Detailed Description
The invention will be further described with reference to the accompanying drawings and the detailed description below:
example 1
Referring to fig. 1 and 2, the present embodiment relates to a mounting device 100, which includes a communication member 1 and a mounting member 2. The communication member 1 is mounted to a mounting member 2. The mounting device 100 may be used to mount a first apparatus 200 (e.g., a memory device such as a chip).
Referring to fig. 3 and 4, the communication member 1 may be used to transmit communication information; for example, after the communication piece 1 is connected to the main board 300 of the first device 200 and the second device (e.g., an image forming device, etc.), the first terminal 201 provided on the first device 200 and the second terminal 301 of the main board 300 are respectively in contact with the communication piece 1, and communication information such as instructions or data for communication between the two main boards 300 of the first device 200 and the second device 300 can be transmitted between the two through the communication piece 1. In order to better realize the communication function of the communication member 1, the communication member 1 may be made of a metal material, for example, the metal material may be one or more of copper, iron, gold, silver, etc. or an alloy material. The first terminal 201 and the second terminal 301 may be made of a metal material. Each communication element 1 can preferably be formed by bending or punching a metal plate or sheet or a metal wire or wire.
The communication part 1 includes a first communication part 1A and a second communication part 1B. The first communication part 1A and the second communication part 1B are arranged at intervals. The number of the first communication parts 1A may be plural, and for example, may be two or three or more. The first communication parts 1A are arranged at intervals from each other. The number of the second communication pieces 1B may be one or more, and the second communication pieces 1B may be arranged at intervals or may be connected to each other. When the first communication piece 1A and the second communication piece 1B are projected in the forward direction on the same plane (for example, when the first communication piece 1A and the second communication piece 1B are projected in the direction F on the same plane with reference to fig. 1), the second communication piece 1B may be disposed at a distance from each first communication piece 1A. Preferably, when the first communication piece 1A and the second communication piece 1B are forward projected on the same plane, the second communication piece 1B is located between the two first communication pieces 1A.
In the present embodiment, each of the communication items 1 (the first communication item 1A and the second communication item 1B) includes a first contact portion 11 and a second contact portion 12. For example: the first contact portion 11 is used to contact the second terminal 301 of the main board 300 in the second device. The first contact part 11 can be rectangular, oval or irregular polygon (the number of sides of the polygon is more than or equal to 3); the ratio of the major axis to the minor axis of the surface of the first contact portion 11 in contact with the second terminal 301 is greater than 1:1, and may be, for example, 1.5:1, 2:1, or 2.5: 1. The ratio of the number of the first contact parts 11 to the number of the second terminals 301 is X:1(X is a positive integer), and each second terminal 301 has at least one first contact part 11 in contact communication therewith, so that when X is greater than 1, the contact stability between the first contact parts 11 and the second terminals 301 can be improved.
The second contact portion 12 may be used to contact a first terminal 201 of the first device 200. The ratio of the number of the second contact parts 12 to the number of the first terminals 201 is X ' to 1(X ' is a positive integer), and at least one second contact part 12 is in contact communication with each first terminal 201, when X ' is greater than 1, the stability of the contact between the second contact part 12 and the first terminal 201 of the first device 200 can be improved. Preferably, the second contact portion 12 and the first contact portion 11 may be combined to form an elastic member, or the first contact portion 11 may be an elastic member, or the second contact portion 12 may be an elastic member. The elastic properties of the elastic member will be described taking the second contact portion 12 as an example: the second contact portion 12 can rotate along the central axis, which is the connection point of the second contact portion 12 and the first contact portion 11, within a certain angle range (for example, 0.1-90 °, or other angle ranges), and can also be automatically reset. When the second contact portion 12 is pushed by the external pressure to move toward the first contact portion 11 and the second contact portion 12 rotates by 5 ° or 10 ° along the central axis, the external pressure is removed and the second contact portion 12 can be returned to the position before the rotation.
As one preferable scheme, as shown in fig. 2 and 4, the first communication piece 1A and the second communication piece 1B are respectively formed by bending a metal sheet, and the connection position of the first contact portion 11 and the second contact portion 12 may be a bent position of the metal sheet, the metal wire or the metal wire.
The first contact portion 11 is disposed non-parallel to the second contact portion 12, for example, the first contact portion 11 forms a predetermined angle with the second contact portion 12, and the predetermined angle may be 0.5 ° to 75 °, or other angle ranges. The first contact portion 11 and the second contact portion 12 may be disposed to intersect with each other in direct contact, or may be disposed to intersect with each other in a non-contact manner.
The mounting member 2 includes a first mounting portion 21 and a second mounting portion 22. The first contact portion 11 is attached to the first attachment portion 21. A part or the whole of the second contact portion 12 extends to the second mounting portion 22. The mounting member 2 may be provided with an installation space 23 for installing the first device 200. The mounting space 23 may be in the shape of a groove or indentation or depression. Part or all of the second contact portion 12 of each communication item 1 may extend to the installation space 23. The mounting space 23 may be provided to the second mounting portion 22.
The mounting member 2 may also be provided with a bore 24. The hole 24 extends through the first mounting portion 22. The second communication member 1B is mounted at the position of the hole 24. Preferably, part or all of the first contact portion 12 of the second communication member 1B is located within the aperture 24. The holes 24 can be cylindrical holes, rectangular holes, hexagonal holes or other polygonal holes, and the specific shape can be set according to actual needs.
The mounting member 2 may be a hexahedral, octahedral, or other polyhedral shape or the mounting member may be a spherical body. The concrete setting can be according to the actual conditions. Taking a hexahedron as an example: the mount 2 comprises a first surface 25 facing the body 300 of the second device, a second surface 26 parallel to the first surface 25 and a third surface 27 intersecting the first surface 25. The first contact portions 12 are distributed over the first surface 25 of the mounting member 2. The installation space 23 may be parallel to or intersect the first surface 25. The hole 24 extends through the first surface. When the installation space 23 is parallel to the first surface 25, the installation space 23 penetrates at least the third surface. The mounting space 23 may extend through one or more of the first surface 25, the second surface 26, and the third surface 27 when the mounting space 23 intersects the first surface 25. The first surface 25 may cover the first mounting portion 21. The second surface 26 may overlie the second mounting portion 22. The third surface 27 may cover both the first mounting portion 21 and the second mounting portion 22.
When the first device 200 is installed in the installation space 23 of the installation apparatus 100 according to the embodiment, after the installation apparatus 100 is installed in a second device, communication information between the main board 300 of the second device and the first device 200 can be transmitted through the communication member 1. The first device 200 is prevented from directly contacting the second terminal 301 of the main board 300 in the second device, so that the appearance of the first device 200 can adopt either a special appearance or a general appearance, and it is only necessary that the appearance of the first device 200 can be mounted to the mounting apparatus 100 and the first terminal 201 of the first device 200 can contact the communication member 1. In addition, since the requirement for the appearance of the first device 200 is reduced, the development and production costs of the first device 200 and the management costs of the manufacturer of the first device 200 can be effectively reduced. In addition, the installation of the first device 200 by the installation apparatus 100 can effectively improve the stability of the installation of the first device 200.
Example 2
Referring to fig. 7, the present embodiment relates to a mounting device 100, and is different from embodiment 1 in that the second communication member 1B further includes a connecting portion 13, and the connecting portion 13 is connected to both the first contact portion 11 and the second contact portion 12. The connection portion 13 connects the first contact portion 11 and the second contact portion 12, which reduces the difficulty in processing the second communication 1B. The connecting part 13 is inserted into the mounting part 2. Other parts of the mounting device 100 of this embodiment are the same as those of embodiment 1, and are not described herein again.
Example 3
Referring to fig. 2 and 5, the present embodiment relates to a mounting device 100, and is different from embodiment 1 in that the communication member 1 (the first communication member 1A and the second communication member 1B) includes a first contact portion 11A, a second contact portion 12a, and a connection portion 13 a. The connecting portion 13a is connected to both the first contact portion 11a and the second contact portion 12 a. For example: the first contact portion 11a is used to contact the second terminal 301 of the main board 300 in the second device, and the second contact portion 12a is used to contact the first terminal 201 of the first device 200. Each of the connection portions 13a may be connected to more than one first contact portion 11a and more than one second contact portion 12a, respectively. As shown in fig. 5, two second contact portions 12a are connected to each first communication member 1A so as to improve the stability of the second contact portions 12a in contact with other devices (e.g., the first device 200).
Preferably, the second contact portion 12a and the connecting portion 13a are combined to form an elastic member, or the first contact portion 11a is an elastic member, or the second contact portion 12a is an elastic member. For example, the second contact portion 12a may rotate within a certain angle range (e.g., 0.1 ° -90 °, or other angle range) along the central axis, which is the connection point of the second contact portion 12a and the connection portion 13a, and may also be automatically reset. When the second contact portion 12a is pushed by the external pressure to move toward the first contact portion 11a or the connection portion 13a, and the second contact portion 12a rotates along the central axis by an angle of 3 ° or 12 °, the external pressure is removed, and the second contact portion 12a can be returned to the position before the rotation. Other parts of the mounting device 100 of this embodiment are the same as those of embodiment 1, and are not described herein again. By elastically providing the second contact portion 12a, when the first device 200 is mounted in the mounting space 23, the second contact portion 12a can be better brought into contact with the first terminal 201 on the first device 200, and also the first device 200 can be pressed or pre-stressed, so that the first device 200 can be more stably mounted to the mounting apparatus 100.
Example 4
Referring to fig. 6, 8 and 10, the present embodiment relates to an installation device 100, which is different from embodiment 1 in that the installation device 2 further includes a limiting member 28, and the limiting member 28 may be a hook or a baffle, and the installation device may be installed on the image forming cartridge through the limiting member 28.
As shown in fig. 6 or 8, the stopper 28 is in the shape of a hook; the position limiting member 28 includes a first position limiting portion 281 and a second position limiting portion 282 fixedly connected to the first position limiting portion 281. The first position-limiting portion 282 may be a strip, for example, the first position-limiting portion 282 may be a cylinder or a polyhedron such as a pentahedron and a hexahedron. The second limiting part can be in the shape of a tetrahedron, a trapezoidal table or a semicircular body and the like. The maximum cross-section of the second stopper portion 282 is larger than the cross-section of the first stopper portion 281. The cross section of the first position-limiting portion 281 may be a section perpendicular to the long axis of the first position-limiting portion 281. The second position-limiting portion 282 is fixed to an end surface of the first position-limiting portion 281, and at least a portion of the second position-limiting portion protrudes toward a direction intersecting with a long axis of the first position-limiting portion 281 relative to the end surface of the first position-limiting portion 281.
As shown in fig. 10, the stopper 28 is in the shape of a baffle; the position-limiting member 28 includes a third position-limiting portion 283 and a fourth position-limiting portion 284. The third position-limiting portion 283 is provided with a through hole or a through groove, the through hole or the through groove can be used for facilitating the second terminal 301 of the main board 301 in the second device to contact with the communication member 1 after passing through, and certainly, the through hole or the through groove can also be used for other protruding members in the second device to pass through. The fourth limiting part 284 is provided with a connecting part 2841; the connecting member 2841 may be a circular hole, a threaded hole, a cylinder, a hook, or the like.
The mounting device 100 can be limited by the limiting member 28, so that the position of the mounting device can be limited to a predetermined position when the mounting device is used, thereby improving the working stability of the mounting device.
Other parts of the mounting device 100 of this embodiment are the same as any one of embodiment 1, embodiment 2, or embodiment 3, and are not described herein again.
Example 5
Referring to fig. 2 and fig. 7, the present embodiment provides a chip assembly M including a mounting apparatus 100 and a chip 200'. The chip 200' may be used to store data, such as imaging cartridge data (e.g., imaging manufacturer, serial number, version number, remaining amount of consumables, number of uses, etc.) and/or communication data (e.g., programs, communication protocols, etc.), for example. The chip 200 'is provided with a first terminal 201, said chip 200' being detachably mounted to the mounting device 100. The mounting device 100 is the mounting device 100 according to any one of embodiments 1-4, and therefore the mounting device 100 is not described in detail in this embodiment. After the chip 200' is mounted to the mounting device 100, the first terminal 201 is in contact with the communication member 1 of the mounting device 100.
Preferably, the chip 200' is detachably disposed in the mounting space 23 of the mounting device 100. The first terminal 201 is in contact with the second contact portion 12 in the mounting device 100. The size of the mounting space 23 is greater than or equal to the size of the chip 200'. Taking the chip 200 'as a rectangle as an example, the ratio of the length, width and height of the chip 200' to the length, width and height of the mounting space is 1:1-1:1.5, so that the chip 200 'can be conveniently mounted in the mounting space, and the chip 200' can be pressed by the second contact portion 12 and thus can be stably mounted on the second mounting portion.
Preferably, referring to fig. 2 or 8, in order to better position the chip 200 ', the mounting space 23 may be a groove embedded in the second mounting portion 22, and the groove is provided with at least one opening for the chip 200' to penetrate. The shape of the mounting space is similar or identical to that of the chip 200'. The opening as shown in fig. 2 may be used to pass a smaller cross-section of the chip 200'. The opening as described in fig. 8 may be used for passing through the largest cross-section of the chip; so can set up spacing parts 231 such as cambered surface dog, cylindrical bumping post or guide way in installation space, lead to spacing part 231 and can be spacing the chip in installation space 23.
The chip described in this embodiment can be well in contact with the second contact portion and can be stably mounted in the mounting device 100.
Example 6
Referring to fig. 10 to 11, the present embodiment provides an imaging cartridge N including a mounting head 400 and a chip component M. The mounting head 400 is provided with a mounting location 401. The chip assembly M is detachably mounted to the mounting position 401. The chip assembly M is the chip assembly M described in embodiment 5. Of course, the imaging box N can also comprise an ink box or a carbon powder box; the ink box or the carbon powder box is used for containing developers such as ink or carbon powder. The mounting head 400 may be mounted to a powder outlet end of an ink cartridge or a toner cartridge. The chip component M may be arranged to be immovable with respect to the mounting position 401 or the mounting device 100 may be fixedly secured with the mounting position 401. If the scheme that the chip assembly M is set to be not movable relative to the mounting position 401 or the mounting device 100 is fixedly connected with the mounting position 401 is adopted, only the chip needs to be mounted in the using process, and the mounting device 100 can be prevented from being detached when the chip is mounted or replaced.
Referring to fig. 11, preferably, after the chip component M is mounted at the mounting position 401, the chip component M may move relative to the mounting head 400, for example, the chip component M may shake within a certain range; in this preferred embodiment, the mounting device 100 may be the mounting device 100 described in embodiment 4.
In this preferred embodiment, the mounting position 401 may be a groove or a recess formed on the mounting head 400. The stopper 28 may be provided in a baffle shape (described in embodiment 4). If the chip component M is movably mounted to the mounting head 400, the size of the mounting position 401 is larger than that of the chip component M. Taking the mounting position 401 as a three-dimensional rectangular groove with an opening on one side and the mounting part 2 of the chip assembly M with a substantially rectangular shape as an example; the ratio of the mounting position 401 to the dimensions of the mounting member 2 may be set to: the ratio of the length is 1:1 to 1.5:1, the ratio of the width is 1:1 to 1.5:1, and the ratio of the height is 1:1 to 1.5: 1. Of course, the shape of the mounting position 401 may also be set to be a three-dimensional oval shape, a three-dimensional rectangle with two ends being arc-shaped surfaces, or other shapes.
If the ratio of the mounting position 401 to the size of the mounting member 2 is larger than 1:1 (e.g., 1.08:1 or 1.3: 1), after the chip module M is mounted on the mounting position 401, when the mounting head 400 is swung, the communication device 1 and the mounting device 2 or the communication device 1, the mounting device 2 and the chip 200' of the chip module M can be moved or swung with the space surrounded by the wall of the mounting position 401 being limited. If the ratio of the sizes of the mounting position 401 and the mounting member 2 is 1: when 1 is detected (error is about ± 0.05), after the chip module M is mounted at the mounting position 401, the chip module M is fixed to the mounting position 401.
Preferably, the chip module M is mounted on the mounting head 400 through the stopper 28 after being mounted on the mounting position 401. The third position-limiting portion 283 of the position-limiting member 28 is aligned with the mounting position 401, and the fourth position-limiting portion 284 is fixed to the other portion of the mounting head 400. At least one of the communication element 1, the mounting element 2 and the chip 200' of the chip assembly M is movably retained in the mounting position 401 by the retaining element 28. When the mounting head 400 is swung, the communication device 1 and the mounting device 2 of the chip module M or the communication device 1, the mounting device 2 and the chip 200' can be moved or swung with the space surrounded by the mounting position 401 and the stopper 28 being limited.
By mounting the chip module M movably with respect to the mounting head 400, the processing accuracy of the mounting apparatus can be reduced, the production cost can be reduced, and the stability of the contact of the chip module M with the second terminals 301 of the main board 300 in the image forming apparatus during use can be improved.
Example 7
Referring to fig. 6 to 9, the present embodiment relates to an image forming cartridge N, and differs from embodiment 6 in that the mounting position 401 may be a surface of the mounting head 400, on which a limiting groove 402 is formed. The mounting apparatus 100 in this embodiment is the mounting apparatus 100 in embodiment 4, the limiting member 28 may be in a hook shape, and the shape of the limiting groove 402 may be similar to or the same as the cross section of the first limiting portion 281 of the limiting member 28. When the position-limiting member 28 is a hook, the position-limiting member 28 of the mounting apparatus 100 passes through the position-limiting groove 402 when the chip module M is mounted at the mounting position 401. The mounting position 401 is located between the second limiting portion 282 and the second mounting portion 22. The first position-limiting portion 281 passes through the position-limiting groove 402, and a part of the first position-limiting portion 21 is located in the position-limiting groove 402. The size of the limiting groove 402 is at least larger than that of the part of the first limiting part 21 in the limiting groove 402. After the chip module M is mounted on the mounting position 401, when the mounting head 400 is shaken, the portion of the first stopper 21 located in the stopper groove 402 can move or shake while being restricted by the space of the stopper groove 402; so that the chip component M can move relative to the mounting head 400. The image forming cartridge of the embodiment can reduce the processing precision of the mounting device, reduce the production cost, and also improve the stability of the chip assembly M contacting the second terminals 301 of the main board 300 in the image forming apparatus during use.
Other parts of the imaging cartridge in this embodiment are the same as those in embodiment 6, and are not described herein.
Example 8
Referring to fig. 1 and 11, the present embodiment provides an image forming cartridge N including a mounting head 400 and a mounting device 100. The mounting head 400 is provided with a mounting location 401; the mounting device 100 is secured in a mounting position 401. Or the mounting member 2 of the mounting device 100 is integrally fixed to the mounting head 400, in which case the stopper 28 may be omitted. The mounting device 100 may be the mounting device 100 described in any of embodiments 1-4. The mounting device 100 is used for mounting a chip 200 ', and the chip 200' is detachably inserted into the mounting space 23 of the mounting device 100.
As another preferred embodiment, when the mounting device 100 is the mounting device 100 described in embodiment 4, the mounting device 100 can be swung relative to the mounting head 400, and the solution of the mounting device movably mounted on the mounting head of this embodiment can be the solution of the chip component movably mounted on the mounting head described with reference to embodiment 6.
Example 9
Referring to fig. 4 and 12, the present embodiment relates to an image forming apparatus 500 including an image forming host O provided with a space (not shown) for mounting an image forming cartridge M and an image forming cartridge N. The image forming cartridge M is detachably mounted to a space of the image forming main body O. The imaging cartridge is the imaging cartridge N of embodiment 6 or embodiment 7 or embodiment 8. The imaging host O is provided therein with a motherboard 300. The main board 300 is provided with a second terminal 301 and a connecting post 302. Wherein a part of the second terminals 301 are mounted to the connection posts 302, and the remaining second terminals 301 are spaced apart from the connection posts 302. The second terminal 301 includes a clock terminal, a data terminal, a ground terminal, and a power supply terminal. For example, the main board 300 may be provided with a connector similar to that described in the fifth embodiment with application number CN 201180004581.0; the connecting posts are similar to the locating pins described in the fifth embodiment. Taking the example of mounting the ground terminal to the connection column 302, after the imaging cartridge is mounted to the imaging host, the connection column 302 can be inserted into the hole 24 of the mounting member 2, and the ground terminal is in contact with the first contact portion 11 of the second communication member 1B; the other second terminals 301 are in contact with the first contact portion 11 of the first communication member 1A.
In order to facilitate the contact of the first contact portion 11 of the second communication member 1B with the second terminal 301 mounted to the connection post 302, the first contact portion 11 may be provided as an elastic member and inserted partially or entirely into the hole 24. The ratio of the vertical distance from the part of the first contact part 11 inserted into the hole 24 to the hole wall to the outer diameter of the connecting column is 0.5: 1-1:1, so that when the connecting column is inserted into the hole 24, the first contact part 11 and the second terminal 301 are squeezed or pre-tightened, and the contact stability of the first contact part 11 and the second terminal is improved. The ratio of the inner diameter of the hole 24 to the outer diameter of the connecting column 302 is 1:1 to 1: 3. Especially when the mounting device 100 is in a fixed state relative to the mounting head, the ratio of the inner diameter of the hole 24 to the outer diameter of the connecting post 302 should be greater than 1:1 (e.g., 1:1.5 or 1:2), so that the connecting post can be inserted into the hole 24 more smoothly.
The communication part 1 of the mounting apparatus 100 of the present invention can be used for communication, and when the chip 200 'is mounted on the mounting apparatus 100, the chip 200' and a device (for example, an imaging device) communicating with the chip 200 'can be communicated by the mounting apparatus 100, and since communication can be performed by the mounting apparatus 100, the appearance of the chip 200' can be freely set, and for example, the appearance of the chip can be set to a specific appearance according to a specific requirement of the device communicating with the chip, or can be set to an existing chip appearance or to an appearance of another shape as needed. The chip module M of the present invention employs the mounting apparatus 100 described above, so that the effect of the mounting apparatus can be achieved. The imaging box N related to the invention comprises a mounting head and a chip component, or comprises a mounting head and a mounting device; the mounting device or the chip component can be movably mounted on the mounting head and can also be fixedly connected with the mounting head, so that a better using effect is achieved. The imaging device 500 of the invention comprises the imaging box of each embodiment, which can effectively improve the stability of the imaging box, and further improve the imaging effect and efficiency of the imaging device 500.
Various other modifications and changes may be made by those skilled in the art based on the above-described technical solutions and concepts, and all such modifications and changes should fall within the scope of the claims of the present invention.
It should be noted that: the embodiments described above are only a part of the embodiments of the present invention, and not all of them. As used in the examples and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include the plural forms as well, and "first," "second," etc. are not specifically ordered or specified, but are provided for convenience of description in the specification unless the context clearly indicates otherwise.