CN107608192B - Consumable, imaging device and imaging system - Google Patents
Consumable, imaging device and imaging system Download PDFInfo
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- CN107608192B CN107608192B CN201710852150.9A CN201710852150A CN107608192B CN 107608192 B CN107608192 B CN 107608192B CN 201710852150 A CN201710852150 A CN 201710852150A CN 107608192 B CN107608192 B CN 107608192B
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Abstract
The invention provides a consumable, an imaging device and an imaging system. The consumable of the invention is applied to an imaging device, and comprises a chip mounting part and a chip arranged on the chip mounting part, the chip mounting part is provided with an engaging structure which is adjacent to the chip and is used for matching and inserting the positioning column on the imaging equipment, the chip is provided with a first matching surface parallel to the extending direction of the positioning column and a second matching surface vertical to the extending direction of the positioning column, the first matching surface is provided with a first contact, the second matching surface is provided with a second contact, the first contact and the second contact are each for mating connection with a contact pin of the imaging device, the first matching surface and the second matching surface are outer surfaces of the chip, and when the positioning column is inserted into the engagement structure in a matching mode, the first matching surface is adjacent to the side wall of the positioning column. The chip in the invention has simple structure and low cost.
Description
Technical Field
The invention relates to the field of printing equipment, in particular to consumable, imaging equipment and an imaging system.
Background
In an imaging system, an imaging apparatus and a consumable detachably attached to the imaging apparatus are generally included, and a chip is provided on the consumable for better management of the consumable. The chip can carry out data communication with imaging device after the imaging device is installed to the consumptive material, imaging device can manage the consumptive material through obtaining the information in the chip like this.
In order to complete the communication between the chip and the imaging device, after the consumable is installed in the imaging device, a good circuit connection needs to be ensured between the chip and the imaging device. For this purpose, patent CN201180004581.0 discloses a connection method between a chip and an imaging device, in which a hole is formed on the chip, a contact capable of electrically connecting is disposed in the hole, a protruded pillar is disposed on the imaging device, and a metal probe is disposed on the pillar. When the consumable is installed in the imaging device, the post on the imaging device is inserted into the hole on the chip, and the probe on the post is electrically connected with the contact in the chip hole.
However, in the above chip mounting method, a large hole must be formed in the chip, and a contact must be formed in the hole to contact with the pillar of the imaging device, so that the chip is difficult to process and high in cost.
Disclosure of Invention
The invention provides a consumable, an imaging device and an imaging system.
In a first aspect, the invention provides a consumable applied to an imaging device, the consumable comprising a chip mounting portion and a chip arranged on the chip mounting portion, wherein a meshing structure is arranged on the chip mounting portion, the meshing structure is adjacent to the chip and used for allowing a positioning column on the imaging device to be inserted in a matching manner, a first matching surface parallel to the extending direction of the positioning column and a second matching surface perpendicular to the extending direction of the positioning column are arranged on the chip, a first contact is arranged on the first matching surface, a second contact is arranged on the second matching surface, the first contact and the second contact are both used for being connected with a contact pin of the imaging device in a matching manner, the first matching surface and the second matching surface are outer surfaces of the chip, and when the positioning column is inserted into the meshing structure in a matching manner, the first matching surface is adjacent to a side wall.
In a second aspect, the invention provides an imaging system, which includes the consumable as described above and an imaging device, where the imaging device includes an electrical connection component, the electrical connection component includes a protruding positioning column, a first contact pin and a second contact pin, the positioning column is used for being connected to the consumable in a matching manner, the first contact pin is located on a side wall of the positioning column, the second contact pin is located on a side of the positioning column, and both the first contact pin and the second contact pin are used for being electrically connected to a contact on the consumable.
The consumable is applied to imaging equipment and comprises a chip mounting part and a chip arranged on the chip mounting part, a meshing structure which is adjacent to the chip and used for matching and inserting a positioning column on the imaging equipment is arranged on the chip mounting part, a first matching surface which is parallel to the extending direction of the positioning column and a second matching surface which is perpendicular to the extending direction of the positioning column are arranged on the chip, a first contact is arranged on the first matching surface, a second contact is arranged on the second matching surface, the first contact and the second contact are both used for matching and connecting with a contact pin on the imaging equipment, the first matching surface and the second matching surface are outer surfaces of the chip, and when the positioning column is matched and inserted into the meshing structure, the first matching surface is adjacent to the side wall of the positioning column. Therefore, the contact on the chip can be connected with the contact pin on the imaging device without arranging a hole or a groove on the chip, the structural difficulty and the cost of the chip are reduced, and the stability of electric connection is enhanced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a consumable according to a first embodiment of the present invention;
FIG. 2 is a top view of the consumable of FIG. 1;
FIG. 3 is a schematic structural diagram of a chip in a consumable according to an embodiment of the present invention;
FIG. 4 is a top view of the chip of FIG. 2;
FIG. 5 is a schematic structural diagram of a chip mounting portion of the consumable according to an embodiment of the present invention;
FIG. 6 is a schematic structural diagram of another consumable according to a second embodiment of the present invention;
fig. 7 is a schematic structural diagram of an imaging apparatus according to a third embodiment of the present invention;
fig. 8 is a schematic structural diagram of an imaging system according to a fourth embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
Fig. 1 is a schematic structural diagram of a consumable according to a first embodiment of the present invention. FIG. 2 is a top view of the consumable of FIG. 1. FIG. 3 is a schematic structural diagram of a chip in a consumable according to an embodiment of the present invention. Fig. 4 is a top view of the chip of fig. 2. FIG. 5 is a schematic structural diagram of a chip mounting portion of the consumable according to an embodiment of the present invention. As shown in fig. 1 to 5, the consumable provided by this embodiment is applied to an imaging device, and includes a chip mounting portion 11 and a chip 12 disposed on the chip mounting portion 11, a meshing structure 111 disposed on the chip mounting portion 11 and used for matching and inserting a positioning post on the imaging device is disposed adjacent to the chip 12, the chip 12 has a first matching surface 121 parallel to an extending direction of the positioning post and a second matching surface 122 perpendicular to the extending direction of the positioning post, the first matching surface 121 is disposed with a first contact 1211, the second matching surface 122 is disposed with a second contact 1221, and the first contact 1211 and the second contact 1221 are both used for matching and connecting with a contact pin on the imaging device; the first mating surface 121 and the second mating surface 122 are outer surfaces of the chip 12, and the first mating surface 121 is adjacent to a sidewall of the positioning post when the positioning post is inserted into the engaging structure 111 in a matching manner.
Specifically, the consumable may be a container for containing an image forming material, such as an ink cartridge or a ribbon, or the like. Consumables are generally provided in a detachable manner on an image forming apparatus to provide the image forming apparatus with a material or medium that can be printed. In order to realize communication and information transmission with the imaging device, the consumable is provided with a chip 12, and the chip 12 is provided with electric connection parts such as contacts which can be electrically connected with the imaging device 2. When the consumable is correctly mounted on the imaging device 2, the electrical connection parts such as the contacts on the chip 12 can be in contact with and conducted with the corresponding parts of the imaging device 2, and reliable electrical connection is established. The relevant information of the consumable can be transmitted to the imaging equipment through the electric connection between the chip 12 and the imaging equipment, so that the imaging equipment can manage the consumable and the printing or imaging process conveniently.
Specifically, the consumable includes a chip mounting part 11 and a chip 12 disposed on the chip mounting part 11, and a chip receiving groove 112 for receiving the chip 12 to be inserted may be generally disposed on the chip mounting part 11. An engagement structure 111 is provided on the chip mounting portion 11 adjacent to the chip 12 and for fitting insertion of a positioning post on the imaging apparatus. In which the chip 12 and the engagement structure 111 are arranged adjacently, i.e. next to each other or with only a small gap between them. When the consumable is mounted on the imaging apparatus, the chip mounting part 11 is brought into contact with and connected to a corresponding portion of the imaging apparatus. The chip mounting portion 11 is provided with an engaging structure 111, and a positioning column of the imaging device can be inserted into the engaging structure 111 and is connected with the engaging structure 111 in a matching manner. Since the engaging structure 111 is adjacent to the chip 12, when the positioning post is inserted into the engaging structure 111, the sidewall of the positioning post is also adjacent to the chip 12.
Since the side wall of the positioning column is adjacent to the chip 12 when the consumable is mounted on the imaging apparatus, an electrical connection component can be provided by positioning between the positioning column and the chip 12. Specifically, two matching surfaces for disposing electrical connection components are disposed on the chip 12, which are a first matching surface 121 whose direction is parallel to the extending direction of the positioning column and a second matching surface 122 whose direction is perpendicular to the extending direction of the positioning column. A first contact 1211 is disposed on the first mating surface 121, a second contact 1221 is disposed on the second mating surface 122, and the first contact 1211 and the second contact 1221 can be electrically connected to a contact pin of the imaging device to realize a data communication connection between the imaging device and the consumable.
The first matching surface 121 and the second matching surface 122 are both located on the outer side of the chip 12, and the first matching surface 121 and the second matching surface 122 face different directions respectively. The first mating face 121 is oriented parallel to the extending direction of the alignment post so that during insertion of the alignment post into the engagement structure, if the contact pins of the imaging device are disposed on the sidewall of the alignment post, the first contact 1211 and the contact pins on the imaging device are easily contacted and connected together due to the first mating face 121 facing the sidewall of the alignment post. When the positioning post is inserted into the engaging structure 111 and the fixing is completed, the distance between the image forming apparatus and the consumable is shortened, and the second matching surface 122 perpendicular to the extending direction of the positioning post is close to another contact pin on the image forming apparatus, so that the second contact 1221 on the second matching surface 122 is connected with the contact pin on the image forming apparatus.
Since the first contact 1211 and the second contact 1221 are located on the surfaces of the chip 12 in different directions, holes or grooves are not required to be formed on the chip 12, so that the contacts on the chip 12 can be connected with the contact pins on the positioning column of the imaging device, the structural difficulty and cost of the chip 12 are reduced, and the stability of electrical connection is enhanced.
The first contact 1211 and the second contact 1221 are used to electrically connect to the imaging device. Wherein generally the first contact 1211 may be provided as a ground contact.
It should be noted that the first contact 1211 and the second contact 1221 may be one contact or more than one contact, and when the first contact 1211 or the second contact 1221 is in the form of a plurality of contacts, corresponding contact pins on the imaging device should have the same number.
It should be noted that, since the consumable is generally stored separately, the surface of the consumable should have a few protruding portions to prevent the protruding portions of the consumable from being damaged by external force. Therefore, in the present application, unless otherwise specified, the electrical connection members on the chip are contacts, and the electrical connection members on the image forming apparatus are contact pins. In addition, as can be understood by those skilled in the art, in order to meet different needs, the electrical connection members on the chip may be contact pins, and the electrical connection members on the imaging device may be contacts, which is similar to the way in which the contacts are provided on the chip and the contact pins are provided on the imaging device in this application, and will not be described herein again.
To ensure proper contact between the contact pins and the first contacts 1211, the first mating surface 121 is adjacent to a sidewall of the locating post when the locating post is matingly inserted into the mating structure 111. Thus, by setting the distance between the chip 12 and the engaging structure 111, when the positioning post on the imaging device is inserted into the engaging structure 111, the first matching surface 121 on the chip 12 is adjacent to the sidewall of the positioning post. Thus, the contact pins disposed on the sidewall of the positioning posts can abut against the first contacts 1211 disposed on the first matching surface 121, and the electrical connection can be realized.
Specifically, the first matching surface 121 is adjacent to a sidewall of the positioning post, the first matching surface 121 may be closely attached to the sidewall of the positioning post, or a certain space may be maintained between the positioning post and the first matching surface 121, but the space enables the first contact 1211 and a contact pin on the imaging device to make contact.
In addition, as an alternative embodiment, the first matching surface 121 is provided with a protruding portion (not shown), and the first contact 1211 is located on the protruding portion. Due to the assembling precision and the like, when the consumable is installed on the imaging device, the distance between the first matching surface 121 and the sidewall of the positioning column may be relatively long, so the protruding convex portion can reduce the distance between the first contact 1211 and the sidewall of the positioning column, and ensure that the first contact 1211 and the contact pin on the imaging device are normally contacted.
Alternatively, the second mating face 122 is generally disposed toward a side adjacent the imaging device in order to allow the second contacts 1221 on the second mating face 122 to contact pins on the imaging device when the alignment post is inserted into the engagement structure. When the imaging device and the consumable are close to each other, the second matching surface 122 will directly face the imaging device, and the second contacts 1221 on the second matching surface 122 will contact with the corresponding contact pins on the imaging device, so as to complete the connection.
To reduce the difficulty of manufacturing the chip 12, at least one of the first matching surface 121 and the second matching surface 122 is a flat surface. Such a flat surface allows easy mounting and arrangement of contacts and other electrical components, allowing the first contact 1211 and the second contact 1221 to be conveniently disposed on the chip 12, making the chip 12 less difficult, less costly, and providing a contact with greater reliability.
In addition, the first matching surface 121 and the second matching surface 122 may also be configured to be an arc surface or a folded surface according to the shapes of the positioning post and the corresponding portion on the imaging device, so as to ensure that the first matching surface 121 or the second matching surface 122 has a sufficient proximity distance with the imaging device, and to enable a reliable connection between the contact and the contact pin.
Further, also to reduce the difficulty of manufacturing the chip 12, the contacts should be exposed on the outside of the chip 12, and therefore, the first matching surface 121 and the second matching surface 122 are generally the outer surfaces of the chip 12. The first contact 1211 and the second contact 1221 thus disposed on the first matching surface 121 and the second matching surface 122 are both located outside the chip 12, which is easy and inexpensive to manufacture.
And the engagement structure 111 may generally include one of a mounting hole, a mounting groove, or a notch in order to achieve a mating connection with the positioning post of the imaging device. The opening orientation of mounting hole or mounting groove all faces imaging device, and like this at the in-process of consumptive material installation to imaging device, the reference column can stretch into from the drill way of mounting hole or other meshing structure 111's opening part to get into the inside of meshing structures such as mounting hole, accomplish installation and accordant connection between the two.
To facilitate possible electrical testing of the chip 12, the first contact 1211 and the second contact 1221 also need to have a closer spacing and a less distinct orientation. At this time, the second contact 1221 may be extended to the first mating face 121. In particular, the second contact 1221 can be proximate to a peripheral region of the second mating face 122 and extend from an edge of the second mating face 122. Thus, the first mating face 121 has an extension of the first contact 1211 and the second contact 1221. In the case of inspecting the chip 12, the inspection can be performed on the first matching surface 121, and in this case, probes for inspection can be connected to the extensions of the first contact 1211 and the second contact 1221, respectively, and the electrical index of the chip 12 can be inspected through the extensions of the first contact 1211 and the second contact 1221 without providing different probes on different planes.
While the chip 12 is provided with the first contact 1211 and the second contact 1221, other components and structures are required, the area of the first matching surface 121 is generally larger than that of the second matching surface 122 for facilitating the arrangement of the other components, and electronic devices on the chip 12, such as a memory for storing consumable information and a circuit for connecting with the components, can be arranged on the outer wall of the chip parallel to the first matching surface 121.
In order to store and record information of consumables, the chip 12 may include an information storage portion (not shown) for storing information of consumables themselves or information of use of consumables by an imaging apparatus, etc., the information storage portion being generally located on the chip 12 at a position other than the first matching surface 121 and the second matching surface 122.
In this embodiment, the consumable is applied to imaging device, the consumable includes chip installation department and the chip of setting on the chip installation department, be provided with on the chip installation department adjacent with the chip and be used for supplying reference column matching male meshing structure on the imaging device, have on the chip with the parallel first matching face of extending direction with the reference column and with the perpendicular second matching face of extending direction of reference column, be provided with the first contact on the first matching face, be provided with the second contact on the second matching face, first contact and second contact all are used for with the contact pin accordant connection on the imaging device, first matching face and second matching face are the surface of chip, when the reference column matching is inserted to meshing structure, first matching face is adjacent with the lateral wall of reference column. Therefore, the contact on the chip can be connected with the contact pin on the imaging device without arranging a hole or a groove on the chip, the structural difficulty and the cost of the chip are reduced, and the stability of electric connection is enhanced.
Example two
In addition to the mating structure with the alignment posts, the chip may also be provided with other structures for mating with an imaging device to improve the reliability of the connection between the contacts and the contact pins. FIG. 6 is a schematic structural diagram of another consumable according to a second embodiment of the present invention. As shown in fig. 6, similar to the previous embodiment, the consumable of this embodiment, still applied to the image forming apparatus, the consumable comprises a chip mounting portion 11 and a chip 12 arranged on the chip mounting portion 11, a meshing structure 111 which is adjacent to the chip 12 and used for enabling a positioning column on an imaging device to be inserted in a matching mode is arranged on the chip mounting portion 11, a first matching surface 121 parallel to the extending direction of the positioning column and a second matching surface 122 perpendicular to the extending direction of the positioning column are arranged on the chip, a first contact 1211 is arranged on the first matching surface 121, a second contact 1221 is arranged on the second matching surface 122, the first contact 1211 and the second contact 1221 are used for being connected with a contact pin of the imaging device in a matching mode, the first matching surface 121 and the second matching surface 122 are outer surfaces of the chip 12, and when the positioning column is inserted into the meshing structure 111 in a matching mode, the first matching surface 121 is adjacent to a side wall of the positioning column.
In which the first contact 1211 and the contact pin of the imaging device may be restricted in the gap between the first mating surface 121 and the sidewall of the positioning post, so that even if the contact pin of the imaging device is loosened or slipped, reliable contact between the first contact 1211 and the contact pin can be ensured due to the restriction of the positioning post and the engagement structure. And since the second contact 1221 is located on the second matching surface 122 perpendicular to the extending direction of the positioning column and facing the imaging device, in order to ensure the contact between the exposed second contact 1221 and the contact pin, and to realize the matching and positioning between the consumable and the imaging device, a recess 122a is provided on the second matching surface 122, and the second contact 1221 is located in the recess 122 a.
In general, the recess 122a may be a pit or a groove, the inner part of the recess 122a is lower than the second matching surface 122, and the second contact 1221 is usually located at the bottom of the pit or the groove, so that when the component extends into the space in the recess 122a, if the component has a tendency to move along the second matching surface 122, the component is constrained in the recess 122a under the limitation of the pit wall or the groove wall and cannot be detached.
In this way, when the contact pin on the image forming apparatus extends to a position where it contacts the second contact 1221, since the second contact 1221 is located in the recess 122a, the tip of the contact pin is also limited to the area surrounded by the recess 122 a. Thus, if the contact pins slide or bend relative to the chip, the contact pins still do not fall out of the area of the recesses 122a due to the restriction of the recesses 122a, i.e., the contact pins always remain in contact with the second contacts 1221. This improves the reliability of the electrical connection between the contacts and the contact pins.
In the embodiment, the consumable is applied to an imaging device, and comprises a chip mounting part and a chip arranged on the chip mounting part, wherein a meshing structure which is adjacent to the chip and used for matching and inserting a positioning column on the imaging device is arranged on the chip mounting part, a first matching surface which is parallel to the extending direction of the positioning column and a second matching surface which is perpendicular to the extending direction of the positioning column are arranged on the chip, a first contact is arranged on the first matching surface, a second contact is arranged on the second matching surface, the first contact and the second contact are both used for matching and connecting with a contact pin on the imaging device, the first matching surface and the second matching surface are outer surfaces of the chip, and when the positioning column is matched and inserted into the meshing structure, the first matching surface is adjacent to the side wall of the positioning column; and the second matching surface is provided with a concave part, and the second contact is positioned in the concave part. Thus, when the contact pin on the imaging device is limited in the area enclosed by the concave part, the contact pin always keeps contact with the second contact. Thereby improving the reliability of the electrical connection between the contacts and the contact pins.
EXAMPLE III
In order to realize the positioning and matching connection between the consumable and the chip on the consumable while installing the consumable, the imaging device also has a structure matched with the external shape of the chip. Fig. 7 is a schematic structural diagram of an imaging apparatus according to a third embodiment of the present invention. As shown in fig. 7, the image forming apparatus provided in this embodiment includes an apparatus main body 21 and an electrical connection assembly 22 disposed on the apparatus main body 21, the electrical connection assembly 22 includes a protruding positioning column 221, a first contact pin 222a and a second contact pin 222b, the positioning column 221 is configured to be connected to a consumable in a matching manner, the first contact pin 222a is located on a sidewall of the positioning column 221, the second contact pin 222b is located on a side of the positioning column 221, and both the first contact pin 222a and the second contact pin 222b are configured to be electrically connected to a contact on the consumable. The imaging apparatus in this embodiment can be used to connect with the consumables of the first or second embodiment.
Specifically, the image forming apparatus may be a printer or other common devices, and includes a main body, a functional element for performing an image forming or printing function, and a structure for connecting to a consumable. Wherein, for being connected with the consumptive material, the imaging device is provided with the consumptive material portion of holding including the consumptive material, and is provided with electrical connection assembly 22 on the consumptive material portion of holding, and electrical connection assembly 22 is last to include the convex reference column 221 to the outside, and be used for respectively with the first contact pin 222a and the second contact pin 222b of different contact connection on the consumptive material.
The positioning post 221 can be used for matching and connecting with a mounting structure on the consumable, such as a meshing structure on the consumable. Locating posts 221 can have a variety of different shapes and configurations, for example, locating posts 221 can have a cross-section that is one of circular, directional, or other polygonal shape.
In the contact pins for connecting with the consumable, the first contact pin 222a is located on the sidewall of the positioning column 221, so that when the positioning column 221 is connected with the corresponding engaging structure on the consumable in a matching manner, the first contact pin 222a is located above the edge of the engaging structure along with the insertion of the positioning column 221, at this time, the first contact point which is also located on the edge of the engaging structure and faces the sidewall of the positioning column can be arranged on the chip, so that the first contact pin 222a is electrically connected and transmits signals through the contact with the first contact point.
Correspondingly, the second contact pin 222b is located at a side of the positioning column 221, for example, on a plane where the positioning column 221 is located, so that when the consumable is installed, the second contact pin 222b faces the consumable and contacts with a second contact point oppositely arranged on the consumable to realize electrical connection.
It should be noted that the first contact pin 222a and the second contact pin 222b can be one or more contact pins, and accordingly, the consumable has the same number of corresponding contacts.
Like this, imaging apparatus sets up different contact pilotage through the side at the lateral wall of reference column 221 and reference column 221, can install the in-process on imaging apparatus at the consumptive material, makes to form reliable contact connection and signal transmission between contact and the contact pilotage, and the last contact pilotage of imaging apparatus all sets up at the outside surface that exposes, and the manufacturing difficulty is lower, can effectively reduce manufacturing cost.
In this embodiment, imaging device is including equipment main part and the electrical connection subassembly of setting in equipment main part, and the last convex reference column, first contact pin and the second contact pin of including of electrical connection subassembly, reference column are used for the mating connection on the consumptive material, and first contact pin is located the lateral wall of reference column, and the second contact pin is located reference column side, and first contact pin and second contact pin all are used for and the contact electricity on the consumptive material to be connected. Through set up the contact pilotage on the reference column lateral wall like this, need not set up hole or groove on the chip, just can guarantee that the contact on the chip can be connected with the contact pilotage on the imaging equipment, has reduced the structure degree of difficulty and the cost of chip, has strengthened the stability of electricity connection.
Example four
On the basis of the first to third embodiments, the present application further provides an imaging system to achieve simple and reliable installation and electrical connection between the consumable and the imaging device. Fig. 8 is a schematic structural diagram of an imaging system according to a fourth embodiment of the present invention. As shown in fig. 8, the imaging system provided in this embodiment includes the consumable 1 described in the first embodiment or the second embodiment and the imaging device 2 described in the third embodiment. Wherein the consumable 1 and the image forming apparatus 2 in the image forming system can be mounted and connected together, thereby completing the image forming job. In the imaging system, the imaging device 2 includes an electrical connection assembly 22, the electrical connection assembly 22 includes a protruding positioning column 221, a first contact pin 222a and a second contact pin 222b, the positioning column 221 is used for being connected to the consumable 1 in a matching manner, the first contact pin 222a is located on a side wall of the positioning column 221, the second contact pin 222b is located on a side of the positioning column 221, and the first contact pin 222a and the second contact pin 222b are both used for being electrically connected to a contact on the consumable 1.
Specifically, the consumable 1 and the imaging device 2 in the imaging system are detachably connected, so that the consumable can be replaced conveniently. When mounting the consumable 1 onto the image forming apparatus 2, contact connection between the electrical connection members between the consumable 1 and the image forming apparatus 2 is also required. The following describes a connection method and a connection process between an image forming apparatus and consumables, taking a specific image forming system as an example.
Specifically, a consumable housing portion that can house the consumable 1 is provided on the apparatus main body 21 of the image forming apparatus 2, and the consumable 1 is detachably mounted on the image forming apparatus 2. An electrical connection assembly 22 is also provided within the consumable housing. The electrical connection assembly 22 is electrically connected to the chip 12 provided on the consumable 1 and transmits a communication signal between the imaging apparatus 2 and the consumable 1. The electrical connection assembly 22 includes a protruding positioning column 221, a first contact pin 222a and a second contact pin 222b, the positioning column 221 is used for being connected to the consumable 1 in a matching manner, the first contact pin 222a is located on a side wall of the positioning column 221, the second contact pin 222b is located on a side of the positioning column 221, the first contact pin 222a and the second contact pin 222b are both used for being electrically connected to a contact on the consumable 1, the first matching surface 121 and the second matching surface 122 are outer surfaces of the chip 12, and when the positioning column 221 is inserted into the engagement structure 111 in a matching manner, the first matching surface 121 is adjacent to a side wall of the positioning column 221.
One end of the consumable 1 comprises a chip mounting part 11 and a chip 12 arranged on the chip mounting part 11, wherein the chip mounting part 11 is provided with an engaging structure 111 adjacent to the chip 12 and used for matching and inserting a positioning column 221 on the imaging device 2 and a chip accommodating groove 112 used for accommodating the chip. Taking the example where the engaging structure 111 is a circular groove, the engaging structure 111 is used to accommodate the positioning post 221 on the main body 21 of the imaging device 2, and the chip accommodating groove 112 is located on one side of the engaging structure 111 and is adjacent to the engaging structure 111.
The chip 12 has a first matching surface 121 parallel to the extending direction of the positioning post 221 and a second matching surface 122 perpendicular to the extending direction of the positioning post 221, the first matching surface 121 is provided with a first contact 1211, the second matching surface 122 is provided with a second contact 1221, and the first contact 1211 and the second contact 1221 are both used for matching connection with the contact pins of the imaging device 2.
Optionally, the first matching surface 121 and the second matching surface 122 are two outer walls of the chip 12, respectively, and the area of the first matching surface 121 is generally larger than that of the second matching surface 122, and electronic devices on the chip 12, such as a memory, a circuit, etc., can be disposed on the outer wall of the chip 12 parallel to the first matching surface 121.
When the chip 12 is mounted in the chip-receiving cavity 112 of the chip mounting portion 11, the second matching surface 122 is exposed outside the consumable 1, and the first matching surface 121 is disposed opposite to the engaging structure 111. When the consumable 1 is inserted into the imaging device 2, the positioning posts 211 are fully inserted into the engagement structures 111, and the first mating surfaces 121 on the chip 1 can complete the contact connection between the first contacts 1211 and the first contact pins 222a together with the positioning posts 211.
In order to ensure reliable contact between the contacts and the contact pins, the first contact pin 222a is in a free state, and is spaced from the center of the positioning post 211 by a distance greater than the distance between the first mating surface 121 and the center of the engagement structure 111. This is because the first mating surface 121 is closer to the center line of the positioning post 211 than the first contact pin 222 a. Therefore, when the first contact pins 222a are inserted into the engaging structures 111 along with the positioning posts 211, the first contact pins 222a are pressed by the first matching surfaces 121 to deform, so that the first contact pins 222a contact the first contacts 1211 in the engaging structures 111, thereby ensuring direct electrical contact and communication between the imaging device 2 and the chip 11.
Alternatively, when the positioning posts 211 are matingly inserted into the engagement structures 111, the positioning posts 211 are generally located outside the chip 12. When the consumable 1 is inserted into the imaging apparatus 2, the chip mounting portion 11 corresponds to the electrical connection assembly 22 of the imaging apparatus 2, and the axis of the positioning post 211 substantially coincides with the center line of the engagement structure 111. The positioning posts 211 are fully inserted into the engaging structures 111, the chip 12 is on one side of the engaging structures 111, and thus the positioning posts 211 are also on one side of the chip 12 without passing through the chip 12, so that the chip 12 has a simpler structure.
In this embodiment, the imaging system includes a consumable and an imaging device; the consumable comprises a chip mounting part and a chip arranged on the chip mounting part, wherein a meshing structure which is adjacent to the chip and used for matching and inserting a positioning column on imaging equipment is arranged on the chip mounting part, a first matching surface which is parallel to the extending direction of the positioning column and a second matching surface which is vertical to the extending direction of the positioning column are arranged on the chip, a first contact is arranged on the first matching surface, a second contact is arranged on the second matching surface, the first contact and the second contact are both used for matching and connecting with a contact pin on the imaging equipment, the first matching surface and the second matching surface are the outer surface of the chip, and when the positioning column is matched and inserted into the meshing structure, the first matching surface is adjacent to the side wall of the positioning column; imaging device is including equipment main part and the electrical connection subassembly of setting in equipment main part, including convex reference column, first contact pilotage and second contact pilotage on the electrical connection subassembly, and the reference column is used for the mating connection on the consumptive material, and first contact pilotage is located the lateral wall of reference column, and the second contact pilotage is located reference column side, and first contact pilotage and second contact pilotage all are used for and the contact electricity on the consumptive material is connected. Therefore, the contact on the chip can be connected with the contact pin on the imaging device without arranging a hole or a groove on the chip, the structural difficulty and the cost of the chip are reduced, and the stability of electric connection is enhanced.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (13)
1. A consumable applied to an imaging device, the consumable comprising a chip mounting portion and a chip disposed on the chip mounting portion, it is characterized in that the chip mounting part is provided with a meshing structure which is adjacent to the chip and used for the matching and inserting of the positioning column on the imaging equipment, the chip is provided with a first matching surface parallel to the extending direction of the positioning column and a second matching surface vertical to the extending direction of the positioning column, the first matching surface is provided with a first contact, the second matching surface is provided with a second contact, the first contact and the second contact are each for mating connection with a contact pin of the imaging device, the first matching surface and the second matching surface are outer surfaces of the chip, and when the positioning column is inserted into the engagement structure in a matching mode, the first matching surface is adjacent to the side wall of the positioning column.
2. The consumable of claim 1, wherein the second mating face is disposed toward a side proximate to the imaging device.
3. The consumable according to claim 1, wherein at least one of the first and second mating surfaces is planar.
4. The consumable of claim 1, wherein the engagement structure comprises one of a mounting hole, a mounting groove, or a notch.
5. The consumable of claim 1, wherein the second contact extends to the first mating face.
6. The consumable according to claim 1, wherein the second mating face is provided with a recess, the second contact being located within the recess.
7. The consumable of claim 1, wherein the first mating face is provided with a boss on which the first contact is located.
8. The consumable according to claim 1, wherein the area of the first matching surface is larger than the area of the second matching surface.
9. The consumable according to claim 1, wherein the first contact is a ground contact.
10. The consumable according to claim 1, wherein the chip comprises an information storage portion located on the chip at a location other than the first matching surface and the second matching surface.
11. An imaging system comprising the consumable of any of claims 1-10, and an imaging device comprising an electrical connection assembly, wherein the electrical connection assembly comprises a protruding positioning post for mating connection to the consumable, a first contact pin located on a sidewall of the positioning post, and a second contact pin located to the side of the positioning post, the first contact pin and the second contact pin for electrical connection to different contacts on the consumable.
12. The imaging system of claim 11, wherein the first contact pin is spaced further from a center of the locating post than the first mating surface is spaced from a center of the engagement structure when the first contact pin is in the free state.
13. The imaging system of claim 11, wherein the locating posts are located outside of the chip when the locating posts are matingly inserted into the engagement structures.
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| CN201710852150.9A CN107608192B (en) | 2017-09-19 | 2017-09-19 | Consumable, imaging device and imaging system |
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| CN201710852150.9A CN107608192B (en) | 2017-09-19 | 2017-09-19 | Consumable, imaging device and imaging system |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108931910B (en) * | 2018-09-17 | 2021-08-03 | 广州众诺电子技术有限公司 | Mounting device, chip assembly, imaging box and imaging equipment |
| CN214751346U (en) * | 2020-07-29 | 2021-11-16 | 珠海艾派克微电子有限公司 | Processing box |
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Address after: 519075 area B, 7th floor, building 04, No. 63, Mingzhu North Road, Qianshan, Zhuhai, Guangdong Patentee after: Jihai Microelectronics Co.,Ltd. Address before: 519075 area B, 7th floor, building 04, No. 63, Mingzhu North Road, Qianshan, Zhuhai, Guangdong Patentee before: APEX MICROELECTRONICS Co.,Ltd. |