CN116393868A - 基于铟-锡-银的无铅焊料 - Google Patents

基于铟-锡-银的无铅焊料 Download PDF

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Publication number
CN116393868A
CN116393868A CN202310564625.XA CN202310564625A CN116393868A CN 116393868 A CN116393868 A CN 116393868A CN 202310564625 A CN202310564625 A CN 202310564625A CN 116393868 A CN116393868 A CN 116393868A
Authority
CN
China
Prior art keywords
alloy
silver
tin
nickel
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310564625.XA
Other languages
English (en)
Chinese (zh)
Inventor
J·佩雷拉
S·C·安塔拉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anbofu Technology Co ltd
Original Assignee
Delphi Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delphi Technologies Inc filed Critical Delphi Technologies Inc
Publication of CN116393868A publication Critical patent/CN116393868A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Joining Of Glass To Other Materials (AREA)
CN202310564625.XA 2015-05-15 2016-05-12 基于铟-锡-银的无铅焊料 Pending CN116393868A (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US201562161966P 2015-05-15 2015-05-15
US62/161,966 2015-05-15
US201562168054P 2015-05-29 2015-05-29
US62/168,054 2015-05-29
PCT/US2016/032076 WO2016186954A1 (en) 2015-05-15 2016-05-12 Indium-tin-silver based lead free solder
CN201680028036.8A CN107635717B (zh) 2015-05-15 2016-05-12 基于铟-锡-银的无铅焊料

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201680028036.8A Division CN107635717B (zh) 2015-05-15 2016-05-12 基于铟-锡-银的无铅焊料

Publications (1)

Publication Number Publication Date
CN116393868A true CN116393868A (zh) 2023-07-07

Family

ID=57320312

Family Applications (4)

Application Number Title Priority Date Filing Date
CN202310564625.XA Pending CN116393868A (zh) 2015-05-15 2016-05-12 基于铟-锡-银的无铅焊料
CN202110190195.0A Active CN112958943B (zh) 2015-05-15 2016-05-12 基于铟-锡-银的无铅焊料
CN201680028036.8A Active CN107635717B (zh) 2015-05-15 2016-05-12 基于铟-锡-银的无铅焊料
CN202211008509.1A Active CN115139008B (zh) 2015-05-15 2016-05-12 基于铟-锡-银的无铅焊料

Family Applications After (3)

Application Number Title Priority Date Filing Date
CN202110190195.0A Active CN112958943B (zh) 2015-05-15 2016-05-12 基于铟-锡-银的无铅焊料
CN201680028036.8A Active CN107635717B (zh) 2015-05-15 2016-05-12 基于铟-锡-银的无铅焊料
CN202211008509.1A Active CN115139008B (zh) 2015-05-15 2016-05-12 基于铟-锡-银的无铅焊料

Country Status (7)

Country Link
US (1) US9981347B2 (enExample)
EP (1) EP3294489A4 (enExample)
JP (2) JP6826995B2 (enExample)
KR (1) KR102272298B1 (enExample)
CN (4) CN116393868A (enExample)
TW (1) TWI652354B (enExample)
WO (1) WO2016186954A1 (enExample)

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US10700408B2 (en) * 2015-05-05 2020-06-30 Saint-Gobain Glass France Pane with electrical connection element and connecting element attached thereto
GB201515010D0 (en) * 2015-08-24 2015-10-07 Pilkington Group Ltd Electrical connector
US11121487B2 (en) 2017-11-07 2021-09-14 Central Glass Company, Limited Car window glass assembly
US20210315061A1 (en) * 2018-09-07 2021-10-07 Central Glass Company, Limited Vehicle window glass assembly
CN109648222A (zh) * 2019-01-21 2019-04-19 上海莜玮汽车零部件有限公司 一种无铅焊料合金及其应用
CN109702372A (zh) * 2019-03-06 2019-05-03 上海莜玮汽车零部件有限公司 无铅焊料合金及其应用
CN109852843A (zh) * 2019-04-02 2019-06-07 史伟华 一种铟锡银铜合金及其制备方法和应用
US11383330B2 (en) 2020-09-21 2022-07-12 Aptiv Technologies Limited Lead-free solder composition
CN113042842A (zh) * 2021-03-24 2021-06-29 河南东微电子材料有限公司 一种钌靶材与背板焊接的方法
JP2023091943A (ja) * 2021-12-21 2023-07-03 Ａｇｃ株式会社 積層部材
US12269127B2 (en) * 2022-04-22 2025-04-08 Magna Exteriors, Inc. Vehicular window assembly process with temperature control of the solder joint that attaches an electrical connector
CN115041863B (zh) * 2022-06-22 2023-04-25 浙江亚通新材料股份有限公司 一种汽车玻璃用复合钎料及其制备方法和应用

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US5256370B1 (en) 1992-05-04 1996-09-03 Indium Corp America Lead-free alloy containing tin silver and indium
US5328660A (en) * 1993-06-16 1994-07-12 International Business Machines Corporation Lead-free, high temperature, tin based multi-component solder
WO1997047426A1 (en) * 1996-06-12 1997-12-18 International Business Machines Corporation Lead-free, high tin ternary solder alloy of tin, silver, and indium
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US6253988B1 (en) * 1999-03-29 2001-07-03 Antaya Technologies Corporation Low temperature solder
US6689488B2 (en) * 2001-02-09 2004-02-10 Taiho Kogyo Co., Ltd. Lead-free solder and solder joint
JPWO2003021664A1 (ja) * 2001-08-31 2005-07-07 株式会社日立製作所 半導体装置、構造体及び電子装置
US7111771B2 (en) 2003-03-31 2006-09-26 Intel Corporation Solders with surfactant-refined grain sizes, solder bumps made thereof, and methods of making same
US20070037004A1 (en) * 2005-08-12 2007-02-15 Antaya Technologies Corporation Multilayer solder article
US20080175748A1 (en) * 2005-08-12 2008-07-24 John Pereira Solder Composition
JP2011240352A (ja) * 2010-05-17 2011-12-01 Central Glass Co Ltd 車両用無鉛はんだ組成物
JP2011243769A (ja) 2010-05-19 2011-12-01 Tokyo Electron Ltd 基板のエッチング方法、プログラム及びコンピュータ記憶媒体
JP5610202B2 (ja) 2010-06-23 2014-10-22 ミネベア株式会社 面状照明装置
JP2012091216A (ja) * 2010-10-28 2012-05-17 Asahi Glass Co Ltd 無鉛はんだ合金、およびこれを用いたガラス物品
CN103313886B (zh) * 2011-01-14 2015-12-09 旭硝子株式会社 车辆用窗玻璃及其制造方法
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Also Published As

Publication number Publication date
KR102272298B1 (ko) 2021-07-05
EP3294489A4 (en) 2019-04-10
CN115139008A (zh) 2022-10-04
CN115139008B (zh) 2023-05-23
WO2016186954A1 (en) 2016-11-24
CN107635717B (zh) 2021-02-05
EP3294489A1 (en) 2018-03-21
TW201807211A (zh) 2018-03-01
JP2018520005A (ja) 2018-07-26
JP7082641B2 (ja) 2022-06-08
US9981347B2 (en) 2018-05-29
KR20180006874A (ko) 2018-01-19
JP2020124747A (ja) 2020-08-20
JP6826995B2 (ja) 2021-02-10
US20170368642A1 (en) 2017-12-28
CN112958943B (zh) 2022-09-06
CN112958943A (zh) 2021-06-15
CN107635717A (zh) 2018-01-26
TWI652354B (zh) 2019-03-01

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PB01 Publication
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SE01 Entry into force of request for substantive examination
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TA01 Transfer of patent application right

Effective date of registration: 20240415

Address after: Jiraum, Luxembourg, Luxembourg J. 12C Kroll Street

Applicant after: Anbofu Manufacturing Management Services Co.,Ltd.

Country or region after: Luxembourg

Address before: Babado J San Michaele

Applicant before: Delphi Technologies, Inc.

Country or region before: Barbados

TA01 Transfer of patent application right
TA01 Transfer of patent application right

Effective date of registration: 20240424

Address after: 2 Pestaroz Street, Schaffhausen, Switzerland

Applicant after: Anbofu Technology Co.,Ltd.

Country or region after: Switzerland

Address before: Jiraum, Luxembourg, Luxembourg J. 12C Kroll Street

Applicant before: Anbofu Manufacturing Management Services Co.,Ltd.

Country or region before: Luxembourg

TA01 Transfer of patent application right