TWI652354B - 基於銦－錫－銀之無鉛焊料 - Google Patents

基於銦－錫－銀之無鉛焊料 Download PDF

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Publication number
TWI652354B
TWI652354B TW106115452A TW106115452A TWI652354B TW I652354 B TWI652354 B TW I652354B TW 106115452 A TW106115452 A TW 106115452A TW 106115452 A TW106115452 A TW 106115452A TW I652354 B TWI652354 B TW I652354B
Authority
TW
Taiwan
Prior art keywords
weight
alloy
silver
nickel
tin
Prior art date
Application number
TW106115452A
Other languages
English (en)
Chinese (zh)
Other versions
TW201807211A (zh
Inventor
約翰 皮萊拉
史蒂芬Ｃ 安塔雅
Original Assignee
美商安塔雅科技公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商安塔雅科技公司 filed Critical 美商安塔雅科技公司
Publication of TW201807211A publication Critical patent/TW201807211A/zh
Application granted granted Critical
Publication of TWI652354B publication Critical patent/TWI652354B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/346—Solder materials or compositions specially adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Joining Of Glass To Other Materials (AREA)
TW106115452A 2015-05-15 2017-05-10 基於銦－錫－銀之無鉛焊料 TWI652354B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201562161966P 2015-05-15 2015-05-15
US201562168054P 2015-05-29 2015-05-29
??PCT/US16/032076 2016-05-12
PCT/US2016/032076 WO2016186954A1 (en) 2015-05-15 2016-05-12 Indium-tin-silver based lead free solder

Publications (2)

Publication Number Publication Date
TW201807211A TW201807211A (zh) 2018-03-01
TWI652354B true TWI652354B (zh) 2019-03-01

Family

ID=57320312

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106115452A TWI652354B (zh) 2015-05-15 2017-05-10 基於銦－錫－銀之無鉛焊料

Country Status (7)

Country Link
US (1) US9981347B2 (enExample)
EP (1) EP3294489A4 (enExample)
JP (2) JP6826995B2 (enExample)
KR (1) KR102272298B1 (enExample)
CN (4) CN116393868B (enExample)
TW (1) TWI652354B (enExample)
WO (1) WO2016186954A1 (enExample)

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GB201515010D0 (en) * 2015-08-24 2015-10-07 Pilkington Group Ltd Electrical connector
CN114071812A (zh) 2017-11-07 2022-02-18 中央硝子株式会社 车窗用玻璃组件
CN112638575A (zh) * 2018-09-07 2021-04-09 中央硝子株式会社 车窗用玻璃组件
CN109648222A (zh) * 2019-01-21 2019-04-19 上海莜玮汽车零部件有限公司 一种无铅焊料合金及其应用
CN109702372A (zh) * 2019-03-06 2019-05-03 上海莜玮汽车零部件有限公司 无铅焊料合金及其应用
CN109852843A (zh) * 2019-04-02 2019-06-07 史伟华 一种铟锡银铜合金及其制备方法和应用
US11383330B2 (en) 2020-09-21 2022-07-12 Aptiv Technologies Limited Lead-free solder composition
CN113042842A (zh) * 2021-03-24 2021-06-29 河南东微电子材料有限公司 一种钌靶材与背板焊接的方法
JP2023091943A (ja) * 2021-12-21 2023-07-03 Ａｇｃ株式会社 積層部材
US12269127B2 (en) * 2022-04-22 2025-04-08 Magna Exteriors, Inc. Vehicular window assembly process with temperature control of the solder joint that attaches an electrical connector
CN115041863B (zh) * 2022-06-22 2023-04-25 浙江亚通新材料股份有限公司 一种汽车玻璃用复合钎料及其制备方法和应用

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Also Published As

Publication number Publication date
JP6826995B2 (ja) 2021-02-10
JP7082641B2 (ja) 2022-06-08
US20170368642A1 (en) 2017-12-28
EP3294489A1 (en) 2018-03-21
CN116393868B (zh) 2026-05-08
KR20180006874A (ko) 2018-01-19
CN115139008B (zh) 2023-05-23
WO2016186954A1 (en) 2016-11-24
CN107635717B (zh) 2021-02-05
KR102272298B1 (ko) 2021-07-05
CN112958943A (zh) 2021-06-15
JP2018520005A (ja) 2018-07-26
CN112958943B (zh) 2022-09-06
CN107635717A (zh) 2018-01-26
CN115139008A (zh) 2022-10-04
JP2020124747A (ja) 2020-08-20
TW201807211A (zh) 2018-03-01
CN116393868A (zh) 2023-07-07
EP3294489A4 (en) 2019-04-10
US9981347B2 (en) 2018-05-29

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