CN116393868B - 基于铟-锡-银的无铅焊料 - Google Patents

基于铟-锡-银的无铅焊料

Info

Publication number
CN116393868B
CN116393868B CN202310564625.XA CN202310564625A CN116393868B CN 116393868 B CN116393868 B CN 116393868B CN 202310564625 A CN202310564625 A CN 202310564625A CN 116393868 B CN116393868 B CN 116393868B
Authority
CN
China
Prior art keywords
alloy
silver
tin
nickel
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202310564625.XA
Other languages
English (en)
Chinese (zh)
Other versions
CN116393868A (zh
Inventor
J·佩雷拉
S·C·安塔拉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anbofu Technology Co ltd
Original Assignee
Anbofu Technology Co ltd
Delphi Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anbofu Technology Co ltd, Delphi Technologies Inc filed Critical Anbofu Technology Co ltd
Publication of CN116393868A publication Critical patent/CN116393868A/zh
Application granted granted Critical
Publication of CN116393868B publication Critical patent/CN116393868B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/346—Solder materials or compositions specially adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Joining Of Glass To Other Materials (AREA)
CN202310564625.XA 2015-05-15 2016-05-12 基于铟-锡-银的无铅焊料 Active CN116393868B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US201562161966P 2015-05-15 2015-05-15
US62/161,966 2015-05-15
US201562168054P 2015-05-29 2015-05-29
US62/168,054 2015-05-29
CN201680028036.8A CN107635717B (zh) 2015-05-15 2016-05-12 基于铟-锡-银的无铅焊料
PCT/US2016/032076 WO2016186954A1 (en) 2015-05-15 2016-05-12 Indium-tin-silver based lead free solder

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201680028036.8A Division CN107635717B (zh) 2015-05-15 2016-05-12 基于铟-锡-银的无铅焊料

Publications (2)

Publication Number Publication Date
CN116393868A CN116393868A (zh) 2023-07-07
CN116393868B true CN116393868B (zh) 2026-05-08

Family

ID=57320312

Family Applications (4)

Application Number Title Priority Date Filing Date
CN202310564625.XA Active CN116393868B (zh) 2015-05-15 2016-05-12 基于铟-锡-银的无铅焊料
CN201680028036.8A Active CN107635717B (zh) 2015-05-15 2016-05-12 基于铟-锡-银的无铅焊料
CN202110190195.0A Active CN112958943B (zh) 2015-05-15 2016-05-12 基于铟-锡-银的无铅焊料
CN202211008509.1A Active CN115139008B (zh) 2015-05-15 2016-05-12 基于铟-锡-银的无铅焊料

Family Applications After (3)

Application Number Title Priority Date Filing Date
CN201680028036.8A Active CN107635717B (zh) 2015-05-15 2016-05-12 基于铟-锡-银的无铅焊料
CN202110190195.0A Active CN112958943B (zh) 2015-05-15 2016-05-12 基于铟-锡-银的无铅焊料
CN202211008509.1A Active CN115139008B (zh) 2015-05-15 2016-05-12 基于铟-锡-银的无铅焊料

Country Status (7)

Country Link
US (1) US9981347B2 (enExample)
EP (1) EP3294489A4 (enExample)
JP (2) JP6826995B2 (enExample)
KR (1) KR102272298B1 (enExample)
CN (4) CN116393868B (enExample)
TW (1) TWI652354B (enExample)
WO (1) WO2016186954A1 (enExample)

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WO2016177653A1 (de) * 2015-05-05 2016-11-10 Saint-Gobain Glass France Scheibe mit elektrischem anschlusselement und daran angebrachtem verbindungselement
GB201515010D0 (en) * 2015-08-24 2015-10-07 Pilkington Group Ltd Electrical connector
CN114071812A (zh) 2017-11-07 2022-02-18 中央硝子株式会社 车窗用玻璃组件
CN112638575A (zh) * 2018-09-07 2021-04-09 中央硝子株式会社 车窗用玻璃组件
CN109648222A (zh) * 2019-01-21 2019-04-19 上海莜玮汽车零部件有限公司 一种无铅焊料合金及其应用
CN109702372A (zh) * 2019-03-06 2019-05-03 上海莜玮汽车零部件有限公司 无铅焊料合金及其应用
CN109852843A (zh) * 2019-04-02 2019-06-07 史伟华 一种铟锡银铜合金及其制备方法和应用
US11383330B2 (en) 2020-09-21 2022-07-12 Aptiv Technologies Limited Lead-free solder composition
CN113042842A (zh) * 2021-03-24 2021-06-29 河南东微电子材料有限公司 一种钌靶材与背板焊接的方法
JP2023091943A (ja) * 2021-12-21 2023-07-03 Ａｇｃ株式会社 積層部材
US12269127B2 (en) * 2022-04-22 2025-04-08 Magna Exteriors, Inc. Vehicular window assembly process with temperature control of the solder joint that attaches an electrical connector
CN115041863B (zh) * 2022-06-22 2023-04-25 浙江亚通新材料股份有限公司 一种汽车玻璃用复合钎料及其制备方法和应用

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Also Published As

Publication number Publication date
JP6826995B2 (ja) 2021-02-10
JP7082641B2 (ja) 2022-06-08
US20170368642A1 (en) 2017-12-28
EP3294489A1 (en) 2018-03-21
TWI652354B (zh) 2019-03-01
KR20180006874A (ko) 2018-01-19
CN115139008B (zh) 2023-05-23
WO2016186954A1 (en) 2016-11-24
CN107635717B (zh) 2021-02-05
KR102272298B1 (ko) 2021-07-05
CN112958943A (zh) 2021-06-15
JP2018520005A (ja) 2018-07-26
CN112958943B (zh) 2022-09-06
CN107635717A (zh) 2018-01-26
CN115139008A (zh) 2022-10-04
JP2020124747A (ja) 2020-08-20
TW201807211A (zh) 2018-03-01
CN116393868A (zh) 2023-07-07
EP3294489A4 (en) 2019-04-10
US9981347B2 (en) 2018-05-29

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