CN107608192A - Consumptive material, imaging device and imaging system - Google Patents
Consumptive material, imaging device and imaging system Download PDFInfo
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- CN107608192A CN107608192A CN201710852150.9A CN201710852150A CN107608192A CN 107608192 A CN107608192 A CN 107608192A CN 201710852150 A CN201710852150 A CN 201710852150A CN 107608192 A CN107608192 A CN 107608192A
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- contact
- chip
- locating dowel
- consumptive material
- matching
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Abstract
The present invention provides a kind of consumptive material, imaging device and imaging system.The consumptive material of the present invention,Applied on imaging device,The consumptive material includes chip installation portion and the chip being arranged on the chip installation portion,It is provided with the chip installation portion with the chip by chip and for matching the engaging structure inserted for the locating dowel on the imaging device,There is the first matching face and with the bearing of trend of the locating dowel vertical second parallel with the bearing of trend of the locating dowel to match face on the chip,The first contact is provided with the first matching face,The second contact is provided with the second matching face,First contact and second contact are used to match with the contact pilotage of the imaging device and connected,The first matching face and the outer surface that the second matching face is the chip,When the locating dowel matching is inserted into the engaging structure,The first matching face is adjacent with the side wall of the locating dowel.The structure of chip in the present invention is simple, and cost is relatively low.
Description
Technical field
The present invention relates to printing device field, more particularly to a kind of consumptive material, imaging device and imaging system.
Background technology
Imaging device and the demountable consumptive material for being installed to imaging device are generally included in imaging systems, in order to more preferable
Management consumptive material, chip can be provided with consumptive material.Chip can be after consumptive material be installed to imaging device between imaging device
Enter row data communication, such imaging device can manage consumptive material by obtaining the information in chip.
In order to complete the communication between chip and imaging device, after consumptive material is installed to imaging device, chip and imaging device
Between need to ensure good circuit connection.Therefore, patent of invention CN201180004581.0 discloses a kind of chip and imaging
The connected mode of equipment, a hole is provided with chip, the contact that can be electrically connected is provided with hole, is set on imaging device
There is the pillar of a projection, metal probe is provided with pillar.After consumptive material is installed to imaging device, the pillar on imaging device
It is inserted into the hole on chip, while the contact electrical connection in the probe and chip hole on pillar.
However, in said chip mounting means, chip internal must be provided with a big hole, and contact is there is provision of in hole
To contact with the pillar of imaging device, the processing technology difficulty of such chip is big, and cost is high.
The content of the invention
The present invention provides a kind of consumptive material, imaging device and imaging system, and the structure of chip is simple, and cost is relatively low.
In a first aspect, the present invention provides a kind of consumptive material, applied on imaging device, consumptive material includes chip installation portion and setting
Chip on chip installation portion, it is provided with chip installation portion with chip by chip and for for the locating dowel on imaging device
Engaging structure with insertion, there is the first matching face parallel with the bearing of trend of locating dowel and the extension with locating dowel on chip
The second vertical matching face of direction, the first contact is provided with the first matching face, the second contact is provided with the second matching face, the
One contact and the second contact are used to match with the contact pilotage of imaging device and connected, and the first matching face and the second matching face are chip
Outer surface, when locating dowel matching is inserted into engaging structure, the first matching face is adjacent with the side wall of locating dowel.
Second aspect, the present invention provide a kind of imaging system, including consumptive material as described above and imaging device, imaging are set
It is standby to include electrical connection module, include locating dowel, the first contact pilotage and the second contact pilotage of protrusion on electrical connection module, locating dowel for
With being connected on consumptive material, the first contact pilotage is located in the side wall of locating dowel, and the second contact pilotage is located at locating dowel side, the first contact pilotage and
Two contact pilotages are used to and the contact electrical connection on consumptive material.
Consumptive material, town and country device and the imaging system of the present invention, consumptive material are applied on imaging device, and consumptive material is installed including chip
Portion and the chip being arranged on chip installation portion, it is provided with chip by chip and for on imaging device on chip installation portion
The engaging structure of locating dowel matching insertion, have on chip the first matching face parallel with the bearing of trend of locating dowel and with positioning
The second vertical matching face of the bearing of trend of post, the first contact is provided with the first matching face, the is provided with the second matching face
Two contacts, the first contact and the second contact are used to match connection with the contact pilotage on imaging device, and first matches face and second
With the outer surface that face is chip, when locating dowel matching is inserted into engaging structure, the first matching face is adjacent with the side wall of locating dowel.
Providing holes or groove are not needed so on chip, it becomes possible to ensure that the contact on chip can connect with the contact pilotage on imaging device
Connect, reduce the constructive difficulty and cost of chip, enhance the stability of electrical connection.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are this hairs
Some bright embodiments, for those of ordinary skill in the art, without having to pay creative labor, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is the structural representation for the consumptive material that the embodiment of the present invention one provides；
Fig. 2 is the top view of consumptive material in Fig. 1；
Fig. 3 is the structural representation for the consumptive material chips that the embodiment of the present invention one provides；
Fig. 4 is the top view of Fig. 2 chips；
Fig. 5 is the structural representation for the consumptive material chips installation portion that the embodiment of the present invention one provides；
Fig. 6 is the structural representation for another consumptive material that the embodiment of the present invention two provides；
Fig. 7 is a kind of structural representation for imaging device that the embodiment of the present invention three provides；
Fig. 8 is a kind of structural representation for imaging system that the embodiment of the present invention four provides.
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
Part of the embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art
The every other embodiment obtained under the premise of creative work is not made, belongs to the scope of protection of the invention.
Embodiment one
Fig. 1 is the structural representation for the consumptive material that the embodiment of the present invention one provides.Fig. 2 is the top view of consumptive material in Fig. 1.Fig. 3
It is the structural representation for the consumptive material chips that the embodiment of the present invention one provides.Fig. 4 is the top view of Fig. 2 chips.Fig. 5 is this hair
The structural representation for the consumptive material chips installation portion that bright embodiment one provides.As shown in Figures 1 to 5, the consumption that the present embodiment provides
Material, applied on imaging device, consumptive material includes chip installation portion 11 and the chip 12 being arranged on chip installation portion 11, chip peace
It is provided with adjacent with chip 12 in dress portion 11 and is used to match the engaging structure 111 inserted, core for the locating dowel on imaging device
There is the first matching face 121 and with the bearing of trend of locating dowel vertical second parallel with the bearing of trend of locating dowel on piece 12
Matching face 122, the first contact 1211 is provided with the first matching face 121, the second contact is provided with the second matching face 122
1221, the first contact 1211 and the second contact 1221 are used to match connection with the contact pilotage on imaging device；First matching face 121
With the outer surface that the second matching face 122 is chip 12, when locating dowel matching is inserted into engaging structure 111, the first matching face 121
It is adjacent with the side wall of locating dowel.
Specifically, consumptive material can be the container for accommodating image forming material, such as print cartridge or colour band etc..Consumptive material generally with
Dismountable mode is set on an imaging device, so as to provide the material or medium that are available for printing for imaging device.In order to and into
As equipment realization communication and information transfer, chip 12 is provided with consumptive material, having on chip 12 can complete between imaging device 2
The electrical connection sections such as the contact of electric connection.After consumptive material is correctly attached on imaging device 2, contact on chip 12 etc. is electrically connected
Socket part can contact and turn on the corresponding position of imaging device 2, and establish reliable be electrically connected with.The relevant information of consumptive material is
Can be transmitted by the electrical connection between chip 12 and imaging device to imaging device, facilitate imaging device to consumptive material and printing or
Imaging process is managed.
Specifically, consumptive material includes chip installation portion 11 and the chip 12 being arranged on chip installation portion 11, chip installation portion
The chip holding tank 112 for accommodating the insertion of chip 12 generally can be set on 11.It is provided with chip installation portion 11 and chip
12 is adjacent, and for the engaging structure 111 for the locating dowel matching insertion on imaging device.Wherein, chip 12 and engaging structure
111 are disposed adjacent, i.e., only have less gap between adjacent arrangement or both between the two.Consumptive material is attached to imaging device
On when, chip installation portion 11 can contact with the corresponding site on imaging device and connect.It is provided with and nibbles on chip installation portion 11
Structure 111 is closed, the locating dowel on imaging device is inserted into engaging structure 111, and completes to match between engaging structure 111
Connection.Because engaging structure 111 and chip 12 are adjacent, so when locating dowel is inserted on engaging structure 111, the side wall of locating dowel
It can be located at and the adjacent position of chip 12.
Due to that when consumptive material is installed on an imaging device, because the side wall and chip 12 of locating dowel are adjacent, therefore can lead to
The positioning crossed between locating dowel and chip 12 sets electrical connection module.It is available for setting specifically, being provided with two on chip 12
The matching face of electrical connection module, it is respectively the direction first matching face 121 parallel with the bearing of trend of locating dowel, and with determining
Second that the bearing of trend of position post is vertical matches face 122.It is provided with the first contact 1211 on the first matching face 121, and second
Be provided with the second contact 1221 on matching face 122, the first contact 1211 and the second contact 1221 can with imaging device
Contact pilotage realizes electrical connection, to realize that the data between imaging device and consumptive material communicate to connect.
Wherein, the first matching face 121 and second matches the outside that face 122 is typically each located at chip 12, and the first matching face
121 and second matching face 122 respectively for different directions.The direction in the first matching face 121 and the bearing of trend of locating dowel
It is parallel, so locating dowel insert engaging structure in during, due to first matching face 121 towards locating dowel side wall, such as
The contact pilotage of imaging device is arranged in the side wall of locating dowel by fruit, then meeting between the contact pilotage on the first contact 1211 and imaging device
It is relatively easy to contact and links together.When locating dowel continue into engaging structure 111 and it is fixed complete when, imaging device with
The distance between consumptive material shortens, and the second matching face 122 of locating dowel bearing of trend vertically can be on imaging device in addition
Contact pilotage, the second contact 1221 so on the second matching face 122 will link together with the contact pilotage on imaging device.
On the surface for the different directions for being located at chip 12 due to the first contact 1211 and the second contact 1221, so, chip
Providing holes or groove are not needed on 12, it becomes possible to ensure that the contact on chip 12 can connect with the contact pilotage in imaging device locating dowel
Connect, reduce the constructive difficulty and cost of chip 12, enhance the stability of electrical connection.
Wherein, the first contact 1211 and the second contact 1221 are used to realize the electric connection between imaging device.Its
In it is common, it is earthing contact that can set the first contact 1211.
It should be noted that the first contact 1211 and the second contact 1221 can be contact either more than one
Contact, when the first contact 1211 or the second contact 1221 are the form of multiple contacts, accordingly, the correspondence on imaging device
Contact pilotage should also have identical quantity.
It should be noted that due to consumptive material generally individually storage, thus its surface should have less evagination position, with
The evagination position on consumptive material is avoided to be damaged by external force.Therefore in this application, unless otherwise instructed, think on chip
Electrical connector is contact, and the electrical connector on imaging device illustrates for the form of contact pilotage.In addition, those skilled in the art
It is appreciated that in order to adapt to different needs, it is contact pilotage that can also make the electrical connector on chip, and the electrical connection on imaging device
Part is contact, and contact is provided with its embodiment and the application chips, and the mode of contact pilotage is set on imaging device
Similar, here is omitted.
In order to ensure the normal contact between contact pilotage and the first contact 1211, locating dowel matching is inserted into engaging structure 111
When middle, the first matching face 121 is adjacent with the side wall of locating dowel.So, by set between chip 12 and engaging structure 111 away from
From, when can make it that locating dowel on imaging device is inserted in engaging structure 111, the first matching face 121 on chip 12 also with
The side wall of locating dowel is adjacent.So, the contact pilotage arranged in the side wall of locating dowel can with it is set on the first matching face 121
The first contact 1211 between abut together, and realize electric connection.
Specifically, the first matching face 121 is adjacent with the side wall of locating dowel, can be that the first matching face 121 is close to positioning
Maintain certain intervals in the side wall of post or between locating dowel and the first matching face 121, but the interval can allow first
Contacted between contact pilotage on contact 1211 and imaging device.
In addition, as an alternative embodiment, be provided with lug boss (not shown) on the first matching face 121,
First contact 1211 is located on lug boss.Due to the reasons such as assembly precision, when consumptive material is installed on an imaging device, the first matching face
121 with the distance between the side wall of locating dowel may farther out, so the lug boss of protrusion can reduce the first contact 1211 with it is fixed
The distance between position post side wall, ensure that the contact pilotage on the first contact 1211 and imaging device normally contacts.
Optionally, in order to allow locating dowel insert engaging structure when, the second contact 1221 allowed on the second matching face 122 can
With the stylus contact on imaging device, the second matching face 122 is typically toward to be set close to the side of imaging device.So imaging is set
When standby and consumptive material is close to each other, the second matching face 122 can region be directly facing imaging device, and second on the second matching face 122 touches
Point 1221 also can corresponding stylus contact, completion connection with imaging device.
In order to reduce the manufacture difficulty of chip 12, the first matching face 121 and second match in face 122 it is at least one be flat
Face.So straight surface can be relatively easy to install and arrange contact and other electrical equipments, make the first contact 1211
Can easily it be arranged on chip 12 with the second contact 1221, the manufacture difficulty of chip 12 is smaller, and cost is relatively low, and contact
Connection reliability is higher.
In addition, the first matching face 121 and second matching face 122 can also be according to corresponding portion in locating dowel and imaging device
Position shape and be arranged to the shape such as cambered surface or folding face, to ensure that the first matching face 121 or the second matching face 122 are set with imaging
There is the distance pressed close to enough, reliable connection can be formed by allowing between contact and contact pilotage between standby.
Further, for the purposes of reducing the manufacture difficulty of chip 12, contact should be exposed to the outside of chip 12, therefore,
First matching face 121 and second matches the outer surface that face 122 is generally chip 12.So be arranged on the first matching face 121 and
The first contact 1211 and the second contact 1221 on second matching face 122 are respectively positioned on the outside of chip 12, and chip is easily fabricated, cost
It is relatively low.
And in order to complete matching connection between the locating dowel of imaging device, engaging structure 111 can typically include installation
One kind in hole, mounting groove or breach.The opening of mounting hole or mounting groove direction towards imaging device, is so pacified in consumptive material
During being filled to imaging device, locating dowel can stretch into from the opening in the aperture of mounting hole or other engaging structures 111, and
Into the inside of the engaging structures such as mounting hole, installation and matching connection between the two is completed.
Possible electrically detection is carried out to chip 12 for convenience, is also needed between the first contact 1211 and the second contact 1221
There is nearer interval and the less direction of difference.At this point it is possible to the second contact 1221 is set to extend to the first matching face
121.Specifically, the second contact 1221 can close to second matching face 122 neighboring area, and from second matching face 122 side
Edge extends out.So, there is the extension of the first contact 1211 and the second contact 1221 on the first matching face 121.
When being detected to chip 12, you can carry out on the first matching face 121, now, the probe of detection can be connected to
On the prolongation of first contact 1211 and the second contact 1221, and pass through the extension of the first contact 1211 and the second contact 1221
Part is detected to the electrical specifications of chip 12, without setting different probes in Different Plane.
And on chip 12 while the first contact 1211 and the second contact 1221 are set, it is also necessary to which other first devices are set
Part and structure, for the ease of the setting of other components, the area in the first matching face 121 is typically greater than the second matching face 122,
And the electronic device on chip 12, such as circuit connected for storing consumable information memory and being used for component etc.
It may be provided on the chip outer wall parallel with the first matching face 121.
And in order to store and record the information of consumptive material, chip 12 can include information storage part (not shown), information
Storage part is used for the information for storing consumptive material itself or imaging device to use information of consumptive material etc., and information storage part is usually located at
The position in addition to the first matching face 121 and second matches face 122 on chip 12.
In the present embodiment, consumptive material is applied on imaging device, and consumptive material includes chip installation portion and is arranged on chip installation portion
On chip, be provided with chip installation portion with chip by chip and for engaging for the locating dowel matching insertion on imaging device
Structure, there is the first matching face parallel with the bearing of trend of locating dowel and vertical with the bearing of trend of locating dowel the on chip
Two match faces, are provided with the first contact on the first matching face, the second contact, the first contact and second are provided with the second matching face
Contact is used to match connection, the first matching face and the outer surface that the second matching face is chip with the contact pilotage on imaging device, fixed
When position post matching is inserted into engaging structure, the first matching face is adjacent with the side wall of institute's locating dowel.It need not be set so on chip
Put hole or groove, it becomes possible to ensure that the contact on chip can be connected with the contact pilotage on imaging device, reduce the structure of chip
Difficulty and cost, enhance the stability of electrical connection.
Embodiment two
In addition to the engaging structure of locating dowel matching connection, other be used for and imaging device can also be provided with chip
Connection, to improve the structure of connection reliability between contact and contact pilotage.Fig. 6 is another consumptive material that the embodiment of the present invention two provides
Structural representation.As shown in fig. 6, consumptive material in the present embodiment, still applied to imaging device similar with previous embodiment one
On, and consumptive material specifically includes chip installation portion 11 and the chip 12 being arranged on chip installation portion 11, on chip installation portion 11
It is provided with adjacent with chip 12 and is used for the engaging structure 111 that insertion is matched for the locating dowel on imaging device, has on chip
The first matching face 121 and with the bearing of trend of locating dowel vertical second parallel with the bearing of trend of locating dowel matches face 122,
The first contact 1211 is provided with first matching face 121, the second contact 1221, the first contact are provided with the second matching face 122
1211 and second contact 1221 be used to and the contact pilotage of imaging device matching connection, first matching face 121 and second match face 122
For the outer surface of chip 12, when locating dowel matching is inserted into engaging structure 111, the first matching face 121 and the side wall of locating dowel
It is adjacent.
Wherein, the contact pilotage of the first contact 1211 and imaging device can limit the first matching face 121 and in locating dowel side wall
Between gap in, accordingly even when the contact pilotage of imaging device occurs to loosen or sliding, due to the limitation of locating dowel and engaging structure,
Also the reliable contacts between the first contact 1211 and contact pilotage can be ensured.And extend because the second contact 1221 is located at locating dowel
Direction is vertical, and is facing generally towards on the second matching face 122 of imaging device, in order to ensure the second exposed contact 1221 and contact pilotage
Between contact, realize the matching positioning between consumptive material and imaging device, be provided with depressed part 122a on the second matching face 122,
Second contact 1221 is located in depressed part 122a.
In general, depressed part 122a can be the structures such as pit or groove, and depressed part 122a inside is less than second
With face 122, and the second contact 1221 is usually located at the bottom surface of pit or groove, so when the sky that part is stretched into depressed part 122a
Between it is middle when, if part has the trend that is moved along the second matching face 122, part will under the limitation of crater wall or cell wall quilt
Constrain in depressed part 122a and can not depart from.
So, when the contact pilotage on imaging device extends to the position with the contact of the second contact 1221, due to the second contact
1221 in depressed part 122a, thus the end of contact pilotage can also be limited in depressed part 122a area defined.So
If the situation that opposite chip slides or bends deformation occurs in contact pilotage, due to depressed part 122a limitation, contact pilotage is still not
Outside the region that depressed part 122a can be departed from, i.e., contact pilotage can be kept contacting with the second contact 1221 all the time.So improve contact
The reliability electrically connected between contact pilotage.
In the present embodiment, consumptive material is applied on imaging device, and consumptive material includes chip installation portion and is arranged on chip installation portion
On chip, be provided with chip installation portion with chip by chip and for engaging for the locating dowel matching insertion on imaging device
Structure, there is the first matching face parallel with the bearing of trend of locating dowel and vertical with the bearing of trend of locating dowel the on chip
Two match faces, are provided with the first contact on the first matching face, the second contact, the first contact and second are provided with the second matching face
Contact is used to match connection, the first matching face and the outer surface that the second matching face is chip with the contact pilotage on imaging device, fixed
When position post matching is inserted into engaging structure, the first matching face is adjacent with the side wall of locating dowel；Wherein, set on the second matching face
There is depressed part, the second contact is located in depressed part.So surrounded when the contact pilotage on imaging device can be limited in depressed part
In region, it can keep contacting with the second contact all the time.So as to improve the reliability electrically connected between contact and contact pilotage.
Embodiment three
In order to which while consumptive material is installed, realization is connected with the positioning between chip on consumptive material with matching, on imaging device
Also there can be the structure with chip exterior form fit.Fig. 7 is a kind of structure for imaging device that the embodiment of the present invention three provides
Schematic diagram.As shown in fig. 7, the imaging device that the present embodiment provides, includes equipment body 21 and is arranged on equipment body 21
On electrical connection module 22, locating dowel 221, the first contact pilotage 222a and the second contact pilotage of protrusion are included on electrical connection module 22
222b, locating dowel 221 are connected to consumptive material for matching, and the first contact pilotage 222a is located in the side wall of locating dowel 221, the second contact pilotage
222b is located at the side of locating dowel 221, and the first contact pilotage 222a and the second contact pilotage 222b are used to and the contact electrical connection on consumptive material.This
Imaging device in embodiment can be used for being attached with the consumptive material in previous embodiment one or embodiment two.
Specifically, imaging device can be the conventional device such as printer, include main structure body on imaging device, be used for
Perform function element and the structure for being connected with consumptive material of imaging or printing function.Wherein, in order to be connected with consumptive material, it is imaged
Include consumptive material receiving portion in equipment, and electrical connection module 22 is provided with consumptive material receiving portion, include on electrical connection module 22
The locating dowel 221 protruded laterally, and be respectively used to the different contact portions with consumptive material the first contact pilotage 222a and second touch
Pin 222b.
Wherein, locating dowel 221 can be used for matching connection, the engagement knot e.g. on consumptive material with the mounting structure on consumptive material
Structure etc..Locating dowel 221 can have a variety of different shapes and structure, such as the cross section of locating dowel 221 can be circular, side
To or other polygons in one kind.
For in the contact pilotage that is connected with consumptive material, the first contact pilotage 222a to be located in the side wall of locating dowel 221, so works as locating dowel
During 221 engaging structure matching connection corresponding with consumptive material, the first contact pilotage 222a can be with the insertion of locating dowel 221 and positioned at engagement
The top of structural edge, now, you can set on chip and be similarly positioned in engaging structure edge, and towards the of locating dowel side wall
One contact, so as to allow the first contact pilotage 222a to realize that electrical connection and signal transmit by the contact between the first contact.
And it is corresponding, the second contact pilotage 222b is located at the side of locating dowel 221, e.g. in the plane where locating dowel 221,
So when consumptive material is installed, the second contact pilotage 222a can be towards consumptive material, and the second contact with being oppositely arranged on consumptive material, realizes
It is electrically connected with.
It should be noted that the first contact pilotage 222a and the second contact pilotage 222b can be for one or more than one tactile
Pin, and accordingly, the also corresponding contact for having identical quantity on consumptive material.
So, imaging device is in the side wall of locating dowel 221 and the side of locating dowel 221 by setting different contact pilotage,
It can make to form reliable contact connection between contact and contact pilotage and signal pass during consumptive material is installed on imaging device
It is defeated, and the contact pilotage on imaging device is arranged at exposed outer surface, manufacture difficulty is relatively low, can effectively reduce and be produced into
This.
In the present embodiment, imaging device includes equipment body and the electrical connection module being arranged on equipment body, electricity
Including locating dowel, the first contact pilotage and the second contact pilotage of protrusion on connection component, locating dowel is connected to consumptive material for matching, and first
Contact pilotage is located in the side wall of locating dowel, and the second contact pilotage is located at locating dowel side, the first contact pilotage and the second contact pilotage is used to and consumptive material
On contact electrical connection.So by setting contact pilotage in locating dowel side wall, providing holes or groove are not needed on chip, it becomes possible to
Ensure that the contact on chip can be connected with the contact pilotage on imaging device, reduce the constructive difficulty and cost of chip, enhance
The stability of electrical connection.
Example IV
On the basis of previous embodiment one to three, the application also provides a kind of imaging system, to realize consumptive material and imaging
Simple between equipment, reliable installation and electric connection.Fig. 8 is a kind of structure for imaging system that the embodiment of the present invention four provides
Schematic diagram.As shown in figure 8, the imaging system that the present embodiment provides, include consumptive material 1 described in previous embodiment one or two with
And the imaging device 2 described in previous embodiment three.Wherein, the consumptive material 1 in imaging system and imaging device 2 can be installed and connected
It is connected together, so as to complete imaging job.In imaging system, imaging device 2 includes electrical connection module 22, on electrical connection module 22
Locating dowel 221 including protrusion, the first contact pilotage 222a and the second contact pilotage 222b, locating dowel 221 are connected to consumptive material 1 for matching
On, the first contact pilotage 222a is located in the side wall of locating dowel 221, and the second contact pilotage 222b is located at the side of locating dowel 221, the first contact pilotage
222a and the second contact pilotage 222b is used to and the contact electrical connection on consumptive material 1.
Specifically, it is detachable connection between consumptive material 1 and imaging device 2 in imaging system, in order to consumptive material more
Change.Realization is also required to when installing on consumptive material 1 to imaging device 2, between the electrical connector between consumptive material 1 and imaging device 2 to connect
Touch connection.Below by taking a specific imaging system as an example, to the connected mode and connection procedure between imaging device and consumptive material
Illustrate.
Specifically, the consumptive material receiving portion of consumptive material 1 can be accommodated by being provided with the equipment body 21 of imaging device 2, consumptive material 1 with
Dismountable mode is installed on imaging device 2.Electrical connection module 22 is additionally provided with consumptive material receiving portion.Electrical connection module 22
It is electrically connected with the chip 12 being arranged on consumptive material 1, and transmits the signal of communication between imaging device 2 and consumptive material 1.Electrical connection
Locating dowel 221, the first contact pilotage 222a and the second contact pilotage 222b, the locating dowel 221 that component 22 includes protrusion are connected to for matching
On consumptive material 1, the first contact pilotage 222a is located in the side wall of locating dowel 221, and the second contact pilotage 222b is located at the side of locating dowel 221, and first
Contact pilotage 222a and the second contact pilotage 222b is used to match face with the contact electrical connection on consumptive material 1, the first matching face 121 and second
122 be the outer surface of chip 12, when the matching of locating dowel 221 is inserted into engaging structure 111, the first matching face 121 and locating dowel
221 side wall is adjacent.
One end of consumptive material 1 includes chip installation portion 11 and the chip 12 being arranged on chip installation portion 11, chip installation portion
Be provided with 11 it is adjacent with chip 12 and for for the locating dowel 221 on imaging device 2 match insert engaging structure 111 and
In the chip holding tank 112 for accommodating chip.This sentences engaging structure 111 to be illustrated exemplified by a circular groove, engagement knot
Structure 111 is used to accommodate the locating dowel 221 on the equipment body 21 of imaging device 2, and chip holding tank 112 is located at engaging structure
111 side, and close to engaging structure 111.
There is on chip 12 the first matching face 121 parallel with the bearing of trend of locating dowel 221 and prolong with locating dowel 221
The second vertical matching face 122 of direction is stretched, the first contact 1211 is provided with the first matching face 121, is set on the second matching face 122
The second contact 1221 is equipped with, the first contact 1211 and the second contact 1221 are used to match with the contact pilotage of imaging device 2 and connected.
Optionally, the first matching face 121 and the second matching face 122 are two outer walls of chip 12 respectively, and first matches
The area in face 121 is generally larger than the second matching face 122, and the electronic device on chip 12, such as memory, circuit etc. can be set
Put on chip 12 outer wall parallel with the first matching face 121.
When chip 12 is installed in the chip holding tank 112 of chip installation portion 11, the second matching face 122 exposed can consumed
Outside material 1, and the face engaging structure 111 of the first matching face 121 is set.And when consumptive material 1 is inserted into imaging device 2, positioning
In the fully-inserted engaging structure 111 of post 211, and the first matching face 121 on chip 1 can complete together with locating dowel 211
Contact connection between one contact 1211 and the first contact pilotage 222a.
In order to ensure the reliable contacts between contact and contact pilotage, when the first contact pilotage 222a is in free state, with locating dowel
The distance between 211 center is more than the distance in the first matching face 121 and the center of engaging structure 111.So due to first
With the contact pilotage 222a of face 121 to the first from a distance from the center line of locating dowel 211 closer to.Therefore when the first contact pilotage 222a is with positioning
When post 211 is inserted into engaging structure 111, the first contact pilotage 222a can be extruded and deformed upon by the first matching face 121, so as to allow
First contact pilotage 222a is contacted in engaging structure 111 with the first contact 1211, ensure that imaging device 2 is directly electric with chip 11
Contact and communication.
Optionally, during the matching of locating dowel 211 insertion engaging structure 111, locating dowel 211 is normally at the outside of chip 12.
When consumptive material 1 is inserted into imaging device 2, chip installation portion 11 is corresponding with the electrical connection module 22 of imaging device 2, and locating dowel
The center line of 211 axis and engaging structure 111 essentially coincides.Locating dowel 211 is completely inserted into engaging structure 111, chip
12 in the side of engaging structure 111, thus locating dowel 211 also can be in the side of chip 12 without through chip 12 so that core
Piece 12 has relatively simple structure.
In the present embodiment, imaging system includes consumptive material and imaging device；Consumptive material includes chip installation portion and is arranged on
Chip on chip installation portion, it is provided with chip installation portion with chip by chip and for being matched for the locating dowel on imaging device
The engaging structure of insertion, there is the first matching face parallel with the bearing of trend of locating dowel and the extension side with locating dowel on chip
To vertical second matching face, the first contact is provided with the first matching face, is provided with the second contact on the second matching face, first
Contact and the second contact are used to match connection with the contact pilotage on imaging device, and the first matching face and the second matching face are chip
Outer surface, when locating dowel matching is inserted into engaging structure, the first matching face is adjacent with the side wall of locating dowel；Imaging device includes
Have equipment body and an electrical connection module being arranged on equipment body, include on electrical connection module protrusion locating dowel, first
Contact pilotage and the second contact pilotage, locating dowel are connected to consumptive material for matching, and the first contact pilotage is located in the side wall of locating dowel, the second contact pilotage
Positioned at locating dowel side, the first contact pilotage and the second contact pilotage are used to and the contact electrical connection on consumptive material.Need not so on chip
Providing holes or groove, it becomes possible to ensure that the contact on chip can be connected with the contact pilotage on imaging device, reduce the knot of chip
Structure difficulty and cost, enhance the stability of electrical connection.
Finally it should be noted that：Various embodiments above is merely illustrative of the technical solution of the present invention, rather than its limitations；To the greatest extent
The present invention is described in detail with reference to foregoing embodiments for pipe, it will be understood by those within the art that：Its according to
The technical scheme described in foregoing embodiments can so be modified, either which part or all technical characteristic are entered
Row equivalent substitution；And these modifications or replacement, the essence of appropriate technical solution is departed from various embodiments of the present invention technology
The scope of scheme.
Claims (13)
1. a kind of consumptive material, applied on imaging device, the consumptive material includes chip installation portion and is arranged on the chip installation portion
On chip, it is characterised in that be provided with the chip installation portion with the chip by chip and for supply the imaging device
On locating dowel matching insertion engaging structure, there is on the chip first parallel with the bearing of trend of the locating dowel
With face and vertical with the bearing of trend of the locating dowel second matches face, and the first contact is provided with the first matching face,
The second contact is provided with the second matching face, first contact and second contact are used to and the imaging device
Contact pilotage matching connection, it is described first matching face and it is described second matching face be the chip outer surface, the locating dowel
During with being inserted into the engaging structure, the first matching face is adjacent with the side wall of the locating dowel.
2. consumptive material according to claim 1, it is characterised in that second matching is facing to close to the imaging device
Side is set.
3. consumptive material according to claim 1, it is characterised in that in the first matching face and the second matching face extremely
Few one is plane.
4. consumptive material according to claim 1, it is characterised in that the engaging structure includes mounting hole, mounting groove or breach
In one kind.
5. consumptive material according to claim 1, it is characterised in that second contact extends to the first matching face.
6. consumptive material according to claim 1, it is characterised in that it is provided with depressed part on the second matching face, described
Two contacts are located in the depressed part.
7. consumptive material according to claim 1, it is characterised in that it is provided with lug boss on the first matching face, described
One contact is located on the lug boss.
8. consumptive material according to claim 1, it is characterised in that the area in the first matching face is more than the described second matching
The area in face.
9. consumptive material according to claim 1, it is characterised in that first contact is earthing contact.
10. consumptive material according to claim 1, it is characterised in that the chip includes information storage part, described information storage
Portion is located at the position in addition to the described first matching face and the second matching face on the chip.
11. a kind of imaging system, it is characterised in that set including the consumptive material any one of claim 1-10, and imaging
Standby, imaging device includes electrical connection module, it is characterised in that on the electrical connection module include protrusion locating dowel, first touch
Pin and the second contact pilotage, the locating dowel are connected to consumptive material for matching, and first contact pilotage is located at the side wall of the locating dowel
On, second contact pilotage is located at the locating dowel side, and first contact pilotage and second contact pilotage are used to and the consumptive material
On contact electrical connection.
12. imaging system according to claim 11, it is characterised in that when first contact pilotage is in free state, with
The distance between center of the locating dowel is more than the distance in the described first matching face and the center of the engaging structure.
13. imaging system according to claim 11, it is characterised in that the engaging structure is inserted in the locating dowel matching
When, the locating dowel is located at the outside of the chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710852150.9A CN107608192B (en) | 2017-09-19 | 2017-09-19 | Consumable, imaging device and imaging system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710852150.9A CN107608192B (en) | 2017-09-19 | 2017-09-19 | Consumable, imaging device and imaging system |
Publications (2)
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| CN107608192A true CN107608192A (en) | 2018-01-19 |
| CN107608192B CN107608192B (en) | 2020-10-30 |
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| CN201710852150.9A Active CN107608192B (en) | 2017-09-19 | 2017-09-19 | Consumable, imaging device and imaging system |
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| CN (1) | CN107608192B (en) |
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Also Published As
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| CN107608192B (en) | 2020-10-30 |
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Address after: 519075 area B, 7th floor, building 04, No. 63, Mingzhu North Road, Qianshan, Zhuhai, Guangdong Patentee after: Jihai Microelectronics Co.,Ltd. Address before: 519075 area B, 7th floor, building 04, No. 63, Mingzhu North Road, Qianshan, Zhuhai, Guangdong Patentee before: APEX MICROELECTRONICS Co.,Ltd. |
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