CN107571433B - Method for manufacturing semiconductor package - Google Patents
Method for manufacturing semiconductor package Download PDFInfo
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- CN107571433B CN107571433B CN201710445072.0A CN201710445072A CN107571433B CN 107571433 B CN107571433 B CN 107571433B CN 201710445072 A CN201710445072 A CN 201710445072A CN 107571433 B CN107571433 B CN 107571433B
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- resin
- temporary transfer
- transfer layer
- release film
- layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/68—Release sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/58—Applying the releasing agents
Abstract
The present invention relates to a method for manufacturing a semiconductor package, which includes: a step of preparing a release film (10), wherein the release film (10) comprises a support layer (11) having releasability and a temporary transfer layer (12) provided on one surface of the support layer (11); a step of extrusion-molding the resin with a mold through a release film (10); transferring the temporary transfer layer (12) of the release film (10) to the sealing section (25) of the resin molded article; a step of removing the temporary transfer layer (12) transferred to the seal section (25); the purpose of the present invention is to provide a novel method for producing a resin molded article obtained by molding a resin having high adhesiveness.
Description
Technical Field
The present invention relates to a method of manufacturing a semiconductor package.
Background
In the production of a printed circuit board, a sealing portion of an electronic device such as a ceramic electronic component or a semiconductor package, or other various resin products, a mold release film is used to prevent adhesion of a resin to a mold or a roll.
As a material of the release film, a material having high releasability from a mold and heat resistance capable of withstanding a molding temperature is used. For example, a method of using a fluorine-based resin such as ethylene-tetrafluoroethylene copolymer (ETFE) as a release film is known. Patent document 1 discloses a method of using a biaxially oriented polystyrene film containing a Syndiotactic Polystyrene (SPS) resin and an antioxidant as a release film.
[ Prior art documents ]
[ patent document ]
[ patent document 1] Japanese patent laid-open No. 2015-21017
Disclosure of Invention
[ problems to be solved by the invention ]
However, due to the resin, there are the following phenomena: even when the release film as described above is used, the release film adheres to the resin molded product.
The present invention aims to provide a novel method for producing a resin molded article obtained by molding such a resin having high adhesiveness and adhesion. Further, it is an object to provide a release film which can be preferably used in such a production method.
[ means for solving problems ]
The release film of the present invention is a release film used for resin molding, characterized in that: the temporary transfer layer transfers at least a part of the temporary transfer layer to a resin molded product and removes the resin molded product from the resin molded product.
The release film of the present invention is used between a resin and a molding die (e.g., a metal die or a resin die) or a roll. Therefore, when the resin is molded by the molding die or the roll, the resin does not contact the molding die or the roll. Further, since only the temporary transfer layer is transferred to the resin molded product, it can be easily removed from the resin molded product. The release film is suitable for molding a resin having high adhesiveness and adhesiveness with a mold or a roll.
In the release film of the present invention, when the thickness of the temporary transfer layer is 35 μm or less, the temporary transfer layer can be more easily removed after transfer to a resin molded article.
In the release film of the present invention, when the support layer has a biaxially oriented SPS-based polymer film, the release film is excellent in releasability, heat resistance and chemical resistance.
The method for producing a resin molded article of the present invention is characterized by comprising: a step of preparing a release film including a support layer having releasability and a temporary transfer layer provided on one surface of the support layer; molding a resin through the release film; transferring at least a part of the temporary transfer layer of the release film to a resin molded article; and removing the temporary transfer layer transferred to the resin molded product.
The method for producing a resin molded product of the present invention can reduce the wear of a molding die without complicating the production process. Particularly, it is suitable for molding a resin having poor releasability and high adhesiveness/adhesion with a mold.
The step of molding the resin in the present invention is preferably a step of molding the resin with a mold or a roll.
The step of removing the temporary transfer layer in the present invention is preferably a step of removing the temporary transfer layer by polishing, spraying, or washing. In this case, the step of removing the temporary transfer layer can be simplified. In particular, in the case where the resin molded article is an electronic device including a resin sealing portion, the removal of the temporary transfer layer can be performed in a polishing step of the surface of the sealing portion for thinning after the sealing portion is molded, a polishing step for exposing the connection electrode, or the like, and the release film of the present invention can be used in a conventional manufacturing process without further increasing the number of steps.
Drawings
Fig. 1 (a) is a side view showing one embodiment of the release film of the present invention, and fig. 1 (b) is a side view showing another embodiment of the release film of the present invention.
Fig. 2 (a), (b), and (c) are schematic diagrams showing resin molding steps in the method for producing a resin molded article according to the embodiment of the present invention.
Fig. 3 (a) is a schematic diagram showing a transfer step of a temporary transfer layer in an embodiment of the method for producing a resin molded article of the present invention, and fig. 3 (b) and (c) are schematic diagrams showing a transfer step of a temporary transfer layer in other embodiments of the method for producing a resin molded article of the present invention.
Fig. 4 (a) and (b) are schematic diagrams showing a resin molding step of an example.
Description of symbols:
10. 10 a: mold release film
11: supporting layer
11 a: a layer in contact with at least the resin molding surface 30a of the molding die
11 b: at least the layer in contact with the temporary transfer layer 12
12: temporary transfer layer
12 a: transferred part
12 b: remaining part
15: substrate
16: spacer member
20: resin composition
25: sealing part
30: forming die
30 a: resin molding surface
31: upper forming die
31 a: concave part
31 b: suction port
32: lower forming die
32 a: suction port
Detailed Description
The release film of the present embodiment includes, as shown in fig. 1 (a) to 1 (b): a support layer 11 having releasability, and a temporary transfer layer 12 provided on one surface (a lower surface in fig. 1a to 1 b) of the support layer 11.
The release film 10 is a film to be disposed between the resin 20 and the mold 30 and to mold the resin 20 with the mold 30 without directly contacting the resin molding surface 30a of the mold 30 with the resin 20 (see (a) and (b) in fig. 2).
The support layer 11 is in contact with the resin molding surface 30a of the molding die 30. The support layer 11 is excellent in releasability from the molding die 30 and slidability, and has toughness following the irregularities of the molding die 30. Further, the resin composition has heat resistance capable of withstanding a molding temperature.
The thickness of the support layer 11 is preferably 20 μm or more, more preferably 25 μm or more, particularly preferably 30 μm or more, preferably 100 μm or less, more preferably 90 μm or less, further preferably 80 μm or less, particularly preferably 75 μm or less. Either too thin or too thick can complicate manufacturing or operation.
Examples of the support layer 11 include synthetic resin films such as polyester resins including styrene polymers, propylene polymers, ethylene polymers, and polyethylene terephthalate (PET), and fluorine resins including polyvinyl fluoride (PVF), polyvinylidene fluoride (PVDF), and ethylene-tetrafluoroethylene copolymers (ETFE).
The styrene polymer is preferably a polymer having a syndiotactic structure (SPS-based polymer). The SPS-based polymer may be exemplified by polystyrene, poly (alkylstyrene), poly (halogenated styrene), poly (halogenated alkylstyrene), poly (alkoxystyrene), poly (vinylbenzoate), hydrogenated polymers thereof, and mixtures thereof, or copolymers containing these as a main component. Examples of the poly (alkylstyrene) include poly (methylstyrene), poly (ethylstyrene), poly (isopropylstyrene), poly (t-butylstyrene), poly (phenylstyrene), poly (vinylnaphthalene), and poly (vinylstyrene). Examples of the poly (halogenated styrene) include poly (chlorostyrene), poly (bromostyrene), and poly (fluorostyrene). Examples of the poly (halogenated alkylstyrene) include poly (chloromethylstyrene). Examples of the poly (alkoxystyrene) include poly (methoxystyrene) and poly (ethoxystyrene).
The synthetic resin film is preferably a biaxially oriented resin film. For example, biaxial orientation may be performed by simultaneous or sequential stretching. Such a biaxially oriented synthetic resin film is preferably an SPS polymer simultaneous (sequential) biaxially oriented film or a PET simultaneous (sequential) biaxially oriented film, and particularly preferably an SPS polymer simultaneous biaxially oriented film.
On the other hand, as in the release film 10a shown in fig. 1 (b), the support layer 11 may have a 2-layer structure or a multilayer structure having 3 or more layers. In this case, for example, the layer 11a that is in contact with at least the resin molding surface 30a of the molding die is a layer having excellent releasability and sliding properties with respect to the resin molding surface 30a of the molding die. At least the layer 11b in contact with the temporary transfer layer 12 is a layer that is easily peeled off from the temporary transfer layer 12, or a layer having a low interlayer adhesion strength to the temporary transfer layer 12.
The temporary transfer layer 12 is a layer in contact with the resin 20. The temporary transfer layer 12 is transferred to the surface of the resin molded article in the process of separating the release film 10 from the resin molded article after the resin 20 is molded into the resin molded article, and is then removed from the resin molded article.
The interlayer adhesion strength of the temporary transfer layer 12 to the resin 20 is greater than the interlayer adhesion strength of the temporary transfer layer 12 to the support layer 11. Therefore, after the resin 20 is sealed, the temporary transfer layer 12 can be easily peeled off from the support layer 11 and transferred onto the resin molded product. The temporary transfer layer 12 has toughness following the irregularities of the molding die. Further, the influence of the molding temperature is preferably small. For example, it is preferable that the resin composition does not thermally decompose to generate gas or foam, and embrittle to generate cracks.
When the temporary transfer layer 12 is removed from the resin molded product by polishing or spraying, the temporary transfer layer 12 preferably has a low viscosity and a low elasticity. On the other hand, when the temporary transfer layer 12 is cleaned with a liquid (water, solvent) and removed from the resin molded product, the temporary transfer layer 12 preferably exhibits solubility to the liquid (water, solvent).
The thickness of the temporary transfer layer 12 is preferably 35 μm or less, more preferably 25 μm or less, and particularly preferably 15 μm or less. If the thickness is too large, removal after transfer to a resin molded article becomes complicated. On the other hand, if the thickness is too thin, lamination becomes difficult, and if the film is broken at the time of resin molding, the resin 20 penetrates the temporary transfer layer 12 and comes into contact with the support layer 11, it is preferably 5nm or more, more preferably 50nm or more, and particularly preferably 1 μm or more.
The temporary transfer layer 12 may be laminated on one surface of the support layer 11 by coating, extrusion lamination, thermal lamination, vapor deposition, sputtering, dry lamination, printing, or the like.
The material of the temporary transfer layer 12 can be appropriately selected depending on the materials of the support layer 11 and the resin 20. Examples of the synthetic resin include polyolefin-based resins such as polyethylene and polypropylene, polyvinyl alcohol, polyester-based resins, acrylic resins, polyurethane-based resins, epoxy-based resins, polyamide-based resins, silicone-based resins, fluorine-based resins, synthetic rubbers, and modified products and mixtures thereof. Further, metals, metal oxides, silica, and the like, and various printing inks and the like can be cited.
Next, a method for producing a resin molded product according to the present embodiment will be described.
The method for producing a resin molded article according to the present embodiment includes: preparing a release film 10; a step of extrusion-molding the resin 20 with the mold 30 through the release film 10; a step of transferring the temporary transfer layer 12 of the release film 10 onto a resin molded article; and a step of removing the temporary transfer layer 12 transferred to the resin molded product.
Fig. 2 (a) to (c) show an outline of the steps of extrusion molding the resin 20 with the mold 30 through the release film 10. In this step, a sealing portion 25 covering the upper surface of the substrate 15 is formed. The sealing portion is preferably a sealing portion of a semiconductor package for sealing a substrate on which a semiconductor element is mounted.
As shown in fig. 2 (a), the forming die 30 includes an upper forming die 31 and a lower forming die 32. The upper molding die 31 is provided with a recess 31a, and if the upper molding die 31 and the lower molding die 32 are brought close to each other, a space is generated. The inner surface of the recess 31a serves as a resin molding surface 30 a.
Next, as shown in fig. 2 (b), the release film 10 is deformed along the concave portion 31a of the upper molding die 31 and fixed to the upper molding die 31 (the lower surface in fig. 2 (a)). The release film 10 can be fixed by, for example, sucking from a suction port 31b of the upper molding die 31. On the other hand, the substrate 15 is placed on the lower molding die 32, and the resin 20 is filled thereon. Thus, the substrate 15, the resin 20, and the release film 10 are sequentially arranged from below between the upper molding die 31 and the lower molding die 32. The substrate 15 is preferably fixed to the lower molding die 32. This fixation can be performed by, for example, suction from the suction port 32a of the lower molding die 32.
As shown in fig. 2 (c), the resin molding surface 30a of the upper molding die 31 is heated to a molding temperature, the upper molding die 31 (or the lower molding die 32) is brought close to the lower molding die 32 (or the upper molding die 31), and the resin 20 is molded into the sealing portion 25 while pressurizing the space between the upper molding die 31 and the lower molding die 32. The molding temperature can be selected according to the resin 20 to be molded. For example, 100 ℃ or higher, preferably 130 ℃ or higher, and particularly preferably 150 ℃ or higher, and the upper limit is about 250 ℃ or lower, and usually 200 ℃ or lower. As the support layer 11, an SPS stretched film, particularly an SPS biaxially stretched film, is preferably used for a resin molded at about 130 to 200 ℃.
In the manufacturing method of this embodiment, the substrate 15, the resin 20, and the release film 10 may be arranged in this order from the bottom to perform resin molding, and the positional relationship may be inverted from the top to the bottom. That is, the release film 10 may be fixed to the lower molding die, the substrate 15 may be fixed to the upper molding die, and the resin 20 may be disposed on the release film 10.
The manufacturing method of this embodiment is used for compression molding in which the resin 20 is molded while being compressed by upper and lower molding dies, but is not limited to this. For example, the present invention may be used for injection molding or transfer molding in which a space formed between upper and lower molding dies is filled with a molten resin or a powdery or liquid prepolymer and solidified. In addition, it can be used in roll forming. Further, the molding die may be a resin die instead of a metal die.
Examples of the resin 20 include: thermosetting resins such as epoxy resins, melamine resins, urea resins, alkyd resins and polyimide resins, and thermoplastic resins such as polyester resins, polyurethane resins and acrylic resins. In particular, epoxy resins have low oxygen/moisture permeability and high chemical resistance, and therefore are suitable as sealing portions of electronic devices such as semiconductor packages, printed circuit boards, and ceramic electronic components.
Examples of the resin molded article include: semiconductor packages having sealing portions, printed circuit boards, other electronic devices such as ceramic electronic components, thermosetting resin products, thermoplastic resin products, and the like. Semiconductor packages are particularly preferred. In this embodiment, a semiconductor package in which one surface of a substrate is sealed is described, but the entire substrate may be sealed. In this case, the resin molding is performed by sandwiching the release film between the upper mold and the resin and between the lower mold and the resin.
Next, a step of transferring the temporary transfer layer 12 of the release film 10 to the resin molded product will be described. That is, after the upper molding die 31 is separated from the lower molding die 32, or simultaneously with the separation, the release film 10 is separated from the resin molded article, whereby the temporary transfer layer 12 of the release film 10 is peeled from the support layer 11 and transferred onto the sealing portion 25 of the resin molded article.
Fig. 3 (a) shows a case where the temporary transfer layer 12 is transferred to the seal portion 25 only at a portion in contact with the seal portion 25. That is, the temporary transfer layer 12 is partially cut and divided into a portion 12a transferred to the sealing portion 25 and a portion 12b remaining on the release film 10. In this case, the subsequent step of removing the temporary transfer layer 12 becomes easy.
In fig. 3, (b) shows that the entire temporary transfer layer 12 is transferred to the seal portion 25.
In fig. 3, (c) shows that a part of the temporary transfer layer 12 in contact with the sealing portion 25 is transferred to the sealing portion 25. That is, as in fig. 3 (a), the temporary transfer layer 12 is divided into a portion 12a transferred to the seal portion 25 and a portion 12b remaining on the release film 10.
Finally, a procedure for removing the temporary transfer layer 12 transferred to the resin molded product will be described.
The method of removing the temporary transfer layer 12 transferred to the sealing portion 25 of the resin molded product includes polishing, spraying, washing, and the like. For example, although the method of manufacturing a semiconductor package includes a step of polishing the surface of the sealing portion for thinning after the sealing portion 25 is formed, the polishing step may also be used as the step of removing the temporary transfer layer 12. In this case, since the manufacturing can be performed by the same number of steps as before using existing equipment, the complexity of the manufacturing steps can be avoided and the manufacturing cost can be reduced.
[ examples ]
[ example 1]
A release film 10 of fig. 1 (a) was obtained by applying polyvinyl alcohol (PVA) to one surface of a 50 μm SPS polymer simultaneous biaxial stretching film (support layer 11) to form a PVA layer (temporary transfer layer 12). The thickness of the PVA layer after coating and drying was 10 μm. This was defined as example 1.
[ example 2]
A linear low-density polyethylene (LLDPE) was simultaneously laminated by extrusion on one side of a 50 μm SPS polymer biaxially stretched film (support layer 11) to provide a 15 μm LLDPE layer (temporary transfer layer 12), and a release film 10 shown in fig. 1 (a) was obtained. This was defined as example 2.
[ example 3]
A linear low-density polyethylene (LLDPE) was extrusion-laminated on one side of a PET simultaneous biaxially stretched film (support layer 11) to provide a 15 μm LLDPE layer (temporary transfer layer 12), and a release film 10 of fig. 1 (a) was obtained. This was defined as example 3.
The compositions of examples 1 to 3 are shown in table 1.
[ Table 1]
| Example 1 | Example 2 | Example 3 | |
| Supporting layer | SPS polymer stretched film | SPS polymer stretched film | PET stretch film |
| Thickness of the supporting layer | 50μm | 50μm | 50μm |
| Temporary transfer layer | PVA | LLDPE | LLDPE |
| Thickness of temporary transfer layer | 10μm | 15μm | 15μm |
Using the release film 10 of examples 1 to 3, the resin 20 is extrusion-molded by a mold 30 including an upper mold 31 and a lower mold 32 as shown in fig. 4 (a) and (b). More specifically, the substrate 15, the resin 20, and the release film 10 are sequentially arranged from bottom to top between the upper and lower molding dies, the resin molding surface 30a of the upper molding die 31 is heated to a molding temperature, and the upper molding die 31 is brought close to the lower molding die 32 to mold the resin 20 in the sealing portion 25 of the resin molded article. Reference numeral 16 denotes a spacer for controlling the proximity of the upper mold 31 and the lower mold 32. As the resin 20, an epoxy resin sheet (prepolymer) is used. The molding was carried out at a molding temperature of 180 ℃ for 3 minutes, with a thickness of 1mm of the substrate 15.
In any of the embodiments, after the seal portion 25 is formed, the temporary transfer layer 12 of the release film 10 is transferred to the seal portion 25 by separating the release film 10 from the seal portion 25.
In any of the embodiments, the transferred temporary transfer layer 12 is removed from the seal portion 25 by polishing or spraying. In addition, in the case of using the release film 10 of example 1, the temporary transfer layer 12 may be removed by washing with water.
Claims (3)
1. A method of manufacturing a semiconductor package, comprising:
a step of preparing a release film including a support layer having releasability and a temporary transfer layer provided on one surface of the support layer, the support layer having a biaxially oriented SPS-based polymer film, the temporary transfer layer having a thickness of 10 to 35 μm, the temporary transfer layer being made of a polyolefin-based resin;
a sealing section molding step of sequentially arranging a substrate, a resin, and a release film, and molding the sealing section while compressing the resin with upper and lower molding dies;
transferring at least a part of the temporary transfer layer of the release film to the sealing portion;
and a step of removing the temporary transfer layer transferred to the sealing portion by polishing, and polishing the surface of the sealing portion.
2. The method of manufacturing a semiconductor package according to claim 1, wherein: the temporary transfer layer is laminated on one side of the support layer by extrusion lamination.
3. The manufacturing method of a semiconductor package according to claim 1 or 2, characterized in that: the material of the temporary transfer printing layer is straight-chain low-density polyethylene.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-132718 | 2016-07-04 | ||
| JP2016132718A JP6738672B2 (en) | 2016-07-04 | 2016-07-04 | Release film and method for manufacturing semiconductor package |
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| Publication Number | Publication Date |
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| CN107571433A CN107571433A (en) | 2018-01-12 |
| CN107571433B true CN107571433B (en) | 2020-10-16 |
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| JP (1) | JP6738672B2 (en) |
| KR (1) | KR102053492B1 (en) |
| CN (1) | CN107571433B (en) |
| TW (1) | TWI728132B (en) |
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| KR20210018185A (en) | 2018-06-08 | 2021-02-17 | 구라시키 보세키 가부시키가이샤 | Release film and release film manufacturing method |
| CN110718474B (en) * | 2019-09-03 | 2022-08-16 | 富联裕展科技(深圳)有限公司 | Packaging method, release part and manufacturing method thereof |
| WO2022153756A1 (en) * | 2021-01-14 | 2022-07-21 | 住友ベークライト株式会社 | Mold release film |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004082502A (en) * | 2002-08-27 | 2004-03-18 | Mitsubishi Plastics Ind Ltd | Release film |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2888856B2 (en) * | 1989-04-21 | 1999-05-10 | 旭化成工業株式会社 | Syndiotactic polystyrene transparent film |
| JPH04175117A (en) * | 1990-11-08 | 1992-06-23 | Aisin Chem Co Ltd | Manufacture of design product made of resin |
| JP3027451B2 (en) * | 1991-10-15 | 2000-04-04 | 出光興産株式会社 | Transparent molded article and method for producing the same |
| JP3086329B2 (en) * | 1992-05-22 | 2000-09-11 | 出光興産株式会社 | Resin composition and multilayer material using the same |
| JPH0724911A (en) * | 1993-07-08 | 1995-01-27 | Toyobo Co Ltd | Syndyotactic polystyrene film |
| JP3566011B2 (en) * | 1997-01-21 | 2004-09-15 | ゼネラル株式会社 | Recording material, recording material for label printer using the same, and cassette for label printer |
| JPH11349703A (en) * | 1998-06-04 | 1999-12-21 | Marusho Kk | Releasing film |
| JP2002172650A (en) * | 2000-12-05 | 2002-06-18 | Nissha Printing Co Ltd | Method for manufacturing reflection preventing member and transfer material for reflection preventing member |
| JP2002292802A (en) * | 2001-03-30 | 2002-10-09 | Mitsubishi Plastics Ind Ltd | Release film and method for manufacturing printed board |
| WO2008020543A1 (en) * | 2006-08-18 | 2008-02-21 | Asahi Glass Company, Limited | Mold release film for the resin encapsulation of semiconductors |
| JP2013131629A (en) * | 2011-12-21 | 2013-07-04 | Towa Corp | Resin sealing method and apparatus of led chip |
| CN105358308B (en) * | 2013-07-16 | 2018-11-09 | 仓敷纺绩株式会社 | Mold release film |
| JP6207268B2 (en) * | 2013-07-16 | 2017-10-04 | 倉敷紡績株式会社 | Polystyrene film and method for producing the same |
| JP5584374B1 (en) * | 2014-02-07 | 2014-09-03 | 株式会社アイセロ | Convex and concave pattern transfer material |
| TW201601918A (en) * | 2014-06-13 | 2016-01-16 | Fujifilm Corp | Temporary adhesion laminate, temporary adhesion laminate manufacturing method, and laminate equipped with device wafer |
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- 2017-06-01 KR KR1020170068387A patent/KR102053492B1/en active IP Right Grant
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2004082502A (en) * | 2002-08-27 | 2004-03-18 | Mitsubishi Plastics Ind Ltd | Release film |
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| KR20180004656A (en) | 2018-01-12 |
| JP2018001626A (en) | 2018-01-11 |
| TW201801883A (en) | 2018-01-16 |
| KR102053492B1 (en) | 2019-12-06 |
| JP6738672B2 (en) | 2020-08-12 |
| TWI728132B (en) | 2021-05-21 |
| CN107571433A (en) | 2018-01-12 |
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