ja) 2018-07-26
TWI652354B (zh) 2019-03-01
CN116393868A (zh) 2023-07-07
CN107635717A (zh) 2018-01-26
CN115139008A (zh) 2022-10-04
JP6826995B2 (ja) 2021-02-10
JP7082641B2 (ja) 2022-06-08
CN112958943A (zh) 2021-06-15
EP3294489A4 (en) 2019-04-10
JP2020124747A (ja) 2020-08-20
CN115139008B (zh) 2023-05-23
EP3294489A1 (en) 2018-03-21
TW201807211A (zh) 2018-03-01
CN112958943B (zh) 2022-09-06

Similar Documents

Publication Publication Date Title
CN107635717B (zh) 基于铟-锡-银的无铅焊料
JP6928062B2 (ja) 無鉛はんだ組成物の製造方法
WO2000058051A1 (en) Low temperature solder
CN108672979B (zh) 一种无铅焊料合金及其应用、玻璃组件
BR112013019849B1 (pt) Composição de solda livre de chumbo, seu método de formação e conexão elétrica

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right

Effective date of registration: 20181130

Address after: Babado J San Michaele

Applicant after: Delphi Technologies, Inc.

Address before: rhode island

Applicant before: ANTAYA TECHNOLOGIES Corp.

TA01 Transfer of patent application right
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20240819

Address after: Luxembourg

Patentee after: Anbofu Technology (2) Co.,Ltd.

Country or region after: Luxembourg

Address before: Babado J San Michaele

Patentee before: Delphi Technologies, Inc.

Country or region before: Barbados

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20241120

Address after: Luxembourg

Patentee after: Anbofu Manufacturing Management Services Co.,Ltd.

Country or region after: Luxembourg

Address before: Luxembourg

Patentee before: Anbofu Technology (2) Co.,Ltd.

Country or region before: Luxembourg

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20241218

Address after: Schaffhausen, Switzerland, 5 Pedder Strasse

Patentee after: Anbofu Technology Co.,Ltd.

Country or region after: Switzerland

Address before: Luxembourg

Patentee before: Anbofu Manufacturing Management Services Co.,Ltd.

Country or region before: Luxembourg

TR01 Transfer of patent right