CN112731781A

CN112731781A - Processing box

Info

Publication number: CN112731781A
Application number: CN202011588835.5A
Authority: CN
Inventors: 刘卫臣
Original assignee: Apex Microelectronics Co Ltd
Current assignee: Apex Microelectronics Co Ltd
Priority date: 2020-07-29
Filing date: 2020-12-28
Publication date: 2021-04-30
Also published as: CN214751346U; WO2022022615A1

Abstract

The invention provides a processing box. The processing box is detachably arranged in the imaging device and comprises a box body, wherein the box body is provided with an installation surface, the installation surface is positioned on the box body close to and facing a contact structure of the imaging device, a probe is arranged on the contact structure, the processing box also comprises a chip, at least part of structure of the chip protrudes out of the installation surface, so that the installation surface comprises a first space and a second space which are respectively positioned at two sides of the chip, and the first space and the second space are used for accommodating the contact structure of the imaging device; the chip comprises a substrate, a circuit module arranged on the substrate, and at least a first contact and a second contact; the base plate comprises a plurality of base planes, the base planes comprise a first base plane, a circuit module is arranged on the first base plane, and a preset included angle is formed between the first base plane and the mounting surface. The chip of the invention has simple structure, good chip stability and lower cost.

Description

Processing box

Technical Field

The invention relates to the technical field of printing and imaging, in particular to a processing box.

Background

The imaging device is provided with replaceable printing consumables such as toner cartridges, ink cartridges and the like. The printing consumables are filled with toner for image formation, for example, a toner cartridge is filled with toner and an ink cartridge is filled with ink. In the event that the toner in the printing supplies is depleted or the printing supplies are damaged, the user may replace with new/other printing supplies.

In addition, a chip for storing information (such as the model of the processing box, the allowance of the color mixer, the production date and the like) related to the printing consumables is also arranged on the printing consumables box, and a contact is arranged on a chip substrate. The imaging device is correspondingly provided with a probe. When the consumable box provided with the chip is installed on the imaging device, the contact on the chip substrate is in contact with the probe on the imaging device to form electric connection, and then communication between the chip and the imaging device is realized.

However, some imaging devices have limited chip mounting positions, and the chips have more and more powerful functions, so that the area of the circuit module on the chip substrate is increased to meet the functions, and then the area of the chip substrate is increased, so that the chips cannot be mounted on the chip mounting positions of the imaging devices.

The existing technical scheme is to provide a chip, wherein a storage module and contacts are separately arranged on different substrates, a chip mounting structure with a complex structure is additionally arranged on a box body of a processing box to be mounted on the substrate provided with the contacts, the substrate provided with the storage module is mounted at other positions except the chip mounting structure, and the contacts and the storage module are connected through wires, so that the chip contacts and the storage module can be mounted on an imaging device and communicate with the imaging device.

However, in the above solution, two substrates and an additional wire for connecting the two substrates are required to be provided, and a substrate of a contact portion is required to be provided on the processing box in a complicated chip mounting structure, which increases difficulty of a chip production process and production cost.

Disclosure of Invention

The invention provides a processing box which is detachably arranged in imaging equipment and comprises a box body, wherein the box body is provided with an installation surface, the installation surface is positioned on the box body close to and facing a contact structure of the imaging equipment, a probe is arranged on the contact structure, the processing box also comprises a chip, at least part of structure of the chip protrudes out of the installation surface, so that the installation surface comprises a first space and a second space which are respectively positioned at two sides of the chip, and the first space and the second space are used for accommodating the contact structure of the imaging equipment; the chip comprises a substrate, a circuit module arranged on the substrate, and at least a first contact and a second contact; the base plate comprises a plurality of base planes, the base planes comprise a first base plane, a circuit module is arranged on the first base plane, and a preset included angle is formed between the first base plane and the mounting surface.

Optionally, the area where the circuit module is located intersects with a center line perpendicular to the mounting surface on the first base surface.

Optionally, at least one line passing through both the first contact and the second contact is perpendicular to the first base surface.

Optionally, the plurality of base surfaces further includes a second base surface parallel to the first base surface, the first contact is disposed on the first base surface, and the second contact is disposed on the second base surface.

Optionally, the plurality of base surfaces further include a third base surface, and the third base surface is perpendicular to the first base surface and farthest from the mounting surface along a normal direction of the mounting surface, and the chip further includes a contact plate, the contact plate is disposed on the third base surface, and the first contact and the second contact are both disposed on the contact plate.

Optionally, at least one line passing through both the first contact and the second contact is parallel to the first base surface.

Optionally, the plurality of base surfaces further includes a third base surface, the third base surface is perpendicular to the first base surface and farthest from the mounting surface along a normal direction of the mounting surface, and the first contact and the second contact are disposed on the third base surface.

Optionally, the plurality of base surfaces further includes a fourth base surface, the fourth base surface being located below the mounting surface.

Optionally, the circuit module is located below the mounting surface.

Optionally, the processing box further comprises a chip mounting structure, and the chip mounting structure is used for fixing the chip from two ends of the chip or fixing the chip from the lower part.

Optionally, the first contact and/or the second contact protrudes from a base surface corresponding to the first contact and/or the second contact, or the first contact and/or the second contact is lower than the base surface corresponding to the first contact and/or the second contact.

The processing box provided by the embodiment of the invention comprises a mounting surface used for being matched with a contact structure of imaging equipment and a chip which is convexly arranged along the normal line of the mounting surface, wherein a contact and a circuit module are arranged on a chip substrate, and a preset included angle is formed between a base surface provided with the circuit module and the mounting surface. Therefore, the chips are not required to be arranged into a structure with a plurality of substrates and connected with the plurality of substrates through the connecting parts, the chips can be arranged on the limited space of the processing box, and the difficulty and the cost of the production process are reduced; in addition, the chip is stably arranged on the processing box and can be universally used on different imaging devices by arranging the movable chip mounting structure on the mounting surface.

Drawings

FIG. 1 is a schematic perspective view of a prior art imaging apparatus;

fig. 2 is a schematic cross-sectional view of an image forming apparatus of the prior art;

FIGS. 3a-3b are schematic structural views of a contact structure on an imaging device;

FIG. 4 is a schematic view showing a structure of a casing of the process cartridge of the present invention;

FIG. 5 is a schematic view of a part of a process cartridge according to the present invention;

FIG. 6a is a schematic diagram of a lower chip according to an embodiment of the present invention;

FIG. 6b is a schematic diagram of a chip structure from another perspective of the exemplary chip of FIG. 6a according to the present invention;

FIG. 7a is a schematic diagram of another exemplary lower chip structure according to the present invention;

FIG. 7b is a schematic diagram of another exemplary lower chip according to the present invention;

FIG. 8 is a schematic view of a bottom chip base according to an exemplary embodiment of the present invention;

FIG. 9a is a schematic diagram of another exemplary lower chip structure according to the present invention;

FIG. 9b is a schematic diagram of another exemplary lower chip structure according to the present invention;

FIG. 10 is a schematic diagram of another exemplary lower chip structure according to the present invention;

FIG. 11 is a schematic diagram of another exemplary lower chip according to the present invention;

FIG. 12 is a schematic diagram of a lower chip according to yet another embodiment of the present invention;

FIG. 13 is a schematic view of a chip according to yet another embodiment of the present invention;

FIG. 14 is a schematic view of a further exemplary lower chip structure of the present invention;

FIG. 15a is a schematic view of another exemplary lower chip structure in accordance with the present invention;

FIG. 15b is a schematic view of another exemplary lower chip structure in accordance with the present invention;

FIG. 16 is a schematic view of a further exemplary lower chip structure of the present invention;

FIG. 17 is a schematic view of a further exemplary lower chip structure of the present invention;

FIG. 18 is a schematic view of a lower chip mounting structure according to an example of the invention;

FIG. 19 is a schematic view of another exemplary lower chip mounting arrangement of the present invention;

FIG. 20 is a schematic view of a further exemplary lower chip mounting structure of the present invention;

FIG. 21 is a schematic view of a further exemplary lower chip mounting structure of the present invention;

FIG. 22 is a schematic view of a further exemplary lower chip mounting structure of the present invention;

FIG. 23 is a schematic view of a further exemplary lower chip mounting structure of the present invention;

fig. 24 is a partial schematic view of a process cartridge mounted to an image forming apparatus according to an example of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

As shown in fig. 1 and 2, the image forming apparatus a includes an image forming portion for transferring a toner image onto a sheet, a sheet feeding portion for conveying the sheet S, a fixing portion for fixing the toner image on the sheet, a contact structure 50 for abutting against a process cartridge, and an openable door 21 that is rotatable about a rotation shaft 21a to effect opening and closing of the door.

The image forming portion includes an attachable and detachable process cartridge 1, a laser scanner unit 3, a transfer roller 9, and the like. The laser scanner unit 3 emits laser light L according to image information and irradiates the photosensitive drum 8 with the laser light L.

The process cartridge 1 includes a cartridge body and a photosensitive drum 8, a charging roller 109, a developing device 105, and a cleaning blade 107 provided in the cartridge body.

As shown in fig. 3a and 3b, the contact structure 50 (hereinafter also referred to as a contact structure of the image forming apparatus) includes a connector 51, a lower connector cover.

The connector 51 includes a probe 51a for making elastic electrical contact with the chip contact of the process cartridge 1. The connector 51 further includes four positioning posts 51b so as to surround the probes 51 a. Each of the positioning posts 51b has an inclined surface 51b1 that is angled with respect to the longitudinal and lateral directions of the connector 51.

The processing box is detachably arranged in the imaging device and comprises a box body, wherein the box body is provided with an installation surface, the installation surface is positioned on the box body close to and facing a contact structure of the imaging device, a probe is arranged on the contact structure, the processing box also comprises a chip, at least part of structure of the chip protrudes out of the installation surface, so that the installation surface comprises a first space and a second space which are respectively positioned at two sides of the chip, and the first space and the second space are used for accommodating the contact structure of the imaging device; the chip comprises a substrate, a circuit module arranged on the substrate, and at least a first contact and a second contact; the base plate comprises a plurality of base planes, the base planes comprise a first base plane, a circuit module is arranged on the first base plane, and a preset included angle is formed between the first base plane and the mounting surface.

With such an arrangement, it is possible to mount the chip on the limited space of the process cartridge to realize communication with the image forming apparatus without providing the chip in a multi-substrate structure, connecting a plurality of substrates by wires, and mounting the contact portion without additionally providing a chip mounting structure having a complicated structure on the process cartridge. The difficulty and the cost of the production process of the chip and the processing box are reduced. Illustratively, as shown in fig. 4 and 5, the process cartridge 1 is provided with a mounting surface 12 on the cartridge body for cooperating with the contact structure 50 of the imaging device, at least part of the structure of the chip 11 is arranged on the mounting surface 12 in a protruding manner along a normal direction F of the mounting surface 12, so that the mounting surface 12 includes a first space 121 and a second space 122 respectively located at two sides of the chip 11, and the first space 121 and the second space 122 are used for accommodating the contact structure of the imaging device. Specifically, the first space 121 accommodates one part of the contact structure, the second space 122 accommodates the other part of the contact structure, when the chip is disposed in one direction, the space for accommodating the positioning posts of the contact structure of the part is the first space, and the space for accommodating the remaining positioning posts is the second space. The chip comprises a substrate 111, and a circuit module 112, at least a first contact 113a and a second contact 113b, arranged on the substrate 111; the substrate 111 includes a plurality of base surfaces including a first base surface 111a, and the circuit module 112 is disposed on the first base surface 111a, the first base surface 111a being substantially perpendicular to the mounting surface 12. Namely, the included angle between the first base surface 111a and the mounting surface 12 is a preset included angle, the preset included angle ranges from 70 degrees to beta to 100 degrees, and beta is preferably 90 degrees. It is understood that the chip 11 is described herein as including two contacts, i.e., the first contact 113a and the second contact 113b, but the application is not limited thereto, and the number of the contacts may be other, such as 3, 4, etc., and the number and the arrangement position thereof may be determined according to actual needs.

When the cartridge is mounted to the imaging device, the chip 11 is surrounded by the contact structure 51, and the structure of the chip protruding from the mounting surface 12 is accommodated inside the contact structure 51. Like this, the chip is surrounded by imaging device's contact structure for when the chip can be installed limited space, can also protect the chip to avoid the friction of external structure, extrusion or collision, improve the stability of chip and probe contact, increase the life of chip, when taking place to handle the box and leak the powder in addition, also can avoid the carbon dust to fall and lead to the short circuit between the chip contact on the chip base plate, and then avoid the printer that arouses because of the contact short circuit condition of makeing mistakes or burning out.

The first contact 113a and the second contact 113b are respectively provided with a first contact portion 1131a and a second contact portion 1131b for contacting with the probe 51a, and a connecting line of the lowest points of the first contact portion 1131a and the second contact portion 1131b does not intersect with a region where the circuit module 112 is located and extending along a normal direction of a base surface where the circuit module is located. For example, as shown in fig. 6a to 6b, a connection line I is located at the lowest point of the first contact portion 1131a and the second contact portion 1131b, an area on the first base surface 111a where the circuit module 112 is located is an area a, the area a extends along a normal direction of the first base surface 111a to form an area b, and the connection line I does not intersect with the area b, or the connection line I is at a certain distance from the area b. Thus, the circuit block 112 does not intersect with the contact, and the circuit block 112 is prevented from being damaged by a force applied thereto during the contact with the probe 51a or during the mounting of the process cartridge 1.

The area of the first base surface on which the circuit module is arranged intersects with a center line perpendicular to the mounting surface on the first base surface. Illustratively, as shown in fig. 7a-7b, the area a of the first base surface 111a where the circuit module 112 is located intersects the centerline C of the first base surface 111 a. Thus, the circuit module 112 is disposed at the middle portion of the base surface as much as possible, so that the circuit module 112 can be protected from interference of some external structures, and the center of gravity of the substrate can be close to the center line of the chip as much as possible to balance the chip, so that the chip can be more stably mounted on the mounting surface 12.

The first contact 113a and the second contact 113b may be disposed on either base surface of the substrate, and both contacts may be disposed on the same base surface or on different base surfaces, respectively. And in the case that the first base surface and the mounting surface form a preset included angle, the position relationship between the other base surfaces and the mounting surface is not limited, such as vertical, at a certain angle or parallel.

The substrate 111 of the chip further includes a second base surface, a third base surface, a fourth base surface, and further includes a fifth base surface and a sixth base surface. For example, as shown in fig. 8, the chip substrate 111 further includes a second base surface 111b parallel to the first base surface 111a, a third base surface 111c and a fourth base surface 111d parallel to the mounting surface 12, the third base surface 111c being a base surface farthest from the mounting surface 12 in the forward direction along the mounting surface normal direction, and the fourth base surface 111d being a base surface farthest from the mounting surface 12 in the reverse direction along the mounting surface normal direction; the substrate 111 of the chip further includes a fifth base surface 111e and a sixth base surface 111 f.

At least one line passing through both the first contact and the second contact is perpendicular to the first base surface. The first contact and the second contact herein are contacts that enable the chip to communicate with the image forming apparatus when the process cartridge is mounted to the image forming apparatus for use. Make contact and the mutual atress contact process of imaging device probe, guarantee under the good circumstances of contacting of chip contact and imaging device's probe, the chip base plate can also be along the direction at first base face place and constantly prolong the setting, increase the area of chip base plate and circuit module's the space that sets up.

Illustratively, as shown in fig. 9a-9b, the first contact 113a is disposed on the first base surface 111a,

the second contact 113b is disposed on the second base 111b, and the distance between the first contact 113a and the second contact 113b is just the same as the distance between the two probes 51a, when the processing cartridge 1 with the chip 11 is mounted on the imaging device, the first contact 113a and the second contact 113b are clamped and contacted by the probes 51a, that is, the chip is contacted with the inner side walls of the two probes 51a, so that the contact area is increased, and the chip 11 is clamped by the probes 51a, so that the contact stability between the chip 11 and the probes 51a can be increased, the chip 11 is prevented from being displaced due to one end force, and in addition, the communication between the chip and the imaging device can be realized even when the chip substrate 111 is set to be thin, thereby further reducing the production cost of the chip and increasing the versatility of the chip 11 in a limited space.

Further, the distances of the fifth and

sixth base surfaces

111e and 111f from the first space 121 and the second space 122 are equal.

The first contact and/or the second contact protrude from or are lower than the base surface corresponding to the first contact and/or the second contact. In other words, the protrusion may be outward of the substrate or inward of the substrate. The case of the inward protrusion includes providing a concave surface on the base surface, and the first contact and/or the second contact may be formed integrally with the substrate or may be formed separately from the substrate.

Specifically, in the case where the projection is provided on the base surface and the contact is provided on the projection, a groove may be provided on the surface of the projection at a position where the contact is desired to be provided, so that the contact is located in the groove.

Projections are provided on the first base surface 111a and the second base surface 111b, respectively, and the first contact 113a and the second contact 113b are provided on the projections, respectively, that is, the projections are structures for providing contacts to achieve normal contact between the contacts and the imaging device-side probes. As shown in fig. 10, for example, the protrusions 114 are respectively provided on the first and

second base surfaces

111a and 111b, and the first and

second contacts

113a and 113b are respectively provided on the protrusions 114 such that the minimum distance d2 between the two contacts is greater than the distance d1 between the first and

second base surfaces

111a and 111 b. By adding the projection, in the case where the substrate d1 can be set smaller, effective contact between the contact and the probe can also be achieved, so that the substrate can be set to a thinner structure, increasing the installation space of the circuit module 12.

In addition, the shape of the protrusion may be a rectangular protrusion, a cylindrical protrusion, or may be an irregularly shaped protrusion. The contacts, such as the first contact and the second contact, may be disposed on the top end face of the projection, or may be disposed on the other side end face of the projection according to actual requirements. And the surface provided with the contact and the plate surface of the chip substrate can be parallel, vertical, intersected and the like, which mainly depends on the contact mode of the contact and the probe.

For example, the contact may contact the inner sidewall of the imaging device opposite to the probe, or may contact the lowest point of the imaging device probe, so that the contact may be disposed on a side far from the chip base surface or on a side intersecting with the chip base surface by those skilled in the art according to actual use.

In addition, the surface of the bump is not limited, for example, the surface of the bump on which the contact is disposed may be parallel to or intersect the first and/or second base surface of the chip at an angle. Preferably, the convex surface, on which the contact is arranged, for example, is parallel to, intersects or is perpendicular to the first base surface.

A tab is disposed on the base surface and a contact is disposed on the tab. Specifically, as shown in fig. 11, the first base surface 111a and the second base surface 111b are respectively provided with a tab 115, and the first contact 113a and the second contact 113b are respectively provided on the tab 115 such that a minimum distance d2 between the two contacts is greater than or equal to a distance d1 between the first base surface 111a and the second base surface 111 b.

The tab 115 may be an "L" or "I" type tab. For example: the protruding piece can be a semi-elliptical or semi-circular semi-ring structure, and the shape of the contact is matched with that of the picture, so that the contact can be in surrounding contact with the outer side wall of the probe.

The entire tab may be a metallic material and the entire tab may serve as a contact, or other insulating, rigid material, with the contact disposed on the tab. By disposing the contacts on the tabs, the contact area is increased in the case where d1 of the substrate can be set smaller, so that normal communication between the chip and the imaging apparatus can be ensured without the chip being mounted precisely on the mounting position. In addition, it is also possible to realize that the substrate 111 can be provided in a thinner structure, the arrangement space of the circuit module 112 is increased, and the substrate 111 can be applied to a more limited space.

A contact plate is further arranged on the third base surface of the chip, and the chip contact is arranged on the contact plate. The contact plate is used for setting a contact point, and the contact point is contacted with the contact structure of the imaging device. Illustratively, as shown in fig. 12, the chip 11 further includes a contact plate 116, the contact plate 116 is disposed on the third base surface 111c, the first contact 113a and the second contact 113b are disposed on the contact plate 116, and a distance d3 of the contact plate 116 along a direction of a connection line between the first base surface 111a and the second base surface 111b is greater than a distance d2 between the first base surface 111a and the second base surface 111 b. By providing the contacts on the contact plate, the contact area is increased in the case where d2 of the substrate can be set smaller, so that the substrate 111 can be set to a thinner structure, increasing the installation space of the circuit module 112.

In addition, it should be noted that the contact plate 116 is disposed on the third base surface by means of pasting or soldering, or the contact plate 116 may be integrally formed with the chip substrate 111, and the shape of the contact plate 116 may be a "convex" shape.

At least one line simultaneously passing through the first contact 113a and the second contact 113b is parallel to the first base surface 111 a. Therefore, the chip contact and the circuit module 112 are not on the same base surface, the arrangement space of the contact and the circuit module 112 can be increased, the contact of the chip contact and the probe 51a of the imaging device is more stable, and the chip is prevented from being displaced due to the stress of one end.

For example, as shown in fig. 13, the first contact 113a and the second contact 113b are provided on the third base surface 111 c. When the process cartridge 1 provided with the chip 11 is mounted on the image forming apparatus, the chip contact is brought into contact with the probe 51 a. Make chip contact and circuit module 112 not on same base plane, increase the setting space of contact and circuit module 112 for first base plane 111a can set up to the base plane of less area, or contact and circuit module 112 can occupy the area of bigger area of base plane, and make chip contact and imaging device's probe 51a contact more stable, and contact and probe 51a atress contact from top to bottom can increase the stability of contact between chip 11 and the probe 51a, prevent that the chip from taking place the displacement because of one end atress.

Further, the fifth base surface 111e is adjacent to the first space 121, and the sixth base surface 111f is adjacent to the second space 122.

The third base surface 111c is provided with a groove in which the contact can be disposed. Illustratively, as shown in fig. 14, the third base surface 111c is further provided with a groove 117, and the first contact 113a and the second contact 113b are disposed in the groove 117. The number of grooves may be 1 or 2, preferably 2. Through setting up the contact in recess 117 for fall into in recess 117 when probe 51a contacts with the contact, prevent that probe 51a from taking place the displacement and leading to contact failure, in addition, set up the contact in the recess, can protect the contact to avoid the collision and the friction of external object to lead to the contact impaired in the chip transportation.

The chip substrate 111 may also be provided in an inverted "L", i.e., the chip substrate 111 is integrally formed in an inverted "L" shape in production. For example, as shown in fig. 15a, the circuit module 112 is disposed on a first base surface 111a perpendicular to the mounting surface 12, and the first contact 113a and the second contact 113b are disposed on a third base surface 111c such that a line connecting the two contacts is perpendicular to the first base surface 111 a. Alternatively, the two contacts may be arranged in other arrangement, such as arranging the two contacts such that a line connecting the two contacts is parallel to the first base surface 111 a. It is contemplated that one of ordinary skill in the art can provide other shapes for the chip. In addition, a groove or a through hole can be further formed in the substrate, and the contact is arranged in the groove or on the inner wall of the through hole, so that the contact stability of the contact and the probe is improved.

In other examples, two contacts may be disposed on the first base surface at the same time; in addition, as mentioned above, a protrusion or a protruding piece may be disposed on the first base surface, and the two contacts are disposed on the protrusion or the protruding piece, respectively.

The first base surface has a length and a height, the height being greater than or equal to the length. In the case where the length is limited, the area of the first base surface can be increased by increasing the height, thereby increasing the area of the circuit module region. Illustratively, as shown in fig. 13 and 15b, the first base surface 111a includes a length L parallel to the mounting surface 12 and a height H perpendicular to the mounting surface 12. Preferably, the first base surface 111a is set to L.ltoreq.H. In this way, in a limited space, the height of the chip 11 can be increased to increase the area of the first base surface 111a to increase the area for disposing the circuit module 112, so that the requirement for the size of the circuit module 112 can be relaxed, and in addition, when the contacts are disposed on the first base surface and/or the third base surface, it is simultaneously satisfied that the area for disposing the contacts and the circuit module is sufficient, and the contacts are in effective contact with the probes 51 a.

At least one base surface of the chip substrate is arranged below the mounting surface. Illustratively, as shown in fig. 16, the fourth base surface 111d is disposed below the mounting surface 12, that is, an opening is provided on the mounting surface 12, and the chip 11 may extend through the mounting surface 12 into a position below the mounting surface 12 in a direction opposite to the normal direction of the mounting surface 12, so that a part of the substrate of the chip 11 may be disposed at a position below the mounting surface 12. This increases the area of the first base surface 111a, increases the space for mounting the circuit module on the substrate, and increases the space for mounting the chip 11.

The circuit module is disposed below the mounting surface. Illustratively, as shown in fig. 17, the circuit module 112 is disposed below the mounting surface 12, i.e., the circuit module 112 can be hidden below the mounting surface. This can better protect the circuit board from the external environment.

The length L and height H of the first base surface may be set according to the particular use, as long as the chip is enabled to communicate with the imaging device. Preferably, L and H can be set to a size ratio of 0.17 ≦ (L/H). ltoreq.1.

The processing box also comprises a chip mounting structure, and the chip mounting structure is used for fixing the chip from two ends of the chip or fixing the chip from the lower part. That is, the mounting surface 12 is further provided with a chip mounting structure on which the chip 11 is detachably mounted, the chip mounting structure being located above or below the level of the mounting surface 12. The chip 11 is more stably mounted on the process cartridge 1 by the chip mounting structure.

Illustratively, a chip mounting structure 123 is further provided on the mounting surface 12 of the process cartridge 1, and the chip 11 is detachably mounted in the mounting structure 123. As shown in fig. 18, the chip mounting structure 123 may be disposed below the mounting surface 12, i.e., the mounting structure 123 is recessed within the mounting surface 12. This allows, on the one hand, an increased installation space for the chip 11, so that a larger substrate can be designed to accommodate the circuit module 112 and the contacts etc., and, on the other hand, to arrange the circuit module 112 within the mounting structure 123, protecting the circuit module 112 from crushing and wear of external structures. As shown in fig. 19, the chip mounting structure 123 may also be disposed above the level of the mounting surface 12. By providing the chip mounting structure 123, the chip 11 is detachably and stably arranged on the mounting surface 12.

The chip mounting structure 123 is provided to be movable in a tangential direction of the mounting surface 12. As shown in fig. 20 to 23, the chip mounting structure 123 includes a first fixing frame 1233a and a second fixing frame 1233b, which are oppositely disposed on the mounting surface 12. The holder includes a holding structure surrounded by three sides to form "c", holding the chip 11 from both sides. The chip mounting structure 123 as a whole can be moved in the tangential direction of the mounting surface 12, which, as will be readily appreciated, includes different directions of 360 ° in this direction.

The chip mounting structure 123 further includes a fastening structure, a fastening structure engaged with the fastening structure is correspondingly disposed on the chip substrate 111, and the fastening structure are engaged to enable the chip substrate 111 to be fixedly mounted on the chip mounting structure 123. Specifically, the snap structure may be an elastic protrusion having elasticity, and when the chip is mounted, the elastic protrusion can be in snap contact with the chip substrate 111, so that the chip 11 can be stably mounted on the chip mounting structure 123. Further, the engaging structure may be a groove, so that the groove of the chip substrate 111 cooperates with the elastic protrusion of the chip mounting structure, and the chip 11 is more conveniently detached and mounted.

A die attach face is provided in the die attach structure 123, and the die is attached to the die attach structure 123. So that the mounting and dismounting of the chip 11 is facilitated.

An image forming apparatus, comprising: the processing box 1 and the contact structure 51, wherein the contact structure 51 is provided with a probe which is used for elastically contacting with a chip contact; when the process cartridge 1 provided with the chip 11 is mounted on the image forming apparatus, the chip 11 is surrounded by the contact structure 51 of the image forming apparatus. Specifically, as shown in fig. 24, when the process cartridge 1 is mounted to the image forming apparatus a, the connector cover 60 of the contact structure 50 of the image forming apparatus a falls into the first space 121 and the second space 122, the chip 11 is surrounded by the contact structure 51, and the structure of the chip protruding from the mounting surface 12 is accommodated inside the contact structure 51.

The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Those of ordinary skill in the art will understand that: all or a portion of the steps of implementing the above-described method embodiments may be performed by hardware associated with program instructions. The program may be stored in a computer-readable storage medium. When executed, the program performs steps comprising the method embodiments described above; and the aforementioned storage medium includes: various media that can store program codes, such as ROM, RAM, magnetic or optical disks.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A processing box is detachably arranged in an imaging device and comprises a box body, wherein a mounting surface is arranged on the box body, the mounting surface is positioned on the box body close to and facing a contact structure of the imaging device, and a probe is arranged on the contact structure; the chip comprises a substrate, a circuit module arranged on the substrate, at least a first contact and a second contact; the base plate includes a plurality of base planes, and is a plurality of the base plane includes first base plane, be equipped with on the first base plane the circuit module, first base plane with the installation face has predetermines the contained angle.

2. A process cartridge according to claim 1, wherein a region where said circuit module is located intersects with a center line perpendicular to said mounting surface on said first base surface.

3. A cartridge according to claim 2, wherein at least one of the wirings which simultaneously passes through said first contact and said second contact is perpendicular to said first base surface.

4. A process cartridge according to claim 3, wherein said plurality of base surfaces further includes a second base surface parallel to said first base surface, said first contact is provided on said first base surface, and said second contact is provided on said second base surface.

5. A process cartridge according to claim 3, wherein said plurality of base surfaces further includes a third base surface which is perpendicular to said first base surface and is farthest from said mounting surface in a direction of a normal to said mounting surface among said plurality of base surfaces, said chip further includes a contact plate provided on said third base surface, and said first contact and said second contact are both provided on said contact plate.

6. A cartridge according to claim 2, wherein at least one of the lines passing through both the first contact and the second contact is parallel to the first base surface.

7. A process cartridge according to claim 6, wherein said plurality of base surfaces further includes a third base surface, among the plurality of base surfaces, which is perpendicular to said first base surface and is farthest from said mounting surface in a normal direction of said mounting surface, said first contact and said second contact being provided on said third base surface.

8. A process cartridge according to any one of claims 1-7, wherein a plurality of said base surfaces further includes a fourth base surface, said fourth base surface being located below said mounting surface.

9. A process cartridge according to claim 8, wherein said circuit module is located below said mounting surface.

10. A process cartridge according to any one of claims 1-9, further comprising a chip mounting structure for fixing said chip from both ends of said chip or fixing said chip from below.

11. A process cartridge according to any one of claims 3-7, wherein said first contact and/or said second contact protrudes from or is lower than a base surface to which said first contact and/or said second contact corresponds.