CN107577056B - 在激光退火系统中用于控制边缘轮廓的定制光瞳光阑形状 - Google Patents

在激光退火系统中用于控制边缘轮廓的定制光瞳光阑形状 Download PDF

Info

Publication number
CN107577056B
CN107577056B CN201710626274.5A CN201710626274A CN107577056B CN 107577056 B CN107577056 B CN 107577056B CN 201710626274 A CN201710626274 A CN 201710626274A CN 107577056 B CN107577056 B CN 107577056B
Authority
CN
China
Prior art keywords
aperture
numerical aperture
laser
optical element
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201710626274.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN107577056A (zh
Inventor
道格拉斯·E·霍姆格伦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN107577056A publication Critical patent/CN107577056A/zh
Application granted granted Critical
Publication of CN107577056B publication Critical patent/CN107577056B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/0988—Diaphragms, spatial filters, masks for removing or filtering a part of the beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • C21D1/06—Surface hardening
    • C21D1/09—Surface hardening by direct application of electrical or wave energy; by particle radiation
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0911—Anamorphotic systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
    • H10P34/40—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation
    • H10P34/42—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation with electromagnetic radiation, e.g. laser annealing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
    • H10P34/40—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation
    • H10P34/42—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation with electromagnetic radiation, e.g. laser annealing
    • H10P34/422—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation with electromagnetic radiation, e.g. laser annealing using incoherent radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Laser Beam Processing (AREA)
  • Recrystallisation Techniques (AREA)
  • Electromagnetism (AREA)
  • Lasers (AREA)
CN201710626274.5A 2013-03-12 2013-12-18 在激光退火系统中用于控制边缘轮廓的定制光瞳光阑形状 Active CN107577056B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361777531P 2013-03-12 2013-03-12
US61/777,531 2013-03-12
CN201380074089.XA CN105026097B (zh) 2013-03-12 2013-12-18 在激光退火系统中用于控制边缘轮廓的定制光瞳光阑形状

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201380074089.XA Division CN105026097B (zh) 2013-03-12 2013-12-18 在激光退火系统中用于控制边缘轮廓的定制光瞳光阑形状

Publications (2)

Publication Number Publication Date
CN107577056A CN107577056A (zh) 2018-01-12
CN107577056B true CN107577056B (zh) 2020-04-03

Family

ID=51526290

Family Applications (4)

Application Number Title Priority Date Filing Date
CN201710626274.5A Active CN107577056B (zh) 2013-03-12 2013-12-18 在激光退火系统中用于控制边缘轮廓的定制光瞳光阑形状
CN201380074089.XA Active CN105026097B (zh) 2013-03-12 2013-12-18 在激光退火系统中用于控制边缘轮廓的定制光瞳光阑形状
CN201610048597.6A Active CN105643107B (zh) 2013-03-12 2013-12-18 在激光退火系统中用于控制边缘轮廓的定制光瞳光阑形状
CN201710676222.9A Active CN107479203B (zh) 2013-03-12 2013-12-18 在激光退火系统中用于控制边缘轮廓的定制光瞳光阑

Family Applications After (3)

Application Number Title Priority Date Filing Date
CN201380074089.XA Active CN105026097B (zh) 2013-03-12 2013-12-18 在激光退火系统中用于控制边缘轮廓的定制光瞳光阑形状
CN201610048597.6A Active CN105643107B (zh) 2013-03-12 2013-12-18 在激光退火系统中用于控制边缘轮廓的定制光瞳光阑形状
CN201710676222.9A Active CN107479203B (zh) 2013-03-12 2013-12-18 在激光退火系统中用于控制边缘轮廓的定制光瞳光阑

Country Status (7)

Country Link
US (2) US9395545B2 (https=)
EP (1) EP2969368A4 (https=)
JP (1) JP6346263B2 (https=)
KR (3) KR102091652B1 (https=)
CN (4) CN107577056B (https=)
TW (2) TWI645457B (https=)
WO (1) WO2014143298A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102091652B1 (ko) * 2013-03-12 2020-03-20 어플라이드 머티어리얼스, 인코포레이티드 레이저 어닐링 시스템들에서의 에지 프로파일의 제어를 위한 맞춤화된 퍼필 스톱 장치
CN110133772B (zh) * 2019-06-25 2024-06-11 南京溯远基因科技有限公司 光阑装置及基因测序仪
CN111921174A (zh) * 2020-06-19 2020-11-13 合肥润成体育用品有限公司 一种羽毛球拍手柄制作方法
CN112355488B (zh) * 2020-11-05 2021-12-03 中国工程物理研究院激光聚变研究中心 一种抗激光损伤的软边光阑制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5059013A (en) * 1988-08-29 1991-10-22 Kantilal Jain Illumination system to produce self-luminous light beam of selected cross-section, uniform intensity and selected numerical aperture
CN1474235A (zh) * 2002-06-11 2004-02-11 ASML�عɹɷ����޹�˾ 用于微光刻法的先进的照明系统
US7176405B2 (en) * 2005-04-22 2007-02-13 Ultratech, Inc. Heat shield for thermal processing
US7196773B2 (en) * 2003-09-12 2007-03-27 Canon Kabushiki Kaisha Illumination optical system and exposure apparatus using the same
CN101047111A (zh) * 2006-03-27 2007-10-03 激光先进技术股份公司 激光退火设备

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3750693T3 (de) * 1986-11-28 1999-12-23 Fuji Photo Film Co., Ltd. Optisches System für Laser.
US4912321A (en) * 1987-03-26 1990-03-27 Texas Instruments Incorporated Radiation scanning system with pupil control
US5305054A (en) * 1991-02-22 1994-04-19 Canon Kabushiki Kaisha Imaging method for manufacture of microdevices
US5473408A (en) * 1994-07-01 1995-12-05 Anvik Corporation High-efficiency, energy-recycling exposure system
US5642287A (en) 1995-03-02 1997-06-24 Sotiropoulos; Nicholas Sculpturing device for laser beams
JPH09326343A (ja) * 1996-06-04 1997-12-16 Nikon Corp 露光方法及び装置
KR980005334A (ko) * 1996-06-04 1998-03-30 고노 시게오 노광 방법 및 노광 장치
JP3760235B2 (ja) * 2003-04-04 2006-03-29 独立行政法人 宇宙航空研究開発機構 半導体レーザ及び半導体レーザの発振方法
WO2007077875A1 (ja) * 2005-12-28 2007-07-12 Nikon Corporation 露光装置及び露光方法、並びにデバイス製造方法
JP5191674B2 (ja) * 2007-03-05 2013-05-08 株式会社アルバック レーザーアニール装置及びレーザーアニール方法
CA2684602A1 (en) 2007-04-23 2008-11-06 California Institute Of Technology Single-lens, 3-d imaging device using polarization-coded aperture masks combined with a polarization-sensitive sensor
JP2009072789A (ja) * 2007-09-18 2009-04-09 Hamamatsu Photonics Kk レーザ加工装置
TWI566051B (zh) * 2008-01-21 2017-01-11 尼康股份有限公司 照明裝置、曝光裝置、曝光方法以及元件製造方法
JP4655136B2 (ja) * 2008-10-28 2011-03-23 ソニー株式会社 対物レンズ、これを用いた光学ピックアップ装置、光記録再生装置及び収差補正方法
JP5385652B2 (ja) * 2009-03-24 2014-01-08 キヤノン株式会社 位置検出装置、露光装置、位置検出方法、露光方法及びデバイス製造方法
CN102063014A (zh) * 2009-11-13 2011-05-18 上海微电子装备有限公司 一种用于微光刻的照明光学系统
JP5595021B2 (ja) * 2009-12-03 2014-09-24 住友重機械工業株式会社 レーザ処理装置
DE102010029089B4 (de) * 2010-05-18 2019-08-29 Carl Zeiss Ag Optisches System zur Kalibrierung einer Lichtquelle
TWI448671B (zh) * 2011-05-05 2014-08-11 Sunplus Technology Co Ltd 溫度感測裝置
US20120325784A1 (en) 2011-06-24 2012-12-27 Applied Materials, Inc. Novel thermal processing apparatus
US9064165B2 (en) * 2012-03-28 2015-06-23 Metrologic Instruments, Inc. Laser scanning system using laser beam sources for producing long and short wavelengths in combination with beam-waist extending optics to extend the depth of field thereof while resolving high resolution bar code symbols having minimum code element widths
KR102091652B1 (ko) * 2013-03-12 2020-03-20 어플라이드 머티어리얼스, 인코포레이티드 레이저 어닐링 시스템들에서의 에지 프로파일의 제어를 위한 맞춤화된 퍼필 스톱 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5059013A (en) * 1988-08-29 1991-10-22 Kantilal Jain Illumination system to produce self-luminous light beam of selected cross-section, uniform intensity and selected numerical aperture
CN1474235A (zh) * 2002-06-11 2004-02-11 ASML�عɹɷ����޹�˾ 用于微光刻法的先进的照明系统
US7196773B2 (en) * 2003-09-12 2007-03-27 Canon Kabushiki Kaisha Illumination optical system and exposure apparatus using the same
US7176405B2 (en) * 2005-04-22 2007-02-13 Ultratech, Inc. Heat shield for thermal processing
CN101047111A (zh) * 2006-03-27 2007-10-03 激光先进技术股份公司 激光退火设备

Also Published As

Publication number Publication date
CN105026097B (zh) 2017-08-29
CN107577056A (zh) 2018-01-12
US9395545B2 (en) 2016-07-19
JP6346263B2 (ja) 2018-06-20
KR101994993B1 (ko) 2019-07-01
CN105026097A (zh) 2015-11-04
CN105643107A (zh) 2016-06-08
US20160327801A1 (en) 2016-11-10
KR20150132302A (ko) 2015-11-25
TW201816854A (zh) 2018-05-01
US10444522B2 (en) 2019-10-15
EP2969368A1 (en) 2016-01-20
WO2014143298A1 (en) 2014-09-18
CN107479203A (zh) 2017-12-15
US20140268749A1 (en) 2014-09-18
TW201435994A (zh) 2014-09-16
TWI607493B (zh) 2017-12-01
KR20170081277A (ko) 2017-07-11
KR102091652B1 (ko) 2020-03-20
KR101754265B1 (ko) 2017-07-06
CN107479203B (zh) 2020-12-29
JP2016518698A (ja) 2016-06-23
CN105643107B (zh) 2019-03-01
KR20190079693A (ko) 2019-07-05
EP2969368A4 (en) 2016-11-16
TWI645457B (zh) 2018-12-21

Similar Documents

Publication Publication Date Title
KR101115077B1 (ko) 레이저 박막 폴리실리콘 어닐링 시스템
KR101167324B1 (ko) 레이저 박막 폴리실리콘 어닐링 광학 시스템
BR112016024485B1 (pt) Dispositivo para projeção de máscara de feixes de laser de femtossegundos e picossegundos em uma superfície de substrato
CN107577056B (zh) 在激光退火系统中用于控制边缘轮廓的定制光瞳光阑形状
TWI546147B (zh) 用於照射半導體材料之裝置及其用途
JP6526855B6 (ja) アドバンスアニールプロセスにおいて粒子を低減させる装置および方法
US9958709B2 (en) Dynamic optical valve for mitigating non-uniform heating in laser processing

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant